Abstract: A seal agent D and liquid crystal C are clamped to a lower substrate 6, a pair of the lower substrate 7 and an upper substrate 7 are laminated with the seal agent D and the liquid crystal C interposed therebetween, and at least one of the pair of substrates is a roll-shaped long flexible resin film. When the substrates are laminated, the lower substrate 6 on one hand is aligned to the upper substrate 7 on the other hand in every arbitrary length. With this arrangement, productivity can be improved as well as a positional dislocation due to accumulation of positioning errors can be prevented.

Abstract: An adjustable pouch machine comprises a vertical sealer module forms transverse seals between two plies of a pouch web to partially define a plurality of pouches. Rollers selectively tension and relax the web on the vertically oriented wheel, allowing them to drop away from heated lands on emergency and cycle stops. A filler wheel has a plurality of adjustable gripper units mounted directly thereon for transporting independent separate pouches cut from the pouch web. An adjustable knife is selectively provided with changeable knife hub sets to handle a variety of pouch sizes where a filler wheel alternately first fills and seals pouches in a train. Gear linkage accommodates variation in distance between hubs of different sets. Various embodiments, apparatus and methods are described.

Abstract: Tape heating means is allowed to come close to an adhesive tape for support and, in a heating state, the adhesive tape for support is stretched and tensioned with proper tension in a tape width direction and a transport direction. A heated work is bonded to an adhesive face of the tensioned adhesive tape for support, thereby supporting the work.

Abstract: The bonding apparatus is capable of effectively increasing temperature of a substrate and reducing occurrence of position gaps and poor connection in a process of flip-chip-bonding semiconductor devices to the substrate. The bonding apparatus comprises: a supporting unit for supporting the substrate, on which the semiconductor devices have been adhered by a non-conductive; and a heating/pressing unit for heating and pressing the substrate, the heating/pressing unit having a built-in heat source and a clamping face, onto which the substrate supported by the supporting unit is pressed. The substrate supported by the supporting unit is moved toward the clamping face of the heating/pressing unit so as to preheat the substrate and the semiconductor devices by radiation heat. Then, the semiconductor devices are pressed onto the clamping face of the heating/pressing unit so as to cure the non-conductive adhesive and bond bumps of the semiconductor devices to terminal sections of the substrate.

Abstract: A laminated assembly (10) is mountable on a wall and comprises a back support (20) and opposed side supports (40,50) for holding the laminating roller (60) and nip roller (70). The assembly includes hanging supports (120) for hanging the assembly (10) on a wall oriented so that the nip is substantially parallel to the wall and items to be laminated can be fed from above, passed through the machine and released below the machine.

Abstract: A film loading arrangement simplifies the film loading process for a user and prevents the improper loading of a laminate film roll into a laminator. The components allow the laminate roll of film to be loaded in the correct orientation by providing differing connection structures on each end of the laminate film roll. The differing connection structures are received by respective receiving structures on the laminator. Each connection structure is compatible with only one of the receiving structures such that when the connection structures are attached to the roll, the film can be loaded in only one direction, i.e., correctly. Therefore, the user can properly load a laminate film roll and avoid damaging the laminator as a result of improper film loading. A tensioning mechanism can be provided for adjusting the force required to unroll laminating film from the supported roll.

Abstract: Provided is a wafer bonding apparatus which performs pressurization and heating and eliminates nonuniformity of wafer thickness by changing the shape of a pressurizing surface so that planarity of a wafer bonding surface is improved. The wafer bonding apparatus places a plurality of wafers to be bonded between an upper unit (101U) and a lower unit (101L), and bonds the wafers by applying pressure and heat by the upper unit and the lower unit. The wafer bonding apparatus is provided with a top plate (111), a pressure profile control module (131), and a heater section arranged between the top plate and the pressure profile control module for heating. Shape change generated on the surface of the pressure profile control module causes change of the surface of the top plate.

Abstract: A welding system for heat welding a component to the contact surface workpiece is provided with a carriage and a component holding positioning unit and workpiece melting unit. The component holding unit and workpiece melting unit each include a respective hooked-shaped holding arm assembly and an associated support assembly used to secure and movably mount the holding arm assembly and an associated support assembly used to secure and movably mounted the holding arm assembly to the carriage. A heating or welding unit is mounted towards a distal end of the holding arm assembly, and which is operable to melt the contact surface when moved thereagainst. The component holding unit is provided with a component holder operable to fixedly grasp or release the selected component in its mounting to the workpiece.

Abstract: A plate press (1), in particular a one-level or multilevel cycle press, including at least one heating plate (2), at least one press plate (5) and at least one press cushion, disposed between the press plate (5) and the heating plate (2), which press cushion comprises a cushion layer (4) which is liquid at least at the operating temperature of the plate press (1), which cushion layer is defined on one side by a fluid tight membrane (3), wherein the press plate is disposed on a side facing the press blank and the membrane (3) includes a flexible polymeric material. The membrane (3) is connected to the press plate (5).

Abstract: To mount electronic components with different types of electrodes en masse on a substrate, the present invention comprises a heating section that heats an electrode of a first electronic component and an electrode of a second electronic component among the plurality of electronic components; a heat releasing section that releases heat from the electrode of the first electronic component and the electrode of the second electronic component; a first thermally conductive member disposed between the electrode of the first electronic component and the heating section or the heat releasing section; and a second thermally conductive member disposed between the electrode of the second electronic component and the heating section or the heat releasing section. The first thermally conductive member and the second thermally conductive member have different amounts of heat transfer per unit time.

Abstract: A manufacturing device used when manufacturing composite material through the RTM method and the vacuum assisted RTM method and provides a manufacturing device which is capable of manufacturing a laminate excellent in the handling property and formability continuously by making the manufacturing device of a laminate to be comprised of an adhesion device for partially adhering and integrating inter-layers of a laminate precursor in which two or more reinforcing fiber base materials having a resin material on a surface are laminated by the resin material to obtain a laminate, the adhesion device including a pressing tool and a plate tool arranged facing each other, the pressing tool including a pressing plate and a plurality of pressing pins, at least one of the pressing tool and the plate tool having a raising and lowering function, and at least one of the pressing tool and the plate tool having a heating function.

Abstract: A component coupling apparatus for mounting a component to an internal contact surface of a hollow workpiece which includes a positioning unit and at least one component holding unit. The component positioning unit includes a processor having memory which pre-stores data representative of a workpiece target feature and an access opening therein. The component positioning unit includes a 3D laser scanner/digitizer which is movable to scan the exterior surface of the workpiece and identify the axial centers of the access opening and target feature, and calculate the distance and/or directional vector therebetween. The component holder unit includes component holder supported on a support arm. The component holder releasably secures the component to be joined to the workpiece, and is sized for insertion at through the access opening to move the component into alignment with the contact surface.

Abstract: The present invention provides an apparatus for automatically punching and bonding MEA materials for a fuel cell, which can automatically and continuously perform a punching process and a bonding process for the MEA materials by improving a conventional method in which a 5-layer MEA material is manually manufactured. Accordingly, it is possible to reduce the time required to manufacture the 5-layer MEA, provide a reduction in manpower and an efficient production, enable mass production, and improve the quality of the finished 5-layer MEA material.

Abstract: A method of manufacturing two screens in a jig by laying a length of woven wire cloth across two rectangular frames laid side by side in the jig with longer edges abutting, and orientating the cloth so that the warp wires extend continuously across the two screens. The cloth is tensioned and bonded to the frames after which it is severed along the join and surplus cloth is trimmed away from the edges of the frame. If the cloth has a square mesh and the warp wires are of greater cross-section than the weft wires, the warp wires will extend across the width of the frame, and if the cloth has a rectangular mesh, the greater number of warp wires per unit length also extends across the width of the frame. In each case warp wires will resist the stresses across the width of the central region of each opening.

Abstract: A gripper assembly for a tray sealing machine. The gripper assembly includes a carriage movable between extended and retracted positions; at least one gripper arm attached to the carriage and movable between gripping and releasing positions; and first and second independently operable drives separate from the carriage but coupled thereto via respective first and second drive train assemblies. The first drive train assembly is adapted to move the carriage between the first and second positions in response to the operation of the first drive, and the second drive train assembly is further adapted to cause the at least one gripper arm to move between the open and closed positions in response to operation of the first and second drives at differing speeds.

Abstract: A highly reliable and productive manufacturing method of boards and a manufacturing apparatus are provided. The manufacturing apparatus includes heater-punches (4a) and (4b) disposed above and under pressuring holes (24) provided on positioning stage (6) which positions and laminates board materials. The apparatus also includes a supplying and discharging means of a mold-releasing sheet, and the means is formed of supply reel (22), take-up reel (23), and guide rolls (25a) and (25b). The sheet is supplied and discharged passing between heater-punches (4a) placed above pressuring holes (24) and heater-punches (4b) placed under pressuring holes (24).

Abstract: The present invention relates to a laminator with changeable rotation speed and heating temperature including a first roller set, a second roller set, a transmission gear set, a speed changing gear set, a first driving device, a second driving device, an input interface, a controller and a heating device. A user selects an option of the input interface according to film thickness. The controller determines rotation speed and heating temperature of the first roller set and the second roller set according to the option. Then the controller controls the second driving device to move the speed changing gear set to alter the engagement between the speed changing gear set and the transmission gear set, as to modulate the rotational speed of the first roller set and the second roller set.

Abstract: A method of applying graphics to a set of articles with a graphic transfer assembly is disclosed. The method includes a step of selecting an article from a set of articles comprising different types of articles. After selecting a last that may be associated with the article, the last may be attached to a last assembly of the graphic transfer assembly. With the article attached to the graphic transfer assembly, a deformable membrane may apply graphics to curved portions of the article. A protective member can be used to protect a portion of the article during the graphic transfer process.

Abstract: An apparatus for heating and pressing a printed circuit board includes a first pressing member, a second pressing member, a driving member, a heater and an electromagnetic assembly. The driving member is configured for driving the first pressing member and the second pressing member to move toward or away from each other. The heater is configured for heating one of the first and second walls, and the electromagnetic assembly is capable of generating a magnetic field to attract the second wall to create additional pressure.

Abstract: A substrate bonding apparatus and method are provided. The substrate bonding apparatus may include a first support member that receives a first substrate, a second support member that receives a second substrate opposite the first support member, and a support pin located at the outside of the first substrate fixed to the first support member. The support pin may be connected to the first support member, and a distance adjustment device may move the support pin upward or downward to adjust the distance between the first support member and the second support member.

Abstract: Provided is a wafer bonding apparatus which performs pressurization and heating and eliminates nonuniformity of wafer thickness by changing the shape of a pressurizing surface so that planarity of a wafer bonding surface is improved. The wafer bonding apparatus places a plurality of wafers to be bonded between an upper unit (101U) and a lower unit (101L), and bonds the wafers by applying pressure and heat by the upper unit and the lower unit. The wafer bonding apparatus is provided with a top plate (111), a pressure profile control module (131), and a heater section arranged between the top plate and the pressure profile control module for heating. Shape change generated on the surface of the pressure profile control module causes change of the surface of the top plate.

Abstract: A hot press device manufacturing a multilayered printed board by pressing processed members laminated by mutually opposing heating plates includes: a plurality of heating plates including a plurality of projected parts and punched parts engaging therewith and capable of moving in a direction in which the processed members are laminated; and a pressure mechanism pressurizing each of the heating plates in the lamination direction, wherein the processed member is arranged between the heating plates and is pressed by the heating plates pressurized by the pressure mechanism while engaged with each other.

Abstract: The apparatus for laminating a solar module includes a press for pressing and heating the solar module including: a first press part and a second press part between which an evacuable cavity is formed; a bearing surface for the solar module disposed in the cavity; a heater being disposed in the cavity and being movable relative to the bearing surface so that the solar module can be pressed via the heater against the bearing surface. The press includes one or more sealing bodies being disposed in an intermediate space between the heater and the first press part and/or in an intermediate space between the heater and the second press part and being brought into contact with the heater and at least one of the press parts so that the cavity is divided into at least two chambers being separated from one another in an airtight manner.

Abstract: Methods and apparatus for fabricating adhesive bonded joints while minimizing the voids and/or porosity found in the cured bondline. In accordance with various embodiments, the apparatus comprises an evacuation chamber combined with a pressure inducing device to produce bonded joints that are both void free and thoroughly compacted. The surfaces to be bonded are continuously evacuated throughout the bonding process (pre-mating, mating, debulking and cure). Continuous evacuation is provided via standard vacuum, while the induced pressure can be pneumatically or mechanically provided.

Abstract: A weight applicator for a wheel of a tire-wheel assembly is disclosed. The weight applicator includes an arm portion and an applicator portion connected to the arm portion. The applicator includes a radially-extending flange portion. The radially-extending flange portion is connected to the arm portion. A first plunger portion is movably-connected to the radially-extending flange portion by one of more first radial arms. A method is also disclosed.

Abstract: A center-folded film splicer is disclosed. The splicer comprises a splicer assembly that is adjustably mounted to a wrapping device such that it can be moved between a storage position and an operating (or splicing) position. The splicer assembly comprises a pair of heat bars, an upper heat bar and a lower heat bar, connected with a synchronized hinge and a back-up pad bar disposed therebetween. In this manner, the upper and lower layers (or “legs”) of the films from a depleted film roll and a fresh film roll can be simultaneously sealed to each other to create a continuous film that does not need to be rethreaded through the wrapping device when replacing film rolls.

Abstract: A manufacturing method of a laminated plate (19) includes: a first step of supporting, by a support member (9), a thermoplastic resin-made laminated material (1) in which a pair of plate-like members (3, 4) are laminated to each other while interposing a longitudinal wall portion (2b) so that a peripheral edge portion (1a) of the laminated material (1) can be exposed, and heating and softening the peripheral edge portion (1a) by blowing a hot air to the peripheral edge portion (1a); and a second step of pressing the plate-like member (4) as one of the pair of plate-like members (3, 4) against other plate-like member (3) by thrusting a cutting blade (17a) of a cutting die (17) against the heated and softened peripheral edge portion (1a), thereby bringing the pair of plate-like members (3, 4) into contact with each other and welding the plate-like members (3, 4) to each other, and then cutting the laminated plate (19) out of the laminated material (1).

Abstract: An apparatus for making “shrink sleeve” labels, comprises a carousel provided peripherally with a spindle arrangement shaped for being wound by portions of film made of plastics, a transferring unit arranged peripherally to the carousel for transferring each portion of film made of plastics on a respective spindle, an electrostatic-charge generating device arranged downstream of the transferring unit such as to charge electrostatically the portions of film made of plastics; a method for labelling containers comprises forming a sleeve and covering a container with the sleeve, the forming comprising winding a portion of film made of plastics to a respective spindle and maintaining the portion of film made of plastics adhering to the spindle in an electrostatic manner.

Abstract: A bonding apparatus has an upper chuck and a lower chuck for holding wafers. The upper chuck is configured such that the center portion is bent to be convex when pressurized with a predetermined pressure. On the bottom surface of the lower chuck, there is an insulating ring formed of a combination of a plurality of insulating members to support the periphery of the lower chuck. The bottom surface of the insulating ring is supported by a support ring formed of a combination of a plurality of supporting members. The supporting members and the lower chuck are fixed by a bolt provided for each of the supporting members. The bolt is inserted through a through hole and a through hole which are formed in the insulating members and the supporting members, respectively, the through holes having a diameter larger than a diameter of the bolt.

Abstract: A method of applying graphics to a set of articles with a graphic transfer assembly is disclosed. The method includes a step of selecting an article from a set of articles comprising different types of articles. After selecting a last that may be associated with the article, the last may be attached to a last assembly of the graphic transfer assembly. With the article attached to the graphic transfer assembly, a deformable membrane may apply graphics to curved portions of the article.

Abstract: Disclosed is a film sticking device that sticks a first film substrate and a second film substrate together on a curved-surface shape. The film sticking device includes a mold having a curved attachment surface formed into a desired curved-surface shape; an attracting and holding unit capable of relatively moving on the curved attachment surface and having plural vacuum chambers on which an attracting surface for attracting and holding the second film substrate is provided; and a suctioning unit capable of separately applying suction processing to the plural vacuum chambers. The suctioning unit starts, as the attracting and holding unit moves, the suction processing of the vacuum chamber corresponding to a position opposing the second film substrate and sequentially stops, as the second film substrate is stuck to the first film substrate, the suction processing of the vacuum chamber corresponding to the stuck second film substrate.

Abstract: The invention relates to a wood particle board (5) and to a process for the manufacture of the same. The process involves the feed-out of a first quantity (9?) of glue-coated wood particles (25), producing a bottom particle mat (10?), feed-out of a second quantity (9?), comprising a homogeneous mixture of glue-coated defibrated wood particles, for producing an intermediate, voluminous mat (20) on top of the bottom particle mat (10?), feed-out of a third quantity (9??) of glue-coated wood particles, producing a top particle mat (10??) on top of said intermediate, voluminous mat (20), and compression of said fed-out quantities, to form a bottom (1), intermediate (7) and top layer (3) of the wood particle board (5).

Abstract: A bonding apparatus and method holds first and second bodies peripherally, one above the other, on respective shelves. A lower heat-transfer body is configured to lift the first body from below and press the first and second bodies against an upper heat-transfer body to enable bonding between the first and second bodies.

Abstract: An industrial-scale high throughput wafer bonding apparatus includes a wafer bonder chamber extending along a main axis and comprising a plurality of chamber zones, a plurality of heater/isolator plates, a guide rod system extending along the main axis, a pair of parallel track rods extending along the main axis, and first pressure means. The chamber zones are separated from each other and thermally isolated from each other by the heater/isolator plates. The heater/isolator plates are oriented perpendicular to the main axis, are movably supported and guided by the guide rod system and are configured to move along the direction of the main axis. Each of the chamber zones is dimensioned to accommodate an aligned wafer pair and the wafer pairs are configured to be supported by the parallel track rods. The first pressure means is configured to apply a first force perpendicular to a first end heater/isolator plate.

Abstract: A hemming system for hemming a fabric, without using seams, and by introducing an adhesively processed element into a surface or between two opposite surfaces of the fabric, comprises an adhesive applying module for applying two adhesive materials to an elastic or resilient element and to the fabric, and a second hemming module, for hemming the fabric at the resilient element.

Abstract: The present invention relates to a method of attaching an active film (5) onto a flexible package comprising the steps of heating a foil (2); applying an active film (5) to the foil (2); and applying sufficient pressure to the active film (5) and foil (2) combination and sufficient heat to the foil (2) so that active film (5) adheres to the foil (2). In one example, the active film (5) comprises two components and wherein the two components are an active agent and a polymer. In another example, the active agent is an absorbing material.

Abstract: A speed changing transmission mechanism of a sheet laminating apparatus includes a speed changing module, a motor, a switching gear, a hot press gear, a first connecting gear and a second connecting gear. By switching the switching gear to be engaged with different gear, the speed changing transmission mechanism is capable of hot laminating the sheet article and withdrawing the jammed sheet article.

Abstract: The invention is directed to a device for inflating and sealing an inflatable structure, such as inflatable cushions. The device includes an assembly configured for inflating a cushion cavity disposed between first and second layers of a film, and a sealing mechanism that preferably includes a rotary sealing drum, which can include a heat source.

Abstract: It is an object of the invention to improve the production efficiency in sealing a thin film integrated circuit and to prevent the damage and break. Further, it is another object of the invention to prevent a thin film integrated circuit from being damaged in shipment and to make it easier to handle the thin film integrated circuit. The invention provides a laminating system in which rollers are used for supplying a substrate for sealing, receiving IC chips, separating, and sealing. The separation, sealing, and reception of a plurality of thin film integrated circuits can be carried out continuously by rotating the rollers; thus, the production efficiency can be extremely improved. Further, the thin film integrated circuits can be easily sealed since a pair of rollers opposite to each other is used.

Abstract: The embodiments described provide apparatus and methods for bonding wafers to carriers with the surface contours of plates facing the substrates or carriers are modified either by re-shaping, by using height adjusters, by adding shim(s), or by zoned temperature control. The modified surface contours of such plates compensate the effects that may cause the non-planarity of bonded substrates.

Abstract: A method and a device to be used in the process of manufacturing plates, such as fiberboards or the like boards, where the raw material in form of bio-mass particles, such as wood fibers or the like, applied with a thermosetting binder is spread onto a forming belt to form a mat, and where said mat by means of a hot press is compressed into the desired thickness of the finished plate and the thermosetting binder is hardened. According to the inventing a system and corresponding method for manufacturing biomass-based products is provided that has enhanced efficiency due to the application of ultra sound.

Abstract: A method for transferring an adhesive film, which contains: conveying the adhesive film to an area between the heating part and the adherend; pressurizing the adhesive film with the heating part from the side of the release layer and heating the adhesive layer up to a first heating temperature so as to bring the adhesive layer into contact with the adherend; bringing a high temperature heating part, which is disposed downstream of the heating part with respect to the conveyance direction of the adhesive film, into contact with the adhesive film from the side of the release layer, and heating the adhesive layer up to a second heating temperature so as to cut the adhesive layer; and releasing the release layer from the adhesive layer which is in contact with the adherend, and transferring the adhesive layer which is in contact with the adherend to the adherend.

Abstract: This invention relates to a dice placement assembly for placing dice on a carrier. The assembly includes a support platform with a clamp mechanism configured to clamp the carrier onto said platform, and at least one camera operatively directed at the platform to detect alignment fiducials on the carrier. The assembly also includes a placement device having a vacuum mechanism to retrieve the dice from a supply mechanism, said placement device having actuators to align the dice with the carrier and to place the dice thereon once aligned, and a heater to heat the dice prior to placement on the test bed. Further included is a controller operatively controlling the clamp mechanism, the camera and the placement device, to facilitate accurate placement of the dice on the carrier.

Abstract: The present invention relates to a thermal pressure welding apparatus for the waist of incontinent pants and training pants and a thermal pressure welding method. The apparatus can thermal pressure weld the waist of incontinent pants and training pants consists of multiple layers of non-woven fabric in a fast, accurate and secure manner. An upper synchronous transmission mechanism and a lower synchronous transmission mechanism are disposed vertically opposed, by means of a shaft, on a side of a vertical frame. The upper synchronous transmission surface of the upper synchronous transmission mechanism and the synchronous transmission surface of the lower synchronous transmission mechanism are opposed. A plurality of toothed pressing blocks are spacedly opposed on the upper synchronous transmission surface and the lower synchronous transmission surface respectively.

Abstract: A method of applying a strip to a surface is disclosed. The strip is laid out spaced apart from a path guide. The path guide is referenced with least two longitudinally spaced apart reference guides to guide an applicator transversely spaced from the reference guides over the strip. The strip is lifted upstream of the applicator with a strip guide longitudinally spaced from the applicator to space the strip from the surface. Heat is applied to at least one of the strip or the surface in a location longitudinally between the applicator and the strip guide. The applicator is moved along the strip to apply pressure to the strip against the surface to bond the strip to the surface. A related apparatus for applying a strip to a surface is also disclosed.

Abstract: A method for manufacturing a solar cell module for a vehicle sunroof is disclosed, in which a solar cell is cut into multiple pieces so that it can be closely adhered to a curved glasses of a sunroof which is generally installed at an intermediate portion of a vehicle roof so as to provide a driver with an air circulation effect in the interior of a vehicle and a fresh driving feeling with its open environment. A solar cell module for a sunroof is manufactured based on a high temperature and vacuum compression work using a laminator as an EVA film adhering unit. So, it is possible to easily perform a laminating work for adhering a sunroof curved glass and a solar cell as compared to a conventional art in which it is not easy to perform the above work.

Abstract: An air cushion maker includes a pair of forming rollers that are provided with recesses and electrothermal wires so that two consecutive plastic films passing between the forming rollers are made into air cushions with geometric puffy air cells.

Abstract: A pair of laminated panels are simultaneously manufactured in a single panel press. A thermal band is stacked between two panel sets and then the two panel sets are simultaneously heated and compressed together in a common stack with the band, with the band being separately heated.

Abstract: A system and method for imprinting distinct patterns along a seam by which two or more layered plastic sheets are mutually attached to each other is provided. The disclosed method comprises (i) heating selected contours located across a surface of the layered plastic to a predefined temperature, and (ii) forcing a molding head against the heated surface, wherein the molding member has a face from which a plurality of pressing faces extend towards a common direction, the footprint of which features the desired pattern. A soldering head of the disclosed system has at least one molding member having a plurality of fingers. The footprints of the fingers are geometrically shaped in accordance with the pattern to be imprinted along the seam. Some of the fingers may have sharpened tips. A soldering head optionally comprises a pressing member for pressing against peripheries of the footprints of the fingers located across the surface of the layered plastic.

Abstract: The invention relates to a transdermal, especially dopaminergic patch, comprising a release liner film, an active substance layer, and a carrier film, wherein the active substance layer is applied between the release liner film and the carrier film. The release liner film and/or the carrier film thereby comprise at least one separation edge brought about thermally, at least partially defining a peripheral edge of the patch. The invention further relates to a method for producing such a transdermal patch and to a tool for producing the patch according to the method according to the invention. Crystal growth in the active substance layer can be reliably prevented by the patch according to the invention.