Abstract: An inexpensive multilayer wiring circuit board capable of conducting high frequency switching operation on the circuit while the generation of high frequency noise is being suppressed by reducing the inductance of the circuit in provided. A multilayer wiring circuit board comprising: an uppermost layer designated as a first layer on which parts are mounted; a second layer on which one of a ground layer and an electric power source layer is arranged; a third layer on which the other is arranged; and an insulating layer arranged between the ground layer and the electric power source layer. A resin layer having a thermoplastic adhesion property on both faces is used as material of the insulating layer arranged between the electric power source layer and the ground layer.

Abstract: A polishing composition comprising an improver of a ratio of a polishing rate of an insulating film to that of a stopper film, wherein the polishing rate of the stopper film is selectively decreased, comprising one or more compounds selected from the group consisting of a monoamine or diamine compound; a polyamine having three or more amino groups in its molecule; an ether group-containing amine; and a heterocyclic compound having nitrogen atom. The polishing composition can be used for removing an insulating film which has been embedded for isolation into a trench formed on a silicon substrate and sedimented outside the trench, thereby planing a surface of the silicon substrate.

Abstract: The present invention provides a polishing composition for a glass substrate having a pH of from 0.5 to 5, containing a silica of which primary particles have an average particle size of from 5 to 50 nm and an acrylic acid/sulfonic acid copolymer having a weight-average molecular weight of from 1,000 to 5,000; and a method for manufacturing a glass substrate using the polishing composition. The polishing composition for a glass substrate can be suitably used, for example, in the manufacture of glass hard disks, aluminosilicate glass for reinforced glass substrates, glass ceramic substrates (crystallized glass substrates), synthetic quartz glass substrates (photomask substrates), and the like.

Abstract: Lens aberration in an objective lens for recording and reproducing optical information, which is composed of a molded aspherical single lens, is inhibited while at the same time good lens productivity is attained. Also attained are excellent optical properties and high production efficiency in a mold processing step and a press molding step conducted to manufacture the lens. To this end there is provided an objective lens 1 having a convex aspherical surface formed at a first surface and a numerical aperture NA which satisfies the condition NA?0.8. It is preferable to have an aspherical surface also at the second surface.

Abstract: A polishing composition for a semiconductor substrate comprising dihydroxyethylglycine, ceria particles, a dispersant, and an aqueous medium, wherein the ceria particles are contained in an amount of from 2 to 22% by weight of the polishing composition, and the dispersant is contained in an amount of from 0.001 to 1.0% by weight of the polishing composition; a polishing process of a semiconductor substrate with the polishing composition for a semiconductor substrate; and a method for manufacturing a semiconductor device including the step of polishing a substrate to be polished in accordance with the polishing process. The polishing composition is used, for example, for the steps of subjecting to shallow trench isolation, subjecting an interlayer dielectric to planarization, forming an embedded metal line, forming an embedded capacitor, and the like.

Abstract: A polishing liquid composition is applicable as a means of forming embedded metal interconnections on a semiconductor substrate. In a surface to be polished comprising an insulating layer and a metal interconnection layer, the polishing liquid composition is capable of maintaining a polishing speed of the metal layer, of suppressing an etching speed, and of preventing dishing of the metal layer.

Abstract: A polishing liquid composition is applicable as a means of forming embedded metal interconnections on a semiconductor substrate. In a surface to be polished comprising an insulating layer and a metal interconnection layer, the polishing liquid composition is capable of maintaining a polishing speed of the metal layer, of suppressing an etching speed, and of preventing dishing of the metal layer.

Abstract: A polishing liquid composition is applicable as a means of forming embedded metal interconnections on a semiconductor substrate. In a surface to be polished comprising an insulating layer and a metal interconnection layer, the polishing liquid composition is capable of maintaining a polishing speed of the metal layer, of suppressing an etching speed, and of preventing dishing of the metal layer.

Abstract: A polishing composition comprising an improver of a ratio of a polishing rate of an insulating film to that of a stopper film, wherein the polishing rate of the stopper film is selectively decreased, comprising one or more compounds selected from the group consisting of a monoamine or diamine compound; a polyamine having three or more amino groups in its molecule; an ether group-containing amine; and a heterocyclic compound having nitrogen atom. The polishing composition can be used for removing an insulating film which has been embedded for isolation into a trench formed on a silicon substrate and sedimented outside the trench, thereby planing a surface of the silicon substrate.

Abstract: A polishing composition comprising an improver of a ratio of a polishing rate of an insulating film to that of a stopper film, wherein the polishing rate of the stopper film is selectively decreased, comprising one or more compounds selected from the group consisting of a monoamine or diamine compound; a polyamine having three or more amino groups in its molecule; an ether group-containing amine; and a heterocyclic compound having nitrogen atom. The polishing composition can be used for removing an insulating film which has been embedded for isolation into a trench formed on a silicon substrate and sedimented outside the trench, thereby planing a surface of the silicon substrate.

Abstract: A polishing composition containing at least one or more aminocarboxylic acids selected from the group consisting of serine, cysteine and dihydroxyethylglycine, ceria particles and an aqueous medium; a polishing process of a semiconductor substrate, including the step of polishing a semiconductor substrate with a polishing composition for a semiconductor substrate, containing at least one or more aminocarboxylic acids selected from the group consisting of serine, cysteine and dihydroxyethylglycine, ceria particles and an aqueous medium; a method for manufacturing a semiconductor device including the step of polishing a semiconductor substrate having a film formed on its surface, the film containing a silicon atom and having a shape with dents and projections, with a polishing pad pressed against a semiconductor substrate at a polishing load of from 5 to 100 kPa in the presence of a polishing composition for a semiconductor substrate, containing at least one or more aminocarboxylic acids selected from the group

Abstract: The present invention is aimed to provide a head suspension having a high resonant frequency, high shock resistance and low rigidity, which greatly contributes to an improvement of a magnetic disk apparatus. In an oscillation-type actuator, at least a part of a spring arm of the head suspension having a data reading/writing head slider 1 is made of an anisotropic layer whose rigidity varies in accordance with a direction. In this case, the anisotropic layer is laminated so that the high rigidity modulus orientation direction is different according to layer.

Abstract: In a method of manufacturing a glass optical element by press-forming a glass material in a chamber by using a forming mold comprising upper and lower dies at least one of which is movable, where a surrounded space is formed between the glass material and at least one of the upper and the lower dies when the upper and the lower dies come into contact with the glass material, a pressure within the chamber is reduced before the glass material placed in the forming mold is heated to a press-forming temperature. After sealing the space as formed when the glass material is in contact with at least one of forming surfaces of the upper and the lower dies, a gas is introduced into the chamber. The glass material is heated in the gas and then press-formed under a pressing load.

Abstract: Disclosed is methods of manufacturing optical elements such as optical glass lenses and to methods of manufacturing optical glass elements in which a heat softened optical glass material is press molded in a pressing mold with high precision. Optical pick up units is also disclosed and it comprises an object lens manufactured by the method. In the method, at least one of an upper mold and a lower mold having a shape such that when a glass material is in contact with the upper mold and the lower mold, a molding surface of at least one of the upper mold or the lower mold forms a closed space with a surface of the glass material.

Abstract: An inexpensive multilayer wiring circuit board capable of conducting high frequency switching operation on the circuit while the generation of high frequency noise is being suppressed by reducing the inductance of the circuit in provided. A multilayer wiring circuit board comprising: an uppermost layer designated as a first layer on which parts are mounted; a second layer on which one of a ground layer and an electric power source layer is arranged; a third layer on which the other is arranged; and an insulating layer arranged between the ground layer and the electric power source layer. A resin layer having a thermoplastic adhesion property on both faces is used as material of the insulating layer arranged between the electric power source layer and the ground layer.

Abstract: Theme To inhibit the lens aberration in an objective lens for recording and reproducing optical information, which is composed of a molded aspherical single lens, while attaining at the same time good lens productivity, and also to ensure excellent optical properties and to obtain a high production efficiency in a mold processing step and a press molding step conducted to manufacture the lens. Means for Solving the Problems An objective lens 1 is a lens wherein a convex aspherical surface is formed at the first surface and a numerical aperture NA satisfies the condition, NA?0.8. It is preferable to have an aspherical surface also at the second surface.

Abstract: The present invention relates to a method of manufacturing a molded article in the form of an optical element such as a glass lens by heat-softening a glass material such as optical glass and press molding it with high precision in a pressing mold as well as an objective lens for optical picking up. The method of manufacturing comprises press-molding a molding material to make a molded article, measuring an optical property of the molded article, correcting pressing rate of at least one of the pressing molds based on the optical property thus measured, and further press-molding to make a molded article with the corrected pressing rate. A pressing device comprising a pair of pressing molds having molding surfaces processed to prescribed shape, and a means of driving one of the pair of pressing molds at a prescribed rate to press mold a molding material supplied between the pressing molds is disclosed.

Abstract: A polishing composition comprising silica particles, polymer particles and a cationic compound in an aqueous medium; a polishing process for a substrate for a precision part with the polishing composition as defined above; a method for planarization of a substrate for a precision part, including the step of polishing the substrate for a precision part with the polishing composition as defined above; and a method for planarization of a substrate for a precision part, including the steps of polishing the substrate for a precision part with the polishing composition as defined above, the polishing composition being a first polishing composition, with applying a polishing load of 50 to 1000 hPa, and polishing the substrate after the first step with a second polishing composition comprising silica particles in an aqueous medium with applying a polishing load of 50 to 1000 hPa.

Abstract: A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.

Abstract: A polishing composition comprising an improver of a ratio of a polishing rate of an insulating film to that of a stopper film, wherein the polishing rate of the stopper film is selectively decreased, comprising one or more compounds selected from the group consisting of a monoamine or diamine compound; a polyamine having three or more amino groups in its molecule; an ether group-containing amine; and a heterocyclic compound having nitrogen atom. The polishing composition can be used for removing an insulating film which has been embedded for isolation into a trench formed on a silicon substrate and sedimented outside the trench, thereby planing a surface of the silicon substrate.