Semiconductor device

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Description

FIG. 1 is a front, top and right side perspective view of a semiconductor device showing our new design;

FIG. 2 is a rear, bottom and left side perspective view thereof;

FIG. 3 is a front view thereof;

FIG. 4 is a rear view thereof;

FIG. 5 is a top view thereof;

FIG. 6 is a bottom view thereof;

FIG. 7 is a right side view thereof; and,

FIG. 8 is a left side view thereof.

Claims

The ornamental design for a semiconductor device, as shown and described.

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Other references
  • An Office Action dated by the Japanese Patent Office on Sep. 3, 2019, which corresponds to Japanese Design Application No. 2019-006781 and is related to Design U.S. Appl. No. 29/697,804.
Patent History
Patent number: D903611
Type: Grant
Filed: Jul 11, 2019
Date of Patent: Dec 1, 2020
Assignee: Mitsubishi Electric Corporation (Tokyo)
Inventors: Hiroya Sannai (Tokyo), Tatsuya Kawase (Tokyo), Seiichiro Inokuchi (Tokyo), Naoki Higashikawa (Kariya)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/697,804