Abstract: A convenient electronic circuit in which a switch is able to be switched through electric power obtained using weak radio waves is provided.

Abstract: A convenient electronic circuit in which a switch is able to be switched through electric power obtained by weak radio waves is provided.

Abstract: A biometric information detection device according to one embodiment of the present disclosure is configured to be installed in a living body, and includes a sensor, a battery, a mechanical switch, a sealing member, and a holding member. The mechanical switch switches between a conduction state in which power is supplied from the battery to the sensor and a cutoff state in which supply of the power is blocked. The sealing member seals all of the sensor, the battery, and the mechanical switch. The holding member is attached to the living body and holds the sealing member.

Abstract: This biometric information detection device includes: a sensor including a light emitting element that is able to emit light and a light receiving element that is able to receive the light emitted from the light emitting element; a sealing member which includes a first light-transmitting part that covers the light emitting element and is able to transmit the light and a second light-transmitting part that covers the light receiving element and is able to transmit the light, and seals the sensor; and a holding member that is attached to at least one of the teeth and the gums and is able to hold the sealing member.

Abstract: An electronic device includes an insulating base substrate having a through electrode, an electronic element provided on one surface of the insulating base substrate and connected to the through electrode, a lid provided on the one surface of the insulating base substrate, and an external electrode covering an end face of the through electrode that is exposed on another surface of the insulating base substrate different from the one surface thereof. The external electrode has a conductive film, a first electrolytic plating film provided on the conductive film, and a second electrolytic plating film provided on the first electrolytic plating film. The conductive film is provided on the exposed end face of the through electrode and on portions of the another surface of the insulating base substrate in the vicinity of the exposed end face of the through electrode.

Abstract: There are provided a first step of bending adjacent portions of first and second metal members in the same direction and forming a flange overlapping part where respective flange portions of the first and second metal members are overlapped and contact each other, a second step of starting to perform arc welding from a tip of the flange overlapping part, and a third step of continuing to perform the arc welding until molten metal of a core wire and a base material reaches an opposite-side face of the flange overlapping part and zinc gas generated is emitted from a side opposite to an arc-welding performance side of the flange overlapping part.

Abstract: An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed, an electronic element which is electrically connected to the through electrodes and is mounted on one surface of the base substrate, a lid which accommodates the electronic element and is bonded to the one surface of the base substrate, and an external electrode which covers a region from an end face of the through electrode, which is exposed by the other surface of the base substrate, to the other surface in the vicinity of the end face. The external electrode includes a conductive film which covers a region ranging from the end face to the other surface in the vicinity of the end face, and a paste film which covers a surface of the conductive film and is formed of a conductive paste. The paste film is formed by a printing method and is formed of tin or a tin alloy.

Abstract: An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed; an electronic element which is electrically connected to the through electrodes and is mounted on one surface of the base substrate; a lid which accommodates the electronic element and is bonded to the one surface of the base substrate; and an external electrode which covers a region ranging from an end face of the through electrode, which is exposed by the other surface of the base substrate, to the other surface in a vicinity of the end face. The external electrode includes a conductive film which covers a region ranging from the end face to the other surface in the vicinity of the end face, a first electrolytic plating film which is formed on a surface of the conductive film by an electrolytic plating method, and a second electrolytic plating film which is formed on a surface of the first electrolytic plating film by an electrolytic plating method.

Abstract: An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed, an electronic element which is electrically connected to the through electrodes and is mounted on one surface of the base substrate, a lid which accommodates the electronic element and is bonded to the one surface of the base substrate, and an external electrode which covers a region from an end face of the through electrode, which is exposed by the other surface of the base substrate, to the other surface in the vicinity of the end face. The external electrode includes a conductive film which covers a region ranging from the end face to the other surface in the vicinity of the end face, and a paste film which covers a surface of the conductive film and is formed of a conductive paste. The paste film is formed by a printing method and is formed of tin or a tin alloy.

Abstract: Combustible gas, which is easy to be stored, transported and the like and can contribute to improving the quality of a finished state of an operation such as gas cutting, gas welding or brazing, contains ethylene at 38 v/v % or more and 45 v/v % or less and the remainder being hydrogen and unavoidable impurity.

Abstract: Combustible gas, which is easy to be stored, transported and the like and can contribute to improving the quality of a finished state of an operation such as gas cutting, gas welding or brazing, contains ethylene at 38 v/v % or more and 45 v/v % or less and the remainder being hydrogen and unavoidable impurity.

Abstract: A manufacturing method of an electronic device package includes: forming concave portions that later form the cavities in one surface of a cover substrate; forming a first metal film on the cover substrate on a surface opposite to the surface in which the concave portions are formed; forming a second metal film on the cover substrate on the surface in which the concave portions are formed; bonding a base substrate and the cover substrate together via the second metal film. It thus becomes possible to provide an electronic device package in which the base substrate and the cover substrate are boned together via the metal film in a stable manner by minimizing warping of the substrate even when the substrate is made thinner.

Abstract: A package manufacturing method capable of easily manufacturing a penetration electrode-attached base board having excellent shape accuracy with a high degree of flatness without forming cracks or the like is provided. The package manufacturing method includes an insertion hole forming step of forming insertion holes in one surface of a base board wafer so as not to penetrate through the base board wafer; a core portion insertion step of inserting conductive core portions made of a metal material into the insertion holes; a welding step of heating the base board wafer to a temperature higher than the softening point of the glass material so as to weld the base board wafer to the core portions while holding the one surface side of the base board wafer with a receiving mold and pressing the other surface of the base board wafer with a flat pressurizing mold; a cooling step of cooling the base board wafer; and a polishing step of polishing both surfaces of the base board wafer.

Abstract: A piezoelectric vibration device is provided that can reduce the stress and strain that transmit through a base substrate. The piezoelectric vibration device includes a piezoelectric vibrating reed that oscillates in an AT mode, and that includes excitation electrodes respectively formed on the front and back surfaces of the reed. One of the excitation electrodes is connected to the base substrate via a metal bump on a center line passing across the shorter sides of the piezoelectric vibrating reed and in the vicinity of one of the shorter sides of the piezoelectric vibrating reed. The other excitation electrode is connected to the base substrate via a metal bump on the same side as the above shorter side, and in the vicinity of a portion where the shorter side of the piezoelectric vibrating reed crosses one of the longer sides of the piezoelectric vibrating reed.

Abstract: An electronic device is provided in which alignment of a lid substrate 2 and a base substrate 3 is facilitated to reduce the rate of occurrence of defects. The electronic device according to the invention includes a lid substrate, a base substrate bonded to the lid substrate and forming a cavity hermetically sealed from the outside air between the base substrate and the lid substrate, an electronic element housed in the cavity, and a mold member placed on an outer face of the lid substrate or the base substrate. Thus, warping of the lid substrate or the base substrate is reduced.

Abstract: An electrostatic vibrator has a vibrating plate including beam-shaped vibrating parts each fixed at opposite ends thereof and configured for electrostatic actuation to perform flexural vibration, and temperature compensation parts connected to the vibrating parts. A silicon oxide film covers each of the vibrating parts but not the temperature compensation parts. A substrate is mounted in parallel relation to the vibrating plate. An oxide layer is disposed between the substrate to the vibrating plate. Electrodes are formed on the substrate and arranged on opposite sides of each of the vibrating parts.

Abstract: A manufacturing method of an electronic device package includes: forming concave portions that later form the cavities in one surface of a cover substrate; forming a first metal film on the cover substrate on a surface opposite to the surface in which the concave portions are formed; forming a second metal film on the cover substrate on the surface in which the concave portions are formed; bonding a base substrate and the cover substrate together via the second metal film. It thus becomes possible to provide an electronic device package in which the base substrate and the cover substrate are boned together via the metal film in a stable manner by minimizing warping of the substrate even when the substrate is made thinner.

Abstract: An electronic device package manufacturing method includes: forming a metal film on both surfaces of the cover substrate so that the metal film on one surface and the metal surface on the other surface conduct with each other; aligning and superimposing the cover substrate and the base substrate; and bonding the base substrate and the cover substrate together via the metal film by anodic bonding by bringing a negative electrode plate into contact with the base substrate on an entire surface opposite to a surface bonded to the cover substrate, bringing a positive electrode plate into contact with the cover substrate on an entire surface opposite to a surface bonded to the base substrate, and applying a voltage between the positive and negative electrode plates. The base substrate and the cover substrates can be thus bonded together via the metal film by anodic bonding in a stable manner.

Abstract: A high voltage operating field effect transistor has a source region and a drain region spaced apart from each other in a surface of a substrate. The source region is operative to receive at least one of a signal electric potential and a signal current. A semiconductor channel formation region is disposed in the surface of the substrate between the source region and the drain region. A gate region is disposed above the channel formation region and is operative to receive a bias electric potential having an absolute value equal to or larger than a first constant electric potential which changes according to an increase or decrease in a drain electric potential. A gate insulating film region is disposed between the channel formation region and the gate region.

Abstract: In a piezoelectric vibrator in which a piezoelectric vibrating reed is mounted on a mounting portion installed on a surface of the base substrate in a cantilevered state and the piezoelectric vibrating reed is accommodated to be covered by a lid substrate, the resistance of a lead-out electrode for supplying a drive power to the piezoelectric vibrating reed is reduced, thereby preventing degradation of vibrating performance. A first lead-out electrode is formed between a first through-electrode and a mounting portion formed on a base substrate, a conductor film is formed from a bonding member on a bonding surface where the base substrate and a lid substrate are bonded to each other, the first lead-out electrode and the conductor film are electrically connected to each other via the first connection portion in the vicinity of the mounting portion and via the second connection portion in the vicinity of the first through-electrode, thereby reducing the resistance of the first lead-out electrode.