Abstract: A polishing liquid composition includes composite oxide particles containing cerium and zirconium, a dispersing agent, and an aqueous medium. A powder X-ray diffraction spectrum of the composite oxide particles obtained by CuK?1 ray (?=0.154050 nm) irradiation includes a peak (first peak) having a peak top in a diffraction angle 2? (? is a Bragg angle) range of 28.61 to 29.67°, a peak (second peak) having a peak top in a diffraction angle 2? range of 33.14 to 34.53°, a peak (third peak) having a peak top in a diffraction angle 2? range of 47.57 to 49.63°, and a peak (fourth peak) having a peak top in a diffraction angle 2? range of 56.45 to 58.91°. A half-width of the first peak is 0.8° or less.

Abstract: An electronic device includes a wiring board including a first electrode and a second electrode, a semiconductor device mounted on the wiring board and including a first terminal and a second terminal, an interposer provided between the wiring board and the semiconductor device, the interposer including a conductive pad and a sheet supporting the conductive pad, the conductive pad having a first surface on a side of the wiring board and a second surface on a side of the semiconductor device, a first solder connecting the first electrode positioned outside of an area in which the interposer is disposed with the first terminal positioned outside of the area, a second solder connecting the second electrode positioned inside of the area with the first surface of the conductive pad, and a third solder connecting the second terminal positioned inside of the area with the second surface of the conductive pad.

Abstract: An electronic device includes an electronic component mounted on a substrate; a cooling system for cooling the electronic component; and a fastening structure for fastening the cooling system to the substrate. The fastening structure includes a first magnet provided to one of the substrate and the cooling system, a second magnetic material fixed to the other of the substrate and the cooling system and magnetically coupled with the first magnet, and a magnetic shield that covers a part or all of the first magnet except for a coupling face to be coupled with the second magnetic material.

Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

Abstract: A polishing composition containing at least one or more aminocarboxylic acids selected from the group consisting of serine, cysteine and dihydroxyethylglycine, ceria particles and an aqueous medium; a polishing process of a semiconductor substrate, including the step of polishing a semiconductor substrate with a polishing composition for a semiconductor substrate, containing at least one or more aminocarboxylic acids selected from the group consisting of serine, cysteine and dihydroxyethylglycine, ceria particles and an aqueous medium; a method for manufacturing a semiconductor device including the step of polishing a semiconductor substrate having a film formed on its surface, the film containing a silicon atom and having a shape with dents and projections, with a polishing pad pressed against a semiconductor substrate at a polishing load of from 5 to 100 kPa in the presence of a polishing composition for a semiconductor substrate, containing at least one or more aminocarboxylic acids selected from the group

Abstract: An electronic device includes a wiring board; a semiconductor device arranged at an upper side of the wiring board with an electrically conductive member being arranged therebetween; a covering member arranged at an upper side of the semiconductor device; and a supporting member arranged at a lower side of the wiring board, the supporting member having a convex portion facing the wiring board, the supporting member being connected to the covering member and supporting the wiring board at the convex portion.

Abstract: An electronic device includes a circuit board having a first electrode formed on a main surface thereof, a semiconductor device disposed toward the main surface of the circuit board, the semiconductor device having a second electrode formed on a surface thereof opposed to the main surface, and a connection member electrically connecting between the first and second electrodes. The connection member includes a hollow cylindrical member and a conductive member disposed within the hollow cylindrical member.

Abstract: A polishing liquid composition includes composite oxide particles containing cerium and zirconium, a dispersing agent, and an aqueous medium. A powder X-ray diffraction spectrum of the composite oxide particles obtained by CuK?1 ray (?=0.154050 nm) irradiation includes a peak (first peak) having a peak top in a diffraction angle 2? (? is a Bragg angle) range of 28.61 to 29.67°, a peak (second peak) having a peak top in a diffraction angle 2? range of 33.14 to 34.53°, a peak (third peak) having a peak top in a diffraction angle 2? range of 47.57 to 49.63°, and a peak (fourth peak) having a peak top in a diffraction angle 2? range of 56.45 to 58.91°. A half-width of the first peak is 0.8° or less.

Abstract: An inexpensive multilayer wiring circuit board capable of conducting high frequency switching operation on the circuit while the generation of high frequency noise is being suppressed by reducing the inductance of the circuit in provided. A multilayer wiring circuit board with an uppermost layer designated as a first layer on which parts are mounted; a second layer on which one of a ground layer and an electric power source layer is arranged; a third layer on which the other is arranged; and an insulating layer arranged between the ground layer and the electric power source layer. A resin layer having a thermoplastic adhesion property on both faces is used as material of the insulating layer arranged between the electric power source layer and the ground layer.

Abstract: A polishing liquid composition is applicable as a means of forming embedded metal interconnections on a semiconductor substrate. In a surface to be polished comprising an insulating layer and a metal interconnection layer, the polishing liquid composition is capable of maintaining a polishing speed of the metal layer, of suppressing an etching speed, and of preventing dishing of the metal layer.

Abstract: A polishing composition containing at least one or more aminocarboxylic acids selected from the group consisting of serine, cysteine and dihydroxyethylglycine, ceria particles and an aqueous medium; a polishing process of a semiconductor substrate, including the step of polishing a semiconductor substrate with a polishing composition for a semiconductor substrate, containing at least one or more aminocarboxylic acids selected from the group consisting of serine, cysteine and dihydroxyethylglycine, ceria particles and an aqueous medium; a method for manufacturing a semiconductor device including the step of polishing a semiconductor substrate having a film formed on its surface, the film containing a silicon atom and having a shape with dents and projections, with a polishing pad pressed against a semiconductor substrate at a polishing load of from 5 to 100 kPa in the presence of a polishing composition for a semiconductor substrate, containing at least one or more aminocarboxylic acids selected from the group

Abstract: A measuring method of a battery includes the step of measuring frequency characteristics of an internal impedance of the battery by an AC impedance method, and determining a parameter of an element representing ease of mobility of charges on a surface of a positive electrode of the battery and that of an element representing the ease of mobility of charges on the surface of a negative electrode.

Abstract: A method of manufacturing an optical element, such as an objective lens, by heat-softening optical glass and press molding it with high precision in a pressing mold. The method comprises press-molding a molding material with a pressing device, comprising a pair of molds with prescribed shape, to make a molded article, measuring an optical property of the molded article, correcting pressing rate of at least one of the pressing molds based on the optical property thus measured, and further press-molding to make a molded article with the corrected pressing rate. The device has a means of driving one of the pair of pressing molds at a prescribed rate, a means for detecting an optical property, a shape or a number of the molded articles, and a means for controlling driving of the means of driving by correcting pressing rate of the molds based on the detected property, shape or number.

Abstract: In a method of manufacturing a glass optical element by press-forming a glass material in a chamber by using a forming mold comprising upper and lower dies at least one of which is movable, where a surrounded space is formed between the glass material and at least one of the upper and the lower dies when the upper and the lower dies come into contact with the glass material, a pressure within the chamber is reduced before the glass material placed in the forming mold is heated to a press-forming temperature. After sealing the space as formed when the glass material is in contact with at least one of forming surfaces of the upper and the lower dies, a gas is introduced into the chamber. The glass material is heated in the gas and then press-formed under a pressing load.

Abstract: Lens aberration in an objective lens for recording and reproducing optical information, which is composed of a molded aspherical single lens, is inhibited while at the same time good lens productivity is attained. Also attained are excellent optical properties and high production efficiency in a mold processing step and a press molding step conducted to manufacture the lens. To this end there is provided an objective lens 1 having a convex aspherical surface formed at a first surface and a numerical aperture NA which satisfies the condition NA?0.8. It is preferable to have an aspherical surface also at the second surface.

Abstract: In a method of manufacturing a glass optical element by press-forming a glass material in a chamber by using a forming mold comprising upper and lower dies at least one of which is movable, where a surrounded space is formed between the glass material and at least one of the upper and the lower dies when the upper and the lower dies come into contact with the glass material, a pressure within the chamber is reduced before the glass material placed in the forming mold is heated to a press-forming temperature. After sealing the space as formed when the glass material is in contact with at least one of forming surfaces of the upper and the lower dies, a gas is introduced into the chamber. The glass material is heated in the gas and then press-formed under a pressing load.

Abstract: The present invention relates to a method of manufacturing a molded article in the form of an optical element such as a glass lens by heat-softening a glass material such as optical glass and press molding it with high precision in a pressing mold as well as an objective lens for optical picking up. The method of manufacturing comprises press-molding a molding material to make a molded articles measuring an optical property of the molded article, correcting pressing rate of at least one of the pressing molds based on the optical property thus measured, and further press-molding to make a molded article with the corrected pressing rate. A pressing device comprising a pair of pressing molds having molding surfaces processed to prescribed shape, and a means of driving one of the pair of pressing molds at a prescribed rate to press mold a molding material supplied between the pressing molds is disclosed.

Abstract: Lens aberration in an objective lens for recording and reproducing optical information, which is composed of a molded aspherical single lens, is inhibited while at the same time good lens productivity is attained. Also attained are excellent optical properties and high production efficiency in a mold processing step and a press molding step conducted to manufacture the lens. To this end there is provided an objective lens 1 having a convex aspherical surface formed at a first surface and a numerical aperture NA which satisfies the condition NA?0.8. It is preferable to have an aspherical surface also at the second surface.

Abstract: The present invention relates to a method of manufacturing a molded article in the form of an optical element such as a glass lens by heat-softening a glass material such as optical glass and press molding it with high precision in a pressing mold as well as an objective lens for optical picking up. The method of manufacturing comprises press-molding a molding material to make a molded article, measuring an optical property of the molded article, correcting pressing rate of at least one of the pressing molds based on the optical property thus measured, and further press-molding to make a molded article with the corrected pressing rate. A pressing device comprising a pair of pressing molds having molding surfaces processed to prescribed shape, and a means of driving one of the pair of pressing molds at a prescribed rate to press mold a molding material supplied between the pressing molds is disclosed.

Abstract: In a method of manufacturing a glass optical element by press-forming a glass material in a chamber by using a forming mold comprising upper and lower dies at least one of which is movable, where a surrounded space is formed between the glass material and at least one of the upper and the lower dies when the upper and the lower dies come into contact with the glass material, a pressure within the chamber is reduced before the glass material placed in the forming mold is heated to a press-forming temperature. After sealing the space as formed when the glass material is in contact with at least one of forming surfaces of the upper and the lower dies, a gas is introduced into the chamber. The glass material is heated in the gas and then press-formed under a pressing load.