Wafer aligner
Latest Hiwin Technologies Corp. Patents:
Description
The broken lines show portions of a wafer aligner that form no part of claimed design.
Claims
The ornamental design for a wafer aligner, as shown and described.
Referenced Cited
U.S. Patent Documents
D323173 | January 14, 1992 | Ishii |
D580061 | November 4, 2008 | Adams |
D583059 | December 16, 2008 | Adams |
D612879 | March 30, 2010 | Nagasaka |
D776290 | January 10, 2017 | Wan |
D783692 | April 11, 2017 | Strothmann |
D798349 | September 26, 2017 | Li |
D843006 | March 12, 2019 | Huang |
D914884 | March 30, 2021 | Glassett |
D917585 | April 27, 2021 | Okuma |
D927565 | August 10, 2021 | Yao |
D976971 | January 31, 2023 | Chen |
Patent History
Patent number: D1003327
Type: Grant
Filed: Dec 13, 2021
Date of Patent: Oct 31, 2023
Assignee: Hiwin Technologies Corp. (Taichung)
Inventors: Jonus Liu (Taichung), Jheng-Fu Huang (Taichung), Yi-Chan Tseng (Taichung), Shou-Yang Huang (Taichung)
Primary Examiner: Omeed Agilee
Assistant Examiner: Fritzgerald L Butac
Application Number: 29/790,740
Type: Grant
Filed: Dec 13, 2021
Date of Patent: Oct 31, 2023
Assignee: Hiwin Technologies Corp. (Taichung)
Inventors: Jonus Liu (Taichung), Jheng-Fu Huang (Taichung), Yi-Chan Tseng (Taichung), Shou-Yang Huang (Taichung)
Primary Examiner: Omeed Agilee
Assistant Examiner: Fritzgerald L Butac
Application Number: 29/790,740
Classifications
Current U.S. Class:
Material Working, Abrading, Or Founding Machinery (D15/122)