Abstract: The present invention is directed to a Spatiotemporal scene-graph embedding methodology that models scene-graphs and resolves safety-focused tasks for autonomous vehicles. The present invention features a computing system comprising instructions for accepting the one or more images, extracting one or more objects from each image, computing an inverse-perspective mapping transformation of the image to generate a bird's-eye view (BEV) representation of each image, calculating relations between each object for each image, and generating a scene-graph for each image based on the aforementioned calculations. The system may further comprise instructions for calculating a confidence value for whether or not a collision will occur through the generation of a spatio-temporal graph embedding based on a spatial graph embedding and a temporal model.

Abstract: A method for training a machine-learning model. A plurality of nodes are assigned for training the machine-learning model. Nodes include agents comprising at least an agent processing unit and local memory. Each agent manages, via a local network, one or more workers that include a worker processing unit. Shards of a training data set are distributed for parallel processing by workers at different nodes. Each worker processing unit is configured to iteratively train on minibatches of a shard, and to report checkpoint states indicating updated parameters for storage in local memory. Based at least on recognizing a worker processing unit failing, the failed worker processing unit is reassigned and initialized based at least on a checkpoint state stored in local memory.

Abstract: An apparatus for automatically cleaning a nozzle of a gas supply system is provided. The apparatus includes a carrier with a gas inlet that is adapted to sealingly mate with the nozzle of the gas supply system and an automated nozzle cleaning system in the carrier. The automated nozzle cleaning system includes a first nozzle cleaning device, a second nozzle cleaning device, and a function switching plate. The function switching plate comprises a plurality of through holes, a first through hole of the plurality of through holes is configured to engage the first nozzle cleaning device with the gas inlet when the function switching plate is positioned at a first position, and a second through hole of the plurality of through holes is configured to engage the second nozzle cleaning device with the gas inlet when the function switching plate is positioned at a second position.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: Among other things, one or more systems and techniques for removing a photoresist from a semiconductor wafer are provided. The photoresist is formed over the semiconductor wafer for patterning or material deposition. Once completed, the photoresist is removed in a manner that mitigates damage to the semiconductor wafer or structures formed thereon. In an embodiment, trioxygen liquid is supplied to the photoresist. The trioxygen liquid is activated using an activator, such as an ultraviolet activator or a hydrogen peroxide activator, to create activated trioxygen liquid used to remove the photoresist. In an embodiment, the activation of the trioxygen liquid results in free radicals that aid in removing the photoresist. In an embodiment, an initial photoresist strip, such as using a sulfuric acid hydrogen peroxide mixture, is performed to remove a first portion of the photoresist, and the activated trioxygen liquid is used to remove a second portion of the photoresist.

Abstract: A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.

Abstract: Disclosed herein are related to a memory cell including one or more programmable resistors and a control transistor. In one aspect, a programmable resistor includes a gate structure and one or more source/drain structures for forming a transistor. A resistance of the programmable resistor may be set by applying a voltage to the gate structure, while the control transistor is enabled. Data stored by the programmable resistor can be read by sensing current through the programmable resistor, while the control transistor is disabled. In one aspect, the one or more programmable resistors and the control transistor are implemented by same type of components, allowing the memory cell to be formed in a compact manner through a simplified the fabrication process.

Abstract: A semiconductor package includes a redistribution structure, a supporting layer, a semiconductor device, and a transition waveguide structure. The redistribution structure includes a plurality of connectors. The supporting layer is formed over the redistribution structure and disposed beside and between the plurality of connectors. The semiconductor device is disposed on the supporting layer and bonded to the plurality of connectors, wherein the semiconductor device includes a device waveguide. The transition waveguide structure is disposed on the supporting layer adjacent to the semiconductor device, wherein the transition waveguide structure is optically coupled to the device waveguide.

Abstract: A vehicle-used bracket includes a base body, a clamping assembly and a buffering element. The base body has a main portion, a peripheral wall extended upward from a periphery of a top surface of the main portion, and a connecting portion fastened to a bottom surface of the base body. A periphery of a bottom surface of the connecting portion extends downward to form a limiting structure. The clamping assembly is mounted to the bottom surface of the connecting portion. The clamping assembly includes a screw, a fastening element and a claw. The claw has a fastening piece. A top surface of the fastening piece is arched towards the connecting portion to form at least one protruding block. The at least one protruding block is limited in the limiting structure. The buffering element is mounted between the connecting portion and the clamping assembly.

Abstract: Embodiments relate to systems and methods for probabilistically filtering candidate intervention representations. Systems and methods are described that receive a candidate intervention representation; specify a plurality of parameters as a function of the candidate intervention representation; identify a plurality of analytical constraints, where each analytical constraint corresponds to an analytical parameter of the plurality of parameters; generate a probabilistic output as a function of the candidate intervention representation, the plurality of analytic constraints, and training data correlating past intervention representations to a deterministic outcome; and, filter the at least a candidate intervention representation using the probabilistic output.

Abstract: Photonic devices and methods of manufacture are provided. In embodiments a fill material and/or a secondary waveguide are utilized in order to protect other internal structures such as grating couplers from the rigors of subsequent processing steps. Through the use of these structures at the appropriate times during the manufacturing process, damage and debris that would otherwise interfere with the manufacturing process of the device or operation of the device can be avoided.

Abstract: A terminal, a storage medium, and a database synchronization method thereof are disclosed. The database synchronization method includes reading data from a first database and capturing a dynamic data log in the first database; joining data to a waiting queue read from the first database; determining a dislocation category of the data in the waiting queue, and rearranging the dislocation data in the waiting queue into a first category according to the dynamic data log; and synchronizing the rearranged data to a second database. According to the database synchronization method provided by the present invention caches the data read from the first database to the waiting queue, and dislocation data in the waiting queue is rearranged and then synchronized to the second database, so that a problem of poor data identity after database synchronization is avoided.

Abstract: A package includes an electronic die, a photonic die underlying and electronically communicating with the electronic die, a lens disposed on the electronic die, and a prism structure disposed on the lens and optically coupled to the photonic die. The prism structure includes first and second polymer layers, the first polymer layer includes a first curved surface concaving toward the photonic die, the second polymer layer embedded in the first polymer layer includes a second curved surface substantially conforming to the first curved surface, and an outer sidewall of the second polymer layer substantially aligned with an outer sidewall of the first polymer layer.

Abstract: A semiconductor package includes a first semiconductor die, a second semiconductor die, an insulating encapsulation, and a plurality of conductive pillars. The second semiconductor die is located on and electrically communicates to the first semiconductor die through joints therebetween. The insulating encapsulation encapsulates the first semiconductor die and the second semiconductor die and covers the joints. The plurality of conductive pillars is next to and electrically connected to the first semiconductor die and the second semiconductor die, and is covered by the insulating encapsulation.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: In a method of atomic electrometry, EIT spectroscopy is performed on host atoms of an alkali metal in a vapor cell. The EIT spectroscopy indicates a resonant energy of a probed Rydberg state of the host atoms. The vapor cell is exposed to an ambient electric field. A shift in the resonant energy as indicated by the EIT spectroscopy is observed and interpreted as a measurement of the ambient field. During the measurement of the ambient field, a bias electric field is generated inside the vapor cell by shining light into the vapor cell from a light source situated outside of the cell. The bias field is useful for increasing the sensitivity of the measurement.

Abstract: An intelligent energy harvesting device, a voltage signal application system, and an energy management module thereof are disclosed. The intelligent energy harvesting device is used to transfer a signal to an application device. The intelligent energy harvesting device includes a power generation module, a battery and an energy management module. The power generation module generates a first voltage signal. The battery generates a second voltage signal. The energy management module is electrically connected to the power generation module and the battery for enabling the first voltage signal output from the power generation module to be used as a power signal to provide the application device, or enabling the first voltage signal output from the power generation module and the second voltage signal output from the battery collectively serves as the power signal to provide the application device.

Abstract: A semiconductor package includes a redistribution structure, a supporting layer, a semiconductor device, and a transition waveguide structure. The redistribution structure includes a plurality of connectors. The supporting layer is formed over the redistribution structure and disposed beside and between the plurality of connectors. The semiconductor device is disposed on the supporting layer and bonded to the plurality of connectors, wherein the semiconductor device includes a device waveguide. The transition waveguide structure is disposed on the supporting layer adjacent to the semiconductor device, wherein the transition waveguide structure is optically coupled to the device waveguide.

Abstract: The present disclosure discloses a preparation method of a multi-functional marine engineering alloy. Through the coupling of a multi-principal alloy structure, structural entropy, and temperature and powder metallurgy and heat treatment, mutual solubility between elements and free energy of an alloy system are regulated, Cu grain boundary segregation is eliminated, and uniform and dispersed nano-precipitation of the anti-fouling element Cu in corrosion-resistant and high-plasticity multi-principal alloys is realized. The preparation method is simple and controllable to operate, and the prepared material has plasticity higher than 75%, high yield strength, excellent corrosion resistance and anti-fouling property, and has important application prospects in the field of marine engineering.

Abstract: A method is provided for sensing a magnetic field in a magnetic gradiometer of the kind in which pump light and light constituting an optical carrier traverse first and second atomic vapor cells that contain host atoms and that are separated from each other by a known distance. According to such method, the host atoms are prepared in a coherent superposition of two quantum states that differ in energy by an amount that is sensitive to an ambient magnetic field. Modulation of the optical carrier in the respective cells gives rise to sidebands that interfere to generate a beat frequency indicative of the magnetic field gradient. The host atoms are prepared at least in a mode that allows measurement of ambient magnetic field components perpendicular to the axis of the pump light. In such mode, the host atoms are spin-polarized by pump light while subjected to a controlled magnetic field directed parallel to the pump beam, and then the controlled magnetic field is adiabatically extinguished.