Abstract: In a method of operating a memory device having a cross point array structure, the memory device includes multiple tiles, and each of the tiles includes memory cells of multiple layers. The method includes accessing, in a first tile, multiple memory cells of a first layer disposed in a region where at least one first line and at least one second line cross each other, accessing, in the first tile, multiple memory cells of a second layer disposed in a region where at least one first line and at least one second line cross each other, and accessing, after the memory cells of the multiple layers of the first tile are accessed, multiple memory cells included in a second tile. Related memory devices and memory systems are also discussed.

Abstract: In a method of operating a memory device having a cross point array structure, the memory device includes multiple tiles, and each of the tiles includes memory cells of multiple layers. The method includes accessing, in a first tile, multiple memory cells of a first layer disposed in a region where at least one first line and at least one second line cross each other, accessing, in the first tile, multiple memory cells of a second layer disposed in a region where at least one first line and at least one second line cross each other, and accessing, after the memory cells of the multiple layers of the first tile are accessed, multiple memory cells included in a second tile. Related memory devices and memory systems are also discussed.

Abstract: A resistive memory device includes a memory cell array including a plurality vertically stacked layers having one layer designated as an interference-free layer and another layer designated as an access prohibited layer, wherein the interference-free layer and the access prohibited layer share a connection with at least one signal line and access operations directed to memory cells the access prohibited layer are prohibited.

Abstract: A memory device is provided including a cell region including at least one cell layer, each cell layer including multiple first lines and multiple second lines; and a control region including at least one control layer. The at least one control layer includes multiple circuit regions for performing a memory operation on the cell region. The multiple first lines include at least one first signal line through which a first signal from a first circuit region of the control layer is transmitted to a second circuit region of the control layer.

Abstract: A resistive memory device includes a memory cell array that includes a plurality of memory layers stacked in a vertical direction. Each of the plurality of memory layers includes a plurality of memory cells disposed in regions where a plurality of first lines and a plurality of second lines cross each other. A bad region management unit defines as a bad region a first memory layer including a bad cell from among the plurality of memory cells and at least one second memory layer.

Abstract: A method of operating a resistive memory device including a plurality of memory cells comprises determining whether to perform a refresh operation on memory cells in a memory cell array; determining a resistance state of each of at least some of the memory cells; and performing a re-writing operation on a first memory cell having a resistance state from among a plurality of resistance states that is equal to or less than a critical resistance level.

Abstract: A method of operating a memory device, which includes of memory cells respectively arranged in regions where first signal lines and second lines cross each other, includes determining a plurality of pulses so that each of the plurality of pulses that are sequentially applied to a selected memory cell among the plurality of memory cells is changed according to a number of times of executing programming loops. In response to the change of the plurality of pulses, at least one of a first inhibit voltage and a second inhibit voltage is determined so that a voltage level of at least one of the first and second inhibit voltages that are respectively applied to unselected first and second signal lines connected to unselected memory cells among the plurality of memory cells is changed according to the number of times of executing the programming loops.

Abstract: A method of operating a memory system including memory cells commonly connected to a first signal line in a memory cell array includes; dividing the memory cells according to cell regions, and independently performing read operations on memory cells disposed in each cell region using a read reference selected from a plurality of read references and respectively corresponding to each cell region.

Abstract: A resistive memory device includes a memory cell array including a plurality vertically stacked layers having one layer designated as an interference-free layer and another layer designated as an access prohibited layer, wherein the interference-free layer and the access prohibited layer share a connection with at least one signal line and access operations directed to memory cells the access prohibited layer are prohibited.

Abstract: Provided are a resistive memory device and a method of the resistive memory device. The method of operating the resistive memory device includes performing a pre-read operation on memory cells in response to a write command; performing an erase operation on one or more first memory cells on which a reset write operation is to be performed, determined based on a result of comparing pre-read data from the pre-read operation with write data; and performing set-direction programming on at least some memory cells from among the erased one or more first memory cells and on one or more second memory cells on which a set write operation is to be performed.

Abstract: An operating method for a resistive memory device includes; applying a bias control voltage to a memory cell array of the resistive memory device, measuring leakage current that occurs in the memory cell array in response to the applied bias control voltage to generate a measuring result, generating a control signal based on the measuring result, and adjusting a level of the bias control voltage in response to the control signal.

Abstract: A method of writing data in a resistive memory device having a memory cell array divided into first and second tiles includes; performing a first simultaneous write operation by performing a set write operation performed on resistive memory cells of the first tile while simultaneously performing a reset write operation on resistive memory cells of the second tile in response to the write command, and performing a second simultaneous write operation by performing a reset write operation on resistive memory cells of the first tile while simultaneously performing a set write operation on resistive memory cells of the second tile in response to the write command.

Abstract: In operating a resistive memory device including a number of memory cells, a write pulse is applied to each of the plurality of memory cells such that each of the memory cells has a target resistance state between a first reference resistance and a second reference resistance higher than the first reference resistance. The resistance of each of the memory cells is read by applying a verify pulse to each of the plurality of memory cells. A verify write current pulse is applied to each of the memory cells that has resistance higher than the second reference resistance, and a verify write voltage pulse is applied to each of the memory cells that has resistance lower than the first reference resistance.

Abstract: A nonvolatile memory device, which has an improved read reliability through a refresh operation, and a memory system, are provided. The nonvolatile memory device includes a resistive memory cell, a reference resistor corresponding to the resistive memory cell, a reference sense amplifier electrically connected to the reference resistor and configured to change a transition time of an output value of the reference resistor, and a refresh request signal generator configured to output the refresh request signal for the resistive memory cell when the transition time of an output value of the reference resistor is in a preset refresh requiring period.

Abstract: Provided are a resistive memory device and an operating method for the resistive memory device. The operating method includes detecting a write cycle, determining whether or not to perform a recovery operation by comparing the detected write cycle with a first reference value, and upon determining to perform the recovery operation, performing the recovery operation on target memory cells of the memory cell array.

Abstract: A method of reading a memory device that includes a memory cell that stores data of at least two bits includes determining whether a cell resistance level is no greater than a threshold resistance level. If the cell resistance level is smaller than or equal to the threshold resistance level, then the data is read based on a first factor that is inversely proportional to the cell resistance level. If the cell resistance level is greater than the threshold resistance level, then the data is read based on a second factor that is proportional to the cell resistance level.

Abstract: The nonvolatile memory device using a variable resistance material and a method for driving the same are provided. A first clamping unit connected between a resistance memory cell and a first sensing node to provide a first clamping bias to the resistance memory cell. The first clamping bias changes over time. A first compensation unit provides a compensation current to the first sensing node. A first sense amplifier is connected to the first sensing node to sense a level change of the first sensing node. In response to if first data stored in the resistance memory cell, an output value of the first sense amplifier transitions to a different state after a first amount of time from a time point from where the first clamping bias starts.

Abstract: A resistive memory device including multiple resistive memory cells arranged in regions where first signal lines and second signal lines cross each other, and a method of operating the resistive memory device, are provided. The method includes applying a first voltage to a first line, from among unselected first signal lines connected to unselected memory cells, that is not adjacent to a selected first signal line connected to a selected memory cell from among the multiple memory cells; applying a second voltage that is lower than the first voltage to a second line, from among the unselected first signal lines, that is adjacent to the selected first signal line; floating the unselected first signal lines; and applying a third voltage that is higher than the first voltage to the selected first signal line.

Abstract: A method of programming memory cells of a resistive memory device includes; applying a first current pulse to each of the plurality of memory cells; applying a second current pulse that increases by a first difference compared to the first current pulse to each of the plurality of memory cells to which the first current pulse is applied; and applying a third current pulse that increases by a second difference compared to the second current pulse to each of the plurality of memory cells to which the second current pulse is applied, wherein the first through third current pulses non-linearly increase, and the second difference is greater than the first difference.

Abstract: Methods of operating a memory device include; applying a first set write voltage to a selected first signal line connected to a selected memory cell, applying a first inhibition voltage to non-selected first signal lines connected to non-selected memory cells, and controlling a first voltage of a selected second signal line connected to the selected memory cell to be less than the first set write voltage, and a difference between the first inhibition voltage and the first voltage is less than a threshold voltage of the selection element.