Semiconductor module
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The ornamental design of the present disclosure is a semiconductor module on which power semiconductor elements and the like may be mounted. Rhombic plate members having rounded corners are centered along the long sides of the rear view, such that the longer diagonal line of each rhombic plate member extends along a long side.
The broken lines shown in the drawing views of
Claims
The ornamental design for a semiconductor module, as shown and described.
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Type: Grant
Filed: May 27, 2015
Date of Patent: Dec 20, 2016
Assignee: Fuji Electric Co., Ltd. (Kawasaki-shi, Kanagawa)
Inventors: Shin Soyano (Tokyo), Yoshikazu Takayima (Tokyo), Keiichi Higuchi (Tokyo), Takahiro Koyama (Tokyo)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/528,214