Abstract: Disclosed is a method for selectively removing a coating from a substrate. Aluminum is diffused into the coating. The coating is contacted with an aqueous composition including at least one of an acid having the formula HxAF6, and precursors to the acid, A being selected from the group consisting of Si, Ge, Ti, Zr, Al, and Ga, and x being 1-6. The coating being removed is often an McrAl(X) material. The substrate is a metal, usually a superalloy.

Abstract: In a method and apparatus for cleaning or processing a workpiece, a process gas is brought into contact with the workpiece by diffusion through a heated liquid layer on the workpiece, and by bulk transport achieved by entraining the gas in a liquid stream, spray or jet impinging on the workpiece. The process gas, which may be ozone, is entrained in the liquid via entrainment nozzles. Use of entrainment and diffusion together increases the amount of gas available for reaction at the workpiece surface, increases the reaction rate, and decreases required process times.

Abstract: A method for cleaning a metal plating tank is provided herein. In accordance with the method, the tank is exposed to a first acid (103), after which the tank is exposed to a second acid in the presence of a first oxidizing agent (107).

Abstract: The present invention is generally directed to methods for reducing microbial population on food, especially seafood, during processing. Provided are methods of seafood processing that involve contacting seafood with a disinfection composition comprising an acid, a buffer, and an antimicrobial metal. Such methods can result in reduced pathogen load, reduced spoilage odor, and prolonged shelf-life of seafood. Also provided are systems for seafood processing employing said disinfectant compositions.

Abstract: A degreasing method for descaling or removing laser scales from iron-containing metal part surface by treating the iron-containing metal part surfaces that is optionally tainted with laser scales with an aqueous solution containing at least one type of highly water-soluble and complexed with Fe ions carboxylic acid, at least one type of salt of at least one type of carboxylic acid exhibiting the same action and at least one type of fatty amine ethoxylate, wherein the solution is buffered, the Fe ions are carried into the solution and at least partially complexed, increasing the pH value of the solution for descaling with respect to at least one type of carboxylic acid. The entire concentration of carboxylic acids and the salts thereof is increased for descaling by 2 to 20% by weight.

Abstract: A composition for removing resists and etching residue from substrates containing at least one nucleophilic amine compound having oxidation and reduction potentials, at least one organic solvent, water and, optionally, a chelating agent is described. The chelating agent is preferred to be included since it provides added stability and activity to the cleaning composition so that the composition has long term effectiveness. If a chelating agent is not present, the composition, while providing for adequate stripping and cleaning upon initial use of the composition following mixing, has only short term stability. In this latter instance, the nucleophilic amine compound and organic solvent components of the composition preferably are maintained separate from each other until it is desired to use the composition. Thereafter, the components are combined.

Abstract: A process for cleaning (e.g., desmutting) an aluminum surface, using compositions free of nitric acid and chromic acid and comprising, in one embodiment, an oxidant and at least one mineral acid salt. In another embodiment, the process uses a composition free of nitric acid and chromic acid and comprising an oxidant, at least one mineral acid salt, and a complexing agent which is a salt of an organic acid. Due at least in part to the absence of nitric and chromic acids, and in particular, strong mineral acids, the cleaning processes of the present invention remove smut residues from aluminum surfaces without significant etching of the aluminum.

Abstract: An article of manufacture, a system, and a method for at least partially deionizing water, including but not limited to converting tap water into essentially deionized water that can be used for numerous purposes including, but not limited to cleaning and/or treating surfaces, including surfaces such as ceramic, steel, plastic, glass and/or painted surfaces such as the exterior surface of a vehicle, is disclosed.

Abstract: Disclosed herein is a method of cleaning a photomask, which prevents haze from being generated on a surface of the photomask during a photolithography process. The photomask is heat treated to remove residual ions on a surface thereof and to induce curing and oxidation of Cr and MoSiON layers, thereby preventing diffusion of the ions. Etching of Cr and MoSiON layers due to a cleaning process is suppressed in order to significantly reduce a change in phase and transmissivity of optical properties of Cr and MoSiON.

Abstract: A technique is provided to precludes elution of the nickel by infallibly removing the nickel adhering to the inner surface of plumbing hardware, realize a treatment for efficient (treating temperature, treating duration, etc.) preclusion of both or either of lead and nickel and perform a neutralizing treatment on the varying fluid used in the treatment for precluding elution, thereby rendering the fluid usable as industrial water, permitting a generous cut in cost and allowing thorough observance of the influence on the environment.

Abstract: Described are methods of rinsing and processing devices such as semiconductor wafers wherein the device is rinsed with using a surface tension reducing agent; the method may include a subsequent drying step which preferably incorporates the use of a surface tension reducing agent during at least partial drying; and the method may be performed using automated rinsing equipment; also described are automated rinsing apparatuses useful with the method.

Abstract: A method for cleaning and polishing a rusted iron-containing metal surface is disclosed. The metal surface is contacted with a composition containing fluorometallate anions of a Group IVB metal.

Abstract: Uncured solvent-based paint may be flushed from a paint delivery installation using a substantially non-aqueous composition containing one or more organic solvents and a polymer having acid and/or amine functional groups.

Abstract: A method for activating the surface of a base material and an apparatus thereof, which is suited to be utilized for pretreatment in electrochemical treatment such as, for example, electroplating or the like, in which the surface of a base material such as metal can be subjected to degreasing treatment and oxide film removing treatment simultaneously, efficiently and rationally, in which productivity can be enhanced and the equipment cost can be reduced, and in which a waste solution can be rationalized so that the solution can be reutilized and the environmental pollution can be prevented. A method for activating the surface of a base material in which the surface of a member to be treated is subjected to degreasing treatment or oxide film removing treatment. Pressurized carbon dioxide is dissolved in a predetermined quantity of water, thereby preparing an oxide film removing solution having a predetermined acidic concentration.

Abstract: A method for selectively removing an aluminide coating from at least one surface of a metal-based substrate by: (a) contacting the surface of the substrate with at least one stripping composition comprising nitric acid at a temperature less than about 20° C. to degrade the coating without damaging the substrate; and (b) removing the degraded coating without damaging the substrate. Also disclosed is a method for replacing a worn or damaged aluminide coating on at least one surface of a metal-based substrate by selectively removing the coating using the above steps, and then applying a new aluminide coating to the surface of the substrate. Turbine engine parts, such as high-pressure turbine blades, treated using the above methods are also disclosed.

Abstract: An object of the present invention is to provide a ceramic susceptor for considerably reducing the count number of metal atoms on the surface of a semiconductor after the semiconductor is treated, specifically to 1×1010 atoms/cm2 or lower. It is provided a ceramic susceptor 2 having a face for mounting semiconductor 2a wherein each of metal elements other than metal element(s) constituting the ceramic material has a count number of 1×1011 atoms/cm2 or lower. It is further provided a method of cleaning a ceramic susceptor 2 having a face 2a for mounting semiconductor, wherein the susceptor is cleaned using a complexing agent capable of forming a complex with a metal element.

Abstract: A neutralization system for controlling the pH of the washwater used to clean and maintain polyacrylic bound glass forming equipment. The neutralization system introduces a base solution to a washwater solution when the pH of the washwater solution contained in a closed loop washwater recovery system falls below about 8.5, thereby substantially reducing the corrosion rate of the components of the equipment associated with acidic polyacrylic acid binder, maleic acid cobinder or maleic anhydride cobinder and washwater solution. A closed-loop hoodwall washwater recovery system may also be introduced in addition to the neutralization system that allows for the recovery and reuse of polyacrylic acid binder and maleic acid cobinder or maleic anhydride cobinder with a minimal amount of base solution, thereby minimizing degradation of insulation properties of polyacylic acid bound glass fiber products.

Abstract: On-Line and Off-Line methods of simultaneously cleaning and disinfecting an industrial water system are described and claimed. The methods involve the addition to the water of the industrial water system of a Compound selected from the group consisting of the alkali salts of chlorite and chlorate and mixtures thereof; and an acid, followed by allowing the water in the industrial water system to circulate for several hours. The reaction of the alkali salts of chlorite and chlorate and acid produces chlorine dioxide in-situ in the water of the industrial water system. The chlorine dioxide kills microorganisms and the acid acts to remove deposits upon the water-contact surfaces of the equipment. An alternative method involves the use of a chelating agent and a biocide. Other possible cleaning and disinfection reagents may be added as needed including corrosion inhibitors, chelating agents, biocides, surfactants and reducing agents.

Abstract: A composition for the cleaning of residues from substrates can contain from about 0.01 percent by weight to about 5 percent by weight of one or more fluoride compounds, from about 20 percent by weight to about 50 percent by weight water, from about 20 percent by weight to about 80 percent by weight of an organic amide solvent and from 0 to about 50 weight percent of an organic sulfoxide solvent. The composition can have a pH between about 7 and about 10, alternately from greater than 8 to about 10. Additionally, the composition optionally can contain corrosion inhibitors, chelating agents, surfactants, acids, and/or bases. In use of the composition, a substrate can advantageously be contacted with the composition for a time and at a temperature that permits cleaning of the substrate.

Abstract: Method of wet cleaning a surface of at least one material chosen from silicon, silicon-germanium alloys, A(III)/B(V)-type semiconductors and epitaxially grown crystalline materials, such as germanium, in which method the following successive steps are carried out: a) the surface is brought into contact with an HF solution; b) the surface is rinsed with acidified, deionized water, then a powerful oxidizing agent is added to the deionized water and the rinsing is continued; c) optionally, step a) is repeated, once or twice, while optionally reducing the contacting time; d) step b) is optionally repeated, once or twice; and e) the surface is dried. Process for fabricating an electronic, optical or optoelectronic device, such as a CMOS or MOSFET device, comprising at least one wet cleaning step using the said cleaning method.

Abstract: Ammonia-free, HF-free cleaning compositions for cleaning photoresist and plasma ash residues from microelectronic substrates, and particularly to such cleaning compositions useful with and having improved compatibility with microelectronic substrates characterized by sensitive porous and low-k to high-k dielectrics and copper metallization. The cleaning composition contain one or more non-ammonium producing, non-HF producing fluoride salt (non ammonium, quaternary ammonium fluoride salt) in a suitable solvent matrix.

Abstract: A vicinity part of a high-voltage feeding anode terminal, embedded in a funnel part and having a part thereof exposed on an outer wall surface of the funnel part, is washed with a hydrofluoric acid solution to remove a moisture-absorptive deposited substance adhering to the outer wall surface. According to a manufacturing method of this invention, anode leak failure due to unwanted discharge of the vicinity part of the high-voltage feeding anode can be restrained, and a projection cathode ray tube having an excellent display characteristic can be provided.

Abstract: The surface treatment agent for copper and copper alloys contains hydrogen peroxide, a mineral acid, an azole compound, silver ion and a halide ion. The surface treatment agent for copper and copper alloys is useful in the production of printed wiring boards in electronics industry. The surface treatment agent roughens the surface of copper and copper alloys. Particularly, the surface treatment agent can form a uniform and undulation-free roughened surface on copper-clad substrates having plated mirror surface, this having been difficult in conventional techniques, thereby significantly improving the adhesion to etching resists, solder resists, in addition, to prepregs and a resin for mounting electronic parts.

Abstract: A process for pickling martensitic or ferritic stainless steel, preferably in the form of wires, tubes or rods, wherein the stainless steel is placed in contact with a pickling solution which has a temperature in the range 15 to 29° C. and contains 50 to 120 g/l of free sulfuric acid, 5 to 40 g/l of free HF and 5 to 40 g/l of Fe(III) ions. Such pickling may be incorporated into a sequential process, wherein the stainless steel is a) subjected to a treatment during which the oxidic coating is applied, preferably sand-blasting or metal-blasting, treatment with a molten salt or treatment with an aqueous permanganate/alkali metal hydroxide solution, b) pickled in accordance with the aforedescribed process, and c) post-treated with a passivating solution.

Abstract: An embodiment of the invention is a method of cleaning a material stack 2 that has a hard mask top layer 8. The method involves cleaning the material stack 2 with a fluorine-based plasma etch. The method further involves rinsing the material stack 2 with a wet clean process.

Abstract: The use of an agent containing surfactant components chosen from sulfonic acids or sulfonates, alkylamine oxides, ethercarboxylic acids, and alkylether sulfates, in total amounts of 0.01 to 1 wt. %, preferably 0.05 to 0.5 wt. %, with respect to the entire agent, and also one or more percarboxylic acids chosen from a) those peracids or salts of peracids with general formula (I) R2—O2C—(CH2)x—CO3H in which R2 is hydrogen or an alkyl group with 1 to 4 carbon atoms and x is a number from 1 to 4, and/or b) phthalimido-percarboxylic acids (II), in which the percarboxylic acid segment contains 1 to 18 carbon atoms, and/or c) compounds of the formula (III) R1—CO3H in which R1 is an is an alkyl or alkenyl group with 1 to 18 carbon atoms, for disinfection purposes in CIP processes.

Abstract: A composition having a first nonionic nonylphenol surfactant having an HLB value ranging from about 10 to about 15, a second nonionic nonylphenol surfactant having an HLB value ranging from about 16 to 20, an aqueous solvent, and optionally, a bio-film permeation agent. A total of the first surfactant and the second surfactant in the composition ranges from about 2 to about 20 percent by weight of a total weight of the composition, and a ratio of the second surfactant to the first surfactant in the composition ranges from about 2:1 to about 4:1.

Abstract: The invention relates to compounds of the formula (1) in which A is C2- to C4-alkylene, B is C1- to C4-alkylene, x is a number from 1 to 3, and y is a number from 1 to 100.

Abstract: Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce defects when employed as a rinse solution either during or after the development of the CMP processing. Also disclosed is a method for reducing the number of defects on a plurality of post-CMP processed substrates employing the process solution of the present invention.

Abstract: A method for cleaning contaminated surfaces of surgical waste management equipment. The method includes rinsing surfaces of the equipment with water to remove water soluble contaminants and waste material. A rinse solution is applied to the surfaces of the equipment to provide a residual film thereon. The rinse solution includes a first nonionic nonylphenol surfactant having an HLB value ranging from about 10 to about 15, a second nonionic nonylphenol surfactant having an HLB value ranging from about 16 to 20, a bio-film permeation agent, and an aqueous solvent. A total of the first surfactant and the second surfactant in the solution ranges from about 2 to about 20 percent by weight of a total weight of the solution and a ratio of the second surfactant to the first surfactant in the solution ranges from about 2:1 to about 4:1.

Abstract: Disclosed herein is a device and a method of cleaning a photomask, which prevents haze from being generated on a surface of the photomask during a photolithography process. The photomask is heat treated to remove residual ions on a surface thereof and to induce curing and oxidation of Cr and MoSiON layers, thereby preventing diffusion of the ions. Etching of Cr and MoSiON layers due to a cleaning process is suppressed in order to significantly reduce a change in phase and transmissivity of optical properties of Cr and MoSiON.

Abstract: In a state of the inside of a treatment chamber of treatment equipment being evacuated, therein a cleaning gas containing trifluoroaceticacid (TFA) as a cleaning agent is supplied. Metal such as copper used in the formation of an interconnection or an electrode and stuck on an inner wall surface of the treatment chamber, when coming into contact with the cleaning agent (TFA) in the cleaning gas, without forming an oxide or a metallic salt, is directly complexed. The complex is sublimed due to the evacuation and is exhausted outside the treatment chamber. Accordingly, at less labor and low cost, the cleaning can be efficiently implemented.

Abstract: A method is suitable for cleaning substrates, after polishing, that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, or liquid crystal displays. The method includes polishing a substrate using an abrasive liquid containing abrasive particles, and cleaning a polished surface of the substrate by supplying a cleaning liquid having substantially the same pH as the abrasive liquid or similar pH to the abrasive liquid so that a pH of the abrasive liquid attached to the polished surface of the substrate is not rapidly changed.

Abstract: Decontamination of nuclear facilities is necessary to reduce the radiation field during normal operations and decommissioning of complex equipment. In this invention, we discuss gel and foam based diphosphonic acid (HEDPA) chemical solutions that are unique in that these solutions can be applied at room temperature; provide protection to the base metal for continued applications of the equipment; and reduce the final waste form production to one step. The HEDPA gels and foams are formulated with benign chemicals, including various solvents, such as ionic liquids and reducing and complexing agents such as hydroxamic acids, and formaldehyde sulfoxylate. Gel and foam based HEDPA processes allow for decontamination of difficult to reach surfaces that are unmanageable with traditional aqueous process methods. Also, the gel and foam components are optimized to maximize the dissolution rate and assist in the chemical transformation of the gel and foam to a stable waste form.

Abstract: An extraction cleaning machine comprising dispensing and recovery systems, the dispensing system including a system for generating heat with an exothermic reaction upon activation for heating the cleaning solution prior to dispensing of the cleaning solution onto a surface. The cleaning solution dispensing system comprises a cleaning solution reservoir to which the heat of the exothermic reaction can be added and a dispenser. The heat of the exothermic reaction can also be added in line to the cleaning solution between the cleaning solution reservoir and the dispenser. The recovery system includes a suction nozzle, a recovery tank and a vacuum source for drawing recovered liquid from the suction nozzle into the recovery tank. A method of cleaning a surface comprises the steps of heating a cleaning solution by an exothermic chemical reaction, applying the cleaning solution to the surface and recovering the cleaning solution from the surface.

Abstract: There is provided a method of removing acids from the surface and interior of an acetate film produced by deterioration during storage. Such methods are characterized by extracting and removing the acids from the surface and interior of the acetate film, and the extraction treatment includes solvent extraction or evacuation (heating). This method suppresses the deterioration process in the storage of the acetate film.

Abstract: A cleaning solution for use in removing a damaged portion of a ferroelectric layer, and a cleaning method using the solution. The cleaning solution includes a fluoride, an organic acid with carboxyl group, an alkaline pH adjusting agent and water.

Abstract: A method and cleaning composition for removing engine deposits from turbine components, in particular turbine disks and turbine shafts. This method comprises the following steps: (a) providing a turbine component having a surface with engine deposits thereon, wherein the turbine component comprises a nickel and/or cobalt-containing base metal; and (b) treating the surface of the turbine component with a cleaning composition to convert the engine deposits thereon to a removable smut without substantially etching the base metal of the turbine component. The cleaning composition comprises an aqueous solution that is substantially free of acetic acid and comprising: a nitrate ion source in an amount, by weight of the nitrate ion, of from about 470 to about 710 grams/liter; and a bifluoride ion source in an amount, by weight of the bifluoride ion, of from about 0.5 to about 15 grams/liter.

Abstract: A method for removing a metallic layer from the surface of a ceramic substrate, the method including the steps of immersing the metallic coated ceramic substrate in a solution of up to 31% hydrochloric acid for a sufficient time to at least substantially dissolve or remove the metallic layer therefrom, removing the ceramic substrate from the acid solution, rinsing the ceramic substrate in a rinse solution, and annealing the ceramic substrate at a predetermined temperature for a sufficient time to at least reduce damage or defects in the surface of the ceramic substrate.

Abstract: There are here disclosed a method for removing a titanium-based film from a honeycomb-molding die having on the surface of a base material coated with the titanium-based film, and a method for removing an oxide of titanium from a honeycomb-molding die having the oxide of titanium adhered/deposited on the surface of a base material. In each method, a removing solution comprising a mixture of an acid and hydrogen peroxide is used. According to the methods for removing the titanium-based film and the oxide of titanium, a large amount of the titanium-based film as well as the oxide of titanium adhered/deposited on the base material of a honeycomb-molding die can be removed by use of a small amount of the removing solution without corroding the base material of honeycomb-molding die while re-deposition of dissolved titanium ions on the base material is prevented.

Abstract: A non-destructive and simple method for cleaning a new or used electrostatic chuck comprises a wet cleaning process, which removes contaminants deposited on a surface of the electrostatic chuck.

Abstract: Filters used in the food and beverage industry can be cleaned by contacting the filters with a cyclic nitroxyl compound and a reoxidator or with a nitroxonium compound in a bromine-free process. The nitroxyl can be TEMPO or its 4-acetamido or 4-acetoxy derivative, and the nitroxonium compound can be the corresponding oxidized ion obtained by enzymatic or metal catalyzed oxidation. The reoxidator may be a peracid, such as peracetic acid, persulphuric acid or permanganic acid, or a metal complex with a hydroperoxide.

Abstract: The present invention provides a method and process for removing adherent molten metal from a surface by applying a non-wetting agent for the metal to the surface or to the adherent molten metal. The non-wetting agent may be a pressurized fluid or applied by a pressurized fluid.

Abstract: An aqueous solution that has the capacity for removing tarnish and other soil from copper, silver, gold and other noble metals and alloys thereof comprises an acid, thiourea and a transition metal salt. The aqueous material can be used to treat the surfaces of such articles for the purpose of removing tarnish. Such tarnish is removed by the composition and the composition treats the metal surface to retard the re-appearance of tarnish contaminants.

Abstract: The present invention is directed to a gas turbine cleaner. The composition of the present invention includes a glycol alkyl ether compound, an alkoxylated surfactant with an alkyl chain length of from about 3 to 18 carbons and a metal corrosion inhibitor component.

Abstract: Disclosed is a method and solvent composition capable of removing iron oxide deposits from the surface of titanium components without substantially damaging the underlying titanium component. Iron oxide deposits may be removed from the surface of a titanium component by contacting the titanium component with the solvent composition of the invention. The solvent composition may then be removed from contact with the titanium component to obtain a recyclable solvent composition which is recycled into repeated contact with the titanium component. The solvent composition comprises an aqueous mixture of an organic acid and a hydrohalide acid.

Abstract: The invention relates to a method of low temperature cleaning and applying an antimicrobial treatment to food and beverage plant equipment. In addition, the method includes carbon dioxide compatible chemistry. The method may be achieved through a multi-step method.

Abstract: An aqueous detergent composition is provided containing phosphoric acid or salt thereof, an organic phosphate surfactant, a nonionic surfactant, and water. The aqueous detergent composition may be employed to improved the adhesion of a coating to a substrate. Also provided is a method of improving the adhesion of a coating to a substrate.

Abstract: A general method and apparatus for treating materials at high speed comprises the steps of dissolving a relatively high concentration ozone gas in a solvent at a relatively low predetermined temperature T1 to form an ozone-solvent solution with a relatively high dissolved ozone concentration, and heating either the ozone-water solution or the material to be treated or both, the ozone-solvent solution and the material to be oxidized with a point-of-use heater to quickly increase the temperature to a predetermined higher temperature T2>T1, and applying the ozone-solvent solution to said material(s) whereby the heated ozone-water solution will have a much higher dissolved ozone concentration at said higher temperature, than could be achieved if the ozone gas was initially dissolved in water at said higher temperature.

Abstract: Methods and compositions for cleaning and maintaining chemical, biological and radiological countermeasure washdown systems are disclosed. Systems are effectively cleaned by the removal of water scale, including deposits, sediment, microbiological scale, microinvertebrate fouling, and the like, from the inside surfaces of piping in the system. A section of the system is isolated for cleaning and an aqueous acidic cleaning solution is circulated through the fouled pipe section to be cleaned for a sufficient time and at a controlled pH to dissolve and loosen the scale. After cleaning all of the sections, the system is restored to operational readiness.