Patents by Inventor Yasuhiro Yoneda

Yasuhiro Yoneda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9978954
    Abstract: A benzobis(thiadiazole) derivative represented by the following general formula (1): in which R1 represents a linear or branched alkyl group, or any one of the groups of the following formula (2): in which R represents a linear or branched alkyl group; R2 represents a hydrogen atom; and R3 represents a hydrogen atom, a linear or branched alkyl group, or any one of the groups of the formula (2); with the proviso that at least one of R1 and R3 represents any one of the groups of the formula (2); and two R1 groups, two R2 groups, and two R3 groups may be the same as, or different from each other.
    Type: Grant
    Filed: August 29, 2014
    Date of Patent: May 22, 2018
    Assignee: UBE INDUSTRIES, LTD.
    Inventors: Shizuo Tokito, Daisuke Kumaki, Masashi Mamada, Kenjiro Fukuda, Yasuhiro Tanaka, Hidetaka Shima, Yasuhiro Yoneda, Harunori Fujita, Kazuaki Kakita, Youji Omata, Natsuko Yamada, Takashi Honma, Toshikazu Machida
  • Patent number: 9585246
    Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: February 28, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Teru Nakanishi, Nobuyuki Hayashi, Masaru Morita, Yasuhiro Yoneda
  • Patent number: 9565755
    Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: February 7, 2017
    Assignee: FUJITSU LIMITED
    Inventors: Teru Nakanishi, Nobuyuki Hayashi, Masaru Morita, Yasuhiro Yoneda
  • Publication number: 20160273852
    Abstract: A cooling device comprising a heat receiver attached to a heat generating member and using a flow of coolant to rob heat from the heat generating member, a heat exchanger radiating off heat from the inflowing coolant to lower the temperature of the coolant, a first channel carrying the coolant from the heat receiver to the heat exchanger, a second channel carrying the coolant from the heat exchanger to the heat receiver, and a pump for making the coolant move, wherein, as the coolant, a mixed working fluid comprised of pure water or impure water containing nanoparticles plus ethanol to give an alcohol concentration of ethanol 0.1 mass % to 5 mass % is used to improve the freezing resistance.
    Type: Application
    Filed: May 31, 2016
    Publication date: September 22, 2016
    Applicant: FUJITSU LIMITED
    Inventors: Nobuyuki HAYASHI, TERU NAKANISHI, Yasuhiro Yoneda
  • Publication number: 20160276598
    Abstract: A benzobis(thiadiazole) derivative represented by the following general formula (1): in which R1 represents a linear or branched alkyl group, or any one of the groups of the following formula (2): in which R represents a linear or branched alkyl group; R2 represents a hydrogen atom; and R3 represents a hydrogen atom, a linear or branched alkyl group, or any one of the groups of the formula (2); with the proviso that at least one of R1 and R3 represents any one of the groups of the formula (2); and two R1 groups, two R2 groups, and two R3 groups may be the same as, or different from each other.
    Type: Application
    Filed: August 29, 2014
    Publication date: September 22, 2016
    Inventors: Shizuo TOKITO, Daisuke KUMAKI, Masashi MAMADA, Kenjiro FUKUDA, Yasuhiro TANAKA, Hidetaka SHIMA, Yasuhiro YONEDA, Harunori FUJITA, Kazuaki KAKITA, Youji OMATA, Natsuko YAMADA, Takashi HONMA, Toshikazu MACHIDA
  • Publication number: 20160192479
    Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.
    Type: Application
    Filed: March 7, 2016
    Publication date: June 30, 2016
    Applicant: FUJITSU LIMITED
    Inventors: Teru Nakanishi, Nobuyuki Hayashi, Masaru Morita, Yasuhiro YONEDA
  • Publication number: 20160192498
    Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.
    Type: Application
    Filed: March 7, 2016
    Publication date: June 30, 2016
    Applicant: FUJITSU LIMITED
    Inventors: Teru Nakanishi, Nobuyuki Hayashi, Masaru Morita, Yasuhiro YONEDA
  • Patent number: 9318425
    Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.
    Type: Grant
    Filed: August 18, 2011
    Date of Patent: April 19, 2016
    Assignee: FUJITSU LIMITED
    Inventors: Teru Nakanishi, Nobuyuki Hayashi, Masaru Morita, Yasuhiro Yoneda
  • Patent number: 9290516
    Abstract: A benzobis(thiadiazole) derivative represented by the formula (1): in which R represents a group containing at least one fluorine atom (with the proviso that fluorine atom (F) and trifluoromethyl group (—CF3) are excluded), and m represents an integer of from 1 to 10.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: March 22, 2016
    Assignee: UBE INDUSTRIES, LTD.
    Inventors: Shizuo Tokito, Daisuke Kumaki, Hidetaka Shima, Hiroyuki Oda, Yasuhiro Tanaka, Kazuaki Kakita, Toshikazu Machida, Yasuhiro Yoneda, Youji Omata, Tetsuro Shimano
  • Publication number: 20160007502
    Abstract: An object of technology disclosed herein is improving cooling efficiency. A heat exchanger includes plural pipes and a tank. The plural pipes are arrayed side-by-side. The tank couples together end portions of neighboring pipes among the plurality of pipes, and allows a coolant to flow from one of the neighboring pipes to another of the neighboring pipes.
    Type: Application
    Filed: September 18, 2015
    Publication date: January 7, 2016
    Inventors: Nobuyuki HAYASHI, TERU NAKANISHI, Yasuhiro Yoneda
  • Publication number: 20160007501
    Abstract: An object of technology disclosed herein is to improve cooling performance for plural heat generating bodies. A cooling system includes a heat dissipating section, plural heat receiving sections, and a bypass section. The heat dissipation section dissipates heat from a coolant by exchanging heat with an external fluid. The plural heat receiving sections are connected in parallel to the heat dissipating section, and heat generated by respective heat generating bodies is absorbed by the coolant. The bypass section couples at least one of the heat receiving sections out of the plurality of heat receiving sections to another heat receiving section.
    Type: Application
    Filed: September 17, 2015
    Publication date: January 7, 2016
    Inventors: TERU NAKANISHI, Nobuyuki HAYASHI, Yasuhiro Yoneda
  • Patent number: 9080080
    Abstract: Provided is a method for producing a polishing composition capable of reducing scratches and particles of an object to be polished, after polishing. It is a method for producing a polishing composition including a step of filtering with a filtration filter a silica particle dispersion containing colloidal silica whose primary particles have an average particle diameter in a range of 1 to 100 nm, wherein the filtration filter includes diatomite cationized by use of a polyvalent amine compound having 9 to 200 cationic groups in the molecule.
    Type: Grant
    Filed: December 21, 2011
    Date of Patent: July 14, 2015
    Assignee: KAO CORPORATION
    Inventors: Yasuhiro Yoneda, Kanji Sato
  • Publication number: 20150059853
    Abstract: A benzobis(thiadiazole) derivative represented by the formula (1): in which R represents a group containing at least one fluorine atom (with the proviso that fluorine atom (F) and trifluoromethyl group (—CF3) are excluded), and m represents an integer of from 1 to 10.
    Type: Application
    Filed: March 15, 2013
    Publication date: March 5, 2015
    Inventors: Shizuo Tokito, Daisuke Kumaki, Hidetaka Shima, Hiroyuki Oda, Yasuhiro Tanaka, Kazuaki Kakita, Toshikazu Machida, Yasuhiro Yoneda, Youji Omata, Tetsuro Shimano
  • Patent number: 8964402
    Abstract: An electronic device includes a wiring board including a first electrode and a second electrode, a semiconductor device mounted on the wiring board and including a first terminal and a second terminal, an interposer provided between the wiring board and the semiconductor device, the interposer including a conductive pad and a sheet supporting the conductive pad, the conductive pad having a first surface on a side of the wiring board and a second surface on a side of the semiconductor device, a first solder connecting the first electrode positioned outside of an area in which the interposer is disposed with the first terminal positioned outside of the area, a second solder connecting the second electrode positioned inside of the area with the first surface of the conductive pad, and a third solder connecting the second terminal positioned inside of the area with the second surface of the conductive pad.
    Type: Grant
    Filed: December 20, 2011
    Date of Patent: February 24, 2015
    Assignee: Fujitsu Limited
    Inventors: Teru Nakanishi, Nobuyuki Hayashi, Masaru Morita, Yasuhiro Yoneda
  • Patent number: 8617994
    Abstract: A polishing liquid composition includes composite oxide particles containing cerium and zirconium, a dispersing agent, and an aqueous medium. A powder X-ray diffraction spectrum of the composite oxide particles obtained by CuK?1 ray (?=0.154050 nm) irradiation includes a peak (first peak) having a peak top in a diffraction angle 2? (? is a Bragg angle) range of 28.61 to 29.67°, a peak (second peak) having a peak top in a diffraction angle 2? range of 33.14 to 34.53°, a peak (third peak) having a peak top in a diffraction angle 2? range of 47.57 to 49.63°, and a peak (fourth peak) having a peak top in a diffraction angle 2? range of 56.45 to 58.91°. A half-width of the first peak is 0.8° or less.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: December 31, 2013
    Assignee: Kao Corporation
    Inventors: Mami Shirota, Yasuhiro Yoneda
  • Publication number: 20130283704
    Abstract: Provided is a method for producing a polishing composition capable of reducing scratches and particles of an object to be polished, after polishing. It is a method for producing a polishing composition including a step of filtering with a filtration filter a silica particle dispersion containing colloidal silica whose primary particles have an average particle diameter in a range of 1 to 100 nm, wherein the filtration filter includes diatomite cationized by use of a polyvalent amine compound having 9 to 200 cationic groups in the molecule.
    Type: Application
    Filed: December 21, 2011
    Publication date: October 31, 2013
    Applicant: KAO CORPORATION
    Inventors: Yasuhiro Yoneda, Kanji Sato
  • Patent number: 8508031
    Abstract: An electronic device includes a wiring board; a semiconductor device arranged at an upper side of the wiring board with an electrically conductive member being arranged therebetween; a covering member arranged at an upper side of the semiconductor device; and a supporting member arranged at a lower side of the wiring board, the supporting member having a convex portion facing the wiring board, the supporting member being connected to the covering member and supporting the wiring board at the convex portion.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: August 13, 2013
    Assignee: Fujitsu Limited
    Inventors: Nobuyuki Hayashi, Yasuhiro Yoneda, Teru Nakanishi, Masaru Morita
  • Publication number: 20130183889
    Abstract: Provided is a process for producing a polishing liquid composition with which it is possible to give a polished work that has a reduced surface roughness and a reduced amount of particles. The process for producing a polishing liquid composition involves a step in which a raw silica dispersion containing colloidal silica having an average primary-particle diameter of 1-100 nm is filtered through a filter including a filter aid, the filter aid having an average pore diameter, as measured by the mercury intrusion method, of 0.1-3.5 ?m.
    Type: Application
    Filed: September 21, 2011
    Publication date: July 18, 2013
    Applicant: KAO CORPORATION
    Inventors: Yasuhiro Yoneda, Koji Taira, Kanji Sato, Yoshiaki Oshima
  • Patent number: 8472195
    Abstract: An electronic device includes an electronic component mounted on a substrate; a cooling system for cooling the electronic component; and a fastening structure for fastening the cooling system to the substrate. The fastening structure includes a first magnet provided to one of the substrate and the cooling system, a second magnetic material fixed to the other of the substrate and the cooling system and magnetically coupled with the first magnet, and a magnetic shield that covers a part or all of the first magnet except for a coupling face to be coupled with the second magnetic material.
    Type: Grant
    Filed: May 9, 2011
    Date of Patent: June 25, 2013
    Assignee: Fujitsu Limited
    Inventors: Teru Nakanishi, Nobuyuki Hayashi, Masaru Morita, Katsusada Motoyoshi, Yasuhiro Yoneda
  • Patent number: 8378687
    Abstract: A measuring method of a battery includes the step of measuring frequency characteristics of an internal impedance of the battery by an AC impedance method, and determining a parameter of an element representing ease of mobility of charges on a surface of a positive electrode of the battery and that of an element representing the ease of mobility of charges on the surface of a negative electrode.
    Type: Grant
    Filed: October 8, 2008
    Date of Patent: February 19, 2013
    Assignee: Fujitsu Limited
    Inventors: Yasuhiro Yoneda, Katsusada Motoyoshi, Yukiko Wakino, Kensuke Yoshida