Abstract: A method and apparatus provide for automatically cleaning and decontaminating medical instruments. The method comprising the steps of: a) placing the medical instruments into a container after their use in a medical procedure; b) closing the container to seal the instruments inside whereby to prevent personnel contact with the instruments and any contaminants which might be thereon; c) inserting the sealed container into a washer/decontaminator and sealing the washer/decontaminator; d) the washer/decontaminator automatically opening the container and applying a washing fluid thereto to wash the instruments within the container; and e) the washer/decontaminator automatically applying a disinfectant to the container to disinfect the instruments whereby to allow safe handling thereof by personnel.

Abstract: A substrate processing system which enables a minute piece of foreign matter attached to a substrate surface to be detected and are suitable for mass production of substrates. The substrate processing system has a substrate processing apparatus that carries out predetermined processing on a substrate. The substrate processing system comprises a substrate surface processing apparatus having a fluid supply unit that supplies onto a surface of the substrate a fluid containing an altering substance that alters a substance exposed at the surface of the substrate, and a substrate surface inspecting apparatus that inspects the surface of the substrate onto which the fluid has been supplied.

Abstract: A silicon wafer after being cleaned by using a cleaning liquid is rinsed by using carbonic water. According to such a silicon wafer cleaning method, generation of static due to a rinsing treatment is not caused, so that an electrostatic breakdown is not caused, adhesion of dirt to a cleaned silicon wafer surface due to the static is not caused, adhesion of metal impurities can be prevented in the rinsing treatment of the silicon wafer and, while giving consideration to the cost, furthermore, a rinsing treatment using a clean rinsing liquid free from causing any residue can be performed.

Abstract: An apparatus capable of cleaning a material includes pipes arranged in a first barrel; and through holes defined in a second barrel. The second barrel is received in the first barrel. The apparatus further includes a driver comprising a drive shaft, the drive shaft extending through the first barrel and being connected to the second barrel. A fluid container is included store fluid, an air controller is provided air-dry the material. Before washing the material, the second barrel is driven by the driver to cause each of the through holes to disengage from a corresponding pipe. After washing the material, the second barrel is driven by the driver to cause each of the through holes to engage with the corresponding pipe.

Abstract: A cleaning apparatus for a semiconductor wafer includes: a gas jet device including a gas nozzle which jets a first gas onto the surface of a semiconductor wafer to thin the thickness of a stagnant layer on the surface of the semiconductor wafer; and a two-fluid jet device including a two-fluid nozzle which jets droplet mist onto a region where thickness of the stagnant layer of the semiconductor wafer is thinned, the droplet mist being mixed two-fluid of a liquid and a second gas.

Abstract: A method of manufacturing a semiconductor device in which an insulating film is filled between patterns etched into a workpiece structure is disclosed. The method includes cleaning etch residues residing between the etched patterns by a first chemical liquid; rinsing the workpiece structure cleaned by the first chemical liquid by a rinse liquid; and coating the workpiece structure rinsed by the rinse liquid with a coating liquid for formation of the insulating film. The cleaning to the coating are carried out within the same processing chamber such that a liquid constantly exists between the patterns of the workpiece structure.

Abstract: A semiconductor apparatus includes a first tank configured to accommodate a first fluid. A second tank is configured to receive overflow of the first fluid into an upper portion of the second tank and to accommodate a second fluid. A cycling system including a first conduit is configured between the first tank and the second tank. The first conduit has an end substantially below a surface of the second fluid. A fluid providing system including a second conduit is fluidly coupled to the second tank and configured to provide the second fluid into the second tank. The second conduit has an end substantially below the surface of the second fluid. An overflow system is coupled to the second tank and configured to remove an upper portion of the second fluid when the surface of the second fluid is substantially equal to or higher than a pre-determined level.

Abstract: Provided is a method and system for stripping a resist film on a plurality of substrates in a resist removal system comprising a processing chamber coupled to a recirculation system comprising a recycle sub-system and a bypass sub-system. The recycle sub-system includes a recycle line, an inline heater, a ratio monitor and control system, and recirculation injection device. The bypass sub-system comprises a treatment liquid supply line, a first injection line, a mixing device, and a second injection line. The treatment liquid comprises a primary stripping chemical, secondary stripping chemical, tertiary stripping chemical, and one or more reactive products. One or more of the temperatures, concentrations, and/or flow rates of the recirculated treatment liquid and/or injected stripping chemicals are adjusted to meet a target strip rate and selectivity for strip over etch of silicon nitride or silicon oxide.

Abstract: An apparatus for cleaning a substrate is disclosed. The apparatus having a first head unit and a second head unit. The first head unit is positioned proximate to the surface of the substrate and has a first row of channels defined within configured to supply a foam to the surface of the substrate. The second head unit is positioned substantially adjacent to the first head unit and proximate to the surface of the substrate. A second and a third row of channels are defined within the second head unit. The second row of channels is configured to supply a fluid to the surface of the substrate. The third row of channels is configured to apply a vacuum to the surface of the substrate.

Abstract: A washing/drying machine according to the present invention is capable of efficiently performing a drying operation to reduce a drying period. The washing/drying machine includes a tank (11) for storing used water, and the water is circulated from the tank (11) for dehumidification of air circulated through a drying air duct (20). Since the water is circulated from the tank (11), a great amount of water can be supplied as dehumidification water for higher dehumidification efficiency. The amount of the circulated water (the amount of cooling water (dehumidification water)) is reduced in a first half of a drying process, and increased in a second half of the drying process. As a result, the drying efficiency is improved during the drying operation, thereby reducing the drying period.

Abstract: A cleaning apparatus in which a cleaning process is simplified, a time required for the cleaning process is reduced and which has an excellent cleaning effect, and a high pressure cleaner for use therein are provided.

Abstract: A liquid processing apparatus includes: a processing part 80 configured to process an object to be processed by a process liquid; a supply path 1 connected to the processing part 80, the supply path 1 being configured to guide the process liquid to the processing part 80; a solvent supply part 7 configured to supply a solvent to the supply path 1; and a chemical-liquid supply part 5 configured to supply a chemical liquid to the supply path 1 through a chemical-liquid supply path so as to generate a chemical liquid diluted with the solvent. A measuring part 10, which is configured to measure a conductivity of the chemical liquid diluted with the solvent, is disposed in the supply path at a position downstream from a connection points 25a, 35a, 45a, to which the chemical-liquid supply path 6 is connected.

Abstract: Systems, apparatus and methods are provided for efficiently reclaiming solvents used to clean surfaces of semiconductor wafers, etc. More particularly, embodiments of the present invention provide a reclaim approach that prevents the evaporation of chemical solvents used to process wafers using proximity heads, by confining hot liquid solvents used to form fluid menisci on the wafer surface with cold liquid solvents of the same chemical composition.

Abstract: The in situ cleaning system provides an inlet capable of providing feed water to an in situ cleaning component, one or more in situ cleaning components, including water treatment components, an oxidizing agent generating component and/or alkalinity generating component, and an outlet in fluid communication with a washing system, providing a cleaning use solution to the washing system.

Abstract: Processing and drying of a sample, such as a semiconductor or MEMS device, is achieved using a single pressure chamber. The pressure chamber holds the sample in a sealed interior volume throughout various process steps, such as, but not limited to, photoresist removal, sacrificial layer etching, flushing or rinsing, dehydration, and critical point drying. The pressure chamber is constructed of a chemically-resistant and pressure-resistant material to withstand the various chemicals and pressures that are encountered in the various process and drying steps. For example, the pressure chamber is constructed from a nickel-copper alloy. Automated release etching and critical point drying of a MEMS or semiconductor device is provided without removing the device from the sealed pressure chamber.

Abstract: A method for cleaning platinum residues from a surface of a substrate is provided. The method initiates with exposing the surface to a first solution containing a mixture of nitric acid and hydrochloric acid. Then, the surface is exposed to a second solution containing hydrochloric acid.

Abstract: A liquid processing apparatus, capable of preventing a cleaning solution from remaining on a lifting member of a target object, thereby preventing an attachment of a cleaning solution to an opposite surface of a target object, and preventing an inflow of the cleaning solution into an inert gas supply part to efficiently supply the inert gas to the object, is disclosed. The liquid processing apparatus includes a hollow-shaped support plate to support an object, a hollow-shaped rotary shaft fixedly connected to the support plate, a rotary drive part to rotate the rotary shaft in a predetermined rotating direction, and a lift pin plate arranged in a hollow of the support plate to have lift pins supporting a main body and the processed object. A cleaning solution supply part to supply a cleaning solution and an inert gas supply part to supply an inert gas are extended in a hollow of the rotary shaft.

Abstract: The present invention provides a substrate processing system in which a processing liquid is supplied to a substrate W from a processing nozzle 50a situated above the substrate W so as to process the substrate W, and which makes it possible to prevent unintended dripping of the processing liquid from the processing nozzle. A substrate processing system 20 comprises a processing nozzle 50a capable of supplying a processing liquid to a substrate to be processed, an arm 54 supporting the processing nozzle, and droplet removing nozzles 60, 62 capable of blowing a gas to the processing nozzle. The arm is movable between a processing position and a waiting position, the processing nozzle being above a substrate when the arm is in the waiting position and being outside a substrate when the arm is in the processing position. The droplet removing nozzles are so situated that they are in the vicinity of the processing nozzle when the arm is in the waiting position.

Abstract: A cleaning system which includes an enclosure and having a door with a transparent window. The door is opened and closed to load and unload products to be cleaned. An operator puck on the outside of the enclosure couples magnetically to another actuator puck on the inside of the enclosure. This coupling allows an operator to move and direct the inside puck to actuate spray or air blast functions, without opening the enclosure. The outside operator puck includes one or more switches which turn on the various electronic components such as the liquid pump, light, or air blast valve. The cleaning system enables a user to efficiently direct cleaning action to parts inside to minimize the cleaning time, and to prevent exposure of chemicals. The cleaning fluid is cycled out of the enclosure continuously, and into a “trap” box, through a pump and back into the cleaner box in a closed loop cycle.

Abstract: A method for cleaning platinum residues from a surface of a substrate is provided. The method initiates with exposing the surface to a first solution containing a mixture of nitric acid and hydrochloric acid. Then, the surface is exposed to a second solution containing hydrochloric acid.

Abstract: In a substrate processing apparatus, an anti-static liquid supply part supplies the anti-static liquid having electrical resistivity higher than that of an SPM liquid onto a substrate to puddle an entire upper surface of the substrate with the anti-static liquid, to thereby gradually remove static electricity from the substrate. Then, the processing liquid supply part supplies the SPM liquid onto the substrate to thereby perform an SPM process. In the SPM process, it is thereby possible to prevent a large amount of electric charges from rapidly moving from the substrate to the SPM liquid and prevent any damage to the substrate. Further, by maintaining the electrical resistivity of the anti-static liquid at the target electrical resistivity, it is possible to increase the static elimination efficiency of the substrate and shorten the time required for the static elimination process within the limits of causing no damage to the substrate.

Abstract: Processing and drying of a sample, such as a semiconductor or MEMS device, is achieved using a single pressure chamber. The pressure chamber holds the sample in a sealed interior volume throughout various process steps, such as, but not limited to, photoresist removal, sacrificial layer etching, flushing or rinsing, dehydration, and critical point drying. The pressure chamber is constructed of a chemically-resistant and pressure-resistant material to withstand the various chemicals and pressures that are encountered in the various process and drying steps. For example, the pressure chamber is constructed from a nickel-copper alloy. Automated release etching and critical point drying of a MEMS or semiconductor device is provided without removing the device from the sealed pressure chamber.

Abstract: A water-conducting domestic appliance including a line system, a detergent feed facility that supplies at least one detergent into the line system, wherein the detergent feed facility includes at least one reservoir configured to be filled with detergent, and a refill fitting having a connection to the at least one reservoir, the refill fitting being arranged on a door of the water-conducting domestic appliance.

Abstract: A surface treating jig of the present invention includes a treatment solution collecting section having (i) a ring-like groove formed on a surface (a) facing to a surface (a) to be treated of a semiconductor wafer and (ii) a through hole for collecting the treatment solution, the through hole formed so as to be continuous with the ring-like groove. With this arrangement, the present invention provides a surface treatment apparatus that prevents the treatment solution from spattering to a surface other than the surface (a) to be treated, and thereby, treatment with the treatment solution can be performed only with respect to the target surface.

Abstract: Apparatus and methods are provided for efficiently reclaiming solvents used to clean surfaces of semiconductor wafers, etc. More particularly, embodiments of the present invention provide an in-situ reclaim approach that utilizes condensing mechanisms to reclaim evaporated solvent components. In these embodiments, the condensing can occur within a proximity head itself and/or along a vacuum line running from the proximity head to a vacuum tank. Other embodiments of the present invention provide an in-situ reclaim approach that prevents the evaporation of solvents at the onset by maintaining appropriate equilibrium gas phase concentrations between the liquid chemistries and gases used to process wafer surfaces.

Abstract: A cleaning apparatus includes at least a holder, a lance with a fluid distributing device, a drive unit for a translatory movement of the lance in the holder, a first fluid conducting system with a first feed, a first return and at least one first flow path proceeding from the first feed toward the first return for cooling the cleaning apparatus, and a second fluid conducting system with a second feed and at least one second flow path proceeding from the second feed toward the fluid distributing device.

Abstract: Process and apparatus is disclosed for providing a chemical reaction between calcium oxide containing grit particles to produce calcium hydroxide and heat, capturing the heat of hydration and using it to preheat water initially at ambient temperature, to rise to an elevated temperature to increase the amount of lime present in the water to a supersaturated lime suspension level, with the chemical reaction running to completion, followed by cooling. Heat from a water jacket may be used to raise the temperature in the lime slaker. A process and apparatus is also provided for dissolving scale on internal surfaces of a lime slaker, a lime aging tank, grit separation device and piping and dosing sub-systems, by adding acid into the system with rinse water. A pressurized delivery system that is substantially closed to atmosphere delivers treating dosing under sufficient pressure conditions to maintain a relatively constant back pressure, by means of valving.

Abstract: Disclosed are a liquid processing apparatus and a liquid processing method that can prevent a substrate in a processing chamber from being contaminated due to contaminants attached to a nozzle supporting arm. The liquid processing apparatus includes a processing chamber in which a substrate holder holding a substrate and a cup disposed around the substrate holder are provided; a nozzle configured to supply a fluid to the substrate held by the substrate holder; and a nozzle supporting arm configured to support the nozzle. A gas ejection mechanism is installed at the nozzle supporting arm to eject a gas toward a front end surface of the nozzle supporting arm.

Abstract: Methods and apparatus are provided for using various megasonic apparatus including megasonic tanks, scanning megasonic plates, megasonic jets, and megasonic sweeping beams etc., in combination with selective chemistries to remove sub-micron particulate contaminants from the surfaces of the processing equipment used in semiconductor, medical, or any other processing environments.

Abstract: A device to provide improved anti-smudging, better gripping and longer shelf-life to products and surfaces includes an electric superheated steam generator and an electric low-ion plasma generator to provide superheated steam and low-ion plasma to the surfaces of products including plastics. One embodiment envisions the superheated steam generator and the low-ion plasma generator being contained in a housing while another embodiment anticipates a conveyor means positioned in front of the superheated steam generator and the low-ion plasma generator. A method for the improving of anti-smudging, gripping and shelf-life for properties includes the application of superheated steam and low-ion plasma by means of a superheated steam generator and a low-ion plasma generator to products for specific periods of time and at specific distances to attain desired surface and bulk properties. The superheated steam and low-ion plasma may be applied individually, simultaneously or sequentially.

Abstract: A cleaning apparatus for cleaning measuring probes (18) of a gas turbine engine (1). The invention further relates to a method for cleaning measuring probes (18) of an gas turbine engine (1). The apparatus comprises distribution means (30) comprising a plurality of supply means (31, 32, 33), each comprising connection means (33) arranged for connection to a probe (18), and each supply means (31, 32, 33) being arranged to, when connected to a probe (18), distribute pressurized cleaning liquid to said measuring probe (18), wherein a substantially simultaneous cleaning of probes connected to said distribution means (30) via said supply means (31, 32, 33) can be obtained.

Abstract: Strategies for tool designs and their uses wherein the tools can operate in either closed or open modes of operation. The tools easily transition between open and closed modes on demand. According to one general strategy, environmentally controlled pathway(s) couple the ambient to one or more process chambers. Air amplification capabilities upstream from the process chamber(s) allow substantial flows of air to be introduced into the process chamber(s) on demand. Alternatively, the fluid pathways are easily closed, such as by simple valve actuation, to block egress to the ambient through these pathways. Alternative flows of nonambient fluids can then be introduced into the process chamber(s) via pathways that are at least partially in common with the pathways used for ambient air introduction. In other strategies, gap(s) between moveable components are sealed at least with flowing gas curtains rather than by relying only upon direct physical contact for sealing.

Abstract: A fluid separation apparatus suitable for separating a mixed fluid with different properties and capable of separating a complex fluid mixture efficiently is provided. The fluid separation apparatus includes a sampling entrance, a first separation column, a second separation column, a bypass line, a detector and a guide multi-channel valve. A mixed fluid flows into the first separation column via the sampling entrance. The second separation column is connected to the first separation column in series and connected to the bypass line in parallel. The detector is connected to the second separation column and the bypass line. The guide multi-channel valve has different modes to control a flow-through status and a closed status between the first separation column and the second separation column, between the first separation column and the bypass line, between the second separation column and the detector, and between the bypass line and the detector.

Abstract: A surface treatment apparatus of a substrate can clean a substrate surface in the air without employing a vacuum apparatus, and can remove a natural oxide film or an organic material, such as BTA, from the substrate surface without resorting to plasma cleaning. The surface treatment apparatus includes: an inert gas supply section for supplying an inert gas to the whole or part of a substrate surface to form an oxygen-blocking zone; a heating section for keeping the substrate surface at a predetermined temperature; and a cleaning gas supply section for supplying a cleaning gas to the oxygen-blocking zone to clean the substrate surface.

Abstract: A liquid treating apparatus comprising a holding device (30) for holding wafers (W) in a substantially vertical attitude and a treating vessel (10) for accommodating the wafers held by the holding device. A treating liquid is supplied into the treating vessel by means of a treating liquid supply system. A rotational drive device (20) is provided for rotating the holding device (30) around a rotational axis passing approximately through the center of the wafers (W) in a state of non-contact with the treating vessel (10).

Abstract: The present invention relates to a system and method for washing gas turbine engines comprising a manifold comprising one or more tubes; a pumping system for providing pressurized washing liquid to the manifold, the pumping system comprising a pump, and one or more valves; and a control unit for regulating the pumping system according to washing parameters associated to a particular engine.

Abstract: A bicycle sprocket chain cleaning and lubrication apparatus allows a sprocket chain (3) to be cleaned while still mounted on the bicycle. The apparatus includes a includes a housing (10) for enclosing the sprocket chain on all sides consisting of mutually connectable upper half-shell (11) and lower half-shell (12) portions and a securement assembly which includes a mounting plate adapted to attach to a rear wheel quick disconnect of the bicycle. The housing is suspended from the sprocket chain and provides a funnel shaped solvent hopper (17), a hose connection (21) to a compressed air supply, and an air knife (23) adapted to direct high velocity air to impinge upon and thereby dry the sprocket chain.

Abstract: A substrate treatment apparatus includes: a nozzle having an opposing surface to be opposed to and spaced from a front surface of a substrate rotated by a substrate rotating unit, the nozzle further having an outlet port provided in the opposing surface to be opposed to a rotation center of the substrate; a second liquid supply control unit which controls the second liquid supplying unit to fill a space defined between the front surface and the opposing surface with the second liquid in a liquid filled state, and then stop supplying the second liquid to form a liquid puddle in the space; and a first liquid supply control unit which controls a first liquid supplying unit to spout a first liquid from the outlet port after the formation of the liquid puddle.

Abstract: A rinsing liquid (DIW) is discharged from a rinsing liquid discharge port formed in a blocking member to perform rinsing processing to a substrate surface while a nitrogen gas is supplied into a clearance space, and a liquid mixture (IPA+DIW) is discharged from a liquid mixture discharge port formed in the blocking member to replace the rinsing liquid adhering to the substrate surface with the liquid mixture while the nitrogen gas is supplied into the clearance space. Thus, an increase of the dissolved oxygen concentration of the liquid mixture can be suppressed upon replacing the rinsing liquid adhering to the substrate surface with the liquid mixture, which makes it possible to securely prevent from forming an oxide film or generating watermarks on the substrate surface.

Abstract: The present disclosure provides a system for in-situ spectrometry. The system includes a wafer-cleaning machine that cleans a surface of a semiconductor wafer using a cleaning solution. The system also includes a spectrometry machine that is coupled to the wafer-cleaning machine. The spectrometry machine receives a portion of the cleaning solution from the wafer-cleaning machine. The portion of the cleaning solution collects particles from the wafer during the cleaning. The spectrometry machine is operable to analyze a particle composition of a portion of the wafer based on the portion of the cleaning solution, while the wafer remains in the wafer-cleaning machine during the particle composition analysis.

Abstract: Conduit can connect a beverage line in fluid communication with a supply of first fluid. A pump operates to allow a second fluid to enter the conduit in a predetermined proportion relative to the first fluid. A primary first fluid control means and a secondary first fluid control means are selectively and independently movable between respective open positions in which the first fluid can flow into the conduit and respective closed positions in which flow of the first fluid into the conduit is substantially prevented. In use, the primary first fluid control means is in the open position, and the secondary first fluid control means selectively alternates between the open position and the closed position so as to create a pulsed secondary flow of the first fluid into the conduit for enhanced cleaning.

Abstract: A cleaning process is provided for a test apparatus that has a switch, external connections and internal volumes that can come into contact with a fluid from a filter to be tested or a container to be tested. The cleaning process includes selecting one or more internal volumes to be cleaned, cleaning the selected internal volumes with a cleaning fluid by a corresponding switching of the switch, at least partially draining the cleaning fluid left in the selected internal volumes after cleaning, and flushing the selected internal volumes with a flushing fluid different from the cleaning fluid. Also provided are a computer program product for performing the cleaning process, a cleaning apparatus, and a test apparatus for testing filters and containers.

Abstract: A laparoscopic lens cleaner which is suitable for maintaining the lens of a laparoscope in a clean, dry condition during a laparoscopic surgical procedure is disclosed. An illustrative embodiment of the laparoscopic lens cleaner includes an elongated cleaner sheath having a sheath interior, a fluid conduit provided in the cleaner sheath, a fluid discharge nozzle provided in the sheath interior and communicating with the fluid conduit, a gas conduit provided in the cleaner sheath and a gas discharge nozzle provided in the sheath interior and communicating with the gas conduit.

Abstract: A surface processing method and a surface processing agent for effectively removing smear produced in a via or the like are disclosed. The smear is to be removed without etching an inner metalized layer without using expensive permanganates that might impose a greater load on an environment and operators. By removing the smear, the tightness in adhesion between an inner metalized circuit layer and plating metal as well as reliability in electrical connection may be improved. To this end, a surface processing method for a resin-containing substrate of a printed circuit board is provided in which the smear left in an opening, such as a blind via, a through-hole or a trench, formed in the substrate, may be removed without etching a metalized inner layer.

Abstract: A solvent that reversibly converts from a hydrophobic liquid form to hydrophilic liquid form upon contact with water and a selected trigger, e.g., contact with CO2, is described. The hydrophilic liquid form is readily converted back to the hydrophobic liquid form and water. The hydrophobic liquid is an amidine or amine. The hydrophilic liquid form comprises an amidinium salt or an ammonium salt.

Abstract: A substrate cleaning device and a substrate cleaning method reduces liquid drops remaining on a substrate to prevent the irregular heating of the substrate by a heating process due to liquid drops or water marks remaining on the substrate. A cleaning liquid is poured through a cleaning liquid pouring nozzle onto the surface of a substrate such that a region onto which the cleaning liquid is poured moves from a central part toward the circumference of the substrate. A gas is jetted radially outward at a region on the surface of the substrate behind a region onto which the cleaning liquid is poured with respect to the rotating direction of the substrate. The gas forces a liquid film of the cleaning liquid flowing on the surface of the substrate to flow in a circumferential direction and a radially outward direction.

Abstract: An object of the present is to uniform particle diameters and speeds of liquid droplets in a two-fluid nozzle for cleaning substrates which mixes gas and liquid internally and injects liquid droplets with gas so as to clean a substrate. The two-fluid nozzle for cleaning substrates has a gas supply passage for supplying gas, a liquid supply passage for supplying liquid, and a lead-out passage for leading out internally-formed liquid droplets, wherein an injection port for injecting liquid droplets to the outside is formed at the front end of the lead-out passage, and wherein a cross-sectional area Sb of the injection port is formed smaller than a cross-sectional area Sa of the lead-out passage, and a cross sectional area Sc of an exit of the gas supply passage is formed smaller than the cross-sectional area Sa of the lead-out passage.

Abstract: A laparoscopic lens cleaner which is suitable for maintaining the lens of a laparoscope in a clean, dry condition during a laparoscopic surgical procedure is disclosed. An illustrative embodiment of the laparoscopic lens cleaner includes an elongated cleaner sheath having a sheath interior, a fluid conduit provided in the cleaner sheath, a fluid discharge nozzle provided in the sheath interior and communicating with the fluid conduit, a gas conduit provided in the cleaner sheath and a gas discharge nozzle provided in the sheath interior and communicating with the gas conduit.

Abstract: A cleaning material is applied to a surface of a substrate. The cleaning material includes one or more polymeric materials for entrapping contaminants present on the surface of the substrate. A rinsing fluid is applied to the surface of the substrate at a controlled velocity to effect removal of the cleaning material and contaminants entrapped within the cleaning material from the surface of the substrate. The controlled velocity of the rinsing fluid is set to cause the cleaning material to behave in an elastic manner when impacted by the rinsing fluid, thereby improving contaminant removal from the surface of the substrate.

Abstract: The invention relates to a device and method for cleaning, activating or pre-treating workpieces by blasting a carbon dioxide snow which is produced from pressurized CO2-containing fluids and at least one type of carrying compressed gas and is accelerated by means of a discharge nozzle (14), wherein a two-phase carbon dioxide mixture of a carbon dioxide gas and carbon dioxide particles is produced in an agglomeration chamber (8) by agglomerating and compressing carbon dioxide snow crystals which are radially added to the carrying gas in a multistage mixing chamber (10, 11, 12) comprising a central jet pipe (4), around which the carbon dioxide mixture circulates and which is used for supplying said carrying gas in such a manner that a high-energy turbulent gas flow for processing a workpiece is obtainable.