Abstract: A blower device includes an axial flow fan having blades to blow air, and a fan shroud that includes a cylindrical portion surrounding an outer circumference of the fan at a distance from the outer circumference, and an air guiding portion guiding air drawn by the fan. The fan shroud includes a short end part shorter in distance to the outer circumference of the fan than another part in an outer end portion of the fan shroud, and a protruding end part provided at a position advanced in a rotational direction from the short end part, protruding upstream in a flow of the drawn air more than the fan and protruding outward of the air guiding portion. Accordingly, the blower device which includes the fan shroud capable of reducing rotational noise can be provided.

Abstract: To provide a prepreg resin composition which has good solubility in a solvent and with which moreover a cured product having excellent flame resistance and a low water absorption rate can be made simply and with good reproducibility, and a prepreg and a laminate and a printed wiring board and the like using the same. The prepreg resin composition of the present invention including at least a cyanate compound (A) obtained by cyanation of a phenol-modified xylene formaldehyde resin, an epoxy resin (B), and an inorganic filler.

Abstract: The present invention provides a novel surface-treated molybdenum compound powder and provides a prepreg, a laminate, a metal foil laminate, a printed wiring board, and the like that have a low thermal expansion coefficient in the planar direction, and excellent drillability, heat resistance, and flame retardancy. The surface-treated molybdenum compound powder of the present invention has at least part of the surface thereof coated with an inorganic oxide, and this is used as a filler.

Abstract: A prepreg for a printed wiring board, comprising a cyanate ester resin having a specific structure, a non-halogen epoxy resin, a silicone rubber powder as a rubber elasticity powder, an inorganic filler and a base material, which prepreg retains heat resistance owing to a stiff resin skeleton structure, has high-degree flame retardancy without the use of a halogen compound or a phosphorus compound as a flame retardant, and has a small thermal expansion coefficient in plane direction without using a large amount of inorganic filler, and a laminate comprising the above prepreg.

Abstract: This invention relates to a method for storing a naphthol aralkyl type cyanate ester resin solution, which is difficult to precipitate due to long term storage in a solution state, and particularly relates to a method for storing a naphthol aralkyl type cyanate ester resin solution (AB), which comprises: preparing (i) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a naphthol aralkyl type cyanate ester resin (A), a maleimide compound (B) and a solvent, (ii) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a prepolymer of a naphthol aralkyl type cyanate ester resin (A), a maleimide compound (B) and a solvent, or (iii) a naphthol aralkyl type cyanate ester resin solution (AB) comprising a prepolymer of a naphthol aralkyl type cyanate ester resin (A) and a maleimide compound (B), and a solvent, and; storing the resin solution (AB).

Abstract: It is an object of the present invention to provide, without using a halogenated compound or a phosphorus compound, a resin composition for printed wiring boards, a prepreg, a laminate, and a metal foil-clad laminate, each of which has high-degree flame retardance, has a low water absorption ratio and a high glass transition temperature, and has a high elastic modulus at high temperature. A resin composition according to the present invention includes a specific maleimide compound (A); a cyanate ester compound (B); a non-halogen epoxy resin (C); and an inorganic filler (D).

Abstract: A resin composition contains a cyanate ester compound, a maleimide compound, an epoxy resin, a silicone rubber powder, and an inorganic filler. The cyanate ester compound contains a compound represented by the following formula. The silicone rubber powder is contained in an amount of 40 to 150 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. The inorganic filler is contained in an amount of 100 to 340 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin. A total content of the silicone rubber powder and the inorganic filler is 140 to 380 parts by mass based on 100 parts by mass in total of the cyanate ester compound, the maleimide compound, and the epoxy resin.

Abstract: To improve operability of a switching operation and locking operation of an operation pattern switching valve for switching the operation pattern of controlling devices for actuator control valves. An operation pattern switching device has a rotating operation member that rotates around a shaft center of a rotating support shaft, and thereby performs a switching operation of the operation pattern switching valve; and an operation lever that is provided rotatably integrally with the rotating operation member and performs a rotating operation of the rotating operation member. The rotating support shaft is, at each pattern switching position of the operation pattern switching valve, in a circumferential direction, provided with a plurality of lock engagement parts each with which the operation lever engages. The operation lever moves in a direction orthogonal to the shaft center of the rotating support shaft, and be thereby made engageable/removable with/from each of the lock engagement parts.

Abstract: Provided is a device including a receiving coil, including a core having a magnetic body, a coil portion in which a wire is wound around the core and which is electromagnetically coupled to an external coil to transmit power, and a non-magnetic body arranged at a predetermined distance from a side face of the coil portion.

Abstract: It is an object to provide a prepreg for a printed laminate that has a low thermal expansion coefficient in the planar direction, excellent drillability, and further excellent heat resistance and flame retardancy, and a laminate and a metal foil-clad laminate. A resin composition according to the present invention includes a molybdenum compound (A); an epoxy resin (B); a curing agent (C); and an inorganic filler (D), wherein a Mohs hardness of the inorganic filler (D) is 3.5 or more, and a content of the inorganic filler (D) is 40 to 600 parts by mass based on 100 parts by mass of a total of resin solid components.

Abstract: Provided is an antenna module including: an antenna coil having a first pattern width; a magnetic sheet, which includes a first surface on which the antenna coil is to be arranged, and has a first distance being a distance on the first surface between an edge of the first surface and the antenna coil, the first distance being twice or more as large as the first pattern width; and a conductor, which includes a second surface on which the magnetic sheet is to be arranged while a surface opposite to the first surface of the magnetic sheet faces the second surface, and has a second distance being a distance on the second surface between an edge of the second surface and the antenna coil, the second distance being equal to or larger than the first distance.

Abstract: A mounting structure of a switch knob for a vehicle includes a panel 10 having an opening portion 11 and a switch knob 14 having a front surface 14a exposed through the opening portion 11. The panel 10 includes a pair of support portions 12 respectively extending upright on opposing edge portions of the opening portion 11 on the back surface 10b of the panel 10 in a direction perpendicular to the panel 10, and the switch knob 14 is pivotably supported by the support portions 12. Thus, there is provided a mounting structure of a switch knob for a vehicle, which is simple, with the number of components for mounting being reduced and in which a possibility of scratching a panel surface during the mounting operation can be reduced.

Abstract: A composition for electromagnetic wave suppression and heat radiation includes: a matrix composed of a high molecular material or a low molecular material; and a magnetic particle filled in the matrix upon mixing a magnetic powder having a relation of {(tap density)/density}?0.58 with the matrix.

Abstract: There are provided a resin composition for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance, a prepreg prepared using the resin composition, and a laminated sheet and a metal foil-laminated sheet prepared using the prepreg. The resin composition comprises (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by formula (1): xMgCO3.yMg(OH)2.zH2O??(1) wherein x:y:z is 4:1:4, 4:1:5, 4:1:6, 4:1:7, 3:1:3, or 3:1:4 and huntite; (B) an epoxy resin; and (C) a curing agent.

Abstract: There is provided a resin composition for printed wiring boards that, while maintaining excellent flame retardance, has excellent heat resistance, reflow resistance, and drilling workability, and, at the same time, has low water absorption without use of halogen compounds and phosphorus compounds. The resin composition comprises (A) a non-halogen epoxy resin, (B) a biphenyl aralkyl phenolic resin, (C) a maleimide compound and (D) an inorganic filler.

Abstract: There is provided a resin composition that, despite the fact that the content of an inorganic filler is on approximately the same level as that of the conventional resins, can provide a cured resin product that has a low coefficient of thermal expansion in a plane direction and possesses excellent heat resistance and flame retardance.

Abstract: A method for manufacturing a semiconductor device includes steps of: (a) forming a thin film containing a phenyl group and silicon on a substrate while obtaining a plasma by activating an organic silane gas containing a phenyl group and silicon and nitrogen as not original component but unavoidable impurity and exposing the substrate to the plasma, temperature of the substrate being set at 200° C. or lower; and (b) obtaining a low-permittivity film by supplying energy to the substrate to allow moisture to be released from the thin film. With this method for manufacturing the semiconductor device, it is possible to obtain a silicon-oxide based low-permittivity film containing an organic substance which is not significantly damaged by the release of the organic substance when subjected to a plasma treatment such as an etching treatment, an ashing treatment, and/or the like.

Abstract: Disclosed is an electromagnetic wave suppression sheet obtained by mixing metallic magnetic particles into a resin and formed into a sheet shape. In the electromagnetic wave suppression sheet, a coercive force is 320 [A/m] or more and a saturation magnetization is 0.35 [Wb/m2] or more at a time when an external magnetic field of 1 kOe in an in-plane direction is applied.

Abstract: Provided is an electromagnetic wave absorber, including a base material and a porous carbon material containing, as a raw material, a plant-based material having a silicon content of 5% by mass or more, in which the porous carbon material has a specific surface area value as measured by the nitrogen BET method of 400 m2/g or more, a silicon content of 1% by mass or less, a pore volume as measured by the BJH method of 0.2 cm3/g or more, and a pore volume as measured by the MP method of 0.2 cm3/g or more, or a total pore volume of pores each having a diameter in the range from 1×10?9 m to 5×10?7 m as measured by the Non Localized Density Functional Theory of 1.0 cm3/g or more.

Abstract: A high frequency coupler includes a ground, a first coupling electrode connected via a first resonator unit to an input and output terminal of a communication circuit, and one or more second coupling electrodes connected via a second resonator unit designed utilizing a ground to a ground terminal of the communication circuit.