Abstract: A method for manufacturing a package substrate including an insulating layer and a wiring conductor, including: forming, on one or both sides of a core resin layer, a substrate including a peelable first metal layer that has a thickness of 1-70 ?m, a first insulating resin layer, and a second metal layer; forming a non-through hole reaching a surface of the first metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and first metal layers; arranging a second insulating resin layer and a third metal layer and heating and pressurizing the first substrate to form a substrate; forming a non-through hole reaching a surface of the second metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and third metal layers; peeling a third substrate; and patterning the first and third metal layers to form the wiring conductor.

Abstract: A method for manufacturing a package substrate for mounting a semiconductor device including: a first laminate preparing step of preparing a first laminate including a resin layer, a bonding layer that is provided on at least one surface side of the resin layer and includes peeling means, and a first metal layer provided on the bonding layer; a first wiring forming step of forming a first wiring conductor in the first laminate by etching the first metal layer; a second laminate forming step of forming a second laminate by laminating an insulating resin layer and a second metal layer in this order on a surface of the first laminate, the surface being provided with the first wiring conductor; a second wiring forming step of forming a second wiring conductor on the insulating resin layer by forming a non-through hole in the insulating resin layer.

Abstract: The method for producing a printed wiring board according to the present invention with use of a metal-clad laminated sheet including a metal foil laminated on each of both surfaces of an insulating resin base material, the method at least including: a step (1) of irradiating a predetermined position in a surface (A) of the metal-clad laminated sheet with a laser to provide a via hole leading to the metal foil in a surface opposite to the surface (A); and a step (2) of irradiating a predetermined position in a surface (B), located in the opposite side to the surface (A), of the metal-clad laminated sheet with a laser to provide a via hole leading to the metal foil in a surface opposite to the surface (B).

Abstract: A test apparatus is configured to test a DUT that does not support synchronous control from an external circuit. A main controller is configured based on an architecture that tests a device by synchronous control with the main controller itself as the master. A MIU is configured as an interface between the main controller and the DUT. The MIU establishes asynchronous control between it and the DUT with the DUT as the master, and establishes control between it and the main controller with the main controller as the master.

Abstract: A method for manufacturing a package substrate for mounting a semiconductor device including: a first laminate preparing step of preparing a first laminate including a resin layer, a bonding layer that is provided on at least one surface side of the resin layer and includes peeling means, and a first metal layer provided on the bonding layer; a first wiring forming step of forming a first wiring conductor in the first laminate by etching the first metal layer; a second laminate forming step of forming a second laminate by laminating an insulating resin layer and a second metal layer in this order on a surface of the first laminate, the surface being provided with the first wiring conductor; a second wiring forming step of forming a second wiring conductor on the insulating resin layer by forming a non-through hole in the insulating resin layer.

Abstract: A support including a heat resistant film layer and a resin layer, wherein the heat resistant film layer is laminated on at least one side (a first side) of the resin layer, and the resin layer is in a semi-cured state (B stage).

Abstract: Provided is a laminate containing a first resin composition layer, a heat-resistant film layer, and a second resin composition layer laminated in the presented order, wherein the first resin composition layer is in a semi-cured state (B stage), and a difference between a maximum thickness and a minimum thickness of the first resin composition layer is 0.5 to 5 ?m; and the second resin composition layer is in a semi-cured state (B stage), and a difference between a maximum thickness and a minimum thickness of the second resin composition layer is 0.5 to 5 ?m.

Abstract: An electronic member provided in a circuit board having a connector. The connector has a card mounting port and holds a memory card in a state where a tip of the memory card is exposed from the card mounting port at a connection position where a connection terminal of the memory card and a connection terminal of the circuit board are connected. The electronic component includes a device that adds capacitance at a position separated from and facing at least a part of the tip of the memory card, in a state where the memory card is held at the connection position by the connector, and a connector having first and second end portions in which the first end portion is connected to the device that adds capacitance and the second end portion is connected to a ground of the circuit board.

Abstract: A method for producing a laminate that includes at least the following: providing a first intermediate laminate comprising a carrier substrate including a support therein and a peelable metal layer formed on at least one surface of the carrier substrate; forming, in a section not serving as a product of the first intermediate laminate, a first hole reaching at least the support in the carrier substrate from a surface of the first intermediate laminate, to prepare a second intermediate laminate with the first hole; stacking and disposing on the surface where the first hole is formed of the second intermediate laminate, an insulating material and a metal foil in this order when viewed from the surface; and pressurizing the second intermediate laminate, the insulating material and the metal foil in the stacking direction thereof with heating, to prepare a third intermediate laminate where the first hole is filled with the insulating material; and performing treatment with a chemical agent on the third intermedia

Abstract: An image pickup apparatus includes a stage configured to support a sample at a plurality of support points, a bending data acquisition unit configured to acquire bending data corresponding to a bending of the sample supported on the stage, a height information detection unit configured to detect a height of the sample supported on the stage, a difference value calculation unit configured to calculate a difference value between a height indicated by height information and a height indicated by the bending data at each of a plurality of points on the sample, a correction data calculation unit configured to calculate correction data based on the difference value, and an estimation unit configured to calculate estimation data for estimating the height of the sample by correcting the bending data using the correction data.

Abstract: The method for producing a laminate having a patterned metal foil includes masking the whole surface of a first metal foil in a laminate having the first metal foil, a first insulating resin layer having a thickness of 1 to 200 ?m and a second metal foil laminated in this order, and patterning the second metal foil.

Abstract: A prepreg including: a thermosetting resin composition (C) containing a thermosetting resin (A) and an inorganic filler (B); and a glass cloth (D) impregnated or coated with the thermosetting resin composition (C); wherein the glass cloth (D) satisfies the following expressions (I) to (III), (x+y)?95??(I) 1.9<(X+Y)/(x+y)??(II) t<20??(III) wherein the glass cloth (D) is defined by X (threads/inch) representing number of warp yarn per inch; Y (threads/inch) representing number of weft yarn per inch; x (threads) representing number of filament per the warp yarn; y (threads) representing number of filament per the weft yarn; and t (?m) representing a thickness, and wherein the content of the inorganic filler (B) in the thermosetting resin composition (C) is from 110 to 700 parts by mass based on 100 parts by mass of the thermosetting resin (A).

Abstract: A method for manufacturing a package substrate for mounting a semiconductor device, including a substrate forming step (a) of forming a supporting substrate for circuit formation including a first insulating resin layer, a release layer including at least a silicon compound, and ultrathin copper foil having a thickness of 1 ?m to 5 ?m, in this order; a first wiring conductor forming step (b) of forming a first wiring conductor on the ultrathin copper foil of the supporting substrate for circuit formation by pattern copper electroplating; a lamination step (c) of disposing a second insulating resin layer so as to be in contact with the first wiring conductor, and heating and pressurizing the second insulating resin layer for lamination; a second wiring conductor forming step (d) of forming in the second insulating resin layer a non-through hole reaching the first wiring conductor and connecting an inner wall of the non-through hole.

Abstract: A test apparatus is configured to test a DUT that does not support synchronous control from an external circuit. A main controller is configured based on an architecture that tests a device by synchronous control with the main controller itself as the master. A MIU is configured as an interface between the main controller and the DUT. The MIU establishes asynchronous control between it and the DUT with the DUT as the master, and establishes control between it and the main controller with the main controller as the master.

Abstract: An electronic member provided in a circuit board having a connector. The connector has a card mounting port and holds a memory card in a state where a tip of the memory card is exposed from the card mounting port at a connection position where a connection terminal of the memory card and a connection terminal of the circuit board are connected. The electronic component includes a device that adds capacitance at a position separated from and facing at least a part of the tip of the memory card, in a state where the memory card is held at the connection position by the connector, and a connector having first and second end portions in which the first end portion is connected to the device that adds capacitance and the second end portion is connected to a ground of the circuit board.

Abstract: A support including a heat resistant film layer and a resin layer, wherein the heat resistant film layer is laminated on at least one side (a first side) of the resin layer, and the resin layer is in a semi-cured state (B stage).

Abstract: The method for producing a printed wiring board according to the present invention with use of a metal-clad laminated sheet including a metal foil laminated on each of both surfaces of an insulating resin base material, the method at least including: a step (1) of irradiating a predetermined position in a surface (A) of the metal-clad laminated sheet with a laser to provide a via hole leading to the metal foil in a surface opposite to the surface (A); and a step (2) of irradiating a predetermined position in a surface (B), located in the opposite side to the surface (A), of the metal-clad laminated sheet with a laser to provide a via hole leading to the metal foil in a surface opposite to the surface (B).

Abstract: The present invention provides a cutting method comprising a cutting step of cutting a workpiece material with a cutting tool to thereby form a through-groove in the workpiece material, wherein in the cutting step, the through-groove is formed in the workpiece material by cutting the workpiece material with the cutting tool while contacting a cut-assisting lubricant with the contact portion of the cutting tool with the workpiece material and/or the contact portion of the workpiece material with the cutting tool, and the workpiece material comprises a fiber reinforced composite material.

Abstract: A work machine includes an unload lever swingably supported by an operation box, the unload lever being configured to be swung to select whether or not to supply an operation fluid to the hydraulic actuator. The unload lever includes a second guide pin to move in a first guide groove in accordance with the swinging of the unload lever, the second guide pin being positioned on a first end of the first guide groove when the unload lever is positioned to a pushed-down position and positioned on a second end of the first guide groove when the unload lever is positioned to a pulled-up position. The first guide groove includes a first latch portion to latch the second guide pin at the first end of the first guide groove, and a second latch portion to latch the second guide pin at the second end of the first guide groove.

Abstract: A method for manufacturing a package substrate for mounting a semiconductor device including: a first laminate preparing step of preparing a first laminate including a resin layer, a bonding layer that is provided on at least one surface side of the resin layer and includes peeling means, and a first metal layer provided on the bonding layer; a first wiring forming step of forming a first wiring conductor in the first laminate by etching the first metal layer; a second laminate forming step of forming a second laminate by laminating an insulating resin layer and a second metal layer in this order on a surface of the first laminate, the surface being provided with the first wiring conductor; a second wiring forming step of forming a second wiring conductor on the insulating resin layer by forming a non-through hole in the insulating resin layer.