Abstract: A device for manufacturing a display device includes a deposition source; a deposition thickness calculator for calculating a deposition thickness of a deposition material deposited on a substrate; and a controller for controlling a power of a heater which heats the deposition source by comparing the deposition thickness calculated with a reference thickness. The controller controls the power of the heater either at least one time for each substrate on which the thin film is to be deposited or at regular intervals while the deposition material is deposited. Influence of measurement noise that is included in a quartz crystal sensor for measuring a deposition speed may be minimized, and distribution of deposition thickness of an organic light emitting material may be reduced, thereby increasing the yield of the deposition process and producing quality display devices.

Abstract: According to one embodiment, a semiconductor manufacturing apparatus includes a substrate stage, a transfer unit, and a control unit. A substrate is settable on the substrate stage. The transfer unit is configured to transfer a pattern having an uneven configuration onto a major surface of the substrate by attachably and removably holding a template. The pattern is provided in the transfer surface. The control unit is configured to acquire information relating to a number of foreign objects on the major surface prior to the transferring of the pattern. The control unit adds the number for a plurality of the substrates including the pattern transferred by the transfer unit. The control unit causes the transfer unit not to implement the transferring of the pattern in the case where the sum has reached the upper limit.

Abstract: The imprint apparatus of the present invention includes a holding unit configured to hold a mold; a particle inspection unit configured to inspect whether or not particle is present on an imprint area, in which the resin pattern is formed, of the substrate; a dispenser configured to apply an uncured resin to the imprint area; a movable unit configured to move the imprint area with respect to the holding unit; and a controller. The movable unit is capable of moving the imprint area to each of an inspection position by means of the inspection unit, an application position by means of the dispenser, and a contacting position by means of the holding unit. Also, the controller causes the inspection unit to perform inspection of the imprint area in association with the movement of the imprint area by means of the movable unit.

Abstract: According to one embodiment, a film forming system includes: a stage including a placement surface on which an object to be coated is placed; a rotating mechanism rotating the stage in a rotational direction along the placement surface; an application nozzle discharging a material onto the object placed on the stage for application; a moving mechanism relatively moving the stage and the application nozzle along the placement surface in a cross direction crossing the rotational direction; a controller performing a control to rotate the stage on which the object is placed through the rotating mechanism while relatively moving the stage and application nozzle along the placement surface in the cross direction through the moving mechanism and applying the material to the object on the stage through the application nozzle; and a cleaning apparatus cleaning the application nozzle.

Abstract: The present disclosure discloses an electromagnetic vapor deposition apparatus comprising a plurality of electromagnets which form a plurality of electromagnetic regions when electronic current passes through. A programmable control equipment is electronically connected to each magnet unit to control magnetic polarity and magnetic intensity of each magnet unit. The programmable control equipment can adjust the magnetic intensity of each of the plurality of electromagnetic regions to adsorb the metal mask tightly. Meanwhile, the problem of colors mixing is overcome.

Abstract: A solar cell extrusion printing system that uses a micro-extrusion printhead to print longer central gridlines and one or more pairs of shorter “side” gridlines such that end points of the gridline sets form step patterns on an octagonal (pseudo-square) substrate. The printhead includes a set of central nozzles that receive ink from a first valve by way of a first flow channel to print the longer central gridlines, and additional sets of side nozzles that receive ink from additional valves by way of additional flow channels to print the shorter “side” gridlines. The central nozzles have outlet orifices that offset in the process direction from side outlet orifices of the side nozzles. A start signal is simultaneously sent to the valves such that ink is substantially simultaneously extruded through both the central and side orifices, whereby the extruded ink produces gridline endpoints having the desired step pattern.

Abstract: The invention provides an apparatus for manufacturing a cylindrical member comprising a cylindrical core body having an outer peripheral surface with a releasing property, the apparatus comprising: a film-forming device that forms a resin film in a region at a central portion from both ends in the axial direction of the outer peripheral surface of the core body; a judging device that judges the deterioration of the releasing property of regions continuous from the region where the resin film is to be formed in the region at the inner side from both ends in the axial direction of the outer peripheral surface of the core body, before the resin film is formed by the film-forming device; and a control device that controls the film-forming device such that the resin film is formed by exposing regions with an undeteriorated releasing property on both ends in the axial direction of the outer peripheral surface of the core body, in accordance with the results of judgment by the judging device.

Abstract: Systems and methods to determine ozone concentration in a gas mixture of ozone and oxygen, based on measurements of the total gas mixture properties, can enable the measurements of ozone concentration at low pressure settings. The ozone concentration determination can be applied to vacuum processing chamber, using either novel ozone sensor or existing mass flow meter or controller.

Abstract: A dispensing apparatus includes a dispensing unit having a main body, a channel through the main body, and a plurality of nozzles connected to the main body, the plurality of nozzles being configured to dispense fluid flowing in the channel, a gap sensor unit configured to determine size of gaps between adjacent nozzles in the dispensing unit, and a thermal expansion adjusting unit configured to thermally expand or contract the main body of the dispensing unit to adjust the gap size between adjacent nozzles to a predetermined size, based on the gap size determined by the gap sensor unit.

Abstract: The invention relates to a high-pressure device for the application of an expandable reaction mixture on a surface, to a method for producing expandable foams, to a device for producing sandwich composite elements, and to a method for producing expanded sandwich composite elements. The high-pressure device includes a mixing head, a distributor head fluidically connected downstream of the mixing head, at feast three outlet lines attached to the distributor head, a high-pressure feed line of a component to the mixing head, a high pressure feed line of a component B to the mixing head, at least one static mixer for mixing an inert gas to the component A, the component B or a mixture of components A and B, at least one high-pressure feed line for the inert gas, which is under increased pressure, and at least one measurement and control unit for the desired pressure of the components on the mixing head.

Abstract: A current detection resistor is connected between an output terminal of a high voltage generator and an air motor. A coater current detector detects a coater current supplied to a coater based on a potential difference taking place on both terminals of the current detection resistor. The high-voltage control device serves to discriminate based on the coater current detected by the coater current detector whether the coater is caused to be close to a coating object. When it is discriminated that the coater is caused to be close to the coating object, the high-voltage control device outputs a shut-off signal for shutting off supply of the power supply voltage to the power supply voltage control device.

Abstract: This invention discloses apparatus for processing one or more of a Lens Precursor, a Lens Precursor Form and an ophthalmic Lens. The apparatus provides for vapor phase processing of the subject Lens Precursor, a Lens Precursor Form and an ophthalmic Lens.

Abstract: Atomic layer deposition (ALD) techniques typically involve briefly exposing the surface of a substrate to a precursor within an atomic layer deposition chamber, and purging the chamber with a purge gas, such as nitrogen, before exposing the substrate to a second precursor. A series of such cycles results in the deposition of microscopically thin film layers on the substrate surface that are further processed to generate a semiconductor component. In order to reduce unintended oxygen deposition, the chamber is typically evacuated to a vacuum level of 10e?06 torr-liters/second, which is suitable for the related techniques of chemical vapor deposition. However, atomic layer deposition is demonstrably more sensitive to oxygen contamination, due to the exposure of each layer to residual oxygen within the chamber. Tighter process control is achievable by performing atomic layer deposition at a higher vacuum level, not exceeding approximately 10e?06 torr-liters/second, in order to reduce oxygen contamination.

Abstract: An adhesive application apparatus sets a dot pattern such that an amount of paste applied to an area on the reverse side of an area on which an image is formed and an amount of paste applied to an area on the reverse side of an area on which the image is not formed are different from each other, and controls a paste discharge head so that the dot pattern having been set is formed on an adhesion surface of paper. Through this, the amount of paste applied to paper can be changed between an area where an image is formed and an area where the image is not formed, thereby making it possible to apply the paste to paper more appropriately in accordance with the state of image formation.

Abstract: A hot melt adhesive system includes a melting unit configured to liquefy a bulk form of hot melt adhesive and deliver the liquefied hot melt adhesive to an application location. The melting unit includes a controller for establishing and/or verifying at least one system condition, such as temperatures associated with system operation. A machine reading unit is coupled with the controller and is capable of receiving information from a machine readable element and communicating the information to the controller for use in establishing and/or verifying the system condition. A method of operating the system includes scanning information on at least one system condition into the controller from a machine readable element, and using the scanned information during operation of the melting unit.

Abstract: Marking information relating to use of a marking device to perform a marking operation may be acquired from one or more input devices, logged/stored in local memory of a marking device, formatted in various manners, processed and/or analyzed at the marking device itself, and/or transmitted to another device (e.g., a remote computer/server) for storage, processing and/or analysis. In one example, a marking device may include one or more environmental sensors and/or operational sensors, and the marking information may include environmental information and operational information derived from such sensors. Environmental and/or operational information may be used to control operation of the marking device, assess out-of-tolerance conditions in connection with use of the marking device, and/or provide alerts or other feedback. Additional enhancements are disclosed relating to improving the determination of a location (e.g.

Abstract: A vacuum chamber is evacuated through a first evacuation passage provided with a first valve and a second evacuation passage provided with a second valve. An opening degree of the first valve is adjusted so that a pressure in the vacuum chamber becomes substantially equal to a process pressure P; an opening degree of a butterfly valve further provided in the second evacuation passage is adjusted to substantially equal to a set value determined by a table in order to set flow rates of gases to be evacuated through the first evacuation passage and the second evacuation passage to be substantially equal to corresponding set values determined by the recipe; and an opening degree of the second valve is adjusted so that a measurement value of a differential pressure gauge further provided in the second evacuation passage becomes substantially equal to a differential pressure written in the table.

Abstract: A plasma processing apparatus includes a detector for detecting interference light of multiple wavelengths from a surface of a sample during processing, a pattern comparator for comparing actual deviation pattern data on the interference light obtained at a given time during processing and a plurality of standard deviation patterns corresponding to two or more thicknesses of the film, and calculating a deviation, the standard deviation patterns corresponding to interference light data of multiple wavelengths obtained, before the processing of the sample, for processing of another sample, a deviation comparator for comparing the deviation between the data and a predetermined deviation and outputting data on a thickness of the film of the sample at that time, a recorder for recording, as time series data, the data on the thickness of the film, and an endpoint decision unit.

Abstract: Inkjet print head dies are directly seated upon an exterior of a tubular member so as to face different directions.

Abstract: A wet processing apparatus for wet-processing substrates can suppress the reduction of throughput when some component part thereof becomes unserviceable. The wet processing apparatus includes a first nozzle unit and a second nozzle unit. When the wet processing apparatus operates in a normal mode, a substrate carrying mechanism is controlled so as to deliver substrates alternately to processing units of a first group and those of a second group so that the substrates are processed sequentially in order. When the processing units of the first group (the second group) are unserviceable due to the inoperativeness of the substrate holders, a processing liquid supply system or a nozzle support mechanism, the nozzle unit for the processing units of the second group (the first group) is moved to process substrates by the serviceable ones of the first group (the second group).

Abstract: A liquid crystal dispensing system includes a container to contain liquid crystal to be dispensed, a discharge pump to receive the liquid crystal from the container and to discharge the liquid crystal, a nozzle to dispense the liquid crystal discharged from the discharge pump onto a substrate, and a control unit to control a dispensing amount of liquid crystal discharged from the discharge pump and to compensate the dispensing amount when the dispensing amount of liquid crystal exceeds a limitation value.

Abstract: A dual-purpose facility of continuous hot-dip coating and continuous annealing is configured so as to be switched between a continuous hot-dip coated material production line and a continuous annealed material production line, and includes a gas discharge path that discharges atmosphere gas in an annealing furnace from a gas discharge port provided in an outlet side of the annealing furnace out of the annealing furnace and a path opening and closing unit for opening and closing the gas discharge path. The path opening and closing unit opens the gas discharge path when the dual-purpose facility is used as the continuous hot-dip coated material production line and closes the gas discharge path when the dual-purpose facility is used as the continuous annealed material production line.

Abstract: A substrate treatment system includes a plurality of treatment apparatuses, a position adjustment apparatus adjusting a center position of the substrate, a substrate transfer apparatus transferring the substrate to the treatment apparatuses and the position adjustment apparatus, and a control unit controlling operations of the apparatuses. The substrate transfer apparatus includes an arm part curved along a peripheral edge portion of the substrate with a radius of curvature larger than a radius of the substrate, and a holding part projecting inward from the arm part and holding a rear surface of the substrate. The position adjustment apparatus includes a mounting table which holds a central portion of the rear surface of the substrate and is rotatable and horizontally movable. The control unit controls the mounting table such that the center position of the substrate held on the mounting table is aligned with a center position of the arm part.

Abstract: A coating method forming a coating film having a predetermined film thickness on a band-like support body. The method includes conveying the band-like support body; forming the coating liquid on the band-like support body using a coating device fixed on an vibration isolation device; and detecting vibration components on a surface of a floor on which the coating device is disposed and controlling vibration of the active vibration isolation device.

Abstract: A gas supply system for supplying a gas into a processing chamber for processing a substrate to be processed includes: a processing gas supply unit; a processing gas supply line; a first and a second processing gas branch line; a branch flow control unit; an additional gas supply unit; an additional gas supply line; a first and a second additional gas branch line; a flow path switching unit; and a control unit. Before processing the substrate to be processed, the control unit performs a pressure ratio control on the branch flow control unit while the processing gas supply unit supplies the processing gas. After the inner pressures of the first and the second processing gas branch line become stable, the control unit switches the pressure ratio control to a fixed pressure control, and then the additional gas supply unit supplies the additional gas.

Abstract: A line marking apparatus, for use in a system that includes a source of a narrow beam of radiation which extends substantially horizontally along or parallel to a line to be marked, includes a wheeled chassis and a line marking head for dispensing line marking material. The marking head is supported on the chassis for lateral movement relative thereto, which movement is controlled by a controller that includes a detector which is movable with the marking head and is positioned and directed to detect such a beam of radiation, the marking head being movable together with the detector in response to a detected beam. Lateral movement of the marking head is thereby controlled such that the head and the detector substantially follow the line to be marked irrespective of whether the chassis deviates from the line direction.

Abstract: Disclosed is an apparatus and process for coating a component with aligning device. Alignments or checking of the spray cone take place within the coating apparatus via an optically transparent reference plate which is optically evaluated.

Abstract: The present disclosure describes a semiconductor manufacturing apparatus. The apparatus includes a processing chamber designed to perform a process to a wafer; an electrostatic chuck (E-chuck) configured in the processing chamber and designed to secure the wafer, wherein the E-chuck includes an electrode and a dielectric feature formed on the electrode; a tuning structure designed to hold the E-chuck to the processing chamber by clamping forces, wherein the tuning structure is operable to dynamically adjust the clamping forces; a sensor integrated with the E-chuck and sensitive to the clamping forces; and a process control module for controlling the tuning structure to adjust the clamping forces based on pre-measurement data from the wafer and sensor data from the sensor.

Abstract: According to one embodiment, a film forming apparatus includes: a stage on which a coating object is placed; a rotation mechanism rotating the stage; an application nozzle supplying a coating material to the coating object; an application moving mechanism moving the application nozzle; a controller which controls the rotation mechanism and application moving mechanism to rotate the stage and move the application nozzle between the rotation center and the outer edge and controls the application nozzle to apply the coating material to the coating object; and a sound wave generator which generates a sound wave. The film forming apparatus projects the sound wave onto the surface of the coating film.

Abstract: A metering mechanism is configured for transferring measured doses of a granular material from a first location to a second location, and is particularly suited for metering source material in a vapor deposition apparatus. A receiver is disposed to receive the granular material from the first location. A discharge port is axially offset from an outlet of the receiver. A reciprocating delivery member having a passage defined therethrough is moved in a reciprocating path by a controllable drive device between a load position wherein the passage is aligned with the receiver outlet and a discharge position wherein the passage is aligned with the discharge port. The amount of granular material transferred from the first location to the second location is a function of the volume of the passage and the reciprocating rate of the delivery member.

Abstract: A gas supply mechanism includes a gas introduction member having gas inlet portions through which a gas is introduced into a processing chamber, a processing gas supply unit, a processing gas supply path, branch paths, an additional gas supply unit and an additional gas supply path. The gas inlet portions includes inner gas inlet portions for supplying the gas toward a region where a target substrate is positioned in the chamber and an outer gas inlet portion for introducing the gas toward a region outside an outermost periphery of the target substrate. The branch paths are connected to the inner gas inlet portions, and the additional gas supply path is connected to the outer gas inlet portion.

Abstract: A temperature controlled showerhead for chemical vapor deposition (CVD) chambers enhances heat dissipation to enable accurate temperature control with an electric heater. Heat dissipates by conduction through a showerhead stem and fluid passageway and radiation from a back plate. A temperature control system includes one or more temperature controlled showerheads in a CVD chamber with fluid passageways serially connected to a heat exchanger.

Abstract: This disclosure describes systems, methods, and apparatus for operating a plasma processing chamber. In particular, a periodic voltage function combined with an ion current compensation can be provided as a bias to a substrate support as a modified periodic voltage function. This in turn effects a DC bias on the surface of the substrate that controls an ion energy of ions incident on a surface of the substrate. A peak-to-peak voltage of the periodic voltage function can control the ion energy, while the ion current compensation can control a width of an ion energy distribution function of the ions. Measuring the modified periodic voltage function can provide a means to calculate an ion current in the plasma and a sheath capacitance of the plasma sheath. The ion energy distribution function can be tailored and multiple ion energy peaks can be generated, both via control of the modified periodic voltage function.

Abstract: A high speed granule delivery system and method is disclosed for dispensing granules in intermittent patterns onto a moving asphalt coated strip in the manufacture of roofing shingles. The system includes a granule hopper and a rotationally indexable pocket wheel in the bottom of the hopper. A series of pockets are formed in the circumference of the wheel and the pockets are separated by raised lands. A seal on the bottom of the hopper seals against the raised lands as the wheel is indexed. In use, the pockets of the pocket wheel drive through and are filled with granules in the bottom of the hopper. As each pocket is indexed beyond the seal, it is exposed to the moving asphalt coated strip below and its granules fall onto the strip to be embedded in the hot tacky asphalt. Well defined patterns of granules are possible at high production rates.

Abstract: The present invention is notably directed to a microfluidic surface processing device including a microfluidic probe head with at least one aperture, on a face, including at least an outlet aperture; and a surface processing structure extending outward and perpendicular with respect to the face, the processing structure being further dimensioned and located with respect to the outlet aperture such that it can intercept a flowpath of liquid dispensed via the outlet aperture. The present invention is further directed to related apparatuses and methods.

Abstract: A paste formation pattern for odd numbers on which dot groups are arranged in an island form and a paste formation pattern for even numbers on which dot groups are arranged at opposing positions to the dot groups on the paste formation pattern for odd numbers in an island form are set. Further, a paste discharge head is controlled such that the set paste formation pattern for odd numbers is formed on an adhesion surface of an odd-numbered sheet of paper and the discharge head is controlled such that the set paste formation pattern for even numbers is formed on an adhesion surface of an even-numbered sheet of paper.

Abstract: A counter roll (26) is positioned to engage a paper or board web (24) in a paper or board making machine along a contact line. A pressure-sensitive EMFi film (28) is disposed on the counter roll to measure the pressure profile of the web along the contact line. A coating apparatus (22) applies a coating to the web passing over the counter roll (26), and a pressure profile of the applied coating is measured by the pressure-sensitive film (28) on the counter roll (26). The pressure-sensitive film (28) may also be disposed to detect details of coating application in a curtain coater (30). Moreover, the film may be driven to provide adjustable vibration for cleaning the coater, or conditioning or controlling the coating flow.

Abstract: A coating film (90) is formed by causing vapor deposition particles (91) discharged from a vapor deposition source opening (61) of a vapor deposition source (60) to pass through a space between a plurality of control plates (81) of a control plate unit (80) and a mask opening (71) of a vapor deposition mask in this order and adhere to a substrate, while the substrate (10) is moved relative to the vapor deposition mask (70) in a state in which the substrate (10) and the vapor deposition mask (70) are spaced apart at a fixed interval. A difference in the amount of thermal expansion between the vapor deposition source and the control plate unit is detected and corrected. It is thereby possible to form, at a desired position on a large-sized substrate, the coating film in which edge blur and variations in the edge blur are suppressed.

Abstract: A gas supply system includes a main gas supply line; a vent gas supply line; a plurality of gas supply mechanisms disposed in middle of both gas supply lines; a pressure type flow-rate control system disposed on an inlet side of the main gas supply line so a flow of carrier gas is supplied to the main gas supply line; a pressure control system disposed on an inlet side of the vent gas supply line, a carrier gas having a predetermined pressure is supplied to the vent gas supply line while the pressure control system performs a pressure adjustment, a gas pressure of the main gas supply line detected downstream from an orifice of the pressure type flow-rate control system and a gas pressure of the vent gas supply line are compared, and the gas pressure of the vent gas supply line is adjusted so a difference therebetween becomes zero.

Abstract: This description relates to a plasma treatment apparatus including a vapor chamber, a gas supply and an upper electrode assembly. The upper electrode assembly includes a gas distribution plate having a plurality of holes in a bottom surface thereof and an upper electrode having at least one gas nozzle and at least one controllable valve connected to the at least one gas nozzle. The plasma treatment apparatus further includes a controller configured to generate a control signal. The at least one controllable valve is configured to be adjusted based on the control signal. A control system and a method of controlling a controllable valve are also described.

Abstract: The heat treating furnace for the gas reaction includes an outer body, an inner body, a heating mechanism, gas supplying mechanism, and a controller. Using the controller to control the amount of gas supply effectively keeps the first pressure (P1) in the gas circulation chamber outside the inner body greater than the second pressure (P2) in the reaction chamber inside the inner body all the time. In this way, the flow rate of gas inlet, reaction rate, cooling rate can be facilitated, and the uniformity of the thin film and the operational safety can be improved.

Abstract: An automated apparatus and method for coating medical devices such as an intravascular stent, are disclosed in the method, a 2-D image of a stent is processed to determine (1) paths along the stent skeletal elements by which a stent secured to a rotating support element can be traversed by a dispenser head whose relative motion with respect to the support element is along the support-element axis, such that some or all of the stent skeletal elements will be traversed (2) the relative speeds of the dispenser head and support element as the dispenser head travels along the paths, and (3), and positions of the dispenser head with respect to a centerline of the stent elements as the dispenser head travels along such paths The rotational speed of the support and relative linear speed of the dispenser are controlled to achieve the desired coating thickness and coating coverage on the upper surfaces, and optionally, the side surfaces, of the stent elements.

Abstract: An apparatus for depositing a ta-C thin film for a magnetic recording medium includes a film deposition chamber; a plasma beam formation portion for supplying a plasma beam to the film deposition chamber to form the ta-C thin film on a substrate with a magnetic recording layer thereon; a substrate holder rotatably arranged in the film deposition chamber; a tilting member for continuously changing an inclination angle of the plasma beam to a surface of the magnetic recording layer; and a rotating member for rotating the substrate about a rotation axis of the substrate holder. A control member rotates the substrate holder with the substrate thereon and operates the tilting member to continuously change the inclination angle from a minimum inclination angle to a maximum inclination angle according to an increase in film thickness of the ta-C thin film being formed by the plasma beam formation portion.

Abstract: Plasma distribution is controlled in a plasma reactor by controlling the phase differences between different RF coil antennas, in accordance with a desired or user-selected phase difference, by a phase-lock feedback control loop.

Abstract: Disclosed herein is a device comprising an evaporator; and a heat exchanger; the heat exchanger being in fluid communication with evaporator; evaporator comprising an outer casing; and an inner casing that is disposed within the outer casing; the inner casing contacting a plate; wherein the inner casing encloses a first conduit that is operative to introduce a carrier fluid into evaporator; and a second conduit that is operative to remove carrier fluid entrained with a precursor; wherein the outer casing is detachably attached to the plate; the plate contacting a first precursor conduit that is operative to introduce the precursor into evaporator from the heat exchanger; where the heat exchanger is disposed proximate to evaporator at a distance effective to maintain the precursor in evaporator at a substantially constant temperature when the ambient temperature around the heat exchanger and evaporator fluctuates by an amount of up to about ±35° C.

Abstract: A material jet system, comprising a container for molten jet material (3) to be ejected, a heater (4) for melting and/or keeping molten said jet material, and a jetting unit (5, 6, 7) which is arranged to form and eject droplets (8) of said jet material. The system, moreover, comprises supply structures (2) which are arranged for providing an uninterrupted supply of said material, which comprises a metal in solid form (1), and which preferably have the shape of a wire, bar or tape. Furthermore the system comprises a structure for sealing the material in solid form and a pressure controller to control a heat insulating fluid pressure in the container.

Abstract: In order to provide a thin film manufacturing method and a thin film manufacturing apparatus, wherein a thin film with good reproducibility can be manufactured at low cost, and in a way wherein resources are saved, a dummy substrate (S2) is conveyed into a chamber (51), dummy processing gas is supplied to the dummy substrate (S2), a product substrate (S3) is conveyed into the chamber (51), and raw material gas different from the dummy processing gas, and containing therein metal material for manufacturing a thin film with the Metal Organic Chemical Vapor Deposition (MOCVD) method, is supplied to the product substrate (S3). Since the raw material gas is not used as dummy processing gas, the amount of metal material to be used can be inhibited, and a thin film with good reproducibility can be manufactured at low cost, and in a way wherein resources are saved.

Abstract: A method and apparatus for dividing a thin film device having a first layer which is a lower electrode layer, a second layer which is an active layer and a third layer which is an upper electrode layer, the layers each being continuous over the device, into separate cells each having a width W, which are electrically interconnected in series by interconnect structures.

Abstract: Disclosed is a substrate processing system, including: a processing chamber to process a substrate; a vaporizing unit to vaporize a material of liquid; a supply system to supply the processing chamber with gas of the material vaporized by the vaporizing unit; an exhaust system to exhaust an atmosphere in the processing chamber; and a cleaning liquid supply system to supply the vaporizing unit with cleaning liquid for cleaning a product deposited in the vaporizing unit, wherein the cleaning liquid supply system supplies at least two kinds of cleaning liquids into the vaporizing unit so that the product can be removed from the vaporizing unit by action of the two kinds of cleaning liquids on the product.

Abstract: The present disclosure sets forth an automated apparatus and method for applying gas plasma coatings to aircraft engine parts. The process and apparatus employ a plurality of sensors which continually monitor various process parameters associated with the coating process. If any of the measured parameters fall out of tolerance, the coating process is interrupted to allow a user to fix the source of the problem, where upon the process is reengaged. Moreover, the process and apparatus employ a pause resume circuit which uses predetermined durations for pausing and resuming the coating process.