Having Housing, Mounting Or Support Patents (Class 136/230)
  • Patent number: 9568373
    Abstract: A cable-base sensor can detect a material level and temperatures of a material stored in a silo. The cable-base sensor comprises an electronic box, a cable, a stopper, and a signal processing module. The electronic box comprises a base and a space for containing the signal processing module, and a hole is formed through a bottom of the electronic box. The base is mounted in the bottom, and a tapered hole is formed through the base. A first end of the cable extents into the tapered hole and the hole, and spreads to form a cable bud. The stopper is a tapered block and pressed into the tapered hole for enforcing the cable bud to be sandwiched between the stopper and the base. The cable bud strengthens a connection between the electronic box and the cable for preventing damages from solid materials.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: February 14, 2017
    Assignee: Finetek Co., Ltd.
    Inventors: Chien-Lung Huang, Sheng-Shou Chen, Tzu-Chuan Tsai, Yao-Chen Yu, Chao-Kai Cheng, Ting-Kuo Wu
  • Patent number: 9523614
    Abstract: Devices for determining sterilization conditions within a sterilization chamber are described. Such devices include an elongate tube to be placed within said sterilization chamber and at least two temperature sensors within the cavity of the elongate tube. The at least two temperature sensors are spaced apart from each other along the length of the elongate tube by a predetermined distance and spaced apart from the interior wall of the elongate tube. Methods for determining sterilization discussed.
    Type: Grant
    Filed: September 16, 2011
    Date of Patent: December 20, 2016
    Inventors: Robbert-Jan Hermsen, Knut Schumacher
  • Patent number: 9404814
    Abstract: An exhaust gas temperature detection sensor is arranged at a predetermined position outside a muffler, or at a predetermined position outside an exhaust pipe constituting an exhaust gas flow passage on a more downstream side than the muffler in an exhaust direction. The sensor detects that an atmosphere temperature at the predetermined position outside the muffler has reached a predetermined temperature based on an increase in a temperature inside the muffler, or detects that an atmosphere temperature at the predetermined position outside the exhaust pipe has reached a predetermined temperature based on an increase in a temperature of an exhaust gas inside the exhaust pipe.
    Type: Grant
    Filed: March 15, 2012
    Date of Patent: August 2, 2016
    Assignee: KUBOTA CORPORATION
    Inventors: Hiroyuki Tada, Masato Asahara, Yoshihiro Ueda, Hideki Aoki, Akira Minoura
  • Patent number: 9356217
    Abstract: An electrically conductive composition, containing (A) a carbon nanotube, (B) an electrically conductive polymer, and (C) an onium salt compound, an electrically conductive film using the composition, and a method of producing the electrically conductive film.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: May 31, 2016
    Assignee: FUJIFILM Corporation
    Inventors: Toshiaki Aoai, Ryo Nishio, Naoyuki Hayashi
  • Patent number: 9349609
    Abstract: A method including forming a structure including a plurality of semiconductor devices surrounded by a dielectric layer such that a top surface of the dielectric layer is substantially flush with a top surface of the plurality of semiconductor devices, depositing a thermal optimization layer above the structure, patterning the thermal optimization layer such that a portion of the thermal optimization layer is removed from a above first region of the structure and another portion of the thermal optimization layer remains above a second region of the structure, the first region having a different thermal conductivity than the second region, and heating the structure, the patterned thermal optimization layer causing substantially uniform thermal absorption of the structure.
    Type: Grant
    Filed: March 31, 2014
    Date of Patent: May 24, 2016
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Brian J. Greene, Yue Liang, Xiaojun Yu
  • Patent number: 9196387
    Abstract: An apparatus for detecting the location of at least one annulus spacer between concentric interior and exterior tubes when a temperature gradient is present therebetween. A probe head assembly is movable within the interior tube. At least one temperature sensor is coupled to the probe head assembly and configured to detect a temperature of an interior surface of the interior tube. A drive assembly is operable to move the probe head assembly relative to the interior tube. A data acquisition system is coupled to the at least one temperature sensor and configured to receive a plurality of temperature measurements in order to identify at least one position along the interior surface having a temperature abnormality corresponding to a reduced temperature gradient.
    Type: Grant
    Filed: November 1, 2012
    Date of Patent: November 24, 2015
    Assignee: Atomic Energy of Canada Limited
    Inventor: Jaroslaw Jan Goszczynski
  • Patent number: 9190505
    Abstract: A semiconductor device includes a substrate and a source structure and a drain structure formed on the substrate. At least one nanowire structure interconnects the source structure and drain structure and serves as a channel therebetween. A gate structure is formed over said at least one nanowire structure to provide a control of a conductivity of carriers in the channel, and the nanowire structure includes a center core serving as a backbias electrode for the channel.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: November 17, 2015
    Assignee: Renesas Electronics Corporation
    Inventors: Tomohiro Hirai, Toshiharu Nagumo
  • Patent number: 9054273
    Abstract: A mobile device for generating electrical power may include a combustion chamber and a heat sink. A TEC module is in thermal communication with the combustion chamber and the heat sink to transfer thermal energy from the combustion chamber to the heat sink. A heat flux across the TEC module causes electrical power to be generated. The mobile device may also include a fuel delivery system to feed fuel into the combustion chamber. A control system may be included to at least monitor and control delivery of fuel to the combustion chamber by the fuel delivery system and to control a temperature gradient across the TEC module to control the electrical power produced by the thermal-to-electric energy conversion device.
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: June 9, 2015
    Assignee: The Boeing Company
    Inventors: James Ping Huang, Ching-Fen Tsai, Han V. Nguyen, Mark Allen Cleveland, Jimmy M. Quiambao
  • Patent number: 9024173
    Abstract: The present invention provides a thermoelectric conversion element module and a manufacturing method thereof capable of easily realizing a high-density array and securing connection reliability. The module includes a thermoelectric conversion element group made up of P-type elements and N-type elements alternately arranged in a first direction and a heat-resistant insulating member filling the periphery of the thermoelectric conversion materials, wherein the P-type elements and the N-type elements are connected via connection electrodes on a side portion of the group along the first direction, and connection electrodes at other parts of the group along a second direction crossing the first direction. The module is manufactured by forming a connection electrode layer that extends to the side portion of the group on the surface of the group and cutting this connection electrode layer between the thermoelectric conversion elements along the first direction and the second direction.
    Type: Grant
    Filed: March 28, 2012
    Date of Patent: May 5, 2015
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Takaaki Higashida, Kaori Toyoda, Takashi Kubo
  • Publication number: 20150059820
    Abstract: A semiconductor element includes at least a thermoelectric material and a first frame part which are connected to each other in a force-locking manner. The first frame part forms an electrical conductor and is made of a ferritic steel which, in particular, has good thermal conductivity and low thermal expansion in addition to good electrical conductivity. A thermoelectric module having semiconductor elements is also provided.
    Type: Application
    Filed: November 7, 2014
    Publication date: March 5, 2015
    Inventors: ROLF BRUECK, SIGRID LIMBECK
  • Patent number: 8952234
    Abstract: The invention relates to a thermoelectric device, comprising a first circuit (1), called hot circuit, through which a first fluid can flow, and, a second circuit (2), called cold circuit, through which a second fluid can flow at a temperature lower than that of the first fluid, and elements (3, 3p, 3n), called thermoelectric elements, that can be used to generate an electric current in the presence of a temperature gradient. According to the invention, it comprises fins (6f, 6c) in a heat exchange relationship with said hot circuit (1) and/or said cold circuit (2), the thermoelectric elements (3, 3p, 3n) being in contact at least with said fins (6f, 6c), at least some of said fins (6f, 6c) being associated in pairs, a compressible material (11) being provided between the fins (6f, 6c) of one and the same pair.
    Type: Grant
    Filed: July 28, 2011
    Date of Patent: February 10, 2015
    Assignee: Valeo Systemes Thermiques
    Inventors: Stephane Tondelli, Michel Simonin
  • Publication number: 20150034140
    Abstract: A thermoelectric element having high thermal resistance and requiring less semiconductor material than a conventional thermoelectric element with comparable performance comprises a substrate having a substrate front side and a substrate rear side opposite the substrate front side, a first contact, applied as a layer to the substrate front side, a second contact, applied as a layer to the substrate front side, a cut-off between the first and second contact which thermally and electrically separates the first and second contact from one another, and a thermoelectrically active layer having a top side and a bottom side, which are connected to one another by lateral delimiting surfaces, wherein the thermoelectrically active layer is arranged in the cut-off in such a way that the bottom side is on the substrate front side, and one of the lateral delimiting surfaces is against the first contact and one of the lateral delimiting surfaces is against the second contact.
    Type: Application
    Filed: January 17, 2013
    Publication date: February 5, 2015
    Inventors: Gerhard Span, Arwed Siegloch, Juergen Haferkamp, Nikolay Iosad
  • Patent number: 8937240
    Abstract: A cable installation having a support structure, for example a rod or a support frame will be proposed, the latter or the former, being able to be hinged to abuses structure about a first axis, respectively, wherein at each end of the support structure a deviating roller is rotatably provided, which is provided for a cable which at one end is fixed to an area of the support structure while the other end of the cable is fixed to a second area of the base structure which is spaced apart from the first area.
    Type: Grant
    Filed: September 2, 2011
    Date of Patent: January 20, 2015
    Inventor: Johann Czaloun
  • Patent number: 8936224
    Abstract: The invention relates to a mounting system, in particular for solar modules (1), consisting of supports (2) with a closed hollow box profile (3), with connectors (4) for solar module fastening means, and connectors (5) for roof fastening means. At least the connectors (4) for the solar module fastening means are formed from longitudinal groove pairs—or longitudinal flange pairs in or on the hollow box profile (3) that are arranged at a distance from each other. The fastening means for the solar module (1) or solar modules (1) in the area of the support consist of a clamping piece with a shaped part (8), with each shaped part (8) having at least two webs (9.1, 9.2), arranged opposite each other on the shaped part (8) whereby at least one positive click connection with one of the groove pair—or flange pairs can be made by means of the ends remote from the shaped part (8), and the shaped part (8) has at least one bore hole (11) for the insertion of a fastening bolt (14).
    Type: Grant
    Filed: June 11, 2007
    Date of Patent: January 20, 2015
    Assignee: Sapa Holding GmbH
    Inventors: Sven Bartelt-Muszynski, Gido Genschorek
  • Patent number: 8933317
    Abstract: In one embodiment, a system includes a strap configured to be coupled to a container. The strap includes a plurality of plates arranged to allow the strap to flex. The system also includes a thermoelectric device coupled to the strap. The strap is configured to transfer heat between the thermoelectric device and the container. The system includes a thermal interface situated between the thermoelectric device and the strap.
    Type: Grant
    Filed: February 22, 2013
    Date of Patent: January 13, 2015
    Assignee: Marlow Industries, Inc.
    Inventors: Joshua E. Moczygemba, Overton L. Parish, IV, Ryan A. Turner, Pravesh Parmanand
  • Publication number: 20140360550
    Abstract: This disclosure examines using lead telluride nanocrystals as well as other materials suitable for thermoelectric conversion, particularly materials with high Figure of Merit values, as coatings on flexible substrates.
    Type: Application
    Filed: August 11, 2012
    Publication date: December 11, 2014
    Applicant: PURDUE RESEARCH FOUNDATION
    Inventors: Yue Wu, Daxin Liang, Haoran Yang, Scott Finefrock
  • Publication number: 20140345666
    Abstract: A thermoelectric element includes a p-type/n-type semiconductor element having an upper end surface and a lower end surface, a lower electrode that is joined to the lower end surface of the p-type/n-type semiconductor element to connect the p-type/n-type semiconductor element and another n-type/p-type semiconductor element adjacently thereto and has an area less than that of the lower end surface in a joint region therebetween. A joint portion is made of a solder and has a surface joint part joining the lower end surface of the p-type/n-type semiconductor element and a surface of the lower electrode while the lower end surface of the p-type/n-type semiconductor element and the surface of the lower electrode are opposed to each other A fillet part is formed to fill a space produced between intersecting surfaces, i.e., the lower end surface and a lateral side of the lower electrode, and composes a step part formed by the lower end surface and the lower electrode.
    Type: Application
    Filed: December 10, 2012
    Publication date: November 27, 2014
    Inventors: Mitsuoki Konnai, Akio Konishi
  • Publication number: 20140332049
    Abstract: A thermoelectric module having a first and second housing element, at least two thermoelectric elements arranged between the housing elements and are each connected electrically to one another via first or second electrical contacts or are connected electrically to an electrical circuit via first and/or second electrical contacts. The first electrical contacts are assigned to the first housing element and the second electrical contacts are assigned to the second housing element. The first housing element and/or the second housing element have at least one opening, which is covered by at least one section of the first electrical contacts and/or the second electrical contacts. The first electrical contacts and/or the second electrical contacts are connected to the first housing element and/or the second housing element.
    Type: Application
    Filed: May 13, 2014
    Publication date: November 13, 2014
    Applicant: Behr GmbH & Co. KG
    Inventor: Hans-Heinrich ANGERMANN
  • Patent number: 8870455
    Abstract: A temperature sensing assembly for measuring the temperature of a surface of a structure includes a thermocouple device having a sheath containing a pair of conductors of dissimilar materials connected at a junction point to provide indications of temperature. The assembly further includes a docking device with a recess formed in a top surface to receive a portion of the sheath that is proximate the junction point. The bottom surface of the docking device is attached to the surface of the structure. The recess extends through the bottom surface of the docking device so that when the thermocouple device is positioned in the recess, the junction point is adjacent the surface of the tube. A heat shield can be attached to the docking device to shield the sheath proximate the junction point from direct and radiant heat sources.
    Type: Grant
    Filed: September 15, 2011
    Date of Patent: October 28, 2014
    Inventors: Jeffrey N. Daily, Larry Welch, Yean C. Chan
  • Patent number: 8863451
    Abstract: The present invention relates generally to photovoltaic systems. The present invention relates more particularly to photovoltaic roofing systems in which photovoltaic elements are disposed upon roofing elements such as shingles, tiles, shakes or slates.
    Type: Grant
    Filed: November 2, 2012
    Date of Patent: October 21, 2014
    Assignee: CertainTeed Corporation
    Inventors: Robert L. Jenkins, Christopher C. Fisher
  • Patent number: 8865999
    Abstract: A thermoelectric converter is formed by a plenum divided into high and low pressure chambers by a partition and includes a stack of series-coupled alkali-metal thermoelectric cells that projects orthogonally from the partition into one of the chambers.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: October 21, 2014
    Assignee: NanoConversion Technologies, Inc.
    Inventors: David M. Rossi, Michael P. Staskus, Derek W. Nam
  • Publication number: 20140299171
    Abstract: Disclosed is a material for an electrode having an excellent performance and an excellent durability by maintaining high electrical conductivity and by restraining the growth of the grain at a high temperature. The material can be manufactured by synthesizing composite materials through use of a metallic material of Mo and a ceramic material, and then the composite materials can be used as the electrode.
    Type: Application
    Filed: August 5, 2013
    Publication date: October 9, 2014
    Applicant: KOREA INSTITUTE OF ENERGY RESEARCH
    Inventors: Sun-Dong KIM, Sang-Kuk Woo, Se-Young Kim, Jong-Hoon Joo, In-Sub Han, Doo-Won Seo, Min-Soo Suh
  • Patent number: 8847059
    Abstract: Electrical energy is generated in a device that includes an integrated circuit which produces thermal flux when operated. A substrate supports the integrated circuit. A structure is formed in the substrate, that structure having a semiconductor p-n junction thermally coupled to the integrated circuit. Responsive to the thermal flux produced by the integrated circuit, the structure generates electrical energy. The generated electrical energy may be stored for use by the integrated circuit.
    Type: Grant
    Filed: July 20, 2011
    Date of Patent: September 30, 2014
    Assignee: STMicroelectronics (Crolles 2) SAS
    Inventors: Thomas Skotnicki, Stephane Monfray
  • Publication number: 20140251406
    Abstract: This invention provides a multi-purpose high performance thermoelectric module, comprising: A first impeller; a second impeller at the opposite side of the first impeller; Two FPCBs respectively positioned between the first and second impellers; Multiple T.E elements located between the two FPCBs, and combine with the first and second impellers to form a thermoelectric module; A shaft at the outer end of the second impeller; Two slip rings located at the insulation layer of the shaft; Two wires inside the shaft, with the two ends of the wires respectively attached to the ends of the T.E elements and two slip rings for connection; and two brushes installed at the slip ring. With this design, the present invention is able to convert the existing kinetic energy within the waste heat into the required rotational energy for the thermoelectric module and achieve the heat dissipation performance of a fan.
    Type: Application
    Filed: March 7, 2013
    Publication date: September 11, 2014
    Inventors: Wen-Pin Chen, Chiu-Yueh Tung
  • Patent number: 8821013
    Abstract: Methods for determining a temperature of a portion of an electrically conductive substrate are provided wherein the substrate is heated by applying an electrical current flow through the substrate. The method for determining the temperature employs a thermocouple including a first tab element and a second tab element that are spaced apart from one another along an axis transverse to a direction of the current flow. In another example, an apparatus includes an electrically conductive substrate and a direct heating apparatus configured to heat the substrate with an electrical current flow through the substrate. The apparatus includes first and second coupling positions of a thermocouple that are spaced apart from one another along an axis transverse to a direction of the current flow.
    Type: Grant
    Filed: May 12, 2011
    Date of Patent: September 2, 2014
    Assignee: Corning Incorporated
    Inventors: Daniel R Boudreault, Kenneth P Ehrlich, David D Rye
  • Patent number: 8816183
    Abstract: A thermoelectric module includes a first insulated substrate having a first opposing surface, a second insulated substrate having a second opposing surface, the second opposing surface faces the first opposing surface, a plurality of electrodes formed on the first and second opposing surfaces, a plurality of thermoelectric transducers provided between the first insulated substrate and the second insulated substrate, the plurality of thermoelectric transducers electrically connected with one another in series and/or in parallel via each electrode, and a conducting circuit electrically connecting the plurality of electrodes with an external power source, wherein the first insulated substrate includes a substrate body having the first opposing surface and a projecting portion being formed continuously from the substrate body and extending in a direction that intersects the substrate body, and the projecting portion includes a fixing surface extending in the direction that intersects the substrate body.
    Type: Grant
    Filed: May 7, 2008
    Date of Patent: August 26, 2014
    Assignee: Aisin Seiki Kabushiki Kaisha
    Inventor: Akihiro Morimoto
  • Patent number: 8814428
    Abstract: A temperature sensor is described that comprises a temperature sensing element, a substantially thermally insulating substrate having a first side and a second side and at least one layer of substantially thermally conductive material coated on the first side of the substrate. A first hole is provided on the second side of the substrate and the temperature sensing element is arranged to sense temperature within the first hole. A plurality of additional holes may also be provided on the second side of the substrate, these holes may be coated to aid thermal transfer. The temperature sensing element may be a thermocouple. The temperature sensor may be included in a temperature measurement probe for use in measuring the temperature of workpieces produced using a machine tool.
    Type: Grant
    Filed: April 28, 2008
    Date of Patent: August 26, 2014
    Assignee: Renishaw PLC
    Inventor: Jean-Marie Chancy
  • Publication number: 20140230875
    Abstract: A thermoelectric module may include a fluid-tight housing having at least one thermoelectrically active element arranged therein. The at least one thermoelectrically active element may have a coating. The housing may form an outer encapsulation and the coating may form an inner encapsulation for the at least one thermoelectrically active element.
    Type: Application
    Filed: February 19, 2014
    Publication date: August 21, 2014
    Applicant: Mahle Behr GmbH & Co. KG
    Inventors: Hans-Heinrich Angermann, Tobias Fuchs, Thomas Himmer, Volker Schall
  • Publication number: 20140224297
    Abstract: A thermoelectric conversion element formed by laminating, on a substrate having a porous anodic oxidation film of aluminum, a thermoelectric conversion layer which contains an inorganic oxide semiconductor or an element having a melting point of 300° C. or higher, as a main component, and which has a void structure; and a method of producing the same.
    Type: Application
    Filed: April 15, 2014
    Publication date: August 14, 2014
    Applicant: FUJIFILM CORPORATION
    Inventors: Naoyuki HAYASHI, Toshiaki AOAI, Yoshinori HOTTA
  • Patent number: 8779276
    Abstract: The present invention relates to a thermoelectric device, in particular an all-organic thermoelectric device, and to an array of such thermoelectric devices. Furthermore, the present invention relates to a method of manufacturing a thermoelectric device, in particular an all-organic thermoelectric device. Moreover, the present invention relates to uses of the thermoelectric device and/or the array in accordance with the present invention.
    Type: Grant
    Filed: July 6, 2012
    Date of Patent: July 15, 2014
    Assignee: Sony Corporation
    Inventors: Rene Wirtz, Silvia Rosselli, Gabriele Nelles
  • Patent number: 8729380
    Abstract: In the thermoelectric module composed of p- and n-conductive thermoelectric material legs which are connected to one another alternately via electrically conductive contacts, at least some of the electrically conductive contacts on the cold and/or the warm side of the thermoelectric module are formed between, or embedded into, the thermoelectric material legs composed of porous metallic materials.
    Type: Grant
    Filed: November 3, 2010
    Date of Patent: May 20, 2014
    Assignee: BASF SE
    Inventors: Madalina Andreea Stefan, Alexander Traut
  • Patent number: 8692104
    Abstract: A thermoelectric element has a first substrate at a high temperature side, a second substrate at a low temperature side facing the first substrate, a thermoelectric material placed on the second substrate via a silicon layer, a first electrode formed on the first substrate, and a second electrode formed on the silicon layer. The thermoelectric element has a stress releasing section which is formed between the first electrode and the thermoelectric material, and which includes a plurality of columnar portions. The stress releasing section suppresses defects such as cracks that might be produced in the thermoelectric element due to a stress generated in the thermoelectric element.
    Type: Grant
    Filed: August 17, 2012
    Date of Patent: April 8, 2014
    Assignee: TDK Corporation
    Inventors: Takashi Asatani, Fujimi Kimura
  • Publication number: 20140083477
    Abstract: The disclosed relates to a thermoelectric device for generating electrical currents exploiting the Seebeck effect, more specifically a structural thermoelectric device which can replace a structural component of a body. The structural thermoelectric device can include a first conductor layer, a second conductor layer and located therebetween a polymer thermocouple layer having a reinforcement formed from a structural support, wherein the internal surface of the support includes at least one layer of at least one conducting polymer. The reinforcement can be is porous material with a plurality of voids, wherein the internal surfaces of the voids are coated with a conducting polymer, which is capable of providing the Peltier effect.
    Type: Application
    Filed: May 1, 2012
    Publication date: March 27, 2014
    Applicant: BAE SYSTEMS plc
    Inventors: Sajad Haq, Michael Dunleavy, Martyn John Hucker, Joseph Maurice Davies
  • Patent number: 8623687
    Abstract: A method of forming a thermoelectric device may include forming a first electrically conductive trace, and bonding a thermoelectric element to the first electrically conductive trace. After bonding the thermoelectric element to the first electrically conductive trace, a metal post may be formed on the thermoelectric element so that the thermoelectric element is between the first electrically conductive trace and the metal post. After forming the metal post, the metal post may be bonded to a second electrically conductive trace so that the metal post is between the second electrically conductive trace and the thermoelectric element. Other related methods and structures are also discussed.
    Type: Grant
    Filed: June 21, 2006
    Date of Patent: January 7, 2014
    Assignee: Nextreme Thermal Solutions, Inc.
    Inventors: Brooks O'Quinn, Rama Venkatasubramanian, Edward Siivola
  • Patent number: 8614392
    Abstract: A micro-combustion power system is disclosed. The invention is comprised of a housing that further comprises two flow path volumes, each having generally opposing flow path directions and each generally having opposing configurations. Each flow path volume comprises a pre-heating volume having at least one pre-heating heat exchange structure. Each flow path volume further comprises a combustion volume having a combustion means or structure such as a catalytic material disposed therein Further, each flow path volume comprise a post-combustion volume having at least one post-combustion heat exchange structure. One or more thermoelectric generator means is in thermal communication with at least one of the combustion volumes whereby thermal energy generated by an air/fuel catalytic reaction in the combustion volume is transferred to the thermoelectric generator to convert same to electrical energy for use by an external circuit.
    Type: Grant
    Filed: September 4, 2009
    Date of Patent: December 24, 2013
    Inventors: Ying Hsu, Itzhak Sapir, Paul Ronney, G. Jeffrey Snyder
  • Publication number: 20130327370
    Abstract: A thermoelectric energy harvesting system may include a thermoelectric generator that may produce a voltage in response to a temperature difference across the thermoelectric generator. The thermoelectric generator may be captured between the housing and the base member. The system may include at least one mechanical fastener coupling the housing to the base member and including a shoulder spacer formed of thermally-insulating material and positioned under the mechanical fastener.
    Type: Application
    Filed: September 24, 2012
    Publication date: December 12, 2013
    Applicant: PERPETUA POWER SOURCE TECHNOLOGIES, INC.
    Inventors: Marcus S. Ward, Mark J. Hauck
  • Publication number: 20130312802
    Abstract: An object of the present invention is to provide a low-cost thermoelectric converter element having high productivity and excellent conversion efficiency. A thermoelectric converter element according to the present invention includes a substrate 4, a magnetic film 2 provided on the substrate 4 with a certain magnetization direction A and formed of a polycrystalline magnetically insulating material, and an electrode 3 provided on the magnetic film 2 with a material exhibiting a spin-orbit interaction. When a temperature gradient is applied to the magnetic film 2, a spin current is generated so as to flow from the magnetic film 2 toward the electrode 3. A current I is generated in a direction perpendicular to the magnetization direction A of the magnetic film 2 by the inverse spin Hall effect in the electrode 3.
    Type: Application
    Filed: January 20, 2012
    Publication date: November 28, 2013
    Applicants: TOHOKU UNIVERSITY, NEC CORPORATION
    Inventors: Akihiro Kirihara, Yasunobu Nakamura, Shinichi Yorozu, Kenichi Uchida, Eiji Saitoh
  • Publication number: 20130284229
    Abstract: P-type semiconductor sheets and n-type semiconductor sheets formed by mixing a powder of semiconductor material, a binder resin, a plasticizer, and a surfactant are prepared. In addition, separator sheets formed by mixing a resin such as PMMA and a plasticizer are prepared. Through holes are formed in each of the separator sheets and then filled with a conductive material. Thereafter, the p-type semiconductor sheet, the separator sheet, the n-type semiconductor sheet and the separator sheet are stacked. The resultant laminated body is cut into a predetermined size and then subjected to a baking process.
    Type: Application
    Filed: July 2, 2013
    Publication date: October 31, 2013
    Inventors: Kazuaki Kurihara, Masaharu Hida, Kazunori Yamanaka
  • Patent number: 8525016
    Abstract: A thermoelectric device may include a thermoelectric element including a layer of a thermoelectric material and having opposing first and second surfaces. A first metal pad may be provided on the first surface of the thermoelectric element, and a second metal pad may be provided on the second surface of the thermoelectric element. In addition, the first and second metal pads may be off-set in a direction parallel with respect to the first and second surfaces of the thermoelectric element. Related methods are also discussed.
    Type: Grant
    Filed: March 25, 2010
    Date of Patent: September 3, 2013
    Assignee: Nextreme Thermal Solutions, Inc.
    Inventors: Philip A. Deane, Ramaswamy Mahadevan, Edward P. Siivola
  • Patent number: 8519254
    Abstract: A mobile device for generating electrical power may include a combustion chamber and a heat sink. A TEC module is in thermal communication with the combustion chamber and the heat sink to transfer thermal energy from the combustion chamber to the heat sink. A heat flux across the TEC module causes electrical power to be generated. The mobile device may also include a fuel delivery system to feed fuel into the combustion chamber. A control system may be included to at least monitor and control delivery of fuel to the combustion chamber by the fuel delivery system and to control a temperature gradient across the TEC module to control the electrical power produced by the thermal-to-electric energy conversion device.
    Type: Grant
    Filed: April 8, 2008
    Date of Patent: August 27, 2013
    Assignee: The Boeing Company
    Inventors: James Ping Huang, Ching-Fen Tsai, Han V. Nguyen, Mark Allen Cleveland, Jimmy M. Quiambao
  • Publication number: 20130213448
    Abstract: In one embodiment, a system includes a strap configured to be coupled to a container. The strap includes a plurality of plates arranged to allow the strap to flex. The system also includes a thermoelectric device coupled to the strap. The strap is configured to transfer heat between the thermoelectric device and the container. The system includes a thermal interface situated between the thermoelectric device and the strap.
    Type: Application
    Filed: February 22, 2013
    Publication date: August 22, 2013
    Inventors: Joshua E. Moczygemba, Overton L. Parish, IV, Ryan A. Turner, Pravesh Parmanand
  • Patent number: 8512034
    Abstract: A pilot burner assembly for easy removal of a thermo-electric or other device is disclosed. In an illustrative embodiment, a burner tube, thermo-electric device, and/or spark source are retained in a desired position via a bracket and resilient clip. The bracket may include retention features built into the bracket to help aid in the positioning of the burner tube, thermo-electric device, and/or spark source. The burner tube, thermo-electric device and/or spark source may include retention features that are configured to engage corresponding retention features in the bracket, when desired. The resilient clip may bias the retention features of the burner tube, thermo-electric device and/or spark source against corresponding the retention features of the bracket.
    Type: Grant
    Filed: August 24, 2009
    Date of Patent: August 20, 2013
    Assignee: Honeywell International Inc.
    Inventors: Gregory Young, Donald J. Kasprzyk
  • Publication number: 20130199593
    Abstract: The present invention provides a thermoelectric conversion element, a thermoelectric conversion element module, and a method of manufacturing the same that can easily realize high-density arrangement of thermoelectric conversion elements and securement of connection reliability. The thermoelectric conversion element has, for example, rod-shaped thermoelectric conversion material, tube that has an insulation property and an adiabatic property and houses thermoelectric conversion material, and electrodes that are in close adhesion to the end surfaces of thermoelectric conversion material and tube. A surface roughness Ra of the end surfaces is larger than 0.8 micrometers. In the present invention, the thermoelectric conversion elements can be arranged at a high density such that tubes are in close adhesion to each other. Also, since the close adhesion surface of electrodes on the end surfaces is large, the connection reliability of electrodes is further improved.
    Type: Application
    Filed: November 18, 2011
    Publication date: August 8, 2013
    Applicant: PANASONIC CORPORATION
    Inventors: Takaaki Higashida, Kaori Toyoda, Takashi Kubo, Yoshihisa Ohido, Nobuaki Hirata, Yasushi Taniguchi
  • Patent number: 8502361
    Abstract: In accordance with the present invention, there is provided a CPV package which comprises a leadframe assembly, such leadframe assembly including multiple frames stacked on top of each other. A top frame of the leadframe assembly provides the electrical interconnect between the top or front surface of the receiver die and the bypass diode required to complete the circuit. The top frame also provides hook up wire interconnect pads for the completed CPV package. An exposed bottom surface of a bottom frame of the leadframe assembly defines a heat spreader which assists in thermal management. The fabrication of the CPV package to include multiple frames stacked on top of each other provides high thermal dissipation and high voltage isolation, while at the same providing a high level of reliability with a comparatively low manufacturing cost.
    Type: Grant
    Filed: December 9, 2010
    Date of Patent: August 6, 2013
    Assignee: Amkor Technology, Inc.
    Inventors: John M. Nickelsen, Jr., Pil Je Sung, Garry Pycroft
  • Patent number: 8498127
    Abstract: The thermal interface material including a thermally conductive metal a thermally conductive metal having a first surface and an opposing second surface, a diffusion barrier plate coupled to the first surface of the thermally conductive metal and the second surface of the thermally conductive metal, and a thermal resistance reducing layer coupled to the diffusion barrier plate.
    Type: Grant
    Filed: September 10, 2010
    Date of Patent: July 30, 2013
    Assignee: GE Intelligent Platforms, Inc.
    Inventor: Graham Charles Kirk
  • Publication number: 20130160807
    Abstract: A semiconductor element includes at least a thermoelectric material and a first frame part which are force-lockingly connected to one another, with the frame part forming a diffusion barrier for the thermoelectric material and an electrical conductor. A method for producing the semiconductor element as well as a thermoelectric module having at least two semiconductor elements, are also provided.
    Type: Application
    Filed: February 25, 2013
    Publication date: June 27, 2013
    Applicant: EMITEC GESELLSCHAFT FUER EMISSIONSTECHNOLOGIE MBH
    Inventor: EMITEC GESELLSCHAFT FUER EMISSIONSTE EMISSIONSTECHNOLOGIE MBH
  • Publication number: 20130139866
    Abstract: In one embodiment, a method for forming a metallized ceramic includes thermal spraying metal directly onto a first side of a ceramic plate. The metal comprising aluminum. The method also includes densifying the thermally ceramic plate after spraying the metal onto the first side of the ceramic plate.
    Type: Application
    Filed: December 1, 2011
    Publication date: June 6, 2013
    Applicant: MARLOW INDUSTRIES, INC.
    Inventors: Joshua E. Moczygemba, James L. Bierschenk
  • Patent number: 8455806
    Abstract: A method includes collecting site specific data, collecting field data at a site of an array of photovoltaic members, determining a current tracked irradiance of the array of photovoltaic members, calculating predicted irradiance for multiple orientations based on the site specific data and the sensed field data, or sensing an actual irradiance for multiple orientations. The method further includes determining a maximum predicted irradiance from the calculated predicted irradiance or a maximum actual irradiance from the sensed irradiance. The method further includes comparing the maximum predicted irradiance or the maximum sensed irradiance with the current tracked irradiance, and re-orienting the array of photovoltaic members to an orientation having the maximum predicted or actual irradiance if the maximum predicted or actual irradiance is greater than the current tracked irradiance.
    Type: Grant
    Filed: January 18, 2010
    Date of Patent: June 4, 2013
    Assignee: Sunpower Corporation
    Inventor: Zachary Judkins
  • Patent number: 8453986
    Abstract: The invention relates to a solar module attachment, comprising a Z-support (2), the one Z-side (2.1) of which is used directly as a roof attachment or can be connected to roof hooks or support posts in the case of a mounting system, while clamps (5) can be displaced over the other Z-side (2.2), the attachment means engaging in said clamps in order to fix solar module frames (1).
    Type: Grant
    Filed: January 21, 2010
    Date of Patent: June 4, 2013
    Assignee: Mounting Systems GmbH
    Inventor: Sandy Schnitzer
  • Publication number: 20130098419
    Abstract: A thermoelectric converter is formed by a plenum divided into high and low pressure chambers by a partition and includes a stack of series-coupled alkali-metal thermoelectric cells that projects orthogonally from the partition into one of the chambers.
    Type: Application
    Filed: October 12, 2012
    Publication date: April 25, 2013
    Applicant: NANOCONVERSION TECHNOLOGIES, INC.
    Inventor: NanoConversion Technologies, Inc.