Abstract: A steel sheet is provided with a coating having at least one layer of zinc and a top layer of paint applied by cataphoresis. The zinc layer is deposited by a jet vapor deposition process in a deposition chamber maintained at a pressure between 6·10?2 mbar and 2·10?1 mbar. A fabrication method and an installation are also provided.

Abstract: A method of substituting an azide for hydrogen bonded to a tertiary carbon atom is provided. A liquid mixture in an oxygen-free environment has spaced-apart carbon and platinum electrodes disposed therein. The liquid mixture includes a solvent, ammonium azide, and a base material having at least one tertiary carbon atom with hydrogen bonded thereto. An electric current is applied to the electrodes where the liquid mixture undergoes a reaction. The electrochemically-induced reaction yields a liquid product and a solid product. The liquid product includes the solvent and a constituent having at least one tertiary carbon atom with an azide bonded thereto.

Abstract: A metal-plated carbon material includes: a carbon material; and a metal layer covering a surface of the carbon material, in which, in the metal layer, crystal grains forming the metal layer have an average crystal grain size of 110 nm or less. A method of manufacturing a metal-plated carbon material, includes: a metal complex fixation step of immersing a carbon material in a supercritical fluid or subcritical fluid containing an organometallic complex of a first metal; and a first energization deposition step of energizing the metal-complex-fixed carbon material in an electroless plating solution containing a second metal.

Abstract: The present invention is related to an acidic zinc or zinc-nickel alloy electroplating bath for depositing a zinc or zinc-nickel alloy layer and a method for zinc or zinc-nickel alloy electroplating making use of such an electroplating bath.

Abstract: Described herein are electrodeposited corrosion-resistant multilayer coating and claddings that comprises multiple nanoscale layers that periodically vary in electrodeposited species or electrodeposited microstructures. The coatings may comprise electrodeposited metals, ceramics, polymers or combinations thereof. Also described herein are methods for preparation of the coatings and claddings.

Abstract: On part of a surface of a metal sheet that is to be heated by radiant heat transfer with a near-infrared ray, a region where reflectance for a radiant ray is made lower than that of the original surface of the metal sheet is formed. As reflectance reducing treatment, painting or thermal spraying in a blackish color, plating in a blackish color, treatment for increasing roughness of the surface of the metal sheet, blasting, etching, blackening, surface layer quality changing treatment of the metal sheet, or the like can be adopted. The metal sheet is turned into a heated metal sheet partially having a different temperature by being heated by radiant heat transfer, and thereafter, the heated metal sheet is subjected to thermal processing accompanied by cooling, for example, by hot stamping.

Abstract: A laminated metal consisting of any metallic or semi-metallic base material onto which alternate layers of monocrystalline nickel and monolayer graphene are deposited. The base material can be any metal, such as alloys of steel, copper, aluminum, nickel, palladium, cobalt, platinum, or silicon. The finished material will have one or more layers of nickel/graphene on its surface. In the case of wire, the layers are coaxial to the core material.

Abstract: Method and apparatus for producing metal-coated optical fiber involves providing a length of optical fiber having a glass fiber with or without a carbon layer surrounded by a liquid-soluble polymeric coating. The optical fiber is passed through a series of solution baths such that the fiber will contact the solution in each bath for a predetermined dwell time, the series of solution baths effecting removal of the polymer coating and subsequent electroless plating of metal on the glass fiber. The optical fiber is collected after metal plating so that a selected quantity of the metal-coated optical fiber is gathered, Preferably, the glass fiber passes through the series of solution baths without contacting anything except for the respective solution in each.

Abstract: A method of activating a metal structure on an intermediate semiconductor device structure toward metal plating. The method comprises providing an intermediate semiconductor device structure comprising at least one first metal structure and at least one second metal structure on a semiconductor substrate. The at least one first metal structure comprises at least one aluminum structure, at least one copper structure, or at least one structure comprising a mixture of aluminum and copper and the at least one second metal structure comprises at least one tungsten structure. One of the at least one first metal structure and the at least one second metal structure is activated toward metal plating without activating the other of the at least one first metal structure and the at least one second metal structure. An intermediate semiconductor device structure is also disclosed.

Abstract: A semi-finished product or tire comprises a metal reinforcing element embedded in a rubber composition comprising a compound of formula (I): where X and Y represent, independently of one another, an alkali metal or alkaline earth metal cation.

Abstract: Disclosed is an anode for a lithium secondary battery. The anode includes a current collector in the form of a wire and a porous anode active material layer coated to surround the surface of the current collector. The three-dimensional porous structure of the active material layer increases the surface area of the anode. Accordingly, the mobility of lithium ions through the anode is improved, achieving superior battery performance. In addition, the porous structure allows the anode to relieve internal stress and pressure, such as swelling, occurring during charge and discharge of a battery, ensuring high stability of the battery while preventing deformation of the battery. These advantages make the anode suitable for use in a cable-type secondary battery. Further disclosed is a lithium secondary battery including the anode.

Abstract: An examples includes a substrate, including a conductive trace and a layer disposed on top of the conductive trace, the layer defining at least one cavity extending to the conductive trace and an electrical probe disposed in the cavity, with solder coupling the electrical probe to the conductive trace. The electrical probe can include a high yield strength wire core including a refractory metal and a thin oxidation protection layer concentrically disposed around high yield strength wire core and providing an outside surface of the electrical probe, the thin oxidation protection layer including predominantly one or more materials selected from gold, platinum, ruthenium, rhodium, palladium, osmium, iridium, chromium, and combinations thereof, wherein the solder fills the cavity and is coupled to the electrical probe inside the cavity, disposed between the electrical probe and the layer.

Abstract: A sliding surface of a high-temperature portion is subjected to an electro-discharge surface treatment with one or both of a high-temperature hard material (4) and a material having a lubricating property at a high temperature (6). The high-temperature hard material (4) is any or a mixture of cBN, TiC, TiN, TiAlN, TiB2, WC, Cr3C2, SiC, ZrC, VC, B4C, Si3N4, ZrO2, and Al2O3. The material having the lubricating property at the high temperature (6) contains chromium and/or chromium oxide (Cr2O3) and/or hexaboron nitride (hBN). An electrode formed by compression molding of the high-temperature hard material, and the high-temperature lubricating material containing at least one of Cr and hBN and having the lubricating property at the high temperature is used as the electrode for the electro-discharge surface treatment.

Abstract: A method of depositing metal on an exposed surface of a p-type semiconductor region of a semiconductor device comprising a p-n junction is disclosed, the method comprising: immersing the exposed surface of the p-type semiconductor region on which the metal is to be deposited in a solution of metal ions; producing an electric field in the semiconductor device such that the p-n junction is forward biased; electrochemically depositing the metal on the exposed surface of the p-type semiconductor region of the semiconductor device by reduction of metal ions in the solution.

Abstract: An electropolishing or electroplating system and method for metal conveyor belts is described. As opposed to conventional polishing processes in which the product is guided around rollers which direct the product into and out of an electrolyte bath, embodiments of the present invention pass the product through a housing supplied with a continuous directional flow of electrolyte. Thus, the electroplating or electropolishing can be targeted to specific areas of the product, such as the edges and/or the center of a conveyor belt, and straight products can pass through the housing without deformation.

Abstract: A method of cleaning metal-containing deposits from a metal surface of a process chamber component includes immersing the metal surface in an electrochemical cleaning bath solution. A negative electrical bias is applied to the metal surface to electrochemically clean the metal-containing deposits from the metal surface. The cleaning method is capable of removing metal-containing deposits such as tantalum-containing deposits from the metal surface substantially without eroding the surface, and may be especially advantageous in the cleaning of components having textured surfaces.

Abstract: An electropolishing or electroplating system and method for metal conveyor belts is described. As opposed to conventional polishing processes in which the product is guided around rollers which direct the product into and out of an electrolyte bath, embodiments of the present invention pass the product through a housing supplied with a continuous directional flow of electrolyte. Thus, the electroplating or electropolishing can be targeted to specific areas of the product, such as the edges and/or the center of a conveyor belt, and straight products can pass through the housing without deformation.

Abstract: An apparatus (1) for continuous electrolytic surface finishing of bars (2) is described, comprising at least one cathode (3), one electrolytic cell (4) containing an electrolyte (5) and comprising an inlet (6) and an outlet (7) for the bars (2), and at least one longitudinal anode (8) along the route of the bars (2) inside the electrolytic cell (4), and means (9) for feeding the bars (2) along the axis of the bars (2) for introducing the bars (2) into the cell (4). Said at least one cathode (3) consists of a plurality of sliding contacts (11), each of which is provided with a selectively and independently actuatable energetic source (30) thereof.

Abstract: A web pressure welding method for pressure welding, with respect to a running web, a first belt-shaped annular body which contact surface rotates with running of at least one web, where an area pressure for pressure welding to the web side is applied on the contact surface of the first belt-shaped annular body.

Abstract: Arrangements for plating a single surface of a thin foil are described. In one aspect, a metal foil is wrapped tightly at least partially around a plating solution drum. The drum is partially immersed in a plating solution such that the waterline of the metal plating solution is below a break point where the metallic foil strip begins to unwind from the plating solution drum. With this arrangement, one side of the metallic foil strip is exposed to the metal plating solution, while the opposing back side of the metallic foil strip does not come in substantial contact with the metal plating solution. In this manner, the exposed side of the foil is plated while the back surface of the foil is not plated. The drum may be rotated to convey the foil through the plating solution.

Abstract: A method for plating a belt substrate including conveying a belt substrate through a plating tank, contacting an immersed cathode power-supply device and/or an auxiliary cathode power-supply device with the belt substrate conveyed into the interior of the plating tank such that the belt substrate becomes a cathode, and electrically plating a surface of the belt substrate in the interior of the plating tank while the immersed cathode power-supply device and/or the auxiliary cathode power-supply device maintains cathode power-supply to the belt substrate conveyed into the interior portion of the plating tank. The immersed cathode power-supply device and the auxiliary cathode power-supply device are positioned in the interior portion of the plating tank and are electrically connected by a short circuit wiring.

Abstract: An apparatus for continuously forming thin ceramic coatings on metal sheets, foils or wires. The apparatus has a reaction chamber, perforated nylon sheets, nylon bar guides, copper rods attached to a power supply, nylon collecting rods, and an inlet and an outlet. The reaction chamber is capable of containing an electrolytic solution. The copper rods are separately connected to the R, Y, or B phase of the power supply. Each phase is provided with two thyristors and the output of the thyristors is connected to the copper rods using current transformers. A process for continuously forming thin ceramic coatings on metal sheets, foils or wires is also provided.

Abstract: The invention has an object of obtaining a low-profile electrolytic copper foil made by electrolytic copper foil manufacturing using a cathode drum such that the surface roughness on the rough surface side (the opposite side to the lustrous surface) is low. In particular, the invention has an object of obtaining an electrolytic copper foil that can be finely patterned and have an excellent elongation and tensile strength at normal and high temperatures. This object is attained by using a copper electrolytic solution containing, as additives, an organosulfur compound, and an amine compound having a specific skeleton obtained by additively reacting an amine compound and a compound having one or more epoxy groups in a molecule thereof to an addition reaction.

Abstract: Arrangements for plating a single surface of a thin foil are described. In one aspect, a metal foil is wrapped tightly at least partially around a plating solution drum. The drum is partially immersed in a plating solution such that the waterline of the metal plating solution is below a break point where the metallic foil strip begins to unwind from the plating solution drum. With this arrangement, one side of the metallic foil strip is exposed to the metal plating solution, while the opposing back side of the metallic foil strip does not come in substantial contact with the metal plating solution. In this manner, the exposed side of the foil is plated while the back surface of the foil is not plated. The drum may be rotated to convey the foil through the plating solution.

Abstract: An anodizing apparatus includes: a power supplying drum for supporting a strip of an anodizable metal or a composite conductive foil having an anodizable metal on one surface thereof in close contact, at least a portion of the power supplying drum supporting the strip being conductive; opposing electrodes facing the power supplying drum; an electrolysis tank filled with an electrolytic solution in which a portion of the power supplying drum that supports the strip and the opposing electrodes are immersed; non conductive protective members that overlap the transverse ends of the strip on the power supplying drum and portions of the power supplying drum that the strip is not in contact with to protect the overlapped portions from the electrolytic solution; and a drive section that causes the strip and the protective members to move together within the electrolytic solution, synchronized with the rotating speed of the power supply drum.

Abstract: Two rotating members placed to face each other and nipping a web such that only an end of the web provided with conductivity is pressed are provided, at least one of the rotating members serves as a feeding electrode, and these rotating members are rotated about the same velocity to a transportation velocity of the web.

Abstract: An improved process for treating an electrically conductive surface of a workpiece by cleaning or coating the surface is provided, comprising the steps of deploying the electrically conducting surface of the workpiece to form a cathode in an electrolytic cell; establishing a DC voltage between the cathode and an anode; forming a working gap between the anode and the cathode, and establishing a seal around the working gap to form a sealed treatment zone; delivering into the working gap an electrically conductive medium selected from the group consisting of: (A) an aqueous electrolyte from which a foam is created; (B) a foam; and a mixture of components (A) and (B), so that electrically conductive medium consisting of a foam comprising a gas/vapor phase and a liquid phase fills the working gap, wherein said electrically conductive medium enters the electrolytic cell through tubes having discharge ends oriented at approximately ten degrees from parallel to the workpiece, and wherein turbulence is created within

Abstract: A continuous plating system with mask registration is disclosed herein that uses drums and rollers with protruding pins which engage with guide holes in a masking belt and a lead frame. Through engagement with the pins the masking belt is keyed to the lead frame as the lead frame passes through a plating solution tank.

Abstract: A plating processing method comprises performing a continuous electrolytic plating of the surface of a film having a surface resistivity in the range of 1 ?f/Sq to 1000 ?/Sq, wherein a distance between the lowest contacting part of a negative electrode with the film and a plating liquid is in the range of 0.5 cm to 15 cm.

Abstract: An apparatus and a method deposits a metal coating on an electrically conductive substrate in a continuous way. The apparatus includes at least one plating vessel for receiving an electrolyte solution and at least one plating unit. The plating unit includes a first zone comprising at least one first electrode (anode) connected to a positive pole of a power supply; a second zone comprising at least one second electrode (cathode) connected to a negative pole of the power supply; and an intermediate zone between the first zone and the second zone. The intermediate zone separates the first zone from the second zone by a predetermined distance larger than zero. The substrate functions as a cathode having a current density Jc when the substrate is facing the first electrode, and as an anode having a current density Ja when the substrate is facing the second electrode.

Abstract: A continuous electro-cleaning, pickling and electroplating apparatus and method using a plurality of elongate tubes that are electrically conductive.

Abstract: Two rotating members placed to face each other and nipping a web such that only an end of the web provided with conductivity is pressed are provided, at least one of the rotating members serves as a feeding electrode, and these rotating members are rotated about the same velocity to a transportation velocity of the web.

Abstract: A metal covered polyimide composite comprising a tie-coat layer and a metal seed layer formed on a surface of a polyimide film by electroless plating or a drying method is provided. A copper layer or a copper alloy layer is formed thereon by electroplating. The copper plated layer or copper alloy plated layer includes three layers to one layer of the copper layer or copper alloy layer. The metal covered polyimide composite effectively prevents peeling in a non-adhesive flexible laminate (especially a two-layer flexible laminate), and more particularly, effectively inhibits peeling from the interface of a copper layer and tin plating. A method of producing the composite and apparatus for producing the composite are also provided.

Abstract: A plating processing method, which comprises continuously electroplating the surface of a film having a surface resistivity of from 1?/square to 1000?/square, wherein the transportation speed of the foregoing film is from 1 m/minute to 30 m/minute.

Abstract: An apparatus (1) for continuous electrolytic surface finishing of bars (2) is described, comprising at least one cathode (3), one electrolytic cell (4) containing an electrolyte (5) and comprising an inlet (6) and an outlet (7) for the bars (2), and at least one longitudinal anode (8) along the route of the bars (2) inside the electrolytic cell (4), and means (9) for feeding the bars (2) along the axis of the bars (2) for introducing the bars (2) into the cell (4). Said at least one cathode (3) consists of a plurality of sliding contacts (11), each of which is provided with a selectively and independently actuatable energetic source (30) thereof. (FIG.

Abstract: A method for plating a belt substrate including conveying a belt substrate through a plating tank, contacting an immersed cathode power-supply device and/or an auxiliary cathode power-supply device with the belt substrate conveyed into the interior of the plating tank such that the belt substrate becomes a cathode, and electrically plating a surface of the belt substrate in the interior of the plating tank while the immersed cathode power-supply device and/or the auxiliary cathode power-supply device maintains cathode power-supply to the belt substrate conveyed into the interior portion of the plating tank. The immersed cathode power-supply device and the auxiliary cathode power-supply device are positioned in the interior portion of the plating tank and are electrically connected by a short circuit wiring.

Abstract: A method and a device for electroplating and electrolytically etching plate-shaped or strip-shaped material in continuous installations or bath installations having rotating transport and contact structures along the conveyor belt. The current is fed to the material in the center, i.e. in the useful zone, thereby obtaining a layer thickness distribution which is at least as good as when the current is supplied from both edges. The invention further allows material of any formats of width and different contours to be electrolytically treated in any order.

Abstract: A method for manufacturing a negative electrode for a non-aqueous electrolyte secondary battery is provided. A negative electrode precursor of the non-aqueous electrolyte secondary battery is allowed to absorb lithium ions, the negative electrode precursor includes a current collector and an active material layer formed on the current collector. The precursor is provided with an exposed portion of the current collector. In this method, a negative electrode active material layer is allowed to absorb lithium ions by electrolysis in the non-aqueous electrolyte solution. At this time, by measuring a potential of a portion immersed in the non-aqueous electrolyte solution, the exposed portion is detected and an electric current of the electrolysis is controlled. Thereby, the deposition of lithium metal on the exposed portion is suppressed.

Abstract: An improved apparatus and method of producing metal foam is provided which involves optimizing the natural convection of electrolyte through a foam being electroplated by inclining the foam during plating. A diagonal flow of electrolyte though the foam enhances electrolyte turnover within the foam while increasing electroplating efficiency. Further increases in plating efficiency are provided by shifting current density from higher plating zones to lower plating zones.

Abstract: A plating method comprising: continuously electroplating a surface of a film having a surface resistivity of from 1 to 1,000?/? in a plurality of times, wherein the plurality of times are equally divided into a former half stage and a latter half stage, and wherein an average plating time of the former half stage of the electroplating step is shorter than an average plating time of the latter half stage of the electroplating step or an average plating voltage at the latter half stage of the electroplating step is 60% or less of an average plating voltage at the former half stage of the electroplating step.

Abstract: A multi step process, which forms a Group VIA material layer, such as a selenium (Se) layer, having a thickness greater than 500 nanometers. The process includes electroplating a Se material layer, which has an amorphous micro-structure and which exhibits high electrical resistivity, on a workpiece and subsequently annealing the Se layer. Annealing process transforms the amorphous structure of the Se layer into a crystalline structure which is conductive. After the annealing, another Se layer can be electroplated onto the annealed Se layer. The electroplating and annealing steps can be repeated until the desired Se layer thickness is reached.

Abstract: Electric welding method is provided of aluminium or aluminium alloy in a magnetic field, the aluminium or aluminium alloy adjacent to a weld joint under formation has an oxide layer, and the free end of a welding wire is supplied with a surrounding shielding gas. Furthermore, a welding wire is used that comprises aluminium or aluminium alloy provided with an oxide-inhibiting coating, which forms the outer covering or sheath of the welding wire and/or that as said shielding gas there is used a shielding gas with oxygen incorporated therein, or that the shielding gas is supplied with oxygen during the welding process. When the process is carried out in a magnetic field, the minimum frequency of the welding current is selected as a function of the strength of the magnetic field. A method is also provided for producing the welding wire and necessary material conditions for a usable welding gun.

Abstract: A plating apparatus includes a plating tank. The plating tank contains a plating solution. A long-sized substrate is transported by transport rollers to pass through inside of the plating tank. Three or more bar-shaped anodes are provided in the plating tank to line up along the long-sized substrate. A surface area of each of the anodes arranged at both ends is smaller than a surface area of another anode.

Abstract: The invention relates to a device and method for electrolytically treating flat work pieces (1), more especially for electrolytically treating electrically conductive structures S that are electrically insulated against each other on the surfaces of the work pieces. The method comprises conveying and processing the work pieces (1) on the conveying paths T?, T? in the device, said device comprising at least one assembly A located between tow conveying paths, said assembly including a first and a second rotatable contacting electrode (2, 8) with the contacting electrodes being associated each with one of the conveying paths, and first contacting electrodes (2) abutting against the work pieces being conveyed in a first conveying path T?, and being spaced from the second conveying path T? and second contacting electrodes (8) abutting against the work pieces being conveyed in the second conveying path T? and being spaced to the first conveying path T?.

Abstract: A method for plating a FPCB base board, comprising the steps of: providing a FPCB base board comprising a sprocket region; and placing an insulation shielding plate spatially opposite to the sprocket region of the FPCB base board to limit a thickness of a plating layer formed on the sprocket region of the FPCB base board.

Abstract: A continuous plating system with mask registration is disclosed herein that uses drums and rollers with protruding pins which engage with guide holes in a masking belt and a lead frame. Through engagement with the pins the masking belt is keyed to the lead frame as the lead frame passes through a plating solution tank.

Abstract: A conductive surface 5 of a film 4 is plated with copper by allowing the film 4 to pass through a plating solution 7 in a plating bath 6 while conveying the film in a direction indicated by the arrow. Air knife devices 20A and 20B are disposed between the plating solution 7 and a next cathode roller 1B so as to face a conductive surface 5 of the film 4. The air knife devices 20A and 20B remove liquid and moisture on the conductive surface 5 by jetting heated air to the conductive surface 5 drawn out of the plating solution 7. Accordingly, even when the conductive surface 5 comes in contact with the next cathode roller 1B, developed silver is not dissolved, thereby preventing the silver contamination of the cathode rollers 1B and 1C.

Abstract: Disclosed is a system and a method for manufacturing flexible copper clad laminate film capable of efficiently electroplating both surfaces of a polyimide-based film to form copper plating layers thereon while making it easy to repair and maintain the apparatus or clean its plating or cleaning bath. The system includes a pickling device adapted to spray a pickling liquid to both surfaces of a to-be-plated film to remove oxide coatings from the copper coatings; a number of water-cleaning devices for removing the pickling liquid and copper electrolyte remaining on the film; at least one plating device positioned between the water-cleaning devices to form copper plating layers on both surfaces of the film; an antirust device for preventing the copper plating layers, which have been formed by the plating device, from rusting; and a drying device for drying the antirust liquid on the film, which has been subjected to antirust treatment.

Abstract: A device for treating a band-shaped substrate with a liquid, including: a conveying system including a winding system guiding the band-shaped substrate in a spiral path around the winding system with at least one winding; a first pulley rotatable about a first axis of rotation guiding the at least one winding of the band-shaped substrate through a first angle of deflection around part of the circumference of the first pulley, and a second pulley guiding the at least one winding of the band-shaped substrate through a second angle of deflection around part of the circumference of the second pulley, which is rotatable about a second axis of rotation, for each winding; and a bath of the liquid. The band-shaped substrate extends through the liquid over at least part of the length of the at least one winding. The second axis of rotation of each second pulley makes an angle alpha with the first axis of rotation.

Abstract: To provide an insoluble anode for metal wire electroplating capable of simultaneously electroplating a plurality of metal wires and uniformalizing the electroplating amounts of the metal wires stably for a long time. For realizing these, a plurality of insoluble electrode plates 20 are disposed in a parallel alignment to be placed sandwiching a plurality of wire travel paths from both sides. A plurality of the insoluble electrode plates 20 are tightened and fixed by through-bolts 40 at a plurality of places along the travel path direction. An conductive spacer 30 is interposed in each gap between the insoluble electrode plates 20 at a tightening part by the through-bolt 40 and also a conductive member 50 is provided so as to contact all the electrode plates 20 and the conductive spacers 30.