Patents by Inventor Yoshihiro Kato
Yoshihiro Kato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9238720Abstract: This invention relates to a prepreg having a low thermal expansion coefficient in plane direction and a high rigidity, and more particularly to a prepreg comprising a glass cloth (A), and a resin composition including a cyanate ester resin (B), a non-halogen based epoxy resin (C) and an inorganic filler (D), wherein the glass cloth (A) is characterized that when the weight per 1 m2 is W (g/m2), the thickness is t (?m), the number of warp threads per inch is X (thread/inch), and the number of weft threads per inch is Y (thread/inch), the total of X and Y is 150 to 240, t is 17 to 35, and the value of W/t as the apparent density is 1.1 to 1.5, and that the volume fraction of the glass cloth (A) in the prepreg is 32% to 42%.Type: GrantFiled: February 16, 2010Date of Patent: January 19, 2016Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Masayoshi Ueno, Yoshihiro Kato, Takeshi Nobukuni
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Patent number: 9232648Abstract: The present invention provides a novel surface-treated molybdenum compound powder and provides a prepreg, a laminate, a metal foil laminate, a printed wiring board, and the like that have a low thermal expansion coefficient in the planar direction, and excellent drillability, heat resistance, and flame retardancy. The surface-treated molybdenum compound powder of the present invention has at least part of the surface thereof coated with an inorganic oxide, and this is used as a filler.Type: GrantFiled: September 12, 2012Date of Patent: January 5, 2016Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Tetsuro Miyahira, Yoshihiro Kato, Takaaki Ogashiwa, Hiroshi Takahashi
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Publication number: 20150351236Abstract: A method for manufacturing a metal foil-clad laminate in which the occurrence of voids and unevenness is suppressed compared with conventional ones even when a prepreg obtained from a curable resin composition containing a relatively large amount of an inorganic filler is used. A laminate and a metal foil-clad laminate has excellent moldability, a low thermal expansion coefficient, and high glass transition temperature and is excellent in the peel strength of the metal foil. A method comprises disposing one or more prepregs between metal foils so that the one or more prepregs are in contact with metal surfaces, and heating and pressurizing the one or more prepregs and the metal foils in a vacuum atmosphere to laminate the prepregs and the metal foils to obtain a metal foil-clad laminate; and further subjecting the metal foil-clad laminate to heating and pressurization treatment in a vacuum atmosphere.Type: ApplicationFiled: December 6, 2013Publication date: December 3, 2015Applicants: MITSUBISHI GAS CHEMICAL COMPANY, INC., MGC ELECTROTECHNO CO., LTDInventors: Yoshihiro KATO, Takeshi NOBUKUNI, Hiroyuki MATSUMOTO, Mitsunori KUBOKI
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Publication number: 20150319853Abstract: An object of the present invention is to provide a resin composition that has a variety of properties required for a material for printed circuit boards such as high flame retardancy, and can attain a cured product having high moldability, high resistance against chemicals in a desmearing step, and a small coefficient of thermal expansion, a prepreg comprising the resin composition, a laminate including the prepreg, a metallic foil clad laminate including the prepreg, and a printed circuit board including the prepreg. A resin composition comprising an acrylic-silicone copolymer (A), a halogen-free epoxy resin (B), a cyanic acid ester compound (C) and/or a phenol resin (D), and an inorganic filler (E).Type: ApplicationFiled: November 27, 2013Publication date: November 5, 2015Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Tomo CHIBA, Hiroshi TAKAHASHI, Eisuke SHIGA, Yoshihiro KATO
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Publication number: 20150299110Abstract: A method for efficiently producing a cyanogen halide with suppressed side effects, and a method for producing a high-purity cyanate ester compound at a high yield includes contacting a halogen molecule with an aqueous solution containing hydrogen cyanide and/or a metal cyanide, so that the hydrogen cyanide and/or the metal cyanide is allowed to react with the halogen molecule in the reaction solution to obtain the cyanogen halide, wherein more than 1 mole of the hydrogen cyanide or the metal cyanide is used based on 1 mole of the halogen molecule, and when an amount of substance of an unreacted hydrogen cyanide or an unreacted metal cyanide is defined as mole (A) and an amount of substance of the generated cyanogen halide is defined as mole (B), the reaction is terminated in a state in which (A):(A)+(B) is between 0.00009:1 and 0.2:1.Type: ApplicationFiled: October 25, 2013Publication date: October 22, 2015Inventors: Masayuki KATAGIRI, Yuuichi SUGANO, Taketo IKENO, Makoto TSUBUKU, Keita TOKUZUMI, Kenj ARII, Takashi KOBAYASHI, Masanobu SOGAME, Yoshinori MABUCHI, Yoshihiro KATO
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Publication number: 20150280838Abstract: This specification discloses an excellent communication device of a field coupling type that increases field coupling efficiency between electrodes and realizes a small-sized device. This specification also discloses a communication system and an electrode. A communication device 100 includes: a first resonant circuit 121 connected in series to an electrode unit 110 formed with two conductor plates; and a second resonant circuit 122 connected in parallel to the electrode unit 110 and the first resonant circuit 121, which are connected in series. The constant of a resonant circuit is determined so that the voltage V2 to be applied to the electrode unit 110 becomes higher than the voltage V1 to be applied to the electrode unit 110 and the first resonant circuit 121 connected in series. In this manner, a field coupling electrode that has a very high coupling strength at a target frequency is obtained.Type: ApplicationFiled: October 18, 2013Publication date: October 1, 2015Applicant: SONY CORPORATIONInventors: Yoshihiro Kato, Koichi Ito, Noriyuki Mukai, Masaya Takano, Takeshi Maeda, Seigo Fukunaga
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Patent number: 9105423Abstract: A mounting structure of a switch knob for a vehicle includes a panel 10 having an opening portion 11 and a switch knob 14 having a front surface 14a exposed through the opening portion 11. The panel 10 includes a pair of support portions 12 respectively extending upright on opposing edge portions of the opening portion 11 on the back surface 10b of the panel 10 in a direction perpendicular to the panel 10, and the switch knob 14 is pivotably supported by the support portions 12. Thus, there is provided a mounting structure of a switch knob for a vehicle, which is simple, with the number of components for mounting being reduced and in which a possibility of scratching a panel surface during the mounting operation can be reduced.Type: GrantFiled: March 7, 2013Date of Patent: August 11, 2015Assignee: KOJIMA PRESS INDUSTRY CO., LTDInventors: Yoshihiro Kato, Kenji Kiyosawa
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Publication number: 20150214429Abstract: There is provided a method for manufacturing a rod-type light emitting device, which includes: forming a rod having lateral surfaces and an upper surface on a GaN layer of a first conductivity-type, the rod being made of a GaN of the first conductivity-type; selectively growing a high-resistivity layer on the upper surface of the rod; forming a multi-quantum well layer to cover the lateral surfaces and the upper surface of the rod and the high-resistivity layer; and forming a GaN layer of a second conductivity-type to cover the multi-quantum well layer.Type: ApplicationFiled: January 28, 2015Publication date: July 30, 2015Inventors: Yoji IIZUKA, Yoshihiro KATO, Koji NEISHI, Hitoshi MIURA, Shinya KIKUTA, Yusaku KASHIWAGI, Hiroshi AMANO, Yoshio HONDA
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Publication number: 20150210832Abstract: The present invention provides a resin sheet that exhibits a small reduction in light reflectance due to a heating treatment and a light irradiation treatment with an excellent heat resistance being maintained. The present invention provides a resin sheet including a layer including a resin composition containing an aliphatic epoxy-modified silicone compound (A), a branched imide resin having an isocyanurate group and a carboxyl group (B), titanium dioxide (C) and a wetting and dispersing agent (D).Type: ApplicationFiled: August 13, 2013Publication date: July 30, 2015Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Keisuke Takada, Syunsuke Hirano, Koji Morishita, Hidetoshi Kawai, Yuichi Koga, Yoshihiro Kato
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Publication number: 20150214423Abstract: A method for manufacturing an optical device includes forming a mask on main surface of a first GaN layer such that the mask has one or more openings in first region on the main surface of the first layer, selectively growing first GaN in the opening such that core including the first GaN is formed on exposed portion of the first layer, forming an active layer on the core such that active region is formed, forming a second GaN layer on the active region, removing a portion of the mask covering second region, forming a first electrode in the second region on the first layer, forming a second electrode covering the second layer and extending onto the mask in third region on the first layer, forming a first pad on the first electrode, and forming a second pad in a pad-forming region of the second electrode in the third region.Type: ApplicationFiled: September 10, 2014Publication date: July 30, 2015Applicants: TOKYO ELECTRON LIMITED, NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITYInventors: Shinya KIKUTA, Yoshihiro KATO, Koji NEISHI, Yoji IIZUKA, Hitoshi MIURA, Yusaku KASHIWAGI, Nobuaki TAKAHASHI, Hiroshi AMANO, Yoshio HONDA
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Publication number: 20150181707Abstract: A resin composition capable of achieving a printed wiring board or the like excellent in heat dissipation properties, water absorption properties, copper foil peel strength, and heat resistance after moisture absorption is provided. A prepreg, a laminate, a metal foil clad laminate, a printed wiring board and the like, which use the resin composition are also provided. The resin composition of the present invention having at least an epoxy resin, a cyanate ester compound, and an inorganic filler, wherein the inorganic filler includes at least a surface-treated silicon carbide of a silicon carbide powder having at least a part of the surface treated with an inorganic oxide.Type: ApplicationFiled: June 6, 2013Publication date: June 25, 2015Inventors: Hiroaki Kobayashi, Masanobu Sogame, Kentaro Nonizu, Yoshinori Mabuchi, Yoshihiro Kato
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Patent number: 9033002Abstract: To improve operability of a switching operation and locking operation of an operation pattern switching valve for switching the operation pattern of controlling devices for actuator control valves. An operation pattern switching device has a rotating operation member that rotates around a shaft center of a rotating support shaft, and thereby performs a switching operation of the operation pattern switching valve; and an operation lever that is provided rotatably integrally with the rotating operation member and performs a rotating operation of the rotating operation member. The rotating support shaft is, at each pattern switching position of the operation pattern switching valve, in a circumferential direction, provided with a plurality of lock engagement parts each with which the operation lever engages. The operation lever moves in a direction orthogonal to the shaft center of the rotating support shaft, and be thereby made engageable/removable with/from each of the lock engagement parts.Type: GrantFiled: August 1, 2013Date of Patent: May 19, 2015Assignee: Kubota CorporationInventors: Yoshihiro Kato, Toshihiro Nakao
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Publication number: 20150111044Abstract: There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.Type: ApplicationFiled: December 23, 2014Publication date: April 23, 2015Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Takaaki OGASHIWA, Hiroshi TAKAHASHI, Tetsuro MIYAHIRA, Yoshihiro KATO
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Publication number: 20150056454Abstract: Provided are a resin composition that can realize a prepreg, a metal foil-clad laminate and the like high in light reflectance in an ultraviolet region and in a visible light region, small in the reduction in light reflectance due to a heating treatment and a light irradiation treatment, good in peel strength of metal foil, also excellent in heat resistance after moisture absorption, also good in outer appearance, and also excellent in preservation stability, and a prepreg, a metal foil-clad laminate and the like using the same. The resin composition of the present invention contains at least an epoxy-modified silicone compound (A), a branched imide resin (B) having an isocyanurate group and a carboxyl group, a phosphorus curing accelerator (C), titanium dioxide (D) and a dispersant (E). The branched imide resin (B) is preferably at least one selected from the group consisting of an epoxy-modified branched imide resin, an alcohol-modified branched imide resin and an amine-modified branched imide resin.Type: ApplicationFiled: March 12, 2013Publication date: February 26, 2015Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Keisuke Takada, Syunsuke Hirano, Koji Morishita, Hidetoshi Kawai, Yuichi Koga, Yoshihiro Kato
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Publication number: 20150050472Abstract: The present invention provides a resin composition which can simply provide, with good reproducibility, a laminate, a printed wiring board, and the like that not only have excellent heat dissipation properties but have good moldability, good mechanical drillability and excellent appearance, and a prepreg, a metal foil-clad laminate, and the like using the same. A resin composition having a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), a second inorganic filler (D), and a molybdenum compound (E), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in a range of 1:0.02 to 1:0.2.Type: ApplicationFiled: March 25, 2013Publication date: February 19, 2015Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Chisato Saito, Daisuke Ueyama, Masanobu Sogame, Yoshinori Mabuchi, Yoshihiro Kato
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Publication number: 20150034369Abstract: Provided is a resin composition which enables the formation of a roughened surface having a low roughness degree on the surface of an insulation layer in a printed wiring board material when used on the insulation layer regardless of the roughening conditions employed and also enables the formation of a conductive layer having excellent adhesion properties, heat resistance, heat resistance under absorption of moisture, thermal expansion properties and chemical resistance on the roughened surface. A resin composition comprising (A) an inorganic filler that is soluble in an acid, (B) a cyanic acid ester compound and (C) an epoxy resin.Type: ApplicationFiled: July 3, 2012Publication date: February 5, 2015Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Naoki Kashima, Keiichi Hasebe, Seiji Shika, Yoshinori Mabuchi, Yoshihiro Kato
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Publication number: 20150035800Abstract: According to an embodiment, an information terminal apparatus includes: a display device equipped with a touch panel; a position detecting section configured to detect a position of a material body in a three-dimensional space opposite to a display surface of the display device; and a command generating section configured to generate a predetermined command for causing predetermined processing to be executed, on the basis of touch position information of a touch position on the touch panel by a touch operation on the touch panel and position-in-space information of the material body in the three-dimensional space detected by the position detecting section after the touch panel is touched or in a state of the touch panel being touched.Type: ApplicationFiled: March 6, 2014Publication date: February 5, 2015Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Mineharu Uchiyama, Yasuhiro Shiino, Mayuko Yoshida, Junya Suzuki, Keiichiro Mori, Hiroyuki Oka, Hideki Yagi, Yoshihiro Kato, Ai Matsui
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Publication number: 20140377565Abstract: A resin composition of the present invention contains a mixture (A) of at least two of cyanate ester compounds selected from the group consisting of cyanate ester compounds (A1) to (A3) having a specific structural unit, an epoxy resin (B), and an inorganic filler (C). A prepreg of the present invention is obtained by impregnating a base material with the resin composition or applying the resin composition to a base material. Furthermore, a metal foil-clad laminate of the present invention is the laminate comprising the prepreg. Furthermore, a printed wiring board of the present invention contains an insulating layer and a conductor layer formed on a surface of the insulating layer, in which the insulating layer contains the resin composition.Type: ApplicationFiled: October 30, 2012Publication date: December 25, 2014Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Hiroaki Kobayashi, Masanobu Sogame, Yoshihiro Kato
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Publication number: 20140349089Abstract: The present invention provides a resin composition with which a laminate, a printed wiring board, and the like that not only have high thermal conductivity but have good moldability with the occurrence of cracks and voids suppressed can be implemented simply and with good reproducibility, and a prepreg, a laminate, a metal foil-clad laminate, and the like using the same. The resin composition of the present invention is a resin composition comprising at least a cyanate ester compound (A), an epoxy resin (B), a first inorganic filler (C), and a second filler (D), wherein an average particle diameter ratio of the first inorganic filler (C) to the second inorganic filler (D) is in the range of 1:0.02 to 1:0.2.Type: ApplicationFiled: October 26, 2012Publication date: November 27, 2014Inventors: Daisuke Ueyama, Masanobu Sogame, Chisato Saito, Yoshinori Mabuchi, Yoshihiro Kato
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Publication number: 20140332159Abstract: This invention relates to a method for storing a naphthol aralkyl type cyanate ester resin solution, which is difficult to precipitate due to long term storage in a solution state, and particularly relates to a method for storing a naphthol aralkyl type cyanate ester resin solution (AB), which comprises: preparing (i) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a naphthol aralkyl type cyanate ester resin (A), a maleimide compound (B) and a solvent, (ii) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a prepolymer of a naphthol aralkyl type cyanate ester resin (A), a maleimide compound (B) and a solvent, or (iii) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a prepolymer of a naphthol aralkyl type cyanate ester resin (A) and a maleimide compound (B), and a solvent, and; storing the resin solution (AB).Type: ApplicationFiled: July 25, 2014Publication date: November 13, 2014Inventors: Masayoshi UENO, Yoshihiro KATO, Takeshi NOBUKUNI