Abstract: A driving force distribution device includes a lubrication path LP supplying lubricating oil from an oil inlet positioned on the case outside a cylinder into a hub of each clutch unit through an oil hole positioned between an external surface of the cylinder of each operation unit and a bearing supporting the same, between a spacer supporting the bearing and a snap ring supporting the spacer, between an internal diameter of the cylinder of each operation unit and an external diameter of a drum of each clutch unit, and in the drum of each clutch unit, allowing left and right lubrication paths for lubrication of left and right clutch units to have the shortest length, and simultaneously, each flow path to have an increased size.

Abstract: A semiconductor memory device includes a memory cell; and a page buffer including a sensing circuit that is coupled to the memory cell through a bit line. The page buffer includes a first transistor included in the sensing circuit; and a second transistor not included in the sensing circuit. A cross-sectional dimension of a first contact which is coupled to the first transistor and a cross-sectional dimension of a second contact which is coupled to the second transistor are different from each other. The cross-sectional dimension of the second contact is smaller than the cross-sectional dimension of the first contact.

Abstract: A method for operating a memory device includes sensing a change in temperature of the memory device, adjusting a level of a reference current for a read operation, and reading data from memory cells of the memory device based on the adjusted level of the reference current. The level of the reference current is adjusted from a reference value to a first value when the temperature of the memory device increases and is adjusted from the reference value to a second value when the temperature of the memory device decreases. A difference between the reference value and the first value is different from a difference the reference value and the second value.

Abstract: A method of reading a memory device that includes a memory cell that stores data of at least two bits includes determining whether a cell resistance level is no greater than a threshold resistance level. If the cell resistance level is smaller than or equal to the threshold resistance level, then the data is read based on a first factor that is inversely proportional to the cell resistance level. If the cell resistance level is greater than the threshold resistance level, then the data is read based on a second factor that is proportional to the cell resistance level.

Abstract: A method of writing data in a resistive memory device having a memory cell array divided into first and second tiles includes; performing a first simultaneous write operation by performing a set write operation performed on resistive memory cells of the first tile while simultaneously performing a reset write operation on resistive memory cells of the second tile in response to the write command, and performing a second simultaneous write operation by performing a reset write operation on resistive memory cells of the first tile while simultaneously performing a set write operation on resistive memory cells of the second tile in response to the write command.

Abstract: An operating method for a resistive memory device includes; applying a bias control voltage to a memory cell array of the resistive memory device, measuring leakage current that occurs in the memory cell array in response to the applied bias control voltage to generate a measuring result, generating a control signal based on the measuring result, and adjusting a level of the bias control voltage in response to the control signal.

Abstract: Provided are a resistive memory device and an operating method for the resistive memory device. The operating method includes detecting a write cycle, determining whether or not to perform a recovery operation by comparing the detected write cycle with a first reference value, and upon determining to perform the recovery operation, performing the recovery operation on target memory cells of the memory cell array.

Abstract: An edge word line management method includes performing an erase operation on a memory device in response to an erase command, randomly determining data of a dummy pattern, and performing a post-program operation by writing the data of the dummy pattern in a dummy memory cell, wherein the dummy memory cell is adjacent to a main memory cell of a cell string included in a memory block for which the erase operation has been performed.

Abstract: A method of operating a resistive memory device having a plurality of word lines and a plurality of bit lines includes selecting one or more first memory cells connected to a first bit line, selecting one or more second memory cells connected to a second bit line, and simultaneously performing a reset write operation on the first and second memory cells using a first write driver.

Abstract: A resistive memory device comprising: a memory cell having a programmable resistance representing stored data; and a read circuit configured to be connected to the memory cell via a first signal line and read the stored data, wherein the read circuit includes: a voltage controller configured to control a first voltage of the first signal line to be a constant voltage and output a signal to a sensing node; and a sense amplifier connected to the voltage controller via the sensing node, and configured to compare a sensing voltage of the sensing node with a reference voltage.

Abstract: A resistive memory device includes a memory cell array having a plurality of memory cells respectively connected to a plurality of first signal lines and a plurality of second signal lines crossing each other. A first write driver is configured to provide a write voltage to write data to the memory cells. A second write driver is configured to be disposed between the memory cell array and the first write driver and provide a write current generated based on the write voltage to a first signal line selected from among the plurality of first signal lines.

Abstract: A resistive memory device includes a column decoder having a first switch unit, including at least one pair of switches arranged in correspondence to each of a plurality of signal lines, and a second switch unit including a pair of switches arranged in correspondence to the at least one pair of switches of the first switch unit. A first pair of switches of the first switch unit includes a first switch and a second switch that are of the same type, and a second pair of switches of the second switch unit includes a third switch and a fourth switch that are connected to the first pair of switches. A selection voltage is provided to the first signal line by passing through the first switch, and an inhibit voltage is provided to the first signal line by selectively passing through the first switch or the second switch.

Abstract: A resistive memory device includes a memory cell array that includes a plurality of memory layers stacked in a vertical direction. Each of the plurality of memory layers includes a plurality of memory cells disposed in regions where a plurality of first lines and a plurality of second lines cross each other. A bad region management unit defines as a bad region a first memory layer including a bad cell from among the plurality of memory cells and at least one second memory layer.

Abstract: A memory device includes a memory cell array having multiple memory cells arranged respectively in regions where first signal lines cross second signal lines. The memory device further includes a decoder having multiple line selection switch units connected respectively to the of first signal lines. Each of the multiple line selection switch units applies a bias voltage to a first signal line corresponding to each of the multiple line selection switch units in response selectively to a first switching signal and a second switching signal, voltage levels of which are different from each other in activated states.

Abstract: A resistive memory device includes a memory cell array having a plurality of memory cells respectively connected to a plurality of first signal lines and a plurality of second signal lines crossing each other. A first write driver is configured to provide a write voltage to write data to the memory cells. A second write driver is configured to be disposed between the memory cell array and the first write driver and provide a write current generated based on the write voltage to a first signal line selected from among the plurality of first signal lines.

Abstract: In operating a resistive memory device including a number of memory cells, a write pulse is applied to each of the plurality of memory cells such that each of the memory cells has a target resistance state between a first reference resistance and a second reference resistance higher than the first reference resistance. The resistance of each of the memory cells is read by applying a verify pulse to each of the plurality of memory cells. A verify write current pulse is applied to each of the memory cells that has resistance higher than the second reference resistance, and a verify write voltage pulse is applied to each of the memory cells that has resistance lower than the first reference resistance.

Abstract: Provided are a resistive memory device and a method of the resistive memory device. The method of operating the resistive memory device includes performing a pre-read operation on memory cells in response to a write command; performing an erase operation on one or more first memory cells on which a reset write operation is to be performed, determined based on a result of comparing pre-read data from the pre-read operation with write data; and performing set-direction programming on at least some memory cells from among the erased one or more first memory cells and on one or more second memory cells on which a set write operation is to be performed.

Abstract: Provided are a resistive memory device including a plurality of memory cells, and a method of operating the resistive memory device. The resistive memory device includes a sensing circuit connected to a first signal line, to which a memory cell is connected, the sensing circuit sensing data stored in the memory cell based on a first reference current; and a reference time generator for generating a reference time signal that determines a time point when a result of the sensing is to be output, based on the first reference current.

Abstract: Provided is a method of programming a non-volatile memory device. The method includes applying a first programming pulse to a corresponding wordline of the non-volatile memory device, applying a second programming pulse to the wordline, wherein a voltage of the second programming pulse is different from that of the first programming pulse, and applying voltages to each bitline connected to the wordline, the voltages applied to each of the bitlines are different from each other according to a plurality of bit values to be programmed to corresponding memory cells in response to the first programming pulse or the second programming pulse.

Abstract: Flash memory devices are provided including a plurality of layers stacked vertically. Each of the plurality of layers include a plurality of memory cells. A row decoder is electrically coupled to the plurality of layers and configured to supply a wordline voltage to the plurality of layers. Memory cells provided in at least two layers of the plurality of layers belong to a same memory block and wordlines associated with the memory cells in the at least two layers of the plurality of layers are electrically coupled.