Patents by Inventor Yi Jiang

Yi Jiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11799193
    Abstract: An electronic device may be provided with wireless circuitry. The wireless circuitry may include one or more antennas. The antennas may include millimeter wave antenna arrays. Non-millimeter-wave antennas such as cellular telephone antennas may have conductive structures separated by a dielectric gap. In a device with a metal housing, a plastic-filled slot may form the dielectric gap. The conductive structures may be slot antenna structures, inverted-F antenna structures such as an inverted-F antenna resonating element and a ground, or other antenna structures. The plastic-filled slot may serve as a millimeter wave antenna window. A millimeter wave antenna array may be mounted in alignment with the millimeter wave antenna window to transmit and receive signals through the window. Millimeter wave antenna windows may also be formed from air-filled openings in a metal housing such as audio port openings.
    Type: Grant
    Filed: December 1, 2020
    Date of Patent: October 24, 2023
    Assignee: Apple Inc.
    Inventors: Yuehui Ouyang, Yi Jiang, Matthew A. Mow, Mattia Pascolini, Ruben Caballero, Basim Noori
  • Publication number: 20230333376
    Abstract: A head-mounted device may have a head-mounted housing. The head-mounted housing may have rear-facing displays that display images for a user. The images are viewable from eye boxes while the head-mounted device is being worn by the user. A peripheral conductive member may run along a peripheral edge of the front face of the housing. Dielectric-filled gaps may divide the peripheral conductive member into elongated conductive segments. The conductive segments may form antenna resonating elements for antennas on the front face. Radio-frequency transceiver circuitry such as cellular telephone transceiver circuitry may be coupled to the antennas.
    Type: Application
    Filed: February 8, 2023
    Publication date: October 19, 2023
    Inventors: Lijun Zhang, Jiangfeng Wu, Lu Zhang, Mattia Pascolini, Siwen Yong, Yi Jiang
  • Publication number: 20230335430
    Abstract: The present disclosure relates to a semiconductor structure and a manufacturing method thereof. The method of manufacturing a semiconductor structure includes: providing a base; forming a plurality of first trenches arranged in parallel at intervals and extending along a first direction, and an initial active region between two adjacent ones of the first trenches, wherein the initial active region includes a first initial source-drain region close to a bottom of the first trench, a second initial source-drain region away from the bottom of the first trench, and an initial channel region located between the first initial source-drain region and the second initial source-drain region; forming a protective dielectric layer, wherein the protective dielectric layer covers a sidewall of the second initial source-drain region and a sidewall of the initial channel region; thinning the first initial source-drain region.
    Type: Application
    Filed: June 27, 2022
    Publication date: October 19, 2023
    Inventors: Guangsu Shao, Deyuan Xiao, Yunsong Qiu, Youming Liu, Yi Jiang, Xingsong Su, Yuhan Zhu
  • Publication number: 20230314592
    Abstract: A head-mounted device may have a head-mounted housing. A radar sensor may be mounted in the housing. The head-mounted housing may have rear-facing displays that display images for a user. The images are viewable from eye boxes while the head-mounted device is being worn by the user. A forward-facing camera may capture real-world image content. The rear-facing displays may be used to display captured real-world image content merged with computer-generated image content. The forward-facing camera and the radar sensor may be mounted under inactive display borders of a forward-facing display. The radar sensor may have a horizontal array of patch antenna elements configured to form a phased antenna array. Communications circuitry in the head-mounted device may use the phased antenna array to transmit and receive wireless communications signals.
    Type: Application
    Filed: February 22, 2023
    Publication date: October 5, 2023
    Inventors: Lijun Zhang, Jiangfeng Wu, Mattia Pascolini, Siwen Yong, Yi Jiang
  • Publication number: 20230305321
    Abstract: A head-mounted device may have a head-mounted housing. The head-mounted housing may have displays that display images for a user through lenses. The displays and lenses may be mounted in left and right optical modules. Attachment structures such as magnets may be used to removably attach left and right vision correction lenses to the left and right optical modules, respectively. The images may be viewed from eye boxes through the vision correction lenses while the head-mounted device is being worn by the user. The vision correction lenses and the head-mounted device may be provided with near-field communications antennas. The antennas may be formed from coils that surround corrective lens elements in the vision correction lenses. In the head-mounted device, antennas may be formed from coils surrounding the lenses in the optical modules and/or may include other coil(s).
    Type: Application
    Filed: February 22, 2023
    Publication date: September 28, 2023
    Inventors: Lijun Zhang, Jiangfeng Wu, Mattia Pascolini, Siwen Yong, Yi Jiang
  • Publication number: 20230305302
    Abstract: A head-mounted device such as a pair of glasses may have display systems. The display systems may present images to eye boxes for viewing by a user. The glasses may have clear lenses through which real-world objects may be viewed from the eye boxes. The glasses may have a metal frame that surrounds the lenses and may have temples that are coupled to the frame using hinges. Radio-frequency transceiver circuitry such as cellular telephone transceiver circuitry may be coupled to one or more antennas in the head-mounted device. The antennas may have antenna resonating elements formed by placing dielectric-filled gaps in the metal frame to divide the frame into segments. Antenna resonating elements formed from segments of the metal frame may be coupled to the radio-frequency transceiver circuitry using transmission lines.
    Type: Application
    Filed: February 17, 2023
    Publication date: September 28, 2023
    Inventors: Lijun Zhang, Jiangfeng Wu, Lu Zhang, Mattia Pascolini, Siwen Yong, Yi Jiang
  • Publication number: 20230301214
    Abstract: According to various embodiments, there may be provided an interposer. The interposer including: a substrate; a dielectric layer disposed on the substrate; a via disposed entirely within the dielectric layer; a resistive film layer disposed to line the via; a metal interconnect disposed in the resistive layer lined via; and a plurality of metal lines disposed in the dielectric layer, the plurality of metal lines including a first metal line connected to the metal interconnect, a second metal line connected to the resistive film layer at a first point, and a third metal line connected to the resistive film layer at a second point.
    Type: Application
    Filed: March 18, 2022
    Publication date: September 21, 2023
    Inventors: Lup San LEONG, Juan Boon TAN, Benfu LIN, Yi JIANG
  • Publication number: 20230301054
    Abstract: A method for forming a memory includes the following operations: a substrate and a semiconductor layer located on the substrate are formed; the semiconductor layer is patterned to form a plurality of first isolation structures and channel regions, each first isolation structure includes a first through hole and a second through hole, and a first isolation pillar located between the first through hole and the second through hole; a first filling layer filling up the first through hole and the second through hole is formed; the first isolation pillar is removed to form a third through hole located in the first filling layer; a barrier layer filling up the third through hole is formed; the channel regions are exposed by removing the first filling layer; and a gate layer covering surfaces of the channel regions is formed.
    Type: Application
    Filed: June 20, 2022
    Publication date: September 21, 2023
    Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventors: Juanjuan HUANG, YI JIANG, Weiping BAI, Deyuan XIAO
  • Patent number: 11752800
    Abstract: A non-pneumatic tire includes a tread layer and a spoke layer including an inner cylinder and several spoke assemblies. The tread layer is annular and has a maximum outer diameter of the non-pneumatic tire and is adapted to be in contact with a ground. The spoke assemblies extend in a radial direction of the non-pneumatic tire and are arranged around an axial core of the non-pneumatic tire. An end of each spoke assembly is connected to the inner cylinder, and another end thereof is connected to the tread layer. Each spoke assembly includes a straight spoke, a bending spoke, and a connecting rib. Each bending spoke includes a first segment and a second segment, which are not connected in a straight line. Each connecting rib has a first end connected to the straight spoke and a second end opposite to the first end and connected to the bending spoke. When the non-pneumatic tire bears a weight and is squeezed, the spoke assemblies do not get in contact with one another.
    Type: Grant
    Filed: August 20, 2020
    Date of Patent: September 12, 2023
    Assignee: KENDA RUBBER IND. CO., LTD.
    Inventors: Chi-Jen Yang, Min-Fan Huang, Jia-Yi Jiang
  • Patent number: 11755098
    Abstract: The disclosure discloses an intelligent terminal energy saving method based on artificial intelligence (AI) prediction. The method includes: collecting application (APP)-related operation data on the intelligent terminal; carrying out AI analysis on the APP-related operation data collected, to predict timing and a restriction measurement to restrict an APP in a background; and adopting the restriction measurement to restrict the APP in the background at the timing predicted. Corresponding to the method, the disclosure further discloses an intelligent terminal energy saving device based on AI prediction. Using the technical schemes disclosed in the disclosure, the power consumption of applications on a portable intelligent terminal can be reduced, and the battery life can be extended, without affecting the user experience.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: September 12, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hai Sun, Wei Su, Yi Jiang, Zhigang Dong, Hua Liu, Chunhai Liu, Xiaokai Tang
  • Patent number: 11744085
    Abstract: A semiconductor device includes a first insulating layer; a second insulating layer arranged over the first insulating layer; a memory structure arranged within a memory region and including a resistance changing memory element within the first insulating layer; and a logic structure arranged within a logic region. In the memory region, the first insulating layer may contact the second insulating layer and in the logic region, the semiconductor device may further include a stop layer arranged between the first insulating layer and the second insulating layer.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: August 29, 2023
    Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
    Inventors: Benfu Lin, Yi Jiang, Lup San Leong, Juan Boon Tan
  • Publication number: 20230260815
    Abstract: The present disclosure provides a multi-substrate handling system having an alignment apparatus capable of positioning each of a set of substrates in predetermined orientations for transfer. A buffer chamber is configured to receive and condition the set of substrates which are disposed on a substrate carrier. A first transfer assembly is configured to transfer the set of substrates to and from the buffer chamber and is capable of transferring each of the set of substrates from the alignment apparatus to the carrier in the buffer chamber. The carrier includes a plurality of modules capable of securing the set of substrates. The system includes a second transfer assembly having at least two robots configured to transfer the carrier of the set of substrates between the buffer chamber and a process chamber. The process chamber is capable of processing the set of substrates using different process parameters for each substrate.
    Type: Application
    Filed: June 16, 2021
    Publication date: August 17, 2023
    Inventors: Hsiu-jen WANG, Sin-Yi JIANG, Neng-rui DONG, Shih-Hao KUO, Chia-Hung KAO, Bang-Yu LIU, Hsu-Ming HSU
  • Patent number: 11705148
    Abstract: Technologies are disclosed for improving the efficiency of real-time audio processing, and specifically for improving the efficiency of continuously modifying a real-time audio signal. Efficiency is improved by reducing memory bandwidth requirements and by reducing the amount of processing used to modify the real-time audio signal. In some configurations, memory bandwidth requirements are reduced by selectively transferring active samples in the frequency domain—e.g. avoiding the transfer samples with amplitudes of zero or near-zero. This has particular importance when the specialized hardware retrieves samples from main memory in real-time. In some configurations, the amount of processing needed to modify the audio signal is reduced by omitting operations that do not meaningfully affect the output audio signal. For example, a multiplication of samples may be avoided when at least one of the samples has an amplitude of zero or near-zero.
    Type: Grant
    Filed: October 13, 2021
    Date of Patent: July 18, 2023
    Assignee: MICROSOFT TECHNOLOGY LICENSING, LLC
    Inventors: Ziyad Ibrahim, Laxmi Narsimha Rao Kakulamarri, Andrew Yi Jiang
  • Publication number: 20230191625
    Abstract: A pick-and-place system includes a movement mechanism, an adjustment mechanism, and a clamping mechanism. The adjustment mechanism includes a first coupling component, a second coupling component, and a driving assembly. The first coupling component is mounted on the movement mechanism. The second coupling component is movably disposed on the first coupling component. The driving assembly is configured to be connected to the first coupling component and the second coupling component so as to force the first coupling component and the second coupling component to move relative to each other. The clamping mechanism is mounted on the second coupling component of the adjustment mechanism.
    Type: Application
    Filed: March 14, 2022
    Publication date: June 22, 2023
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Cheng CHEN, Jun-Yi JIANG, Guan-Wei SU
  • Publication number: 20230189508
    Abstract: Embodiments relate to a method for fabricating a semiconductor structure. The method includes: providing a substrate, where pillars arranged in an array are formed on a surface of the substrate, and bit lines extending along a first direction are formed at bottoms of the pillars; forming, between adjacent two of the pillars, a first groove extending along a second direction; forming an isolation layer on the substrate, where the isolation layer is filled in the first groove and is filled between adjacent two of the bit lines; etching the isolation layer to expose a surface of the pillar, where a first sub isolation layer positioned in the first groove is lower than a second sub isolation layer; forming a word line surrounding a side wall of the pillar, where a surface of the word line is not higher than a surface of the second sub isolation layer; and forming a dielectric layer on the word line.
    Type: Application
    Filed: September 23, 2022
    Publication date: June 15, 2023
    Inventors: Guangsu SHAO, Deyuan XIAO, Yunsong QIU, Yi JIANG
  • Publication number: 20230185506
    Abstract: The method includes: obtaining a changing distance of the retractable display screen in an extending-retracting direction in response to the retractable display screen being extended or retracted; and adjusting a spacing of application icons displayed on a current desktop in the extending-retracting direction according to the changing distance, and/or adjusting a number of the application icons displayed on the current desktop in the extending-retracting direction according to the changing distance.
    Type: Application
    Filed: December 30, 2022
    Publication date: June 15, 2023
    Inventors: Yi JIANG, Biao MA
  • Publication number: 20230173888
    Abstract: The present application discloses an electric vehicle, and a heating cavity assembly of an electric heater of the electric vehicle. The heating cavity assembly includes: an electric heating unit, located in a heating cavity and configured to convert electric energy into heat energy; a flow channel structure, located in a heat exchange cavity, configured to allow a heat transfer medium passing through the flow channel structure to receive heat energy from the electric heating unit and including a plurality of medium flow channels, wherein the plurality of medium flow channels extend in parallel to each other along respective extension track lines with a translation relationship.
    Type: Application
    Filed: May 18, 2021
    Publication date: June 8, 2023
    Inventors: Jian XU, Cheng YANG, Zhiwen SHEN, Peng WANG, Tao CHANG, Yi JIANG
  • Publication number: 20230151820
    Abstract: A range hood, includes a fan system (2), the fan system (2) having a volute (21) and an impeller (22); the volute (21) includes a front cover (211), a rear cover (212) and an annular wall (213); the annular wall (213) has a volute tongue (214); the front cover (211) has an air inlet (215), the air inlet (215) faces downward to make the range hood to be a horizontal range hood; the volute tongue (214) is gradually inclined from the rear cover (212) to the front cover (211) in a direction opposite to the rotation direction of the impeller (22).
    Type: Application
    Filed: October 30, 2020
    Publication date: May 18, 2023
    Applicant: NINGBO FOTILE KITCHEN WARE CO., LTD.
    Inventors: Yi JIANG, Zhineng XU, Gai LEI, Lei SHI, Wenbo GOU
  • Patent number: 11643478
    Abstract: Provided is a low-molecular-weight holothurian glycosarninoglycan, with the constituent units thereof being a glucuronic acid group, an N-acetaminogalactose group and a fucose group, and a sulfate ester group or acetyl ester group thereof. Glucuronic acid and N-acetaminogalactose are interconnected via ?(1-3) and ?(1-4) glucosidic bonds to form a backbone of a disaccharide repeating structural unit, and a fucose group is connected to the backbone as a side chain. On a molar ratio basis, the ratio of the glucuronic acid group:the N-acetaminogalactose group:the fucose group is 1:(0.8-1.2):(0.6-1.2). In the structure of the low-molecular-weight holothurian glycosaminoglycan, 10-30% of glucuronic acid groups are modified, on the 2-position, with a sulfate ester group, and the rest are hydroxyl groups; and a proportion of 10-30% of fucose groups is modified, on the 2-position, with an acetyl ester group, and the rest are hydroxyl or sulfate ester groups.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: May 9, 2023
    Inventors: Yongsheng Jin, Xiujuan Ding, Wu Chen, Xiaoming Li, Junting Sun, Yihao Zhu, Xiaohua Lu, Caijuan Jin, Hua Zhou, Ningxia Wang, Yongbao Li, Qiaoyun Zhou, Jiangen Qian, Xi Chong, Yiming Yao, Yi Jiang
  • Patent number: 11646501
    Abstract: An electronic device may have an antenna embedded in a substrate. The substrate may have first layers, second layers on the first layers, and third layers on the second layers. The antenna may include a first patch on the first layers that radiates in a first band, a second patch on the second antenna layers that radiates in a second band, and a parasitic patch on the third layers. A short path may couple ground to a location on the first patch that allows the first patch to form a ground extension in the second band for the second patch without affecting performance of the first patch in the first band. The first layers may have a higher dielectric permittivity than the second and third layers to minimize the thickness of the substrate without requiring a separate dielectric loading layer over the substrate.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: May 9, 2023
    Assignee: Apple Inc.
    Inventors: Jiangfeng Wu, Siwen Yong, Simon G. Begashaw, Yi Jiang, Lijun Zhang