Abstract: A conductive-wire position inspecting device includes: a reference body disposed in a radial direction of a stator core; an imaging device configured to image a conductive wire and the reference body; and a calculating device configured to find a relative position and a relative angle of the conductive wire with respect to the reference body, based on an obtained image. In addition, the conductive-wire position inspecting device includes a determining device configured to determine whether or not the found relative position and relative angle are within respective permissible ranges, and if they are within the permissible ranges, determine the position of the conductive wire to be acceptable.

Abstract: An optical semiconductor device includes a base, a wiring substrate, and a sub-mount. The base includes a bottom wall, a side wall projecting from a peripheral edge of the bottom wall, and a flange extending outward from an upper end of the side wall. The wiring substrate includes a distal portion inserted into and fixed to the base. An optical element is mounted on the sub-mount. The bottom wall of the base includes a first seat to which the sub-mount is fixed and a second seat to which the distal portion is fixed. The second seat is located at a higher position than the first seat. An upper surface of the distal portion of the wiring substrate includes a pad connected to the optical element. An upper surface of the pad of the distal portion is flush with an upper surface of an electrode of the optical element.

Abstract: An optical semiconductor device includes a base, a wiring substrate, and a sub-mount. The base includes a bottom wall, a side wall projecting from a peripheral edge of the bottom wall, and a flange extending outward from an upper end of the side wall. The wiring substrate includes a distal portion inserted into and fixed to the base. An optical element is mounted on the sub-mount. The bottom wall of the base includes a first seat to which the sub-mount is fixed and a second seat to which the distal portion is fixed. The second seat is located at a higher position than the first seat. An upper surface of the distal portion of the wiring substrate includes a pad connected to the optical element. An upper surface of the pad of the distal portion is flush with an upper surface of an electrode of the optical element.

Abstract: A coin processing device including: a material detection sensor including first and second coils facing each other with a coin passage interposed therebetween; an outer diameter detection sensor including ring-shaped third and fourth coils that surround the first and second coils, respectively; a first oscillation circuit connected to the material detection sensor that oscillates a first oscillation signal in an individual connection state and a series connected state and is connected to the material detection sensor and the outer diameter detection sensor; a second oscillation circuit connected to the outer diameter detection sensor that oscillates a second oscillation signal in the individual connection state; a switching unit that switches the individual connection state and the series connection state; a coin identification unit that detects an outer diameter of a coin using the second oscillation signal in the individual connection state or the first oscillation signal in the series connection state.

Abstract: A package for an optical semiconductor device includes an eyelet, a signal lead inserted in a through hole formed in the eyelet, and sealing glass sealing the signal lead in the through hole. The signal lead includes a first portion, a second portion and a third portion that are greater in diameter than the first portion and on opposite sides of the first portion, a first tapered portion extending from the second portion to the first portion, and a second tapered portion extending from the third portion to the first portion. The first portion and the first and second tapered portions are buried in the sealing glass. The total length of a part of the second portion in the sealing glass and a part of the third portion in the sealing glass is 0.2 mm or less.

Abstract: A coin processing device including: a material detection sensor including first and second coils facing each other with a coin passage interposed therebetween; an outer diameter detection sensor including ring-shaped third and fourth coils that surround the first and second coils, respectively; a first oscillation circuit connected to the material detection sensor that oscillates a first oscillation signal in an individual connection state and a series connected state and is connected to the material detection sensor and the outer diameter detection sensor; a second oscillation circuit connected to the outer diameter detection sensor that oscillates a second oscillation signal in the individual connection state; a switching unit that switches the individual connection state and the series connection state; a coin identification unit that detects an outer diameter of a coin using the second oscillation signal in the individual connection state or the first oscillation signal in the series connection state.

Abstract: A package for an optical semiconductor device includes an eyelet, a signal lead inserted in a through hole formed in the eyelet, and sealing glass sealing the signal lead in the through hole. The signal lead includes a first portion, a second portion and a third portion that are greater in diameter than the first portion and on opposite sides of the first portion, a first tapered portion extending from the second portion to the first portion, and a second tapered portion extending from the third portion to the first portion. The first portion and the first and second tapered portions are buried in the sealing glass. The total length of a part of the second portion in the sealing glass and a part of the third portion in the sealing glass is 0.2 mm or less.

Abstract: An optical element package includes: an eyelet including an upper surface and a lower surface opposite to the upper surface; a heat releasing part disposed on the upper surface of the eyelet; a through hole formed through the eyelet to extend from the upper surface of the eyelet to the lower surface of the eyelet; a lead sealed by a certain member provided in the through hole and including a lead portion extending from the lower surface of the eyelet and a lead wiring portion extending from the upper surface of the eyelet; and an insulating substrate disposed between the lead wiring portion and the heat releasing part and comprising a front surface and a back surface opposite to the front surface.

Abstract: An optical device package includes a metal base body including a cutout portion formed from an outer circumferential surface of the metal base body toward the center portion thereof, and a wiring board connected on a side surface of the cutout portion of the metal base body. The wiring board includes an optical device mounting region provided on a portion of the wiring board located inside the cutout portion of the metal base body, and a pad arranged on a portion of the wiring board located outside the optical device mounting region.

Abstract: A semiconductor device header is provided with a base including a main body and a heat sink. A lead is inserted through a through hole extending through the main body. The is defined by a first opening and a second opening that opens in the upper surface of the main body. The second opening is in communication with the first opening and is smaller than the first opening in a plan view. The first opening is filled with an encapsulant that seals the lead. The second opening is filled with a covering material having a smaller relative permittivity than the encapsulant. The heat sink is located at a position partially overlapped with the first opening in a plan view and separated from the second opening in a plan view.

Abstract: An optical device package includes a metal base body including a cutout portion formed from an outer circumferential surface of the metal base body toward the center portion thereof, and a wiring board connected on a side surface of the cutout portion of the metal base body. The wiring board includes an optical device mounting region provided on a portion of the wiring board located inside the cutout portion of the metal base body, and a pad arranged on a portion of the wiring board located outside the optical device mounting region.

Abstract: The present invention has the purpose of providing a coin processing device capable of identifying a plated coin with high precision. An identification sensor 3 is arranged on a wall face of a coin passage 2 in which the coin 1 rotatively moves, in a position where a thickly plated part of layer of the coin 1 passes through, and genuineness of the coin is determined by obtaining from output of the identification sensor 3 data including characteristics of both of a plated layer and a core material of the coin 1.

Abstract: A wiring substrate includes a substrate, a first insulating layer formed on the substrate, wiring patterns formed on a first surface of the first insulating layer, and a second insulating layer formed on the first surface of the first insulating layer. The second insulating layer covers the wiring patterns and includes a first opening that partially exposes adjacent wiring patterns as a pad. A projection is formed in an outer portion of the substrate located outward from where the first opening is arranged. The projection rises in a thickness direction of the substrate.

Abstract: An optical semiconductor element package, includes a ceramic wiring substrate portion having a mounting area for mounting an optical semiconductor element in a center part, and including an element electrode for connecting the optical semiconductor element, and an external connection electrode connected to the element electrode, and a metal sealing ring provided on the ceramic wiring substrate portion, and including an opening portion exposing the element electrode and the mounting area, in a center part, and a ring-like protruding portion provided to an outer peripheral part of the opening portion.

Abstract: A manufacturing method for a rotating electric machine, in which the distal end portions of a plurality of coil ends, which are projected from slots of a stator core of a rotating electric machine and which are arranged in the radial direction of the stator core to form a plurality of layers, are held, and the coil ends are twisted and bent while moving the distal end portions in the circumferential direction. Neutral lines for bending the coil ends are different for each layer, and the neutral lines for the bending are positioned on farther outer sides for coil ends of farther outer layers.

Abstract: A method of manufacturing a light-emitting element mounting package including laminating a metallic layer on an insulating layer; forming a light-emitting element mounting area which includes a pair of electroplating films formed by electroplating using the metallic layer as a power supply layer on the metallic layer; forming a light-emitting element mounting portion in which a plurality of wiring portions are separated by predetermined gaps, by removing predetermined portions of the metallic layer, wherein, in the forming the light-emitting element mounting portion, the metallic layer is removed so that one of the pair of electroplating films belongs to one wiring portion of the plurality of wiring portions and another of the pair of electroplating films belongs to another wiring portion adjacent to the one wiring portion.

Abstract: A lead frame includes a plurality of leads defined by an opening extending in a thickness direction. An insulating resin layer fills the opening to entirely cover side surfaces of each lead and to support the leads. A first surface of each lead is exposed from a first surface of the insulating resin layer.

Abstract: A package includes: a leadframe made of conductive material and on which the plurality of electronic components are to be mounted, the leadframe including a first surface and a second surface opposite to the first surface and including a plurality of elongate portions arranged in parallel to each other with a gap interposed between the adjacent elongate portions; a heat sink including a first surface and a second surface opposite to the first surface, wherein the leadframe is disposed above the heat sink such that the second surface of the leadframe faces the first surface of the heat sink; and a resin portion, wherein the leadframe and the heat sink are embedded in the resin portion such that the first surface of the leadframe and the second surface of the heat sink are exposed from the resin portion, respectively.

Abstract: A package for mounting a light emitting element includes a housing and a flat plate-shaped electrode. The electrode is exposed from a lower surface of the housing. An upper surface of the electrode includes a mounting area on which the light emitting element is mounted. An insulator is arranged on the upper surface of the electrode. An element connector is connected to the insulator. A tubular reflective portion extends from the element connector to a height corresponding to the upper surface of the housing. A terminal is arranged on the side surface of the housing and connected to the reflective portion. A recess accommodates the light emitting element. The recess is formed in an upper portion of the housing, and the recess is formed by the upper surface of the electrode, the element connector, and the reflective portion.

Abstract: A substrate includes a first lead frame, a second lead frame, and a resin layer. The first lead frame includes a heat sink and a plurality of electrodes for external connection. The second lead frame is laminated on the first lead frame and includes a plurality of wirings for mounting light emitting elements. The resin layer is filled between the first lead frame and the second lead frame. The plurality of wirings are arranged above the heat sink. The plurality of electrodes and part of the plurality of wirings are joined with each other.