All Laminae Planar And Face To Face Patents (Class 156/299)
  • Patent number: 6471818
    Abstract: A process for applying a portion of a closed zipper inside a container of flexible material, in which a segment or portion of a closed zipper-strip is first applied by a fixing device upon the inner sides of a film of flexible material, prior to cutting of the zipper strip portion from the remainder of the zipper strip. The zipper portion is applied in such a position that it will not interfere with the subsequent sealing along transverse seal lines defining the opposite sides of the container.
    Type: Grant
    Filed: February 9, 2000
    Date of Patent: October 29, 2002
    Assignee: ICA S.p.A.
    Inventor: Gino Rapparini
  • Patent number: 6467235
    Abstract: A shingle and a method of and apparatus for making the shingle is provided, whereby patches of preselected granules or combinations of granules are provided, separated by transverse areas of different, preferably darker granules, having slots centrally thereof, to yield the appearance of multi-tab shingles that are thicker than they actually are, with transverse shadow lines. A longitudinal shadow line is optionally provided, along the upper and/or lower portion of the exposed tab.
    Type: Grant
    Filed: December 6, 2000
    Date of Patent: October 22, 2002
    Assignee: CertainTeed Corporation
    Inventors: Husnu M. Kalkanoglu, Kermit E. Stahl, Joseph Quaranta
  • Patent number: 6461709
    Abstract: This invention relates to an article comprising a transparent stack of sheets that may be applied, for example, to protect substrates such as glass or plastic windows, signage or displays. A topmost sheet can be peeled away after it is damaged to reveal an undamaged sheet below. The invention also relates to the protected substrates and a method of protecting substrates such as glass or plastic windows, signage and displays from vandalism or other surface damage by adhering the stack of sheets to the substrate to be protected and subsequently pulling a topmost sheet away from the stack after it becomes damaged.
    Type: Grant
    Filed: October 28, 1998
    Date of Patent: October 8, 2002
    Assignee: 3M Innovative Properties Company
    Inventors: Jeffrey R. Janssen, Albert I. Everaerts, Donald R. O'Keefe, William F. Sheffield
  • Patent number: 6461464
    Abstract: A colinear laminate honeycomb panel permits the use of two or more different materials to form a single panel. In this manner, a retractable cover for an architectural opening may be formed that has a different appearance depending upon which side of the panel is being viewed. The resultant panel is formed by attaching a plurality of elongated precursor tubular cells, wherein each precursor tubular cell itself comprises at least two strips of material held in proximity to one another by a common carrier strip.
    Type: Grant
    Filed: May 9, 2000
    Date of Patent: October 8, 2002
    Assignee: Hunter Douglas Inc.
    Inventor: Paul G. Swiszcz
  • Patent number: 6449915
    Abstract: A wall panel structure for controlling humidity within a building having a panel assembly attachable to an inner wall surface of the building including: a first panel having a surface with a first predetermined porosity to moisture; and a second panel secured to said first panel with a space for accomodating airflow between the first and second panels, the second panel having a surface with a second predetermined porosity to moisture, the first perdetermined panel porosity being greater than the second predetermined porosity to thereby absorb moisture from air being circulated between the first and second panels; whereby humidity of an environment within the building is controllable.
    Type: Grant
    Filed: December 17, 1999
    Date of Patent: September 17, 2002
    Assignee: Time & Space Tech. Co., Ltd.
    Inventor: Ki-Seok Park
  • Patent number: 6448109
    Abstract: Individual caps are provided for mutually spaced MEMS on a common wafer by establishing a fixed spatial array of caps in positions that correspond to the positions of the MEMS on the wafer, and simultaneously bonding the caps to corresponding MEMS. The caps are preferably held in place within recesses in a template, and include protective sealing rings that are bonded to the MEMS wafer. The wafer is diced into individual MEMS chips after the caps have been bonded. The caps can be provided with circuitry that faces away from MEMS wafer and is wire bonded to the wafer, or that faces towards the wafer with a flip-chip mounting.
    Type: Grant
    Filed: November 15, 2000
    Date of Patent: September 10, 2002
    Assignee: Analog Devices, Inc.
    Inventor: Maurice S. Karpman
  • Patent number: 6447625
    Abstract: A method of bringing together and joining plastic cards, which are provided with an identification mark, and printed card carriers associated with the respective plastic cards, has the following steps: providing the plastic card, detecting the identification mark of said plastic card, deriving a test mark from said identification mark of the plastic card in such a way that unequivocal calculating back to the identification mark is not possible on the basis of the test mark, reading a data base by means of said identification mark, printing on the card carrier data read from the data base as well as the test mark, detecting the test mark of the card carrier prior to joining said card carrier to the plastic card, determining whether the test mark derived from the identification mark of the plastic card, which is about to be joined to the card carrier, corresponds to the detected test mark, and, provided that the test marks of the plastic card and of the card carrier correspond, bringing together and joining the
    Type: Grant
    Filed: December 7, 1999
    Date of Patent: September 10, 2002
    Assignee: Bowe Systec AG
    Inventors: Eduard Schmid, Ulrich Erpenstein, Herbert Dassinger, Wolfgang Magg
  • Patent number: 6436498
    Abstract: A method of laminating two substrates by coating at least one side of a substrate with a laminating adhesive, bringing a coated side of the substrate into contact with a second substrate to form a three layer film, and treating the three layer film with a free radical initiator. The laminating adhesive is formed by mixing an ethylenically unsaturated acid, a bis-silane and a polyamine, and the polyamine optionally can have a crosslinker reacted therein.
    Type: Grant
    Filed: March 3, 2000
    Date of Patent: August 20, 2002
    Assignees: Dow Corning Corporation, Dow Corning SA, EG Technology Partners, L.P.
    Inventors: Imtiaz J. Rangwalla, John E. Wyman, Patrick Jacques Jean Merlin, Shrenik Mahesh Nanavati, Lisa Marie Seibel, Laurence Gallez
  • Patent number: 6432243
    Abstract: A method of producing refastenable side seams in an absorbent garment results in an absorbent garment that is adapted to easy application and removal. The refastenable side seams can be produced in either a cross direction or a machine direction. Each of the refastenable side seams is a dual side seam that includes a front lap seam and a back lap seam. The resulting garment can be opened and closed on either a front side of the garment or a back side of the garment on either a left side or a right side of the garment.
    Type: Grant
    Filed: May 16, 2000
    Date of Patent: August 13, 2002
    Assignee: Kimberly-Clark Worldwide, Inc.
    Inventors: Robert Lee Popp, Joseph D. Coenen, Jack L. Couillard, Christopher Peter Olson, David Arthur Kuen, Shawn A. Quereshi
  • Publication number: 20020100548
    Abstract: Disclosed is a powders-affixed nonwoven fabric prepared from a fiber web comprising fine short fibers having a fiber diameter of 4 &mgr;m or less and a fiber length of 3 mm or less in a dispersed state in the fiber web, and powder materials affixed to the fiber web formed by a method other than a wet-laid method. Further, a process for manufacturing the powders-affixed nonwoven fabric, and a sheet material comprising the powders-affixed nonwoven fabric are also disclosed.
    Type: Application
    Filed: December 6, 2001
    Publication date: August 1, 2002
    Applicant: JAPAN VILENE COMPANY, LTD.
    Inventors: Akinori Minami, Masaaki Kawabe
  • Publication number: 20020096253
    Abstract: Methods of making packages for integrated circuit devices are described. An exemplary method includes providing a substrate sheet having an array of package sites at which individual integrated circuit packages will be assembled. A continuous sheet of an adhesive film is placed on the substrate strip so as to cover the plurality of package sites. The adhesive film sheet is then cured by applying heat or pressure or heat and pressure to the substrate strip and the sheet of adhesive film. The pressure and/or heat cause the sheet of adhesive film to be permanently attached to the substrate strip. A subsequent step forms one or more apertures though the joined substrate strip and adhesive film at each package site. An integrated circuit die is mounted on the adhesive film at each package site, and bond wires are attached through the aperture between metallizations of the substrate and the integrated circuit device.
    Type: Application
    Filed: November 23, 1999
    Publication date: July 25, 2002
    Applicant: AMKOR Technology, Inc.,
    Inventors: Il Kwon Shim , Do Sung Chun , Vincent DiCaprio , Paul Hoffman
  • Patent number: 6406579
    Abstract: Process for manufacturing anti-theft and/or traceability devices associated with stoppering and covering means The invention relates to the high-rate industrial manufacture of remote-detectable devices used in particular as anti-theft devices but also to carry information, associated with means for stoppering and covering containers. To this end, a material in web form is unwound and caused to travel along, and at least one detectable means such as a filament or an oriented-particles film or an electronic tag is deposited in continuous or discontinuous form on this material, this or these detectable means running or following on from one another in the direction of travel of the web-form material. This material is cut according to the singular or plural detectable means deposited on it, so as to separate individual elements each equipped with a detectable means such as a filament, and themselves constituting stoppering or covering means, or parts of such means, for example gaskets for caps.
    Type: Grant
    Filed: April 13, 2000
    Date of Patent: June 18, 2002
    Assignee: Manufacture Lyonnaise de Bouchage-MLB
    Inventor: Robert De Vaujany
  • Patent number: 6406583
    Abstract: Integrated multiple optical elements may be formed by bonding substrates containing such optical elements together or by providing optical elements on either side of the wafer substrate. The wafer is subsequently diced to obtain the individual units themselves. The optical elements may be formed lithographically, directly, or using a lithographically generated master to emboss the elements. Alignment features facilitate the efficient production of such integrated multiple optical elements, as well as post creation processing thereof on the wafer level.
    Type: Grant
    Filed: February 28, 2000
    Date of Patent: June 18, 2002
    Assignee: Digital Optics Corp.
    Inventors: Brian Harden, Alan Kathman, Michael Feldman
  • Patent number: 6402869
    Abstract: The invention relates to a method of gluing veneers to form LVL and plywood boards from veneers laid one over the other in several layers by curing the adhesive placed between the single layers in a heated press. The invention consists in the fact that the gluing and pressing of the outer layers of a veneer pack to form LVL and plywood boards is performed by high-temperature adhesive and the inner layers by low-temperature adhesive, so that the amount of heat to be put into the veneer pack decreases from the outside in.
    Type: Grant
    Filed: May 1, 2000
    Date of Patent: June 11, 2002
    Assignee: Maschinenfabrik J. Dieffenbacher GmbH & Co.
    Inventor: Gernot von Haas
  • Patent number: 6402881
    Abstract: Electrical interconnects for solar cells or other electronic components using a silver-silicone paste or a lead-tin (Pb—Sn) no-clean fluxless solder cream, whereby the high breakage of thin (<6 mil thick) solar cells using conventional solder interconnect is eliminated. The interconnects of this invention employs copper strips which are secured to the solar cells by a silver-silicone conductive paste which can be used at room temperature, or by a Pb—Sn solder cream which eliminates undesired residue on the active surfaces of the solar cells. Electrical testing using the interconnects of this invention has shown that no degradation of the interconnects developed under high current testing, while providing a very low contact resistance value.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: June 11, 2002
    Assignee: The Regents of the University of California
    Inventors: Paul G. Carey, Jesse B. Thompson, Nicolas J. Colella, Kenneth A. Williams
  • Patent number: 6398900
    Abstract: A method of sticking a transparent electromagnetic wave shield film onto a front surface of a plasma display panel is disclosed. The plasma display panel has a level difference in a thickness direction thereof. The plasma display panel is mounted on an attachment adapted to an outer shape of the plasma display. The level difference is eliminated apparently, and the transparent electromagnetic wave shield film is stuck onto the front surface of the plasma display panel.
    Type: Grant
    Filed: June 30, 2000
    Date of Patent: June 4, 2002
    Assignee: Nitto Denko Corporation
    Inventors: Yoshihiro Hieda, Kazuaki Sasa, Kazuhiko Miyauchi, Toshitaka Nakamura
  • Patent number: 6398901
    Abstract: A sharpening guide assembly for use in sharpening ski and snowboard edges includes an angle member and at least one riser member. The angle member includes at least a first outer surface and a second outer surface, an inner edge of the first outer surface adjoining an upper edge of the second outer surface. The riser member is positioned on the first outer surface of the angle member such that a top portion of the riser member extends above the first surface of the angle member. The angle member is formed of a first material and the riser member is formed of a second material, wherein the second material has a hardness which is greater than a hardness of the first material. During a sharpening operation, a sharpening tool is supported on the riser member such that the sharpening tool such as a file member is positioned above the first outer surface of the angle member so as to avoid potential wear causing contact therewith.
    Type: Grant
    Filed: October 6, 1999
    Date of Patent: June 4, 2002
    Inventor: Donald C. Hodge
  • Patent number: 6395126
    Abstract: A micro-fabrication method of manufacturing optical assemblies and a temperature compensated optical isolator. The manufacturing method employs a lamination procedure to create an array of optics-receiving micro-fixtures. The method is well adapted for the automated manufacturing of optical assemblies. Desirably, the method provides for high speed, high volume production, thereby advantageously, maintaining low manufacturing costs. The isolator utilizes a bimetallic element to rotate a polarization element of the isolator in response to temperature variations. The isolator maintains an effectively constant isolation over a substantially wide temperature range. Advantageously, the isolator is simple, compact and a viable solution to a wide range of optical applications.
    Type: Grant
    Filed: January 12, 2000
    Date of Patent: May 28, 2002
    Assignee: Horizon Photonics, Inc.
    Inventors: Robert C. Cullen, Richard J. Sweeney
  • Patent number: 6372075
    Abstract: A method of applying appliqués to any or all sides of a transparent substrate comprises the steps of removably attaching a first pattern to a second side of a transparent substrate, where the first pattern corresponds to a first design. A first appliqué, which is the first design, is attached to a first side of the transparent substrate in alignment with the first pattern and the first pattern is removed. A second pattern, which corresponds to a second design, is removably attached to the first side of the transparent substrate in alignment with the first appliqué. A second appliqué, which is the second design, is attached to the second side of the transparent substrate in alignment with the second pattern and the second pattern is removed.
    Type: Grant
    Filed: September 14, 1999
    Date of Patent: April 16, 2002
    Inventor: Marilyn R. Johnson
  • Patent number: 6372072
    Abstract: A method of manufacturing a composite laminate and a composite laminate manufactured according to the method are provided. The laminate comprises a series of fabric plies (1 to 15) of fibrous reinforcing material set in plastics matrix material. The method includes the steps of providing a relatively small number of fabric styles from which to choose; selecting at least one of those fabric styles according to design requirements for a particular portion of the laminate; laying up that portion with the said selection, and repeating the selection and layup steps as required to complete the layup of the laminate.
    Type: Grant
    Filed: November 26, 1999
    Date of Patent: April 16, 2002
    Assignee: BAE Systems plc
    Inventor: Michael J Healey
  • Patent number: 6367529
    Abstract: The method and the device of the present invention are capable of uniformly using whole surface of a carrying plate, improving the polishing accuracy of wafers and extending span of life of the carrying plate. The method of adhering a plurality of wafers onto a surface of a carrying plate with predetermined spaces is characterized by regularly shifting wafer adhering positions, at which the wafers are respectively adhered, with respect to a standard position of the carrying plate, in the surface of the carrying plate. The wafer adhering position is regularly shifted when the carrying plate is exchanged or predetermined time elapses.
    Type: Grant
    Filed: April 26, 1999
    Date of Patent: April 9, 2002
    Assignee: Fujikoshi Kikai Kogyo Kabushiki Kaisha
    Inventor: Toshihisa Yanagisawa
  • Patent number: 6368758
    Abstract: This invention relates to a decorative package comprising a package having adhered thereto a label comprising a transparent polymer sheet, and at least one dye containing layer is on each side of said sheet, wherein there are at least four separate dye containing layers and the dye containing layers comprise at least four spectrally distinct colors.
    Type: Grant
    Filed: September 18, 2000
    Date of Patent: April 9, 2002
    Assignee: Eastman Kodak Company
    Inventors: Alphonse D. Camp, James L. Edwards, Robert P. Bourdelais, Peter T. Aylward
  • Patent number: 6358355
    Abstract: A method for manufacturing a roll top is disclosed, in which solid wood strips are arranged equidistant apart in a mold. Then glue is applied to the same side of the strips. Then a wood texture rubber sheet is covered onto strips on the side having glue. Then the mold is vacuumed, causing the rubber sheet to completely adheres to the strips. A roll top of the present invention is then fabricated in this manner, which is a simple, rapid and low cost manufacturing method for roll tops.
    Type: Grant
    Filed: September 28, 1999
    Date of Patent: March 19, 2002
    Assignee: Kenmark Industrial Co., Ltd.
    Inventor: James Hwang
  • Patent number: 6358351
    Abstract: A thermally conductive substrate having a structure in which inorganic filler for improving the thermal conductivity and thermosetting resin composition are included. The thermosetting resin composition has a flexibility in the not-hardened state, and becomes rigid after hardening. The thermally conductive substrate has excellent thermal radiation characteristics. The method of manufacturing the thermally conductive substrate includes: piling up (a) the thermally conductive sheets comprising 70 to 95 weight parts of an inorganic filler, and 4.
    Type: Grant
    Filed: August 1, 2001
    Date of Patent: March 19, 2002
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Seiichi Nakatani, Hiroyuki Handa
  • Patent number: 6352875
    Abstract: In a photoelectric conversion apparatus obtained by arranging and fixing a plurality of semiconductor element substrates onto a base with an adhesive, the levels of the upper surfaces of the substrates are adjusted with a desired thickness of the adhesive so as to set the upper surfaces within the same plane while the distance from the upper surface of the base to the semiconductor element surface of each substrate is kept to a design value, thereby realizing a photoelectric conversion apparatus constituted by a plurality of substrates arranged two-dimensionally, which eliminates level gaps between the substrates, and hence is free from problems such as a decrease in resolution, a deterioration in sensitivity, and peeling of a phosphor and the like.
    Type: Grant
    Filed: October 21, 1998
    Date of Patent: March 5, 2002
    Assignee: Canon Kabushiki Kaisha
    Inventors: Shinichi Hayashi, Akira Funakoshi, Akira Tago, Satoshi Okada, Shinichi Takeda, Eiichi Takami, Masakazu Morishita, Chiori Mochizuki, Tadao Endo, Toshikazu Tamura
  • Patent number: 6332946
    Abstract: A book-like fixture and method for assembly of a plurality of multi-layered ceramic packages including a substrate and a cap. The fixture has a baseplate, a removable tray, an alignment plate for precisely aligning the caps with the substrates, a compression plate, and a plurality of compression devices designed to uniformly distribute compressive force on the plurality of packages. The fixture is preferably adapted for use of removable trays conforming to the Joint Electronics Design Engineering Council Tray Standard. The compression devices preferably have a spring, preferably a detachable leaf spring, and a compression plate placed over each cap. The structure of the fixture allows replacement of the springs and other modifications to allow assembly of multi-layered ceramic packages of differing dimensions. The structure of the fixture also allows stacking one on top of another.
    Type: Grant
    Filed: December 15, 1999
    Date of Patent: December 25, 2001
    Assignee: International Business Machines Corporation
    Inventors: Michael Emmett, Ronald L. Hering, Eric B. Hultmark, Howard D. Hutchinson
  • Patent number: 6331225
    Abstract: An apparatus for mounting electronic parts on a printed circuit board is disclosed. Plural electronic parts to be mounted on a printed circuit board are arranged as a set and loaded in a loading member for electronic parts. A set of such loading members for electronic parts, each carrying a set of electronic parts of the same type, are arrayed in a loading member furnishing casing. This set of the loading members for electronic parts, arrayed and held in the loading member furnishing casing is inserted and held by a loading member holder by which the set of the loading members for electronic parts can be held in register with an electronic part mounting portion of the printed circuit board. The loading member holder holding the set of the loading members for electronic parts is loaded on a electronic part loading device. The set of the electronic parts held by the loading member holder is loaded at a time on the sole printed circuit board by the electronic part loading device.
    Type: Grant
    Filed: April 19, 1999
    Date of Patent: December 18, 2001
    Assignee: Sony Corporation
    Inventor: Osamu Sugiyama
  • Patent number: 6322658
    Abstract: A method for making a unitary composite headliner adapted to be installed in a motor vehicle includes providing an inner layer and two reinforcing layers, each of which comprises polymeric material, the inner layer being configured to absorb sound and vibrations, and the reinforcing layers being configured to provide sufficient flexibility to the headliner to facilitate installation in the vehicle, while also providing sufficient rigidity to the headliner to enable the headliner to be self-supporting once installed in the vehicle; differentially heating the layers such that each reinforcing layer is heated to a respective predetermined reinforcing layer temperature, and the inner layer is heated to a predetermined inner layer temperature less than either respective reinforcing layer temperature; inserting the layers into a mold such that the inner layer is disposed between the reinforcing layers; and compressing the layers together to bond the layers and form the headliner.
    Type: Grant
    Filed: February 23, 1998
    Date of Patent: November 27, 2001
    Assignee: Lear Corporation
    Inventors: George B. Byma, John J. Gabrysiak
  • Patent number: 6315024
    Abstract: A manual electronic-part mounting apparatus includes a manual adhesive coating apparatus, a manual electronic-part fitting apparatus, and a manual printed-wiring-board checking apparatus. The manual adhesive coating apparatus has a pressing plate portion to which a large number of needles are fitted, being arranged such that the needles with the adhesive are brought in contact with a printed-wiring board, thereby the adhesive being coated on predetermined positions of the printed-wiring board. The manual electronic-part fitting apparatus has a large number of electronic-part supply rods. The electronic-part supply rod has an electronic-part storage rod supported by a fixed plate and an extruding rod supported by a movable plate. When the movable plate is moved relative to the fixed plate, the chip-type electronic part is extruded from an end-portion side aperture of the electronic-part storage rod.
    Type: Grant
    Filed: April 2, 1999
    Date of Patent: November 13, 2001
    Assignee: Sony Corporation
    Inventor: Osamu Sugiyama
  • Patent number: 6294037
    Abstract: The invention relates to a method and a device for joining a first web material to a second web material, in which the first web material is divided into individual sections of a predetermined length while the second web material is continuous. According to the present invention the method and device permitting sections of a first web material to be applied without waste to a second web material. With regard to the method, the first web material is applied to a substrate, by separating every two successive sections of the first web material (2) from each other so that they are spaced by a predetermined relative distance, and by applying the sections to the second web material at the noted relative distance.
    Type: Grant
    Filed: April 26, 1999
    Date of Patent: September 25, 2001
    Assignee: Meto International GmbH
    Inventors: Manfred Ruhrig, Gordon Klassen
  • Patent number: 6287410
    Abstract: A method and a system for producing a pressed-wood composite product from a prepared, pre-assembly mat having opposed facial expanses, and including, between such expanses, selected wood components, such as wood veneer, wood strands or other wood fibrous material, plywood sheets, lumber pieces, and further including between such wood components, inter-component heat-curable adhesive. The proposed method and system feature transporting such a pre-assembly through a processing zone, and, within that zone, creating within the pre-assembly both cyclic compression and cyclic heating. Compression is effected principally utilizing distributed pairs of opposing pinch rolls which act on transported material either through independent platens, or through surface materials which become incorporated in a final pressed-wood product. Cyclic heating is effected through use of microwave wave-guides interleaved effectively with the pressure-applying pinch rolls.
    Type: Grant
    Filed: August 8, 2000
    Date of Patent: September 11, 2001
    Inventor: Andrzej M. Klemarewski
  • Patent number: 6286577
    Abstract: An integrated system and method for fabricating a countertop from a slab is disclosed. The system includes a cutting station where an apron strip of a predetermined size is cut from a slab, a translating station where the apron strip is translated and positioned along the cut edge of the slab, and a press for adhesively bonding the apron to the cut edge of the slab.
    Type: Grant
    Filed: August 2, 1999
    Date of Patent: September 11, 2001
    Assignee: Premark RWP Holdings, Inc.
    Inventors: Howard Lynn Douglas, Steven J. Moore
  • Patent number: 6280560
    Abstract: The invention relates to a method and a plant for assembling, gluing and pressing veneer panels to be connected in a plurality of layers one above the other and one behind the other to form an endless strand of laminated veneer boards forming a continuous veneer-panel strand. The plant has a glue application machine, rolling belts, a laying device and a continuously operating press. A veneer-panel laying and interlinking device has a buffer acceleration belt with a combined reversing action. The laying device has a veneer-assembly laying belt and is embodied as a recirculating chain device with a recirculating supporting surface to form a fall-through gap, which can be moved forward and backward and raised and lowered for the front or rear veneer-panel edge and can be adjusted to the respective deposition and interleaving position on the veneer-assembly laying belt.
    Type: Grant
    Filed: October 14, 1999
    Date of Patent: August 28, 2001
    Assignee: Maschinenfabrik J. Dieffenbacher GmbH & Co.
    Inventor: Matthias Graf
  • Patent number: 6254968
    Abstract: Conventional plastic mouldings with several fields of which at least one is laminated with a covering material are produced in a single operation. In order to prevent the covering material from becoming warped in the laminated region, the plastic substrate of the known plastic part is injected into all fields under a low pressure, to the detriment under certain conditions of the quality of the blank fields. The invention therefore proposes to produce during one step the plastic substrate of the blank field from plastics injected under high pressure, and to produce the plastic substrate of the laminated field during another step from plastics injected under a relatively low pressure. Also disclosed is a corresponding moulding tool for producing the disclosed plastic moulding in a conventional press.
    Type: Grant
    Filed: May 18, 2000
    Date of Patent: July 3, 2001
    Assignee: Otto Deuschle Modell-Und Formenbau GmbH & Co.
    Inventor: Alfred Scharrenberg
  • Patent number: 6251219
    Abstract: A fixture holds a plurality of circuit components backside up in a substantially coplanar relationship in the same spatial relationship between the circuit components that the components are intended to have a circuit board or substrate as part of an electronic device. An adhesive applying device, such as a screen printer, applies adhesive to the backside of each circuit component. The circuit components may then be transferred onto a substrate by the use of a piston transfer device, for instance. Preferably, all the circuit components are transferred substantially simultaneously.
    Type: Grant
    Filed: September 17, 1998
    Date of Patent: June 26, 2001
    Assignee: Intermedics Inc.
    Inventors: Philip H. Chen, Dennis M. Gibson, Cuong Van Pham
  • Patent number: 6214156
    Abstract: One-side ends of fine metal wires are bonded onto pads of a semiconductor chip via wire bonding and the other ends of the fine metal wires are mounted on the board by flip chip.
    Type: Grant
    Filed: June 21, 1999
    Date of Patent: April 10, 2001
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Eiji Takano, Shinya Shimizu
  • Patent number: 6206070
    Abstract: A reinforcing hole punch including a reciprocating punch member supported for movement toward a base is disclosed. The reciprocating punch member is actuated to form a hole within a sheet of paper positioned on the base. The hole punch also includes a dispensing sleeve positioned about the punch member, defining a space between an inner wall of the dispensing sleeve and the punch member, in which reinforcing members are positioned for attachment to a sheet of paper when the punch member is actuated to form a hole within a sheet of paper.
    Type: Grant
    Filed: January 15, 1999
    Date of Patent: March 27, 2001
    Inventor: Avraham Salmon
  • Patent number: 6203653
    Abstract: A technique for forming a contoured axially extending engineered moulding that has at least one axially extending exposed surface. The technique includes providing an elongated outer wood section. A substrate having at least one axially extending side is provided. The wood section is adhered to the axially extending side. The wood section is contoured uniformly in an axial direction to form the exposed surface. A preferred embodiment uses a reengineered rip saw to contour the piece of wood. It is also assumed that multiple moldings can be machined by the reengineered rip saw simultaneously. The simultaneous machining by the reengineered rip saw also permits simultaneous measurements and simultaneous cross cutting and dado cutting of the moldings.
    Type: Grant
    Filed: September 18, 1996
    Date of Patent: March 20, 2001
    Inventor: Marc A. Seidner
  • Patent number: 6183592
    Abstract: The present invention relates to assembly techniques and the resulting products which are thermally stable, have high structural integrity, and compensate for thermal stresses that occur between the various components of the package. This is accomplished, in-part, by designing the package so that the coefficient of thermal expansion (CTE) of a stiffening ring which is mounted on the package substrate matches the CTE of the substrate and optional lid. Further, the particular adhesives used to bond the stiffening ring are chosen to match their CTE to that of the substrate, ring and lid. Moreover, the substrate is designed so that its CTE, at least in-part, matches that of the chip, and also that of the stiffening ring.
    Type: Grant
    Filed: November 20, 1998
    Date of Patent: February 6, 2001
    Inventor: Mark F. Sylvester
  • Patent number: 6176957
    Abstract: A method of using a coversheet to remove a plurality of pieces of temporary tape from a laminated assembly. In particular, a method of using a coversheet to remove a plurality of pieces of pressure sensitive adhesive tape from a laminated veneer assembly. The coversheet and the pressure sensitive adhesive tape are selected such that after application of heat and pressure during the veneer lamination process, the back of the tape bonds to the surface of the coversheet. After lamination, the coversheet is removed with the pieces of tape bonded thereto. In this manner, the large number of pieces of tape do not have to be removed individually.
    Type: Grant
    Filed: March 15, 1999
    Date of Patent: January 23, 2001
    Assignee: 3M Innovative Properties Company
    Inventors: Robert E. Bolitsky, Kathryn W. Cox
  • Patent number: 6162312
    Abstract: The resin impregnated composite wood product comprises a plurality of wood layers, with each layer having relatively thin strips of wood. The strips in each layer are arranged at an angle to the strips of wood in adjacent layers. The strips of wood of such layers are saturated with resin throughout their length, width and thickness to fill the pores and when cured to provide a strong, tough, durable, long lasting product which is economical to manufacture.
    Type: Grant
    Filed: January 19, 1999
    Date of Patent: December 19, 2000
    Inventor: Dennis R. Abney
  • Patent number: 6159329
    Abstract: A method of incorporating small graphs on to pages of text or calculations by using small adhesive-backed appliques or labels which have been pre-printed with a graphical coordinate grid. These appliques eliminate the necessity of a separate piece of graph paper or the tedium of drawing or gluing a coordinate grid directly on the report or calculation page.
    Type: Grant
    Filed: February 29, 1996
    Date of Patent: December 12, 2000
    Inventor: Charles M. Tschanz
  • Patent number: 6153289
    Abstract: A laminate comprises:a first layer of thickness between 75 .mu.m and 150 .mu.m of a polyester material not being absorbent of xerographic toner and having an image deposited on a first surface thereof by an electrostatic deposition process,a second layer of optically transparent or translucent plastics material,a first surface of the first layer being bonded to the second layer by a layer of optically transparent adhesive material, in a lamination process involving heat and pressure to ensure that the relief of the deposited image is apparent in the laminate through the second layer,the arrangement being such that the image on the first layer can be viewed through the second layer and the layer of optically transparent adhesive material.
    Type: Grant
    Filed: September 30, 1997
    Date of Patent: November 28, 2000
    Inventor: Nicholas J. Murray
  • Patent number: 6146483
    Abstract: A decal for use in forming a solar cell includes an antireflective precursor material and a patterned electrically conductive material. The antireflective precursor material and the patterned electrically conductive material are disposed over a base material. The antireflective precursor material can be one or more layers of paste which form an antireflective coating upon being fired. A cover layer can be disposed over the antireflective precursor material and the electrically conductive material.
    Type: Grant
    Filed: July 1, 1999
    Date of Patent: November 14, 2000
    Assignee: Evergreen Solar, Inc.
    Inventors: Jack I. Hanoka, Brynley E. Lord, Mark T. Mrowka, Xinfa Ma
  • Patent number: 6143105
    Abstract: A label applicator, easily mounted on a desktop in association with a label printer, has a compact configuration with no external power requirements since the components are electrically powered and the power is received from the printer. Preferably the label does not move during application, providing a high degree of accuracy and placement. The applicator may be used with both linered and linerless labels and associated printers, and uses inexpensive components. Positive stops are provided for stopping the movement of a label into the applicator housing, and the manual movement of a mailpiece into the applicator housing. Sensors sense the label and the mailpiece when accurately aligned, and cause actuation of a linear solenoid with tamp pad to move the mailpiece vertically upwardly into contact with the label pressure sensitive adhesive. The label is held in place in the desired position by one or more electric fans exhausting air from the opposite face of an apertured plate from the label.
    Type: Grant
    Filed: April 27, 1998
    Date of Patent: November 7, 2000
    Assignee: Moore U.S.A., Inc.
    Inventors: Thomas P. Nash, Frank C. DeReu, Eric V. Palmer, Joseph T. Duffy, James M. Schweitzer
  • Patent number: 6143119
    Abstract: A method of making composite strips for mouldings, frames and the like, including the steps of providing a first elongate panel of a first material and a second elongate panel of a second material, laminating the first and second panels onto one another to provide a laminated panel, making a plurality of parallel cuts or slots in the second panel, adhering a filler strip to the first and second panels in each of the cuts, and gang sawing the laminated panel into composite strips by cutting the laminated panel at each of the filler strips. The filler strips may be formed as single pieces and may be formed as a pair of pieces not joined together. A composite panel having first and second elongate panels of different materials laminated together, with a plurality of parallel cuts in the second panel, and with filler strips in the cuts and adhered to the first and second panels. Several alternative embodiments are also disclosed.
    Type: Grant
    Filed: April 9, 1997
    Date of Patent: November 7, 2000
    Inventor: Marc A. Seidner
  • Patent number: 6136116
    Abstract: A system is provided for filling a gap between adjoining coplanar first and second sheet members mounted on an outer surface of a common substrate and having juxtaposed first and second edge surfaces. A permanent gap filler member of predetermined shape and size intended for eventual permanent reception in the gap is employed for partially filling the gap. A temporary gap filler tool which includes a substitute gap filler element having substantially the same predetermined size and shape of the permanent gap filler member, has an abutting surface for contiguous engagement with the first edge surface of the first sheet member when advanced to an attached position before the permanent gap filler member is mounted in the gap, a minor gap surface facing opposite said abutting surface, and means for releasably attaching the temporary gap filler tool to the first sheet member. A minor gap is thereby defined between the temporary gap filler element and the second edge surface of the second sheet member.
    Type: Grant
    Filed: November 12, 1998
    Date of Patent: October 24, 2000
    Assignee: Northrop Grumman Corporation
    Inventors: Carl Andrew Reis, Robert Warner Koon
  • Patent number: 6129804
    Abstract: A system for aligning and attaching together a plurality of thin film transistor tiles for constructing a flat panel display. A coverplate loading station where a coverplate that the tiles are to be attached to is arranged on a coverplate support. A coverplate bonding material dispensing station where a bonding material for bonding the tiles to the coverplate is applied to a surface of the coverplate. A tile placement station where the tiles are arranged on the coverplate. A tile aligning and securing station where the tiles are aligned relative to each other and the coverplate by the tile aligner and where the tiles are at least partially bonded to the coverplate. A tile assembly bonding material dispensing station where a bonding material is applied to a surface of the tiles opposite the side that the coverplate is bonded to. A backplate placement station where a backplate is arranged on the tiles.
    Type: Grant
    Filed: May 1, 1998
    Date of Patent: October 10, 2000
    Assignee: International Business Machines Corporation
    Inventors: Michael A. Gaynes, Allan O. Johnson, Ramesh R. Kodnani, Mark V. Pierson, Edward J. Tasillo
  • Patent number: 6126775
    Abstract: A temperature compensated optical isolator and a method of manufacturing optical assemblies. The isolator utilizes a bimetallic element to rotate a polarization element of the isolator in response to temperature variations. The isolator maintains an effectively constant isolation over a substantially wide temperature range. Advantageously, the isolator is simple, compact and a viable solution to a wide range of optical applications. The manufacturing method employs a lamination procedure to create an array of optics-receiving micro-fixtures. The method is well adapted for the automated manufacturing of optical assemblies. Desirably, the method provides for high speed, high volume production, thereby advantageously, maintaining low manufacturing costs.
    Type: Grant
    Filed: January 12, 1999
    Date of Patent: October 3, 2000
    Assignee: Horizon Photonics, LLC
    Inventors: Robert R. Cullen, Richard J. Sweeney
  • Patent number: 6117538
    Abstract: An oxygen absorbent is provided which includes a multilayered body formed from a plurality of thin resin layers laminated over one another. At least one laminated side of this multilayered body is constructed as an oxygen-absorbing surface. The multilayered body includes an oxygen-absorbing layer of a resin composition in which an oxygen-absorbing component is dispersed and which is made porous; a non-porous oxygen-permeable layer which is permeable to oxygen; and a porous oxygen-permeable layer which serves as a protection layer for the non-porous oxygen-permeable layer. The layers are thermally bonded to one another and the resulting laminate is drawn to simultaneously enlarge the pores in the porous layers.
    Type: Grant
    Filed: January 15, 1998
    Date of Patent: September 12, 2000
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Masukazu Hirata, Yoshinori Mabuchi, Hiroshi Hasegawa, Chihara Nisizawa, Hideyuki Takahashi