Abstract: A method and biological cleaning system are provided for cleaning substrate surfaces of oils and/or greases using a biological cleaning system which utilizes a pre-treatment bath and/or post-treatment bath as part of the cleaning system. The pre-treatment and/or post-treatment baths are compatible with the biological cleaning bath and during operation of the system, the used pre-treatment and/or post-treatment baths are recycled to the biological cleaning solution for biodegradation. A system is provided in which none of the pre-treatment, post-treatment or biological cleaning baths need expensive waste disposal. Replenishment pre-treatment and/or post-treatment baths as well as biological cleaning baths are added as needed to the biological cleaning system. Other treatment baths may be added directly to the biological cleaning bath with or without pre- or post-treatment for specific purposes such as a detergent phosphating bath used in the biological cleaning tank to provide a cleaned phosphated part.

Abstract: Where a substrate such as a semiconductor wafer held in a process space in a process chamber consisting of an outside chamber and an inside chamber is subjected to a cleaning processing, a chemical agent such as IPA or a solvent having a surfactant added thereto is supplied in the form of a mist or a vapor toward the substrate under the sate that the substrate is stopped or rotated at a low speed after processing with a chemical agent and a subsequent rinsing processing with a pure water. After the supply of the chemical agent is stopped, the substrate is rotated at a rotating speed higher than said low speed so as to centrifugally remove the chemical agent attached to the substrate.

Abstract: Apparatus and method for dispensing a gas using a gas source coupled in selective flow relationship with a gas manifold. The gas manifold includes flow circuitry for discharging gas to a gas-using zone, and the gas source includes a pressure-regulated gas source vessel containing the gas at superatmospheric pressure. The pressure-regulated gas source vessel can be arranged with a pressure regulator at or within the vessel and a flow control valve coupled in flow relationship to the vessel, so that gas dispensed from the vessel flows through the regulator prior to flow through the flow control valve, and into the gas manifold. The apparatus and method permit an enhancement of the safety of storage and dispensing of toxic or otherwise hazardous gases used in semiconductor processes.

Abstract: An apparatus for processing a microelectronic workpiece is set forth. The apparatus comprises a workpiece support adapted to hold the microelectronic workpiece and a processing container adapted to receive the microelectronic workpiece held by the workpiece support. A drive mechanism is connected to drive the processing container and the workpiece support relative to one another so that the microelectronic workpiece may be moved to a plurality of workpiece processing positions for processing using processing fluid that is provided by first and second chemical delivery systems. The apparatus also includes first and second chemical collector systems that are used to assist in at least partially removing spent processing fluid. In accordance with one embodiment, the apparatus is particularly adapted to execute an immersion process, such as electroplating, and a spraying process, such as an in-situ rinse.

Abstract: A milking plant for milking animals, such as cows, wherein milk collecting means, prefeably in the form of teat cups, are attached to the teat of the animal whereafter milk is taken from the animal by use of vacuum. The milk is transported by a milk line system (31) to milks storage means comprising a cooling tank (30). For cleaning purposes the milk line system from each milk collecting means can be shut off from the milk tank by valve means (32) in order for separate cleaning of the milk line system. The invention is characterized by preventing any possible leakage of detergent from a cleaning fluid to the milk that has been collected in the milk tank, by providing a pressure difference between the two fluids. The pressure difference between the fluids is preferably achieved by connecting the cleaning fluid to the vacuum supply (4) of the milking plant.

Abstract: A sequential process for dry cleaning laundry articles is provided comprising a) at least one non-aqueous dry cleaning step, b) at least one low-aqueous dry cleaning step, and, optionally, at least one rinsing step.

Abstract: A process and apparatus to deliver both process chemical and solvent for cleaning the process chemical in a solvent purge refill system along with an integral solvent sorption module, in a single “assembly” that permits ease of shipping, minimal end-user interaction, sufficient solvent for the solvent purge operation, without residual solvent, requiring disposal. This eliminates customer handling of the solvent, and eliminates the customer's need to find a solvent waste facility, as residual solvent can be returned in the same package in one piece/one step.

Abstract: A system for equalizing pressure in a washing chamber in response to changes in pressure inside washing chamber. Gate elements are operable between open and closed positions to regulate pressure conditions inside the washing chamber.

Abstract: A household appliance, such as a dishwasher, a washing machine, or similar apparatus, is proposed with an addition unit (9) to add cleansing agent to a cleaning liquid, which ensures reliable rinsing out of the cleansing agent chamber(s). This is accomplished according to the invention by the fact that the addition unit (9) is connected with a pressure line (7) of a rinsing pump (2) to deliver wash liquid to the addition unit (9) in order to rinse out cleansing agent located in it.

Abstract: A substrate treating apparatus for performing a predetermined treatment of substrates. The apparatus includes a holder for holding a plurality of substrates in erected posture, a treating tank for storing hot sulfuric acid at at least 140° C. for treating the substrates immersed therein, and a bubble supply device including a plurality of bubble generating members formed by sintering quartz particles and arranged in the treating tank for generating bubbles of ozone gas such that the bubbles of ozone gas partially overlap one another in a direction parallel to surfaces of the substrates.

Abstract: In a method of cleaning process residues formed on surfaces in a substrate processing chamber, a sacrificial substrate comprising a sacrificial material is placed in the chamber, a sputtering gas is introduced into the chamber, and the sputtering gas is energized to sputter the sacrificial material from the substrate. The sputtered sacrificial material reacts with residues on the chamber surfaces to clean them. In one version, the sacrificial substrate comprises a silicon-containing material that when sputtered deposits silicon on the chamber walls that reacts with and cleans fluorine-containing species that are left behind by a chamber cleaning process.

Abstract: The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.

Abstract: Methods of and apparatus for washing an array of sites in high-density microplates or similar assay plates wherein the microplates or assay plates are washed in an inverted or nearly inverted position, rather than in an upright position. Preferably, the wash liquid is dispensed upwardly in the form of a sheet from a nozzle mounted on a spray bar as the spray bar moves relative to the microplate or assay plate. After washing, the microplate or assay plate is dried with a stream of gas such as air, also preferably blown upwardly in the form of a sheet.

Abstract: A portable apparatus cleans a passage such as an oxygen line by circulating a cleaning medium, such as a silicated alkaline cleaner such as OCC, through the passage. A rinse medium, such as distilled water, may than be circulated through the passage. The cleaning medium and the rinse medium may be filtered, and a flush medium is preferably circulated through the passage after the circulation of the cleaning medium and before the circulation of the rinse medium.

Abstract: A method of cleaning process residues formed on surfaces in a chamber during processing of a substrate in the chamber includes first and second steps. In a first cleaning step, a first energized cleaning gas having a first chlorine-containing gas and oxygen is provided in the chamber and then exhausted. In a second cleaning step, a second energized cleaning gas having a second chlorine-containing gas and oxygen is provided in the chamber and then exhausted.

Abstract: A method for cleaning an apparatus using a clean-in-place system is disclosed. The clean-in-place system is in fluid communication with an inlet and an outlet of the apparatus. In the method, a cleaning composition having a measurable physical property (e.g., pH) is supplied from a cleaner tank into the inlet of the apparatus for a first period of time. A rinsing composition having the measurable physical property at a second measured value is then supplied from a rinse tank into the inlet of the apparatus for a second period of time. The measurable physical property is sensed versus time for fluids exiting the outlet of the apparatus, and a circulation time of the cleaning composition is determined. A closing time for a return valve of the cleaner tank is then determined for subsequent cleaning cycles such that minimal rinsing composition enters the cleaner tank during the subsequent cleaning cycle.

Abstract: The invention relates to a process including a chemical liquid treatment and a rinse liquid treatment on a substrate, more particularly to a technique for reducing consumption of a chemical liquid while achieving uniform process and preventing particle generation. In a specific embodiment, the process is performed for removing a silicon oxide film formed on a silicon wafer. The process includes three subsequently performed steps, in which (1) diluted hydrofluoric acid (DHF), (2) DHF and de-ionized water (DIW), (3) DIW are supplied, respectively, onto a rotating wafer. Transition from step (1) to step (2) is done immediately before the hydrophilic silicon oxide film is dissolved to expose the underlying hydrophobic silicon layer.

Abstract: The present invention provides a processing liquid tank and a processing system which take smaller spaces for the tank and the heat exchanger and can be realized at low costs. The processing liquid tank 100 for storing a prescribed processing liquid comprises an inner cylinder 130 in the processing liquid tank 100. The processing liquid is stored outer of the inner cylinder 130. The pipes 160a, 160b, 160c for passing a heat medium are disposed in the processing liquid. The flow of the heat medium passing through the pipes 160a, 160b, 160c is opposite to the flow of the heat medium. The processing device comprises a processing liquid tank 100, a processing unit for processing objects-to-be-processed and a processing liquid supply line for supplying a processing liquid from the process liquid tank to the processing unit.

Abstract: Silicon wafers are treated with chemicals during the manufacture of integrated circuits according to the method of the invnention in the apparatus of the invention which comprises a process tank for cleaning, rinsing, and/or drying silicon wafers; a first chemical supply vessel suitable for being pressurized, fluidly coupled to the process tank; a chemical flow sensor for electronically monitoring the flow rate of chemical from the first hemical supply vessel; a first chemical flow metering valve for electronically controlling the flow rate of chemical from the first chemical supply vessel; a supply of hot DI water fluidly coupled to the process tank; a hot water metering valve for electronically controlling the flow rate of hot DI water from the supply of the hot DI water; a supply of cold DI water fluidly coupled to the process tank; a cold water metering means for electronically controlling the flow rate of cold DI water from the supply of cold DI water; water flow sensor means for electronically monitorin

Abstract: Apparatus for pressure processing components is disclosed which includes an improved closure system that minimizes dust-generating parts and allows easy access to the chamber. Ports are provided for introducing and releasing pressurized gases and fluids to and from the processing space. The heating system of the apparatus heats both the cover and the stage inside the pressurized chamber such that cycle time to equilibrate heated, pressurized fluids such as supercritical carbon dioxide inside the chamber are decreased. The apparatus includes a mechanism that raises the stage inside the chamber, pressing it against the fixed cover and sealing the inside of the pressure vessel. In one embodiment a screw-type jack is used to move the component-loaded stage fitted with a deformable o-ring seal a short travel distance to seat against the lid and seal the pressure chamber. In a related embodiment a computer and an electronic stepper motor are used to drive the pressing means in an automated fashion.

Abstract: A method for cleaning an apparatus using a clean-in-place system is disclosed. The clean-in-place system is in fluid communication with an inlet and an outlet of the apparatus. In the method, a cleaning composition having a measurable physical property (e.g., pH) is supplied from a cleaner tank into the inlet of the apparatus for a first period of time. A rinsing composition having the measurable physical property at a second measured value is then supplied from a rinse tank into the inlet of the apparatus for a second period of time. The measurable physical property is sensed versus time for fluids exiting the outlet of the apparatus, and a circulation time of the cleaning composition is determined. A closing time for a return valve of the cleaner tank is then determined for subsequent cleaning cycles such that minimal rinsing composition enters the cleaner tank during the subsequent cleaning cycle.

Abstract: A stripping solution is supplied onto the surface of a substrate and an alternating magnetic flux is applied to the substrate. The alternating magnetic flux induces a current in a conductive pattern of the substrate which heats the conductive pattern while the stripping solution is in contact with the substrate. The stripping solution, containing particles to be cleaned off the substrate, is then removed from the substrate.

Abstract: A substrate treating apparatus and substrate treating method for performing at least cleaning treatment of substrates. The substrate are cleaned in a treating tank while a cleaning liquid (deionized water) is introduced into the treating tank through a bottom thereof and an excess amount of the cleaning liquid is allowed to overflow the tank. During the treatment, a feeding flow rate of the cleaning liquid is varied with time, to prevent a stagnation of flows in the tank and promote the effect of removing particles. The cleaning liquid in the tank is not drawn off quickly, to avoid unnecessary vibration being applied to the substrates.

Abstract: A dish-cleaning appliance comprising a sink having a bowl defining a wash chamber with an open top for providing access to the wash chamber. A liquid recirculation system is provided for spraying liquid onto the dish rack to effect the cleaning of any dishes along the rack. A basket with a sprayer is disposed within the wash chamber. A self-aligning coupling fluidly connects a liquid conduit to the sprayer when the basket is seated.

Abstract: The present invention comprises methods, compositions and apparatus for cleaning the surfaces within vessels that have restricted points of entry, and in particular, the surfaces within oxygen converters and oxygen cylinders. These oxygen converters and oxygen cylinders are components of the onboard oxygen supply systems of aircraft. A surfactant and a solvent are mixed to form a cleaning composition that is boiled at reduced pressure and increased temperature within the oxygen converter or oxygen cylinder. The oxygen converter or oxygen cylinder is rinsed with pure solvent, and the rinse fluid is measured to determine the level of contaminants. Dry air is forced through the oxygen converter or oxygen cylinder to remove remaining solvent. The cleaning composition may comprise a fluorocarbon solvent and a fluorosurfactant.

Abstract: A method of and system for cleaning semiconductor wafers minimizes the exposure of the wafers to the air by washing, rinsing and drying the wafers in one cleaning chamber. The system includes a wafer support by which a plurality of wafers can be supported in the cleaning chamber as oriented vertically and spaced from each other, and tubular de-ionized water supply nozzles extending longitudinally in the direction in which the wafers are spaced from each other as disposed to the sides of the wafers. Each de-ionized water supply nozzle has an inner nozzle passageway, and a plurality of sets of nozzle holes extending radially through the main body of the nozzle from the inner nozzle passageway. Each such set of nozzle holes subtends an angle of 80˜100° in a vertical plane and is directed towards a surface of a respective wafer W.

Abstract: An apparatus and method are disclosed that can process a substrate such as a wafer while keeping high cleanliness. The apparatus comprises a center port 100, which is stationarily arranged in the center and on the surface of which at least one blow-off outlet is provided for blowing off fluid, and a rotating housing portion 200 which is capable of rotating about the center port 100. The rotating housing portion 200 comprises a top plate 210 comprising a main surface S2 that opposes a wafer W, and a lower housing being connected to the top plate 210 and rotatably driven by a rotation-driving member. When the surface S1 comprising blow-off outlets 151a and 153a of the center port 100 is offset from the main surface S2 of the top plate 210 and fluid is blown off from the blow-off outlet 151a, the substrate W is contactlessly held above the main surface S2 of the top plate 210 and the surface S1 of the center port 100.

Abstract: A flushing system for flushing away any coking material which may have built up in the bearing of a gas turbine. Three fluid tanks respectively contain a solvent for dissolving the coked material, a cleaner and a lubricant. By means of a three-way valve, one of the fluids is provided to a supply pump for delivery to the bearing housing via a quick disconnect coupling. Fluid is returned to the appropriate tank by means of a return pump, via a quick disconnect coupling and another three-way valve between the return pump and the tanks. The system includes respective filters for filtering the return fluids and the entire system may be carried on a wheeled cart for servicing the gas turbine.

Abstract: Method for processing an article with a dense processing fluid in a processing chamber while applying ultrasonic energy during processing. The dense fluid may be generated in a separate pressurization vessel and transferred to the processing chamber, or alternatively may be generated directly in the processing chamber. A processing agent may be added to the pressurization vessel, to the processing chamber, or to the dense fluid during transfer from the pressurization vessel to the processing chamber. The ultrasonic energy may be generated continuously at a constant frequency or at variable frequencies. Alternatively, the ultrasonic energy may be generated intermittently.

Abstract: Method for processing an article by contacting the article with a dense fluid. The article is introduced into a sealable processing chamber and the processing chamber is sealed. A dense fluid is prepared by introducing a subcritical fluid into a pressurization vessel and isolating the vessel, and then heating the subcritical fluid at essentially constant volume and essentially constant density to yield a dense fluid. At least a portion of the dense fluid is transferred from the pressurization vessel to the processing chamber, wherein the transfer of the dense fluid is driven by the difference between the pressure in the pressurization vessel and the pressure in the processing chamber, thereby pressurizing the processing chamber with transferred dense fluid. The article is contacted with the transferred dense fluid to yield a spent dense fluid and a treated article, and the spent dense fluid is separated from the treated article.

Abstract: In order to free a seized valve, an inspection port is formed in a wall of the valve body and the areas where the valve is seized are determined. One or more injection ports are formed in the valve body adjacent to the seized portions of the valve, pressurized fluid (preferably an insoluble lubricant having a very high cone penetration) is injected through the or each injection port and the injection ports are then closed.

Abstract: A substrate treatment apparatus for removing an unnecessary substance from a surface of a substrate. The apparatus is provided with: an oxidation liquid supply mechanism for supplying an oxidation liquid having an oxidative effect to the substrate surface; a physical cleaning mechanism for physically cleaning the substrate surface; and an etching liquid supply mechanism for supplying an etching liquid having an etching effect to the substrate surface. It is preferred to physically clean the substrate surface while supplying the oxidation liquid to the substrate surface.

Abstract: Cleaning according to an evaporating dish cleaning mode or heating chamber cleaning mode is implemented based on a signal inputted by the control part. In the heating chamber cleaning mode, condensation is generated on the inner surface of the heating chamber 11 by steam, and the soil adhered to the inner surface of the heating chamber 11 is allowed to float to be in a state of removing it easily. In the evaporating dish cleaning mode, a cleaning liquid made of citric acid solution is pumped into an evaporating dish 35, it is heated to a predetermined temperature, and it is left therein. Therefore, calcium and magnesium deposited on the evaporating dish 35 are allowed in a state of removing them easily.

Abstract: An engine cleaning system has a cleaning solution container (11) having a filter element (52) therein and is adapted to establish a predetermined quantity of solution for a particular engine. Solution is pumped from the solution container (11) to the engine interior by the engine oil pump, and a solution drain line (31) connects the engine interior and the solution container. Oil and cleaning solution are pumped by the engine oil pump continuously during the cleaning process. The solution container has a removable closure for filter replacement and a drain valve (12) for solution and oil.

Abstract: A method and system for reliably reducing the formation of particles upon wafers or substrates during wafer processes is disclosed. The method and system reduces residue contamination of a substrate material during wafer processes by pre-filling a pressure chamber to a first pressure P1 with a purified pre-fill prior to filling the pressure chamber with a primary bulk source at a second pressure P2. By pre-filling a chamber with purified pre-fill source at the first pressure P1 which is substantially equal to the bulk source pressure P2, the contaminants found in the bulk CO2 remain within the bulk CO2. Thus, this method and system reduces precipitation of contaminates caused by the depressurization of the bulk source during wafer processes and thereby reduces corresponding substrate material contamination.

Abstract: Equipment of pretreatment before painting for a composite vehicle body comprises a treatment tank, an aluminum chemical conversion unit, and a rinse unit. The treatment tank is filled with a degreasing and chemical conversion solution containing a mixed solution of a polar organic solvent and water, any of sodium ion and lithium ion, phosphate ion, zinc ion, nickel ion, manganese ion, and any of nitrate ion and nitrite ion. The mixed solution has a weight ratio of the polar organic solution to the water in a range of 2.8:7.2 to 3.8:6.2. The aluminum chemical conversion unit treats the composite vehicle body with a chemical conversion solution for aluminum. The rinse unit washes the composite vehicle body with a washing solution.

Abstract: The present invention comprises methods, compositions and apparatus for cleaning the surfaces within vessels that have restricted points of entry, and in particular, the surfaces within oxygen converters and oxygen cylinders. These oxygen converters and oxygen cylinders are components of the onboard oxygen supply systems of aircraft. A surfactant and a solvent are mixed to form a cleaning composition that is boiled at reduced pressure and increased temperature within the oxygen converter or oxygen cylinder. The oxygen converter or oxygen cylinder is rinsed with pure solvent, and the rinse fluid is measured to determine the level of contaminants. Dry air is forced through the oxygen converter or oxygen cylinder to remove remaining solvent. The cleaning composition may comprise a fluorocarbon solvent and a fluorosurfactant.

Abstract: A self-service car wash provided with coin-operated time-controlled wash and rinse spray capability includes an integrated exit air drying apparatus controlled by the coin-operated controller.

Abstract: A pressure washer including a first container adapted to contain a first liquid, a second container adapted to contain a second liquid, a valve, a first conduit fluidly connecting the first container to the valve, and a second conduit fluidly connecting the second container to the valve. The pressure washer also includes a single engine-powered pump and a mixing device. The pump is adapted to receive water from a water source, and the mixing device adapted to receive water from the pump. The mixing device is adapted to mix at least one of the first and liquids received from the valve with the water received from the pump.

Abstract: The present invention relates to a method of cleaning a wafer chuck (10) by an automated system that supplies a solvent to a chuck surface (12), washes the chuck surface (12), and dries the chuck surface (12) by spinning the chuck (10), in one embodiment. In another embodiment, the chuck surface (12) is dried by pulling a vacuum on the chuck surface (12) or flowing a gas on the chuck surface (12). Additionally, a brush can be used to wash the chuck surface (12).

Abstract: This invention provides a process for treating a workpiece having a front side, a back side, and an outer perimeter. In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides or the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece as the workpiece and corresponding reactor are spinning about an axis of rotation that is generally orthogonal to the center of the face of the workpiece being processed. The flow rate of the one or more processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.

Abstract: A method is provided for treating an object. In this method, a treating chemical is introduced to a bath under conditions effective to at least partially envelop the object to be treated in eddy currents of the bath liquid, followed by introducing non-treating liquid into the bath under conditions effective to at least partially envelop the object to be treated in eddy currents of the bath liquid. An apparatus for carrying out this method is also provided.

Abstract: By a simple apparatus construction and process, it is made possible to “clean precisely” a surface at the molecular/atomic level, and the purification degree of the surface processed minutely is made into 1012 molecules/cm2 or less. A steam-spraying nozzle is disposed such that a line slit nozzle is in a diameter direction, and mist-containing steam is sprayed onto the surface of a substrate. Thereby, particles in the steam-spraying surface (the particles were made to adhere by dipping the substrate in a solution containing polystyrene (particle diameter of 0.6 &mgr;m) or alumina (particle diameter of 0.3 &mgr;m to 0.5 &mgr;m) particles at 105 particles/ml.) are removed by about 90% to 95% after ten-seconds spraying, and by 99% or more, that is, to less than the detection limit of a wafer inspection device, after twenty-seconds spraying.

Abstract: In a method of cleaning process residues formed on surfaces in a substrate processing chamber, a sacrificial substrate comprising a sacrificial material is placed in the chamber, a sputtering gas is introduced into the chamber, and the sputtering gas is energized to sputter the sacrificial material from the substrate. The sputtered sacrificial material reacts with residues on the chamber surfaces to clean them. In one version, the sacrificial substrate comprises a silicon-containing material that when sputtered deposits silicon on the chamber walls that reacts with and cleans fluorine-containing species that are left behind by a chamber cleaning process.

Abstract: There is provided a method of cleaning completely a deposit on the surface of the member to be cleaned, of a plasma processing apparatus without any damage of the coating which has been formed anodized coating or sprayed coating on the surface of the member to cleaned. The method of cleaning comprises a chemical cleaning step of dipping in an organic solvent (e.g. acetone) (a); and then a step blowing pressurized air so as to remove the deposit which has been peeled from a buffer plate (14) treated chemically (b); and then, of removing physically the deposit remained at the edges of the buffer plate (14) by blasting by using a CO2blast apparatus (105), and f steps of dipping the buffer plate (14) in pure water (104), and imparting supersonic vibration to remove the deposit remaining on a buffer plate (14).

Abstract: A device and method is disclosed for cleaning a plurality of injection needles having a hollow tubular body of a generally constant outer diameter, a proximal opening, and a distal opening. The device includes a housing defining a manifold. The housing has a plurality of corresponding openings through a top and a bottom surface. The openings have a diameter approximately equal to the needle diameter. The device further includes a high-pressure air source coupled to the housing and in fluid communication with the manifold. The method includes inserting needles into the openings, such that a proximal opening of the needle is located within the manifold, and injecting air into the manifold and through the bore of the needles.

Abstract: An apparatus for monitoring a cleaning process for a medical device includes a cleaning chamber for receiving and cleaning the instrument with a cleaning liquid, a receiving well within the cleaning chamber, a removable soil standard receivable within the receiving well whereby to be exposed to the cleaning process within the cleaning chamber; and a soil detector coupled to the cleaning chamber and adapted to provide an indication of the amount of the soil on the soil standard while the soil standard is received within the receiving well.

Abstract: A wet processing device of this invention is comprised of a chemical processing tank to store chemicals for processing the surface of the wafer, a wafer conveyor device to carry the wafer in and out of the interior of the chemical processing tank, and a sensor to determine the amount of air bubbles occurring within the chemical when present within the chemical processing tank and issue a first and a second control signal, and a wash tank to store water for washing the wafer carried out from the chemical processing tank by the wafer conveyor. The rising speed of the wafer conveyor device pulled the wafer up from the chemical processing tank is controlled in response to the first control signal, and the wash tank water fill quantity for supplying water to the wash tank is controlled in response to the second control signal.

Abstract: There is provided a cleaning apparatus having a first vacuum container into which a cleaning object is to be introduced, a second vacuum container set apart from the first vacuum container by means of a light-transmissive member, a pump for evacuating the inside of each of the first vacuum container and the second vacuum container, a gas feed means for feeding an electric-discharge gas into the second vacuum container, and an electric-discharge generation means for generating electric discharge in the second vacuum container, wherein the cleaning object is irradiated through the light-transmissive member by light produced by the electric discharge generated in the second vacuum container.

Abstract: A method of washing a process station and/or the material being processed therein uses a series of tanks of wash solution used in a sequential fashion. A first volume of wash solution is used and discarded to waste. Subsequent volumes of solution are transferred after use to the tank from which the previous volume of solution was supplied. The last volume of solution used is taken from a source of clean solution.