Abstract: In one embodiment, an apparatus of treating a surface of a semiconductor substrate comprises a substrate holding and rotating unit, first to fourth supplying units, and a removing unit. A substrate holding and rotating unit holds a semiconductor substrate, having a convex pattern formed on its surface, and rotates the semiconductor substrate. A first supplying unit supplies a chemical onto the surface of the semiconductor substrate in order to clean the semiconductor substrate. A second supplying unit supplies pure water to the surface of the semiconductor substrate in order to rinse the semiconductor substrate. A third supplying unit supplies a water repellent agent to the surface of the semiconductor substrate in order to form a water repellent protective film onto the surface of the convex pattern. A fourth supplying unit supplies alcohol, which is diluted with pure water, or acid water to the surface of the semiconductor substrate in order to rinse the semiconductor substrate.

Abstract: A method for operating a dishwasher is provided. During a first phase, the dishwasher is operated with a first fluid quantity that is heated by a desorption process of a drying material. The first fluid quantity is increased to a second fluid quantity by adding a third fluid quantity that is stored in the drying material. During a second phase, the dishwasher is operated with the second fluid quantity. The first and second fluid quantities are circulated by a circulation pump during the first and second phases, respectively. The circulation pump is operated at a rotational speed that is higher during the second phase than during the first phase.

Abstract: In one embodiment, an apparatus of treating a surface of a semiconductor substrate comprises a substrate holding and rotating unit which holds a semiconductor substrate with a surface having a convex pattern formed thereon and rotates the semiconductor substrate, a first supply unit which supplies a chemical and/or pure water to the surface of the semiconductor substrate, and a second supply unit which supplies a diluted water repellent to the surface of the semiconductor substrate to form a water-repellent protective film on the surface of the convex pattern. The second supply unit comprises a buffer tank which stores the water repellent, a first supply line which supplies a purge gas to the buffer tank, a second supply line which supplies a diluent, a pump which sends off the water repellent within the buffer tank, a third supply line which supplies the water repellent sent off from the pump, and a mixing valve which mixes the diluent and the water repellent to produce the diluted water repellent.

Abstract: A device for the regeneration of a biosensor, having an immobilized and biologically active material applied to the surface of a carrier that is suitable for interacting with a substance to be analyzed. The device comprises at least one injector through which, by means of a pump, at least one solution can be applied to the surface of the carrier for the purposes of rinsing the biologically active material.

Abstract: A method of clearing a pipe of contents with an air system. The method may include providing air by the air system at high pressure and low velocity until the contents begin to move within the pipe, providing air by the air system air at low pressure and high velocity until a majority of the contents are removed from the pipe, and continuing to provide air at low pressure and high velocity until substantially all remaining contents are removed from the pipe.

Abstract: Provided are methods for processing a substrate using a proximity system defined by one or more meniscus windows on one or more proximity heads. One method includes applying a first fluid meniscus to a surface of the substrate to apply a chemical precursor to the surface of the substrate. The first fluid meniscus is applied to first proximity meniscus window. Then, applying a second fluid meniscus to the surface of the substrate to leave an atomic layer of the chemical precursor on the surface of the substrate, through a second proximity meniscus window. A third fluid meniscus is applied to the surface of the substrate to apply a chemical reactant configured to react with the atomic layer of the chemical precursor to generate a layer of a material, through a third proximity meniscus window.

Abstract: A substrate processing apparatus of the present invention is to apply processing using a processing liquid to a substrate. The substrate processing apparatus includes a first-side plate disposed oppositely to a first surface of the substrate with a distance and provided with plural discharge ports and suction ports in a surface opposing the first surface, a first-side processing liquid supply mechanism that supplies a processing liquid to the discharge ports in the first-side plate, and a first-side suction mechanism that sucks insides of the suction ports in the first-side plate.

Abstract: The invention is a dual functioning system for de-scaling or blowing down an electrically powered steam boiler. The steam boilers are generally used for sterilizing equipment and other items commonly used by health care professionals. The system includes a microprocessor controlled module, which is interfaced with the sterilizer controlled module, to measure the frequency and duration of the cleaning or blow down cycles. Typically, a cleaning cycle involves the use of an acid, such as phosphoric acid, to facilitate chemical removal of scale which is mineral deposits resulting from the use of hard water in the boiler. In the blow down cycle, the scale is removed by simple mechanical means without the use of a phosphoric acid cleaning solution. Various pumps and valves are utilized so that cleaning or blow down may be accomplished without having to disassemble or modify any input or drain lines.

Abstract: An apparatus and method for regenerating spent ion exchange resin is described. In one method, a fresh regenerant solution comprising sodium ions and chloride ions is prepared, and passed across spent cation exchange resin to regenerate the spent resin. To recover the spent regenerant solution, a regenerant treatment composition is added to the spent solution to form precipitate flocs, which are then separated out of the regenerant solution. The concentration of at least one of the sodium or chloride ions in the regenerant solution can also be adjusted to form fresh regenerant solution which can be reused.

Abstract: The technology of washing and treatment MWU (modular washing unit) is conceived to wash and treat fruits and vegetables in a confined environment, with progressively more and more clean water (counter-current) and with an optimal ratio between the quantities of water used and processed products. The system allows important savings of water, chemicals and energy. The technology of washing and treatment MWU (modular washing unit) is conceived to allow the transport and the treatment of the product in confined environment, with clean water (counter-current) In the MWU the product is submitted to sequence of filling and emptying with appropriated solutions, progressively cleaner, prior to subsequent discretionary treatments. A treatment plant can be equipped with a variable number of MWUs, with additional remote MWUs to meet the desired production capacity.

Abstract: In a liquid processing apparatus configured to remove, from a substrate including a first film and a second film formed above the first film, the first film and the second film, a first chemical-liquid supply part supplies, to a substrate W, a first liquid for dissolving the first film, a second chemical-liquid supply part supplies a second chemical liquid for weakening the second film, and a fluid supply part serving also as an impact giving part gives a physical impact to the second film so as to break the second film and supplies a fluid for washing away debris of the broken second film. A control device controls the respective parts such that, after the second liquid has been supplied and then the fluid has been supplied from the fluid supply part, the first chemical liquid is supplied.

Abstract: The disclosure concerns a manufacturing method of a semiconductor device includes dry-etching a semiconductor substrate or a structure formed on the semiconductor substrate; supplying a solution onto the semiconductor substrate; measuring a specific resistance or a conductivity of the supplied solution; and supplying a removal solution for removing the etching residual material onto the semiconductor substrate for a predetermined period of time based on the specific resistance or the conductivity of the solution, when an etching residual material adhering to the semiconductor substrate or the structure is removed.

Abstract: Removing contaminants from an electroless nickel (EN) plated surface. A surface of an EN plated object is washed in a first deionized water to remove a first portion of surface contaminants. The surface is immersed into a chemical solution wash for a pre-determined duration to remove nickel phosphate particles from the surface, wherein the chemical solution wash comprises at least one type of chelating agent dissolved in a solvent. The chemically washed surface is then washed in a second deionized water to remove a second portion of the surface contaminants.

Abstract: A first application of a cleaning material is made to a surface of a substrate. The cleaning material includes one or more viscoelastic materials for entrapping contaminants present on the surface of the substrate. A first application of a rinsing fluid is made to the surface of the substrate so as to rinse the cleaning material from the surface of the substrate. The first application of the rinsing fluid is also performed to leave a residual thin film of the rinsing fluid on the surface of the substrate. A second application of the cleaning material is made to the surface of the substrate having the residual thin film of rinsing fluid present thereon. A second application of the rinsing fluid is then made to the surface of the substrate so as to rinse the cleaning material from the surface of the substrate.

Abstract: A drawer-type dishwasher includes a dispenser mounted to a basin slidably supported in an outer body of the dishwasher. The dispenser includes a main body portion, a reservoir formed in the main body portion for receiving detergent and a lid hingedly mounted for selectivity closing the reservoir. The reservoir includes front, rear, bottom and opposing side walls, with one of the front, rear and opposing side walls being provided with a drainage port which is adapted to be closed by the lid. The dispenser is provided with a manual actuator that enables a consumer to open the dispenser lid to add detergent. An automatic actuator is provided to open the dispenser lid, exposing the reservoir and the drainage port, at a predetermined point in a washing operation. In addition to detergent, the dispenser can be provided with a reservoir for retaining and releasing rinse aid.

Abstract: A process for treating the surface of a substrate in the manufacture of a semiconductor device. The process comprises providing a concentrated acid or base, a peroxide and water, and delivering the acid or base, the peroxide and the water to the surface of the substrate. The acid or base and the water are delivered separately to the surface of the substrate and allowed to mix on the surface, and the water is delivered in pulses. The present invention also provides an apparatus adapted to carry out this process.

Abstract: An apparatus for etching a substrate includes (a) a nozzle system including at least one nozzle through which acid solution containing at least hydrofluoric acid is sprayed onto the substrate, (b) a mover which moves at least one of the nozzle system and the substrate relative to the other in a predetermined direction in such a condition that the substrate and the nozzle system face each other, (c) a filter system which filters off particles out of the acid solution having been sprayed onto the substrate, and (d) a circulation system which circulates the acid solution having been sprayed onto the substrate, to the filter system, and further, to the nozzle system from the filter system.

Abstract: A substrate support for holding a substrate during fluid preparation is provided. The substrate support includes a support member defined from a resistive material. The support member is coupled to a first electrode and a second electrode to enable current heating of the resistive material of the support member. The support member is configured to support the substrate at a point. The current heating assists in evaporating fluid at the point during fluid preparation of the substrate.

Abstract: A system that removes PCBs from synthetic resins in an environmentally safe and economical manner. The system includes a solvent wash subsystem (10) including a first tank (44) to expose the resin particles to a solvent for a first predetermined period of time. In the solvent tank (44), the solvent contacts the resin particles, removing the PCBs. Thereafter, a separator is provided to separate the solvent from the resin particles after removal from the first tank (44). The system also includes a carbon dioxide subsystem (34) where, after separation, the resin particles are exposed to carbon dioxide in a vessel for a second predetermined period of time. Exposure to the carbon dioxide substantially removes any residual solvent and trace amounts of PCBs remaining on the resin particles. In various embodiments, the first predetermined period of time and the second predetermined period of time are selected so that the PCBs on the resin particles are reduced to a predetermined acceptable level, for example, 2.

Abstract: Apparatus and method for dispensing a gas using a gas source coupled in selective flow relationship with a gas manifold. The gas manifold includes flow circuitry for discharging gas to a gas-using zone, and the gas source includes a pressure-regulated gas source vessel containing the gas at superatmospheric pressure. The pressure-regulated gas source vessel can be arranged with a pressure regulator at or within the vessel and a flow control valve coupled in flow relationship to the vessel, so that gas dispensed from the vessel flows through the regulator prior to flow through the flow control valve, and into the gas manifold. The apparatus and method permit an enhancement of the safety of storage and dispensing of toxic or otherwise hazardous gases used in semiconductor processes.

Abstract: An apparatus for cleaning substrates includes a substrate support that is configured to support a plurality of substrates horizontally as spaced regularly one above the other, a rotating device for rotating the substrate support and a liquid supply system for dispensing cleaning liquid onto the substrates. The substrate support has a base plate and support rods extending upright on the base plate. The support rods include fixed rods and at least one movable rod. The movable rods is movable between an open position to provide a passage that allows the substrates to be placed between the support rods, and a closed position at which the substrates are held by and between the support rods. Once the substrates are supported in this way, the substrates are rotated. Then, the cleaning liquid, such as a chemical solution(s) followed by a rinsing liquid, is dispensed onto all of the substrates as the substrates are being rotated.

Abstract: A method and apparatus provide for automatically cleaning and decontaminating medical instruments. The method comprising the steps of: a) placing the medical instruments into a container after their use in a medical procedure; b) closing the container to seal the instruments inside whereby to prevent personnel contact with the instruments and any contaminants which might be thereon; c) inserting the sealed container into a washer/decontaminator and sealing the washer/decontaminator; d) the washer/decontaminator automatically opening the container and applying a washing fluid thereto to wash the instruments within the container; and e) the washer/decontaminator automatically applying a disinfectant to the container to disinfect the instruments whereby to allow safe handling thereof by personnel.

Abstract: The disclosed system, device and method for automated non-contact cleaning of hardware articles generally includes: a cleaning chamber configured to at least partially enclose the hardware article to be cleaned; a plurality of nozzles configured to spray a sublimating agent on the hardware article; an air inlet configured to purge the chamber with a gas; and an air outlet configured to exhaust the purge gas, contaminants and sublimating agent from the chamber. Disclosed features and specifications may be variously controlled, adapted or otherwise optionally modified to realize improved non-contact cleaning function.

Abstract: A system, apparatus and method for processing flat articles, such as semiconductor wafers, with acoustical energy. In a cleaning process, the inventive system, apparatus and method can remove particles from both sides of a wafer more efficiently and effectively. In one aspect, the invention is a system for processing flat articles comprising: a first dispenser for applying a liquid to a first surface of a flat article; a second dispenser for applying liquid to a second surface of a flat article; a first transducer assembly positioned so as to transmit acoustical energy to the first surface of the flat article; and a second transducer assembly positioned so as to transmit acoustical energy to the second surface of the flat article.

Abstract: A substrate processing apparatus includes a substrate holding member configured to rotate along with a wafer (W) held thereon and a drain cup (51) configured to surround the wafer (W). A cleaning process is performed by rotating the wafer (W) while supplying a process liquid onto the wafer (W), and then a rinsing process is performed by rotating the wafer (W) in a similar way while supplying a rinsing liquid onto the wafer (W). The rinsing process is performed by first adjusting a rotational speed of the wafer (W) to be the same as the rotational speed used in the cleaning process while supplying the rinsing liquid, and then raising a liquid level of the rinsing liquid inside the drain cup (51) by decreasing the rotational speed of the wafer (W) or increasing a flow rate of the rinsing liquid, and raising a reach position of the rinsing liquid on the outer sidewall of the drain cup (51) by increasing the rotational speed of the wafer (W).

Abstract: Disclosed are an apparatus for cleaning a membrane module and a method therefor, which can minimize consumption of chemicals required to clean the membrane module while maximizing a recovery cleaning rate of the membrane module without completely stopping a water treatment operation. The cleaning apparatus includes a first flushing bath for flushing a membrane module transferred from a water treatment tank, and a first chemical cleaning bath for cleaning the membrane module, which has been completely flushed and transferred from the first flushing bath, by use of a first chemical solution.

Abstract: Apparatus to clean silicon electrode assembly surfaces which controls or eliminates possible chemical attack of electrode assembly bonding materials, and eliminates direct handling contact with the parts to be cleaned during acid treatment, spray rinse, blow dry, bake and bagging. Aspects of the apparatus include a kit including an electrode carrier to hold an electrode assembly, a treatment stand to allow access to the electrode assembly, a spider plate to clamp the electrode assembly in the electrode carrier, a nitrogen purge plate to supply nitrogen gas to the backside of the electrode assembly during acid cleaning of the electrode, a water rinse plate to supply water to the electrode face, a blow dry plate to supply nitrogen to dry the electrode assembly and a bake stand to support the electrode assembly during a bake before placing the clean electrode assembly in a bag.

Abstract: A reactor for washing sand contaminated with hydrocarbons comprises a vessel having an aperture in a bottom portion thereof. A steam cleaning device is located near a top of the vessel for receiving contaminated sand and cleaning the contaminated sand as it is introduced into the vessel. A rinsing device is positioned below the steam cleaning device for rinsing the sand with water. A sand conveying device comprising an air injection device is positioned in the bottom portion of the vessel for urging sand out of the aperture using compressed air, such that the sand is partially dewatered as the sand is urged out of the aperture.

Abstract: An endoscope reprocessor having a water supply disinfection filter and a method for self-disinfection of the filter employ a pair of connectors to switch from a normal operating mode into a self-disinfection mode in which circulating germicidal fluid within the reprocessor flows through the filter, while the water supply remains connected to the system and isolated from the circulating fluid.

Abstract: Disclosed is a liquid processing method, apparatus, and storage device for cleaning a member disposed at holding part-side of a substrate, such as a lift pin plate (including a lift pin) or a holding plate, with a rinsing liquid, thereby preventing a chemical liquid adhered to such a member from having a bad influence on the wafer. The liquid processing method includes holding the substrate by a holding part, rotating the substrate held by the holding part through a rotation driving part, and supplying a chemical liquid to a holding part-side surface of the substrate by a chemical liquid supply part. After the supply of the chemical liquid, rinsing liquid droplets are generated and supplied to the holding part-side surface of the substrate by supplying gas toward the holding part-side surface of the substrate through a gas supply part and supplying a rinsing liquid toward the holding part-side surface of the substrate through a rinsing liquid supply part.

Abstract: A template cleaning method for cleaning a template for nanoimprint, according to an embodiment of the present invention includes placing a wafer on a stage provided in a chamber, cleaning the wafer placed on the stage, inspecting the wafer for particles after the cleaning of the wafer, placing the template on the stage after the inspection of the wafer, and cleaning the template placed on the stage.

Abstract: The device (1) can be used in particular for the pivotable door of a dishwasher and comprises, in a structure or body (2) a first dispenser device (5, 6) for a washing agent, and a second dispenser device (4) for rinse agent, an electrically controlled actuator device (20, 21) connected to the first dispenser device (5, 6) in such a way that when the door is closed, a first excitation of the actuator device (20, 21) causes substantially only washing agent to be dispensed, and connected to the second dispenser device (4) by means of a transmission mechanism (22, 23) which includes a pivotable interconnecting element (23). The interconnecting element (23) is able to make the mechanism (22, 23) inoperative when the door of the dishwasher is opened, and to make it operative after a first excitation of the actuator device (20, 21) after the door has been closed. One end (23a) of this interconnecting element (23) is pivoted directly onto a movable control member (18) of the second dispenser device (4).

Abstract: On the top surface of a substrate, an atmosphere blocker plate, of which plan size is equal or larger than the substrate size, is disposed opposing to the top surface of the substrate. In the rim portion of the atmosphere blocker plate, a vertical through hole is formed so that a nozzle can be inserted into the hole. Nozzle move mechanism moves the nozzle to insert the nozzle to the through hole and position it to the opposing position that is opposed to the top rim portion of the substrate and to the retract position that is away from the atmosphere blocker plate. Processing liquid is supplied from the nozzle, which is positioned to the opposing position, to the top rim portion of the substrate.

Abstract: A chemical solution is mixed to deionized water from a chemical cartridge 29 via a chemical supply unit 27 to produce a treating liquid. Then, the treating liquid is supplied to a treating tank via a supply pipe. The chemical cartridge 29 is not supplemented with the chemical solution through a supplementing line etc., and the chemical solution is not contaminated. As a result, cleanliness of the chemical solution can be kept high, and substrates can be cleaned at a high clean level. Moreover, the chemical cartridge 29 also has a residual quantity display portion 39. Thus a residual quantity of the chemical solution in the chemical cartridge 29 can easily be recognized, and periodic replacement timing of the chemical cartridge 29 can be recognized easily. Furthermore, the chemical cartridge 29 can control the flow rate by a nozzle portion 47. Consequently, the chemical cartridge 29 can directly be attached to the supply pipe, which can simplify the construction and thus can reduce apparatus cost.

Abstract: A bicycle sprocket chain cleaning and lubrication apparatus allows a sprocket chain (3) to be cleaned while still mounted on the bicycle. The apparatus includes a includes a housing (10) for enclosing the sprocket chain on all sides consisting of mutually connectable upper half-shell (11) and lower half-shell (12) portions and a securement assembly which includes a mounting plate adapted to attach to a rear wheel quick disconnect of the bicycle. The housing is suspended from the sprocket chain and provides a funnel shaped solvent hopper (17), a hose connection (21) to a compressed air supply, and an air knife (23) adapted to direct high velocity air to impinge upon and thereby dry the sprocket chain.

Abstract: A rotary rinser 1 which injects dual fluids includes a rotary valve 11 in which an admixture of one of the fluids into the other fluid is prevented. A stationary valve member 28 is formed with a chemical liquid supply passage 60 and an air supply passage 48 while a rotary valve member 16 is formed with a chemical liquid discharge passage 18 and an air discharge passage 24. As the rotary valve member 16 rotates, a supply passage and a discharge passage for each fluid move into and out of communication. Sliding surfaces into which the chemical liquid passages 60 and 22a open (sliding surfaces of a chemical liquid stator 34 and a chemical liquid distributor 22) and sliding surfaces through which the air passage 48 and 24 move into and out of communication (sliding surfaces of the rotary valve member 16 and the air distributor 49) are disposed at different radial positions and at different elevations.

Abstract: Provided are methods for processing a substrate using a proximity system defined by one or more meniscus windows on one or more proximity heads. One method includes applying a first fluid meniscus to a surface of the substrate to apply a chemical precursor to the surface of the substrate. The first fluid meniscus is applied to first proximity meniscus window. Then, applying a second fluid meniscus to the surface of the substrate to leave an atomic layer of the chemical precursor on the surface of the substrate, through a second proximity meniscus window. A third fluid meniscus is applied to the surface of the substrate to apply a chemical reactant configured to react with the atomic layer of the chemical precursor to generate a layer of a material, through a third proximity meniscus window.

Abstract: A method is provided for reducing the amount of film fragments discharged into a processing liquid circulation system during removal of films from wafers, thereby reducing the frequency of filter cleaning or filter replacement. The method includes exposing a wafer containing a film formed thereon in a process chamber of a substrate processing system to a processing liquid, where the wafer is not rotated or is rotated at a first speed and the processing liquid is discharged from the process chamber to a processing liquid circulation system. Subsequently, exposure of the wafer to the processing liquid is discontinued and the wafer is rotated at a second speed greater than the first speed to centrifugally remove fragments of the film from the wafer. Next, the wafer is exposed to the same or a different processing liquid and the processing liquid is discharged from the process chamber to a processing liquid drain.

Abstract: A second line 44 is branched from a first line 22 connected to a processing part 10 configured to process a wafer W. A plurality of third lines (an ammonia-water supply line 48, a hydrochloric-acid supply line 52, and a hydrofluoric-acid line 56) are branched from the second line 44. The third lines are respectively provided with valves 48a, 52a, and 56a at locations branched from the second line 44. Chemical-liquid supply sources (an ammonia-water supply source 46, a hydrochloric-acid supply source 50, and a hydrofluoric-acid supply source 54) are connected to the respective third lines, whereby chemical liquids can be supplied from these chemical-liquid supply sources to the respective third lines.

Abstract: An apparatus to clean a continuously running conveyor belt for a machine to produce or refine paper, cardboard or other layers of fibrous material including a cleaning device and at least one supplementary device. The cleaning device is configured to dispense at least one cleansing stream to the conveyor belt in at least one cleaning stage. The supplementary device is configured to dispense a chemically active medium and/or a physically active medium in a preparation process. The preparation process is configured to support and/or enhance the cleaning effectiveness and conditioning of a surface of the conveyor belt for a cleaning process.

Abstract: Conditioning fluid flow into a proximity head is provided for fluid delivery to a wafer surface. An upper plenum connected to a plurality of down flow bores is supplied by a main bore. The down flow bores provide fluid into the upper plenum, and a resistor bore is connected to the upper plenum. The resistor bore receives a resistor having a shape so as to limit flow of the fluid through the resistor bore. A lower plenum connected to the resistor bore is configured to receive fluid from the resistor bore as limited by the resistor for flow to a plurality of outlet ports extending between the lower plenum and surfaces of the head surface. Fluid flowing through the upper plenum, the resistor bore with the resistor and the lower plenum is substantially conditioned to define a substantially uniform fluid outflow from the plurality of outlet ports, across the width of the proximity head.

Abstract: A system and method for removing polymer residue from around a metal gate structure formed on a surface of a substrate during a post-etch cleaning operation includes determining a plurality of process parameters associated with the metal gate structure and the polymer residue to be removed. A plurality of fabrication layers define the metal gate structure and the process parameters define characteristics of the fabrication layers and the polymer residue. A first cleaning chemistry and second cleaning chemistry are identified and a plurality of application parameters associated with the first and second cleaning chemistries are defined based on the process parameters. The first and second application chemistries are applied sequentially in a controlled manner using the application parameters to substantial remove the polymer residue while preserving the structural integrity of the gate structure.

Abstract: A liquid processing apparatus and method capable of separately collecting first and second processing liquids from each other, and preventing a formation of a defect (such as watermarks and particles) on a target substrate are disclosed. In one embodiment, the liquid processing apparatus includes a substrate holding device, a processing liquid supply device to supply a first processing liquid and a second processing liquid, a rotating cup, an outer discharge portion and an inner discharge portion to respectively discharge the first processing liquid and the second processing liquid received from the first receiving surface of the rotating cup, and a discharge portion switch device to open/close the outer discharge portion. The lower end of the first receiving surface of the rotating cup extends to a lower position than the position of the substrate held by the substrate holding device.

Abstract: A substrate processing method includes: supplying a fluid to a resist on a substrate after an ion implantation in which the resist is used as a mask; and supplying a stripping liquid to the resist for stripping the resist after the supplying the fluid. A cured layer is formed in a surface of the resist in the ion implantation. The fluid is purified water or a mixed fluid of purified water and an inert gas. A volume flow rate of the purified water is not less than 1/400 of a volume flow rate of the inert gas when the mixed fluid is supplied as the fluid.

Abstract: Apparatus and method for dispensing a gas using a gas source coupled in selective flow relationship with a gas manifold. The gas manifold includes flow circuitry for discharging gas to a gas-using zone, and the gas source includes a pressure-regulated gas source vessel containing the gas at superatmospheric pressure. The pressure-regulated gas source vessel can be arranged with a pressure regulator at or within the vessel and a flow control valve coupled in flow relationship to the vessel, so that gas dispensed from the vessel flows through the regulator prior to flow through the flow control valve, and into the gas manifold. The apparatus and method permit an enhancement of the safety of storage and dispensing of toxic or otherwise hazardous gases used in semiconductor processes.

Abstract: A substrate processing method that processes a substrate on which a plurality of patterns adjacent to each other are formed, has: supplying a first processing liquid to a principal surface of the substrate that is dry and has the patterns formed thereon to make the first processing liquid adhere to the principal surface of the substrate; and supplying a second processing liquid having a higher surface tension than the first processing liquid to the principal surface of the substrate in the state where the first processing liquid adheres to the principal surface of the substrate to process the principal surface of the substrate with the second processing liquid.

Abstract: The present invention concerns an improved apparatus for cleaning the interior of a liquid handling probe to reduce the amount time and the volume of wash fluid required to clean the probe and minimize carryover of material between different samples. In addition to the probe, the apparatus includes one or more wash fluid reservoirs, a compressed gas supply, one or more pumps, two or more valve-controlled probe lines and a controller for opening and closing the valves and actuating the pump(s) at desired time intervals. The invention further concerns a method of cleaning a liquid handling probe using the claimed apparatus and comprising sequential steps of pumping wash fluid and compressed gas through the probe.

Abstract: This invention relates to a ware washing process that is conducted in the presence of a biocide. More particularly, but not exclusively, the invention relates to a ware washing process including the steps of (i) washing ware in a washing cavity (25) of a ware washer (10) with water and a ware washing detergent; (ii) rinsing the ware in the ware washer with water; and (iii) introducing a biocide into the washing cavity of the ware washer in order to provide a gaseous atmosphere thereof in the washing cavity, the biocide being introduced into the washing cavity prior to or contemporaneously with or subsequently to the washing or rinsing of the ware.

Abstract: A mixing valve assembly 42 is communicated with a dedicated tank 51D, storing therein a compatibilizer D, via an inlet valve 43 and is also communicated with dedicated tanks 51A-51C via three injection valves, the tanks storing therein auxiliaries A-C respectively. A chemical formulation is prepared by selectively injecting any one(s) of four chemical agents into the mixing valve assembly 42 by way of on-off control of the inlet valve 43 and the injection valves and blending together the injected chemical agents. Then, the chemical formulation is pumped into SCF by a high-pressure pump 45 such that the SCF and the chemical formulation are mixed together to form a process fluid. Thus, the number of components of a high-pressure portion can be reduced to achieve a cost reduction of an apparatus. Furthermore, a pipe line for pumping the chemical agents is simplified.

Abstract: A method for removing contaminants from synthetic resin material includes contacting a particulate synthetic resin material containing at least one contaminant with a solvent other than carbon dioxide. At least a portion of the contaminant is removed from the particulate synthetic resin material and becomes dispersed in the solvent. The solvent, with the contaminant dispersed therein, is then removed from the particulate synthetic resin material. Thereafter, at least a portion of the solvent still contained on the synthetic resin material is removed by contacting the particulate synthetic resin material with liquid carbon dioxide to dissolve the solvent into the carbon dioxide.