Abstract: The invention relates to a method of low temperature cleaning and applying an antimicrobial treatment to food and beverage plant equipment. In addition, the method includes carbon dioxide compatible chemistry. The method may be achieved through a multi-step method.

Abstract: The invention teaches the preparation of a concentrated sanitizing and cleaning preparation. The preparation has a dual use for cleaning and sanitizing food surfaces as well as food contact and non-food contact surfaces. The composition of the invention shows rapid microbicidal properties against representative gram positive and gram-negative bacteria. The invention uses GRAS, food additive ingredients and/or ingredients that are approved by the USFDA for use on food.

Abstract: An environmental friendly cleaning method is provided. The method comprises the step of cleaning an article using a composition comprising material extracted from the fruit of a plant of the genus Garcinia, for example the fruit of the plant Garcinia atroviridis.

Abstract: Treating a water system containing or in contact with a metal sulphide scale to inhibit, prevent, reduce, dissolve or disperse iron sulphide deposits. A solution of tris(hydroxyorgano)phosphines (THP) and tetrakis(hydroxyorgano)phosphonium salts (THP+ salts) and sufficient of a chelant (amino-carboxylates or amino-phosphonates) to provide a solution containing from 0.1 to 50% by weight of said THP or THP+ salt and from 0.1 to 50% by weight of said chelant, is contacted with the metal sulphide scale thereby to dissolve at least part of said scale in said solution.

Abstract: A coherent body (B) of wet crushed ice is pumped along a pipe (5). The crushed ice body can be used as a means of cleaning the pipe wall, as a means of driving a product liquid out of the pipe for recovery, or as a barrier for preventing mixing of two different bodies of liquid (1,2) in the pipe to either side of it. Being coherent but flowable and non-tensile, the mass of crushed ice can negotiate internal constrictions, obstructions and junctions of the pipe readily, unlike conventional solid or gelled pigs.

Abstract: Removal of water-insoluble organic residues from inorganic surfaces can be accomplished in aqueous cleaning solutions containing an oxidant at a preselected temperature wherein the pH is adjusted with respect to the isoelectric point of the surface material to be removed so that the pH is above the pK, and the isoelectric point of the surface for acid materials, and below the PKa and the isoelectric point of the surface for basic materials. Surfactants can also be added to the cleaning solution.

Abstract: In a method of cleaning and refurbishing a process chamber component having a metal coating having a surface thereon, the surface of the metal coating is immersed in an acidic solution to remove at least a portion of the process deposits from the surface. Thereafter, the surface of the metal coating is immersed in a basic solution to remove substantially all the metal coating. The component may optionally be bead blasting to roughen a surface of the component, and the metal coating may be re-formed.

Abstract: In a method of cleaning metal-containing deposits such as tantalum from a surface of a process chamber component, such as a metal surface, the surface is immersed in a cleaning solution. In one version, the cleaning solution is a solution having HF and HNO3 in a ratio that removes deposits from the surface substantially without eroding the surface. In another version, the cleaning solution is a solution having KOH and H2O2. The solution can be treated after cleaning the surface to recover tantalum-containing materials and one or more of the cleaning solutions.

Abstract: A liquid etchant and a method for roughening a copper surface each capable of providing copper with a roughened surface increased in acid resistance regardless of a chlorine ion in a short period of time, to thereby ensure firm adhesion between a copper conductive pattern and an outer layer material during manufacturing of a printed circuit board, resulting in the manufacturing being highly simplified. The liquid etchant includes a main component containing an oxo acid such as sulfuric acid and a peroxide such as hydrogen peroxide. Also, the liquid etchant includes an auxiliary component containing a tetrazole such as 5-aminotetrazole or the like, or a 1,2,3-azole. The liquid etchant permits a copper surface to be roughened in an acicular manner.

Abstract: A method of cleaning the interior of a processing chamber first performs a halogenation treatment by supplying a treatment gas containing a halogenating gas into the processing chamber and heating a support member for a target substrate, thereby halogenating a metal element in a by-product film. A reduction treatment is then performed by supplying a treatment gas containing a reducing gas into the processing chamber, thereby reducing a halide of the metal element and liberating the metal element. An oxidation treatment is then performed by supplying a treatment gas containing an oxidizing gas into the processing chamber and heating the casing walls of the processing chamber, thereby passivating the liberated metal element by oxidation.

Abstract: An aqueous solution that has the capacity for removing tarnish and other soil from copper, silver, gold and other noble metals and alloys thereof comprises an acid, thiourea and a transition metal salt. The aqueous material can be used to treat the surfaces of such articles for the purpose of removing tarnish. Such tarnish is removed by the composition and the composition treats the metal surface to retard the re-appearance of tarnish contaminants.

Abstract: The invention relates to the use of tenside agents containing selected non-ionic tensides, for use in cleaning and/or disinfecting processes and/or cleaning and/or disinfecting preparations.

Abstract: The present invention relates to a method for preventing the deposition of contaminants in steam systems. In a method of this type, deposits are prevented in a simple and economic manner by metering an additive into the steam, which additive adheres to the steam-side surface of the steam system and has the effect of repelling moisture and contaminants.

Abstract: A process of rejuvenating a diffusion aluminide coating on a component. The rejuvenation process involves treating the coating with an aqueous solution of nitric acid and phosphoric acid until at least part of the additive layer of the coating has been removed, but the diffusion zone underlying the additive layer remains. The exposed surface of the component is then re-aluminized to deposit additional aluminum to build up the additive layer to a desired thickness. While potentially useful for a variety of situations, the process is particularly applicable to a diffusion aluminide coating that has been deposited on a component to have an excessively thick additive layer, and prior to the component being returned to service.

Abstract: A method for selectively removing oxide material from the surface of a substrate or coating disposed on the substrate is disclosed. The method includes the step of contacting the oxide material with an aqueous treatment composition having the formula HxAF6, wherein A can be Si, Ge, Ti, Zr, Al, and Ga; and x is 1-6. The composition can sometimes include an additional acid, such as phosphoric acid, nitric acid, sulfuric acid, hydrochloric acid, hydrofluoric acid, and mixtures thereof. A method for replacing a worn or damaged protective coating applied over a substrate, utilizing the treatment composition, is also described.

Abstract: A method for cleaning an electrodeposition surface following an electroplating process including providing a process surface including electro-chemically deposited metal following an electrodeposition process; and, cleaning the process surface with a sulfuric acidic cleaning solution to remove electrodeposited metal particles according to at least one of an immersion and spraying process the spraying process including simultaneously rotating the process surface.

Abstract: An improved method for removing contaminant particles from a surface of a semiconductor wafer includes forming a sacrificial film on the surface of the wafer and then removing the sacrificial film by supercritical fluid cleaning. The removal of the sacrificial film via the supercritical fluid cleaning process facilitates removing the contaminant particles. The method further includes identifying and characterizing the contaminant particles and creating a record of the contaminant particle data. The composition of the sacrificial film is selected based on the contaminant particles data and the supercritical cleaning recipe is selected based on the composition of the sacrificial film and the contaminant particles data.

Abstract: The pan release coating is provided which includes water, mono and diclycerides, polysorbate, and an antimicrobial effective amount of acetic acid, citric acid and sodium benzoate. Desirably, the composition of the present invention is composed of water in an amount of 77% to 95% by weight, acetic acid in the amount of 0.3 to 1% by weight, citric acid in the amount of 0.02 to 1.0% by weight, sodium benzoate in an amount of 0.02 to 0.3% by weight, monoglycerides and diglycerides in the amount of 2 to 8% by weight and polysorbate in the amount of 2 to 7% by weight. Desirably, lecithin is also included. The resulting product has a pH of 4.5 or below, desirably between about 3.5 and 4.5, and most desirably a pH of 3.6 to 3.9. The product has a shelf life of 12 months or longer at room temperature, without refrigeration or a sealed container.

Abstract: The present invention is directed to compositions for removing silver soil from the surface of objects. These compositions contain a reducing agent, and an alkaline source, and may optionally contain various other components including a chelating agent, cleaning agent, filler, an anti-corrosion agent, a defoaming agent, an odorant, a dye, an antioxidant, or a bleaching agent. Methods of using the compositions are also disclosed, wherein the object to be cleaned is contacted with the composition and the object is then washed with an aqueous solution.

Abstract: A long-time stable pickling agent for the removal of an oxide layer on a stainless steel after heat treatment, such as welding, which pickling agent comprises nitric acid and fillers and constitutes of a pickling paste or pickling gel to be coated on the heat treated stainless steel, or of a pickling liquid to be sprayed on the steel. According to the invention, the pickling agent also comprises urea for reduced formation of nitrous fumes when the pickling agent is used.

Abstract: The invention relates to a method for pickling hot-rolled special steel strips (1) having an austenite, ferrite and/or martensite structure. The inventive method is carried out in a pickling line (7) with pickling sections (8) containing acids and rinsing sections (9) containing rinsing water (15). The aim of the invention is to provide a method that does not require an additional stretch-leveling step for descaling. The costs for pickling are reduced by pickling the hot-rolled special steel strip (1) in the pickling sections (8) with hydrochloric acid (13) and rinsing it in the first rinsing sections (9) with azotic acid (14) or an equivalent substitute pickling medium (14b) and treating it in further rinsing sections (9) with rinsing water (15).

Abstract: On-Line and Off-Line methods of simultaneously cleaning and disinfecting an industrial water system are described and claimed. The methods involve the addition to the water of the industrial water system of a Compound selected from the group consisting of the alkali salts of chlorite and chlorate and mixtures thereof; and an acid, followed by allowing the water in the industrial water system to circulate for several hours. The reaction of the alkali salts of chlorite and chlorate and acid produces chlorine dioxide in-situ in the water of the industrial water system. The chlorine dioxide kills microorganisms and the acid acts to remove deposits upon the water-contact surfaces of the equipment. An alternative method involves the use of a chelating agent and a biocide. Other possible cleaning and disinfection reagents may be added as needed including corrosion inhibitors, chelating agents, biocides, surfactants and reducing agents.

Abstract: An automatic deliming process for a steam oven cooker is described. The process initiates a deliming procedure after a predetermined time of normal operation, which period of time is determined by the hardness of the water in the local area. Upon the expiration of this period of time a microprocessor signals an operator to shut down normal operation of the oven, and initiate the deliming process. The microprocessor then activates a peristaltic pump which injects a predetermined quantity of deliming liquid from an external reservoir into the generator. After the deliming time has passed and the generator contents have cooled to 140° F. the microprocessor automatically activates a drain pump to drain the deliming solution from the generator. Subsequently the microprocessor activates a fill-solenoid opening and inlet from a reservoir of rinse water into the generator to rinse the same. The microprocessor then again opens the drain to drain the rinse water, and normal operation is resumed.

Abstract: A method for selectively removing one or more coatings from the surface of a substrate is described. The coating is treated with an aqueous composition which includes an acid of the formula HxAF6, or precursors to such an acid. In that formula, A is Si, Ge, Ti, Zr, Al, and Ga; and x is 1-6. The acid is often H2SiF6. The composition may sometimes include at least one additional acid, such as phosphoric acid. The coating being removed is often an aluminide coating or an MCrAl(X)-type material. The substrate is usually a polymer or a metal, such as a superalloy.

Abstract: Basic cleaning compositions using toxicologically-acceptable ingredients for cleaning fruits and vegetables are provided. Liquid formulations comprising detergent surfactant, such as oleate, alcohol ethoxylates, etc., and neutralized phosphoric acid are sprayed onto apples, lettuce and the like to remove soil and unwanted deposits, especially wax. Articles for applying the compositions to produce by spraying are disclosed. Use of the compositions for disinfectancy/sanitization of produce and cleaning/disinfectancy/sanitization of non-food inanimate surfaces are disclosed.

Abstract: The present invention is a persulfate microetchant composition especially useful for removing impurities from copper surfaces during fabrication of microelectronic packages. The microetchant formulation is characterized by its ability to selectively clean copper in the presence of nickel, nickel-phosphorous and noble metal alloys therefrom. Furthermore, no deleterious galvanic etching occurs in this microetchant-substrate system so that substantially no undercutting of the copper occurs. The combination of high selectivity and no undercutting allows for a simplification of the microelectronic fabrication process and significant improvements in the design features of the microelectronic package, in particular higher density circuits. The persulfate microetchant composition is stabilized with acid and phosphate salts to provide a process that is stable, fast acting, environmentally acceptable, has high capacity, and can be performed at room temperature.

Abstract: Brass articles having leachable lead are contacted with an aqueous caustic solution that contains a chelating agent. A brass article can optionally be post-treated by contacting it with an aqueous solution containing anazole.

Abstract: A cleaning method for removing foreign bodies during the fabrication of semiconductor devices including treating a substrate with a cleaning solution including an oxidizer to form a chemical oxide layer and then removing the chemical oxide layer, thereby removing foreign bodies from a surface of the semiconductor substrate. Accordingly, the foreign bodies can be substantially removed from the surface of the substrate without corroding a metal.

Abstract: Process for removing deposits from water-carrying systems and devices for water supply, or from their individual parts, in which the deposits are dissolved by means of an aqueous treatment solution and removed in dissolved form from the system or the device or their individual parts, wherein the deposits are dissolved by means of an aqueous treatment solution comprised of a combination of (i) a reducing agent, in particular in the form of a slat-like, reducing sulfur-oxygen compound, nitrogen-oxygen compound or phosphorous-oxygen compound, and (ii) a complexing agent having phosphonic acid groups or phosphonate groups or a complexing agent of the hydroxy acid type at pH values in the range of approximately 4.5 to 9.5, in particular from approximately 6.0 to 8.0.

Abstract: A composition for removing etching residue and a method using same are disclosed herein. In one aspect, there is provided a method for removing etching residue from a substrate comprising: contacting the substrate with a composition comprising water, an organic dicarboxylic acid, a buffering agent, a fluorine source, and optionally a water miscible organic solvent.

Abstract: The present invention relates to compositions, kits and processes for the brightening of metal surfaces by the application of the chemical compositions. These compositions act to release hydrofluoric acid as a brightening agent. The solutions are preferably mixed during application of the brightening composition to a metal surface by mixing the solutions immediately prior to or even during application of the solution. This can be readily accomplished by mixing two solutions, one having a fluoride source and the other having a strong acid to release hydrofluoric acid from the fluoride source, the mixing occurring immediately before spray application, during spraying, or immediately after spraying of the two solutions. Mixing may be done on-site, which means that mixing is performed at the site of use, usually on the same day of use or even within a few (less than 10) minutes of use.

Abstract: A method of cleaning process residues from the surface of a substrate processing chamber component having holes. In the method, the component is at least partially immersed into a cleaning solution having hydrafluoric acid and nitric acid, and a non-reactive gas is passed through the holes to prevent the cleaning solution from back-flowing into the holes during the cleaning process. The method is particularly useful for cleaning sputtering residue deposits from an electrostatic chuck used in a sputtering process.

Abstract: A method of substantially reducing biofilm-associated microorganisms on a surface and a composition designed to substantially reduce biofilm-associated microorganisms on surfaces are disclosed. In one embodiment, the composition is an anionic surfactant selected from the group consisting of alkyl sulfates, alkyl sulfonates, and aryl sulfonates with alkyl or aryl substituents, an acid, and an alcohol solvent, wherein the pH of the composition is between pH 1 and pH 5.

Abstract: A semiconductor device production method that is used to uniformly and efficiently reduce metal oxides produced on metal (copper, for example) which forms electrodes or wirings on a semiconductor device. An object to be treated on which copper oxides are produced is put into a process chamber and is heated by a heater to a predetermined temperature. Then carboxylic acid stored in a storage tank is vaporized by a carburetor. The vaporized carboxylic acid, together with carrier gas, is introduced into the process chamber via a treating gas feed pipe to reduce the copper oxides produced on the object to be treated to metal copper. As a result, metal oxides can be reduced uniformly without making the surfaces of electrodes or wirings irregular. Moreover, in this case, carbon dioxide and water are both produced in a gaseous state. This prevents impurities from remaining on the surface of copper.

Abstract: A method for treating surfaces of titanium or titanium alloys which includes the steps of applying a treatment for removing surface adhesion substances from the surface and then forming a transparent protective layer on the surface.

Abstract: A method for preparing a solution for treating an article, a treatment solution made thereby, and a method for treating an article with the solution are presented with, for example, the treatment method comprising providing a quantity of treatment solution, the treatment solution comprising an acid having the formula HxAF6, wherein A is selected from the group consisting of Si, Ge, Ti, Zr, Al, and Ga, and x is in the range from about 1 to about 6; determining a concentration of free acid contaminant in the treatment solution; and removing the concentration of free acid contaminant.

Abstract: To clean contaminants on a substrate including a metal wiring formed thereon, a cleaning solution including diluted aqueous sulfuric acid solution is applied onto the substrate. Mega-sonic energy is applied to the cleaning solution on the substrate. The contaminants are removed from the substrate in accordance with the reaction between the diluted aqueous sulfuric acid solution and the contaminant while the mega-sonic energy is applied to the substrate. The corrosion of the metal wiring is prevented because of the cleaning solution including the diluted aqueous sulfuric acid solution. Additionally, the damage of the substrate is reduced because the mega-sonic energy is appropriately applied to the substrate.

Abstract: Alkaline and acid cleaning solutions (180, 182), are used sequentially for removing organic and inorganic residues, respectively, from the chamber. The two cleaning solutions are stored in separate storage containers (52, 54) carried by the cart. The alkaline cleaning fluid preferably includes a strong base, such as potassium or sodium hydroxide. The acid cleaning solution includes a strong acid, such as phosphoric acid, which passivates the chamber during the cleaning process. After cleaning is complete, the two cleaning fluids are mixed together to form a neutral or near neutral solution which is disposable in a sanitary sewer system without further treatment.

Abstract: A method for cleaning an apparatus using a clean-in-place system is disclosed. The clean-in-place system is in fluid communication with an inlet and an outlet of the apparatus. In the method, a cleaning composition having a measurable physical property (e.g., pH) is supplied from a cleaner tank into the inlet of the apparatus for a first period of time. A rinsing composition having the measurable physical property at a second measured value is then supplied from a rinse tank into the inlet of the apparatus for a second period of time. The measurable physical property is sensed versus time for fluids exiting the outlet of the apparatus, and a circulation time of the cleaning composition is determined. A closing time for a return valve of the cleaner tank is then determined for subsequent cleaning cycles such that minimal rinsing composition enters the cleaner tank during the subsequent cleaning cycle.

Abstract: A method for forming for inhibiting the buildup of cerlum-containing deposits in a process tool is disclosed. The method involves spraying a solution of a dilute acid, preferably nitric or perchloric acid, through the chamber and bowl rinse nozzles of the process tool. The method is less time consuming than previous methods for inhibiting the buildup of cerium-containing deposits and can be conveniently carried out at the end of every shift.

Abstract: Methods of removing discoloration from a metal surface of an electronic device are presented the methods comprising the steps of exposing a metallic surface of an electronic device to a first composition comprising an organic reagent, the metallic surface having discoloration thereon, under conditions sufficient to form a first intermediate metallic surface substantially devoid of non-ionic residues; a second step of contacting the first intermediate metallic surface with a second composition comprising an acid under conditions sufficient to form a second intermediate metallic surface substantially devoid of non-ionic residues, oxides, hydroxides and the like; and rinsing the second intermediate metallic surface with deionized water.

Abstract: A cleaning apparatus and a cleaning method for cleaning a object are provided. In the cleaning apparatus, a drying chamber 42 and a cleaning bath 41 are separated from each other up and down, respectively. Thus, a space in the drying chamber 42 can be insulated from a space of the cleaning bath 41 through rotary doors 59a and a slide door 72. In the cleaning method, a cleaning process in the cleaning bath 41 is carried out while sealing it by the rotary doors 59a. On the other hand, a drying process in the drying chamber 42 is accomplished while sealing and closing it by the slide door 72. Consequently, there is no possibility that, during the drying process, the object is subjected to a bad influence from a chemical treatment.

Abstract: A method and kit are disclosed for removing or alleviating the severity or intensity of stains from aldehyde-based sterilizing solutions through the use of reducing agents. This invention is effective even for porous surfaces such as filter paper and porous nylon films as well as for smooth surfaces such as glass, aluminum, copper, brass and stainless steel. Also, the invention may be used in a variety of formats such as a kit useful for making or using solutions or gels to treat the aldehyde-based stained surfaces of, for example, medical devices, hospital bench or table tops, hospital floors and skin (if in appropriate pH range), etc.

Abstract: A method of pickling a material strip is provided that prevents spots from forming and removing formed spots on a material strip that comes to a standstill during the pickling process. The material strip is passed in a first direction through at least one pickling section to form a first pickled material strip. The first pickled material strip is passed in the first direction through at least one rinsing section to form a first rinsed material strip. The first rinsed material strip is sensed when it comes to a standstill. Pickling solution is applied to at least a portion of the first rinsed material strip when the first rinsed material strip has come to a standstill to form a second pickled material strip. The second pickled material strip may then be moved in a second direction that is opposite to the first direction to move the material strip back into the pickling section to form a third pickled material strip.

Abstract: A process and a moveable container for pickling a metal piece after welding is disclosed in which process the metal piece is brought into contact with an acid surface-treatment agent in the area of the welded joint and the heat-affected zone, the surface treatment agent is allowed to act on the area for a set period of time, the surface treatment agent is removed from the surface of the metal piece with the aid of a neutralizing wash fluid, the wash fluid is chemically treated with an alkalizing agent and an agent that increases the floc size, the chemically treated wash fluid is taken for clarification to form a clarified liquid and a sediment, the heavy-metal waste accumulated during clarification is taken to a hazardous waste treatment plant.

Abstract: Disclosed herein is a post-CMP cleaning method for effectively removing residues, including nitride particles and oxide particles produced in the chemical mechanical polishing (CMP) of a trench-buried oxide film and a pad oxide film as an etch barrier, which is carried out during a process of forming an isolation region in a semiconductor substrate using shallow trench isolation (STI). The post-CMP cleaning method comprises cleaning the substrate with a cleaning solution having a pH below 3 or above 9, so that the substrate surface, including the oxide film and the nitride film, has the same electric polarity as that of the nitride and oxide particles such that a repulsive force acts between the substrate surface and the nitride particles and between the substrate surface and the oxide particles, thereby effectively removing the nitride particles and the oxide particles.

Abstract: A method of enhancing the corrosion resistance of an austenitic steel includes removing material from at least a portion of a surface of the steel such that corrosion initiation sites are eliminated or are reduced in number relative to the number resulting from processing in a conventional manner. Material may be removed from the portion by any suitable method, including, for example, grit blasting, grinding and/or acid pickling under conditions more aggressive than those used in conventional processing of the same steel.

Abstract: In a method of treating substrates a treatment fluid is fed into a collection vessel after treatment, at least a portion of the treatment fluid is withdrawn from the collection vessel and returned to respective reservoir and the collection vessel is rinsed before receiving another treatment fluid.

Abstract: Disclosed a method for radioactive decontamination of a steel surface, which is performed by bringing the surface to be decontaminated into contact with a pickling solution comprising a first iron oxidation agent, wherein bringing into contact being achieved by means of the direct continuous introduction into the pickling solution of a gas comprising a second oxidation agent, and a device for implementing the said method.

Abstract: A method of removing surface-deposited contaminants, comprising bringing an ozone-containing treating solution into contact with the surface of a treating target on which contaminants have deposited. The ozone-containing treating solution comprises an organic solvent having a partition coefficient to ozone in a gas, of 0.6 or more, and ozone having been dissolved in the solvent. Contaminants having deposited on the surfaces of various articles including substrates for electronic devices, such as semiconductor substrates and substrates for liquid crystal display devices can be removed by room-temperature and short-time treatment in a high safety and a good efficiency.