Abstract: The invention provides a semiconductor structure, which comprises a chip comprising a substrate, wherein the substrate has a front surface and a back surface, and the front surface of the substrate comprises a circuit layer, the back surface of the substrate comprises a plurality of microstructures, and a thermal interface material located on the back surface of the substrate, and the thermal interface material contacts the microstructures directly.

Abstract: Labels that include dibromopyridazinedione attached to signal molecules are disclosed, along with methods of producing and using same. Also disclosed are conjugates of the label attached to an analyte-specific binder, as well as methods of producing and using same. Kits containing the labels and/or conjugates are also disclosed, along with microfluidics devices containing same.

Abstract: A protective package assembly includes middle, upper, and lower packages. The middle package includes side buffer boards. The side buffer boards are connected in a ring shape to form an accommodating space communicated with upper and lower openings. The upper package includes an upper buffer board and upper buffer members. The upper buffer board is configured to cover the upper opening. The upper buffer members are distributed at intervals and protrude from a surface of the upper buffer board. The upper buffer members are disposed toward the interior of the accommodating space. The lower package includes a lower buffer board and lower buffer members. The lower buffer board is configured to cover the lower opening. The lower buffer members are distributed at intervals and protrude from a surface of the lower buffer board. The lower buffer members are disposed toward the interior of the accommodating space.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.

Abstract: A method includes the following operations: disconnecting at least one of drain regions that are formed on a first active area, of first transistors, from a first voltage; and disconnecting at least one of drain regions that are formed on a second active area, of second transistors coupled to the first transistors from a second voltage. The at least one of drain regions of the second transistors corresponds to the at least one of drain regions of the first transistors.

Abstract: A low-dropout regulator includes an amplifier circuit, a buffer circuit, a control circuit, a power transistor, and a feedback circuit. The amplifier circuit is configured to operate based on an input voltage and generate a first voltage at a first node according to a reference voltage and a feedback voltage. The buffer circuit is configured to generate a second voltage at a second node according to the first voltage. The control circuit is configured to work with the buffer circuit to form a noise canceller. The noise canceller is coupled between the first node, the second node, and a voltage terminal. The power transistor is configured to generate an output voltage according to the input voltage and the second voltage. The feedback circuit is configured to generate the feedback voltage according to the output voltage.

Abstract: A semiconductor device includes a substrate and a metallization layer. The substrate has an active region that includes opposite first and second edges. The metallization layer is disposed above the substrate, and includes a pair of metal lines and a metal plate. The metal lines extend from an outer periphery of the active region into the active region and toward the second edge of the active region. The metal plate interconnects the metal lines and at least a portion of which is disposed at the outer periphery of the active region.

Abstract: A band saw is disclosed that includes a frame, a guide wheel, and a blade disposed around the guide wheel. A guide wheel chassis can be movably disposed on the frame, the guide wheel rotatably disposed on the guide wheel chassis. The band saw can include a blade tension adjustment assembly including a tensioning motor, wherein operation of the tensioning motor produces movement of the guide wheel chassis and the guide wheel relative to the frame to adjust the tension of the blade. A tension gauge can be positioned to determine a tension in the blade, and a controller can be communicated with the tensioning motor and the tension gauge, the controller operable to receive tension data from the tension gauge and control operation of the tensioning motor based on the tension data to control the tension of the blade.

Abstract: A door device includes a door body and a substrate retaining assembly. The substrate retaining assembly is disposed on a side of the door body. The substrate retaining assembly includes a retaining body and a plurality of retaining members. The retaining members are disposed on the retaining body and arranged at intervals. Each of the retaining members includes two elastic arms and a clamping structure. The clamping structure includes a clamping body, a clamping groove, and at least one relief portion. The clamping body is connected between the two elastic arms. The clamping groove is located on the clamping body and is communicated with adjacent ends of the elastic arms. The relief portion and the clamping groove are communicated to each other.

Abstract: An air valve with a SMA wire for switching is located in an air chamber in which at least two air holes are formed. The air valve comprises a base, an air piston, a driving component, and the SMA wire. The base is provided with two supporting blocks, and two conduction components near one of the two supporting blocks. The air piston determines a ventilation state of one of the two air holes. The air piston comprises a rod body on the two supporting blocks and with a first triggering part, and a spring sleeved on the rod body. The driving component is sleeved on the rod body and with a second triggering part matched with the first triggering part. The SMA wire is connected with the two conduction components and the driving component, and is turned by the supporting block opposite to the two conduction components.

Abstract: A resonant converter having a pre-conduction mechanism for realizing a wide output voltage range is provided. The resonant converter includes a first circuit and a second circuit. The first circuit includes a plurality of primary-side switches. The plurality of primary-side switches includes a first high-side switch, a second high-side switch, a first low-side switch and a second low-side switch. The second circuit includes a plurality of secondary-side switches. The plurality of secondary-side switches includes a third high-side switch, a fourth high-side switch, a third low-side switch and a fourth low-side switch. When the second low-side switch and the first low-side switch are turned on and a current time reaches a preset on time, the fourth high-side switch and the third low-side switch are turned on.

Abstract: Generally, this disclosure provides systems, devices, methods and computer readable media for dynamic configuration and enforcement of access lanes to I/O controllers. The System may include a plurality of Input/Output (I/O) controllers and a plurality of lanes. The system may also include a lane mapping module configured to multiplex at least one of the I/O controllers to at least one of the lanes based on a configuration. The system may further include a first processor configured to detect a change request, the change request to modify the configuration from an existing configuration to a new configuration; and a second processor configured to: verify that the new configuration is valid based on a stock keeping unit (SKU) associated with the system; and, if the verification is successful, store the new configuration in non-volatile memory and reset the system.

Abstract: An integrated circuit includes a semiconductor substrate, first tap regions, second tap regions, and first gate structures. The semiconductor substrate includes a first active region. The first and second tap regions in the semiconductor substrate and on opposite sides of the first active region. The first gate structures are over the first active region. A distance between the first tap region and a first one of the first gate structures adjacent the first tap region is greater than a distance between the second tap region and a second one of the first gate structures adjacent the second tap region.

Abstract: A method for manufacturing a fabric with an intelligently-designed digitally-printed pattern with energy saving effect is disclosed. It includes S1: knitting a cotton yarn, a bamboo fiber yarn, and a mulberry silk yarn into a silk-cotton plain knitted single-sided fabric; S2: subjecting the fabric to a double-sided singeing; S3: mercerizing the fabric obtained in step S2; S4: subjecting the mercerized fabric to a neutralizing processing, a bleaching processing, a deoxidating processing, and a whitening processing in sequence; S5: setting the base color of the fabric obtained in step S4; S6: subjecting the fabric obtained in step S5 to a sizing and setting treatment, a pattern design treatment, a digital printing, a steaming treatment, and a water washing treatment; S7: subjecting the fabric obtained in step S6 to a soft setting; S8: subjecting the fabric obtained in step S7 to a decating treatment; and S9: pre-shrinking the fabric obtained in S8.

Abstract: This disclosure relates to a material set including a build material for 3-D printing including particles of a polymer comprising polymer chains having at least one reactive group that is protected with a protecting group. The material set further includes an inkjet composition including a de-protecting agent for removal of the protecting group, and a liquid carrier.

Abstract: A carrier for a storage device is provided. The carrier includes an accommodation bracket, a panel and an electromagnetic shielding element. The accommodation bracket has an open space. The panel has a handle. The electromagnetic shielding element is disposed between the accommodation bracket and the panel. The electromagnetic shielding element is engaged with the accommodation bracket.

Abstract: Compositions including polyamides and methods of employing compositions including polyamides are described herein. For instance, composition for three-dimensional (3D) printing can include a polymer build material comprising of at least two polyamides including a first polyamide and a second polyamide, where the first polyamide is present in an amount ranging of from about 95% to about 99% of a total weight of the polymer build material and where the second polyamide is present in an amount ranging of from about 1% to about 5% of the total weight of the polymer build material.

Abstract: An integrated circuit includes a semiconductor substrate, devices, first tap regions, and second tap regions. The devices are over the semiconductor substrate. The first tap regions are over the semiconductor substrate along a first direction. The second tap regions are over the semiconductor substrate along the first direction. A first pitch between adjacent two of the first tap regions in the first direction is greater than a second pitch between adjacent two of the second tap regions in the first direction.

Abstract: An electronic device and an antenna structure are provided. The electronic device includes a metal housing, a partition wall, a first antenna module, and a second antenna module. The metal housing has a T-shaped slot. The slot includes an opening end, a first closed end, and a second closed end. The partition wall is connected with the metal housing. The first antenna module has a first feeding element and a radiating element. The second antenna module has a second feeding element and an antenna array. The first antenna module and the second antenna module are respectively disposed on two sides of the partition wall, and the first antenna module is closer to the opening end than the second antenna module.