Patents by Inventor Yi Feng

Yi Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230290745
    Abstract: A semiconductor device includes a substrate and a metallization layer. The substrate has an active region that includes opposite first and second edges. The metallization layer is disposed above the substrate, and includes a pair of metal lines and a metal plate. The metal lines extend from an outer periphery of the active region into the active region and toward the second edge of the active region. The metal plate interconnects the metal lines and at least a portion of which is disposed at the outer periphery of the active region.
    Type: Application
    Filed: May 18, 2023
    Publication date: September 14, 2023
    Inventor: Yi-Feng Chang
  • Publication number: 20230275878
    Abstract: Systems, methods, and apparatus for satellite operations with a secure enclave for secure hosted payload operations are disclosed. In one or more embodiments, a disclosed method for payload operations comprises receiving, by a command receiver on a vehicle (e.g., a satellite), host commands from a host spacecraft operations center (SOC). The method further comprises reconfiguring a host payload on the vehicle according to the host commands. Also the method comprises transmitting, by a telemetry transmitter on the vehicle, host payload telemetry to the host SOC. In addition, the method comprises receiving, by a payload antenna on the vehicle, hosted commands from a secure enclave of the host SOC. Additionally, the method comprises reconfiguring a hosted payload on the vehicle according to the hosted commands. Further, the method comprises transmitting, by the payload antenna, host payload data, hosted payload data, and hosted telemetry to the secure enclave of the host SOC.
    Type: Application
    Filed: May 10, 2023
    Publication date: August 31, 2023
    Inventors: Robert J. Winig, Yi-Feng J. Chen
  • Patent number: 11739214
    Abstract: Compositions including polyamides and methods of employing compositions including polyamides are described herein. For instance, composition for three-dimensional (3D) printing can include a polymer build material comprising of at least two polyamides including a first polyamide and a second polyamide, where the first polyamide is present in an amount ranging of from about 95% to about 99% of a total weight of the polymer build material and where the second polyamide is present in an amount ranging of from about 1% to about 5% of the total weight of the polymer build material.
    Type: Grant
    Filed: June 10, 2022
    Date of Patent: August 29, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Carolin Fleischmann, Rachael Donovan, Shannon Reuben Woodruff, Yi Feng
  • Publication number: 20230252002
    Abstract: A performance adjusting method and apparatus for a file system architecture. The method includes: determining a plurality of internet bandwidths among a client, an Object Storage Server (OSS), and a storage controller in a file system architecture; determining an overall network architecture of the file system architecture and a maximum transmission bandwidth of the file system architecture; testing read-write performance of a single Object Storage Target (OST) to calculate an Input/Output (IO) processing capability of a storage node; determining whether the maximum transmission bandwidth matches the IO processing capability of the storage node to add or reduce a storage array accordingly to adjust a number of OSTs; executing a performance benchmark test to determine IO read-write performance of the file system architecture; and determining whether the maximum transmission bandwidth matches the IO read-write performance to adjust a number of OSSs or a number of storage arrays accordingly.
    Type: Application
    Filed: January 26, 2021
    Publication date: August 10, 2023
    Inventors: Yi FENG, Xinxiu ZHANG
  • Publication number: 20230251865
    Abstract: In example implementations, an apparatus is provided. The apparatus includes an interface, a previous generation carrier connected to the interface, a controller communicatively coupled to the interface, and a basic input/output system (BIOS). The previous generation carrier includes a current generation memory card. The controller is to detect the previous generation carrier. The BIOS is to set the interface to operate at a speed associated with the previous generation carrier in response to detection of the previous generation carrier.
    Type: Application
    Filed: February 9, 2022
    Publication date: August 10, 2023
    Inventors: CHAO-WEN CHENG, WEN SHIH CHEN, CHEN-PANG CHANG, YI-FENG LIN
  • Patent number: 11718024
    Abstract: This disclosure relates to a material set including a build material for 3-D printing including particles of a polymer comprising polymer chains having at least one reactive group that is protected with a protecting group. The material set further includes an inkjet composition including a de-protecting agent for removal of the protecting group, and a liquid carrier.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: August 8, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Shannon Reuben Woodruff, Ali Emamjomeh, Yi Feng, Erica Fung, Carolin Fleischmann, Geoffrey Schmid
  • Patent number: 11720455
    Abstract: A method and an apparatus for migrating virtual machine includes monitoring a status of a compute node; determining whether the compute node meets a trigger condition; wherein the trigger condition comprising a time period of lost connection of the compute node reaches a predetermined time period, or an unstable status of the compute node; and if the compute node meets the trigger condition, transmitting a message to a control node to migrate the VM.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: August 8, 2023
    Assignee: Fulian Precision Electronics (Tianjin) Co., LTD.
    Inventors: Yu-Sheng Chu, Yi-Feng Chen
  • Publication number: 20230218623
    Abstract: A salt of a neuroceutical and of an acid, wherein the neuroceutical is a substituted benzodiazepine, a substituted benzothiazepine, a substituted pyridopyrimidines or a substituted amino-cyclohexaneacetic acid; and the acid is benzoic acid, nicotinic acid, pantothenic acid and tannic acid. The molar ratio of the neuroceutical and the acid in the salt ranges from about 6:1 to about 1:5. Also disclosed herein are compositions comprising the neuroceutical salt and therapeutic uses thereof for treating a central nervous system (CNS) disorder or a metabolic disorder associated with the CNS disorder.
    Type: Application
    Filed: May 5, 2021
    Publication date: July 13, 2023
    Inventors: Guochuan Emil Tsai, Ching-Cheng Wang, Tien-Lan Hsieh, Yi-Feng Huang, Hsin-Hsin Yang, Ming-Hong Chien, Han-Yi Hsieh, Wei-Hua Chang
  • Publication number: 20230221898
    Abstract: In example implementations, an apparatus is provided. The apparatus includes a polymer based enclosure, an absorber, and a connection interface. The polymer based enclosure is shaped to enclose a memory module connected to a memory module connection interface on a printed circuit board. The absorber is coated over the polymer based enclosure to block radio frequency signals generated by the memory modules. The connection interface is to connect to the memory module connection interface.
    Type: Application
    Filed: January 13, 2022
    Publication date: July 13, 2023
    Inventors: Ying-Chi Chou, Chien Fa Huang, Yi-Feng Lin
  • Publication number: 20230216173
    Abstract: An electronic device and an antenna structure are provided. The electronic device includes a metal housing, a partition wall, a first antenna module, and a second antenna module. The metal housing has a T-shaped slot. The slot includes an opening end, a first closed end, and a second closed end. The partition wall is connected with the metal housing. The first antenna module has a first feeding element and a radiating element. The second antenna module has a second feeding element and an antenna array. The first antenna module and the second antenna module are respectively disposed on two sides of the partition wall, and the first antenna module is closer to the opening end than the second antenna module.
    Type: Application
    Filed: June 8, 2022
    Publication date: July 6, 2023
    Inventors: Hsuan-Jui CHANG, Hsieh-Chih LIN, Guan-Ren SU, Wei-Shan CHANG, Yi-Feng WU, Shang-Sian YOU
  • Patent number: 11693807
    Abstract: Generally, this disclosure provides systems, devices, methods and computer readable media for dynamic configuration and enforcement of access lanes to I/O controllers. The System may include a plurality of Input/Output (I/O) controllers and a plurality of lanes. The system may also include a lane mapping module configured to multiplex at least one of the I/O controllers to at least one of the lanes based on a configuration. The system may further include a first processor configured to detect a change request, the change request to modify the configuration from an existing configuration to a new configuration; and a second processor configured to: verify that the new configuration is valid based on a stock keeping unit (SKU) associated with the system; and, if the verification is successful, store the new configuration in non-volatile memory and reset the system.
    Type: Grant
    Filed: March 19, 2021
    Date of Patent: July 4, 2023
    Assignee: Intel Corporation
    Inventors: Balaji Parthasarathy, Ramamurthy Krithivas, Bradley A. Burres, Pawel Szymanski, Yi-Feng Liu
  • Patent number: 11689509
    Abstract: Systems, methods, and apparatus for satellite operations with a secure enclave for secure hosted payload operations are disclosed. In one or more embodiments, a disclosed method for payload operations comprises receiving, by a command receiver on a vehicle (e.g., a satellite), host commands from a host spacecraft operations center (SOC). The method further comprises reconfiguring a host payload on the vehicle according to the host commands. Also the method comprises transmitting, by a telemetry transmitter on the vehicle, host payload telemetry to the host SOC. In addition, the method comprises receiving, by a payload antenna on the vehicle, hosted commands from a secure enclave of the host SOC. Additionally, the method comprises reconfiguring a hosted payload on the vehicle according to the hosted commands. Further, the method comprises transmitting, by the payload antenna, host payload data, hosted payload data, and hosted telemetry to the secure enclave of the host SOC.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: June 27, 2023
    Assignee: The Boeing Company
    Inventors: Robert J. Winig, Yi-Feng J. Chen
  • Patent number: 11688702
    Abstract: A semiconductor device includes a substrate and a metallization layer. The substrate has an active region that includes opposite first and second edges. The metallization layer is disposed above the substrate, and includes a pair of metal lines and a metal plate. The metal lines extend from an outer periphery of the active region into the active region and toward the second edge of the active region. The metal plate interconnects the metal lines and at least a portion of which is disposed at the outer periphery of the active region.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: June 27, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventor: Yi-Feng Chang
  • Patent number: 11688701
    Abstract: A semiconductor device includes a substrate and a metallization layer. The substrate has an active region that includes opposite first and second edges. The metallization layer is disposed above the substrate, and includes a pair of metal lines and a metal plate. The metal lines extend from an outer periphery of the active region into the active region and toward the second edge of the active region. The metal plate interconnects the metal lines and at least a portion of which is disposed at the outer periphery of the active region.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: June 27, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventor: Yi-Feng Chang
  • Publication number: 20230197802
    Abstract: A method according to the present disclosure includes forming a fin-shaped structure protruding from a substrate, forming a gate structure intersecting the fin-shaped structure, forming a gate spacer on a sidewall of the gate structure, and forming a conductive feature above the fin-shaped structure. The gate spacer is laterally between the gate structure and the conductive feature. The method also includes depositing a dielectric layer over the gate structure and the conductive feature, performing an etching process, thereby forming an opening through the dielectric layer and exposing top surfaces of the conductive feature and the gate structure, recessing the gate spacers through the opening, thereby exposing the sidewall of the gate structure, and forming a contact feature in the opening, wherein the contact feature is in contact with the conductive feature and has a bottom portion protruding downward to be in contact with the sidewall of the gate structure.
    Type: Application
    Filed: June 4, 2022
    Publication date: June 22, 2023
    Inventors: Jui-Lin Chen, Chao-Hsun Wang, Hsin-Wen Su, Yi-Feng Ting, Chi Hua Wang, I-Hung Li, Yuan-Tien Tu, Fu-Kai Yang, Mei-Yun Wang, Ping-Wei Wang, Lien Jung Hung
  • Patent number: 11679553
    Abstract: The present disclosure relates to a composition for printing a three-dimensional object. The composition comprises composite particles comprising a thermoplastic polymer and a colour-masking pigment. The colour-masking pigment is encapsulated by the thermoplastic polymer and is present in an amount of from about 1.5 to less than about 6 wt % of the total weight of the composite particles.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: June 20, 2023
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Carolin Fleischmann, Hector Lebron, Yi Feng, Jesiska Tandy, Alay Yemane, Ali Emamjomeh
  • Publication number: 20230186642
    Abstract: An object detection method includes steps that are to be performed for each piece of point cloud data received from a lidar module, of selecting a first to-be-combined image from among images received from a camera device that corresponds in time to the piece of point cloud data, selecting a second to-be-combined image from among the images that is the Nth image before the first to-be-combined image in the time order, combining the first to-be-combined image and the second to-be-combined image to generate a combined image, generating a result image by incorporating the piece of point cloud data into the combined image, and inputting the result image into a trained machine learning model in order to determine a class to which each object in the result image belongs.
    Type: Application
    Filed: December 15, 2021
    Publication date: June 15, 2023
    Inventors: Yun-Ling CHANG, Yi-Feng SU, Ying-Ren CHEN
  • Patent number: 11656713
    Abstract: A touch indicating cover includes a light-guide plastic piece, a printed circuit layer, an ink layer, a passivation layer, and a light-emitting component. The light-guide plastic piece has a first surface and a second surface opposite to each other, wherein the second surface of the light-guide plastic piece comprises a plurality of microstructures. The printed circuit layer is disposed on the first surface of the light-guide plastic piece. The ink layer is disposed on the printed circuit layer and the first surface of the light-guide plastic piece, wherein the ink layer comprises a light-emitting pattern region corresponding to the microstructures. The passivation film is disposed on the ink layer. The light-emitting component is embedded in the first surface of the light-guide plastic piece and connected to the printed circuit layer, wherein the light-emitting component is disposed adjacent the light-emitting pattern region.
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: May 23, 2023
    Assignee: DARWIN PRECISIONS CORPORATION
    Inventors: Yu-Jen Lai, Yi-Feng Chen
  • Publication number: 20230155511
    Abstract: A resonant converter having a pre-conduction mechanism for realizing a wide output voltage range is provided. The resonant converter includes a first circuit and a second circuit. The first circuit includes a plurality of primary-side switches. The plurality of primary-side switches includes a first high-side switch, a second high-side switch, a first low-side switch and a second low-side switch. The second circuit includes a plurality of secondary-side switches. The plurality of secondary-side switches includes a third high-side switch, a fourth high-side switch, a third low-side switch and a fourth low-side switch. When the second low-side switch and the first low-side switch are turned on and a current time reaches a preset on time, the fourth high-side switch and the third low-side switch are turned on.
    Type: Application
    Filed: February 28, 2022
    Publication date: May 18, 2023
    Inventors: JING-YUAN LIN, HSUAN-YU YUEH, Yi-Feng Lin, Che-Yu Chang
  • Publication number: 20230135741
    Abstract: A method for manufacturing a fabric with an intelligently-designed digitally-printed pattern with energy saving effect is disclosed.
    Type: Application
    Filed: February 5, 2021
    Publication date: May 4, 2023
    Inventors: Guo Zhu FU, Yi Feng WANG, Ke ZHOU