Coating Moving Substrate Patents (Class 205/137)
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Patent number: 11932957Abstract: Provided is a method for forming a metal film using a solid-state electrolyte membrane, and the method allows a metal film having a smooth surface to be formed and an additive to sufficiently serve its function. A method for forming a metal film includes the successive steps of (a) supplying a solution to a solution-housing space, the solution containing ions of the metal and an additive; (b) increasing a pressure of the solution in the solution-housing space in a state where the solution-housing space is uncommunicated with a solution tank and the substrate held by a holder is in contact with the solid-state electrolyte membrane; (c) decreasing the pressure of the solution in the solution-housing space; and (d) forming the film of the metal on the substrate by applying a voltage between an anode and the substrate while the solution is circulated between the solution-housing space and the solution tank.Type: GrantFiled: June 21, 2022Date of Patent: March 19, 2024Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHAInventor: Haruki Kondoh
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Patent number: 11851781Abstract: Described herein are apparatus and methods for the continuous application of nanolaminated materials by electrodeposition.Type: GrantFiled: November 22, 2021Date of Patent: December 26, 2023Assignee: MODUMETAL, INC.Inventor: Christina A. Lomasney
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Patent number: 11668018Abstract: There is provided a contact structure, comprising a substrate contact including a first contact portion that is located on a leading end side of the substrate contact and that comes into contact with a substrate and a second contact portion that is located nearer to a base end side of the substrate contact than the first contact portion; a seal member configured to cover a periphery of the substrate contact and to have a sealing surface that comes into contact with the substrate to seal the substrate contact; a first pressing portion configured to elastically apply a contact pressure on the substrate to the substrate contact; and a second pressing portion configured to come into contact with the seal member and to apply a contact pressure on the substrate to the seal member independently of the first pressing portion, wherein the first contact portion adheres to the seal member, and the second contact portion is fit in the seal member to be displaceable relative to the seal member.Type: GrantFiled: June 23, 2021Date of Patent: June 6, 2023Assignee: EBARA CORPORATIONInventor: Matsutaro Miyamoto
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Patent number: 11545378Abstract: A leak detection apparatus and method and a wafer electroplating method are provided. An air tightness state of a reaction chamber in a wafer electroplating device is detected in advance before a wafer electroplating process is performed, namely whether leak occurs at the reaction chamber is judged by inputting a detection gas to the reaction chamber and detecting a gas pressure value of the detection gas, and whether to perform the wafer electroplating process is determined according to a judgment result.Type: GrantFiled: August 12, 2021Date of Patent: January 3, 2023Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.Inventor: Dongjin Kim
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Patent number: 11322400Abstract: A method of manufacturing a semiconductor wafer having a roughened metallization layer surface is described. The method includes immersing the semiconductor wafer in an electrolytic bath. Gas bubbles are generated in the electrolytic bath. A surface of a metallization layer on the semiconductor wafer is electrochemically roughened in the presence of the gas bubbles by applying a reversing voltage between the metallization layer and an electrode of the electrolytic bath.Type: GrantFiled: June 19, 2020Date of Patent: May 3, 2022Assignee: Infineon Technologies AGInventors: Carsten von Koblinski, Tobias Polster
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Patent number: 11187602Abstract: A method includes disposing a wafer in a cup of a clamshell of an electroplating apparatus. The wafer is clamped using the cup and a cone of the clamshell. A pressure force applied by the cone against the wafer is detected. Stopping clamping the wafer when the pressure force is higher than a predetermined value.Type: GrantFiled: April 30, 2019Date of Patent: November 30, 2021Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yung-Chang Huang, Tsun-En Kuo
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Patent number: 10954603Abstract: A substrate holder includes: a first holding member having a surface configured to come into contact with the substrate; and a second holding member, between which and the first holding member the substrate is put and held. The second holding member includes a removal portion that is disposed along an outer circumference of the substrate and configured to come into contact with the substrate and remove an insulating material on the substrate when the substrate is put between the first holding member and the second holding member, and an electric contact portion that is disposed along the outer circumference of the substrate and configured to come into contact with a region on the substrate in which the removal portion has removed the insulating material when the substrate is put and held between the first holding member and the second holding member.Type: GrantFiled: February 8, 2018Date of Patent: March 23, 2021Assignee: EBARA CORPORATIONInventor: Jumpei Fujikata
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Patent number: 10749388Abstract: A stator includes a first core including a plurality of non-oriented electromagnetic steel sheets that is stacked and having an insertion hole penetrating the plurality of non-oriented electromagnetic steel sheets in an axial direction of the stator and a second core arranged in the insertion hole and including a plurality of oriented electromagnetic steel sheets that is stacked. The first core has a thin-wall part adjoining the second core, and a conditional expression of 0.5tm?ta?2tm is satisfied, where ta denotes a thickness of the thin-wall part when the first core is viewed in the axial direction and tm denotes a sheet thickness of one non-oriented electromagnetic steel sheet in the plurality of non-oriented electromagnetic steel sheets.Type: GrantFiled: May 30, 2016Date of Patent: August 18, 2020Assignee: Mitsubishi Electric CorporationInventors: Kazuhiko Baba, Masahiro Nigo
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Patent number: 10692754Abstract: A method includes disposing a wafer in a cup of a clamshell of an electroplating apparatus. The wafer is clamped using the cup and a cone of the clamshell. First pressure forces of contacts of the cup applied by the wafer is detected. The first pressure forces are respective compared with corresponding predetermined pressure ranges.Type: GrantFiled: October 3, 2018Date of Patent: June 23, 2020Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yung-Chang Huang, Tsun-En Kuo
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Patent number: 10316425Abstract: A substrate holder according to the present invention comprises a first power supply member and a second power supply member which allow power to be supplied to substrates having different properties. The first power supply member comprises a first power supply member end part which extends toward the inside of a substrate holding surface and is disposed at a first position of the substrate holding surface. The second power supply member comprises a second power supply member end part which extends toward the inside of the substrate holding surface and is disposed at a second position of the substrate holding surface. The first position is located on the center side of the substrate holding surface relative to the second position.Type: GrantFiled: February 27, 2015Date of Patent: June 11, 2019Assignee: EBARA CORPORATIONInventors: Toshikazu Yajima, Mitsutoshi Yahagi, Masaaki Kimura
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Patent number: 10214830Abstract: A substrate holder for holding a substrate, such as a wafer, is disclosed. The substrate holder includes a seal ring which can be brought into contact with a peripheral portion of the substrate, a support ring supporting the seal ring, and a fixing ring pressing the seal ring against the support ring. The fixing ring includes an annular portion having an inner circumferential surface and an outer circumferential surface, each of which is constituted by a tapered surface. The fixing ring further includes a seal-ring pressing portion connected to the annular portion, and a regulation ring projecting radially inwardly from the seal-ring pressing portion. The regulation ring has an inside diameter which is smaller than an inside diameter of the seal ring.Type: GrantFiled: October 14, 2015Date of Patent: February 26, 2019Assignee: EBARA CORPORATIONInventors: Mitsutoshi Yahagi, Masaaki Kimura, Yusuke Tamari
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Patent number: 9984910Abstract: A plating apparatus allows a substrate holder to be serviced easily while ensuring easy access to the substrate holder and while a substrate is being processed in the plating apparatus. The plating apparatus includes a plating section for plating a substrate, a substrate holder for holding the substrate, a substrate holder transporter for holding and transporting the substrate holder, a stocker for storing the substrate holder, and a stocker setting section for storing the stocker therein. The stocker includes a moving mechanism for moving the stocker into and out of the stocker setting section.Type: GrantFiled: June 22, 2017Date of Patent: May 29, 2018Assignee: EBARA CORPORATIONInventor: Yoshio Minami
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Patent number: 9876397Abstract: An electrical machine, in particular an electric motor of a motor vehicle, having a stator and having a rotor which has a rotation axis. An electrical machine can be a brushless electric motor (DC motor) or a synchronous machine, but also a generator. The stator or the rotor has an electromagnet structure, and the other has a permanent-magnet structure which comprises a first quantity of permanent magnets and a second quantity of permanent magnets. At at least the operating temperature (T), the magnetic coercive field strength (Hcji) of the first quantity is greater than the magnetic coercive field strength (Hcj2) of the second quantity. Further, two methods for producing hybrid magnets are provided.Type: GrantFiled: September 12, 2014Date of Patent: January 23, 2018Assignee: Brose Fahrzeugteile GmbH & Co. KG, WuerzburgInventors: Sunny Zhang, Matthias Koch, Axel Steinshorn
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Patent number: 9587322Abstract: Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.Type: GrantFiled: April 14, 2015Date of Patent: March 7, 2017Assignee: Novellus Systems, Inc.Inventors: Manish Ranjan, Shantinath Ghongadi, Frederick Dean Wilmot, Douglas Hill, Bryan L. Buckalew
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Patent number: 9293364Abstract: There is provided an electroless plating apparatus which, despite using a high-productivity batch processing method, can reduce the amount of a liquid chemical brought out of a processing tank, thereby reducing the cleaning time in a cleaning step, and can perform flushing easily and quickly. The electroless plating apparatus includes a pre-plating treatment module including a pre-plating treatment tank, a plating module, and an inter-module substrate transport device. The pre-plating treatment tank is provided with a pre-plating treatment solution circulation line having a temperature control function for a pre-plating treatment solution. The plating tank is provided with a plating solution circulation line having a filter and a temperature control function for a plating solution. The plating solution circulation line is connected to a flushing line for flushing the interior of the plating solution circulation line and the interior of the plating tank.Type: GrantFiled: November 15, 2012Date of Patent: March 22, 2016Assignees: Ebara Corporation, Screen Holdings Co., Ltd.Inventors: Hiroyuki Kanda, Junichiro Tsujino, Junko Mine, Makoto Kubota, Tsutomu Nakada, Kenichiro Arai
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Patent number: 9028666Abstract: Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.Type: GrantFiled: April 30, 2012Date of Patent: May 12, 2015Assignee: Novellus Systems, Inc.Inventors: Manish Ranjan, Shantinath Ghongadi, Frederick Dean Wilmot, Douglas Hill, Bryan L. Buckalew
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Patent number: 8926803Abstract: It is an object of this disclosure to provide high productivity, low cost-of-ownership manufacturing equipment for the high volume production of photovoltaic (PV) solar cell device architecture. It is a further object of this disclosure to reduce material processing steps and material cost compared to existing technologies by using gas-phase source silicon. The present disclosure teaches the fabrication of a sacrificial substrate base layer that is compatible with a gas-phase substrate growth process. Porous silicon is used as the sacrificial layer in the present disclosure. Further, the present disclosure provides equipment to produce a sacrificial porous silicon PV cell-substrate base layer.Type: GrantFiled: January 15, 2010Date of Patent: January 6, 2015Assignee: Solexel, Inc.Inventors: Doug Crafts, Mehrdad Moslehi, Subramanian Tamilmani, Joe Kramer, George D. Kamian, Somnath Nag
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Publication number: 20140262802Abstract: A process for treating a surface of an electrically conductive workpiece is provided, comprising placing a movable workpiece within a reaction chamber, wherein the reaction chamber includes an anode, and wherein the workpiece is a cathode; creating a gap between the anode and the cathode, wherein the anode includes a plurality of orifices; applying an aqueous electrolyte into the reaction chamber through the orifices in the anode and onto the workpiece, and applying the aqueous electrolyte from below the workpiece, to establish an electrically conductive medium around the workpiece, applying a DC voltage to the electrically conductive medium in excess of 30 VDC, such that a foam is formed within the reaction chamber, wherein the foam comprises a gas/vapor phase and a liquid phase which fills the entire reaction chamber; adjusting the voltage to establish an electro-plasma discharge between the anode and workpiece, sufficient to cause positive ions in the electrically conductive medium to become concentrated nType: ApplicationFiled: March 17, 2014Publication date: September 18, 2014Applicant: CAP TECHNOLOGIES, LLCInventors: Edward O. Daigle, Pratheesh George
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Patent number: 8821699Abstract: An apparatus (1) for continuous electrolytic surface finishing of bars (2) is described, comprising at least one cathode (3), one electrolytic cell (4) containing an electrolyte (5) and comprising an inlet (6) and an outlet (7) for the bars (2), and at least one longitudinal anode (8) along the route of the bars (2) inside the electrolytic cell (4), and means (9) for feeding the bars (2) along the axis of the bars (2) for introducing the bars (2) into the cell (4). Said at least one cathode (3) consists of a plurality of sliding contacts (11), each of which is provided with a selectively and independently actuatable energetic source (30) thereof.Type: GrantFiled: April 30, 2010Date of Patent: September 2, 2014Assignee: Plating Innovation s.r.l.Inventors: Nicola Nisco, Ilaria Muratori
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Publication number: 20140216940Abstract: An apparatus for substrate metallization from electrolyte is provided. The apparatus comprises: an immersion cell containing metal salt electrolyte; at least one electrode connecting to at least one power supply; an electrically conductive substrate holder holding at least one substrate to expose a conductive side of the substrate to face the at least one electrode; an oscillating actuator for oscillating the substrate holder with an amplitude and a frequency; at least one ultrasonic device with an operating frequency and an intensity, disposed in the metallization apparatus; at least one ultrasonic power generator connecting to the ultrasonic device; at least one inlet for metal slat electrolyte feeding; and at least one outlet for metal salt electrolyte draining.Type: ApplicationFiled: June 24, 2011Publication date: August 7, 2014Applicant: ACM Research (Shanghai) Inc.Inventors: Hui Wang, Yue Ma, Chuan He, Xi Wang
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Patent number: 8747640Abstract: Arrangements for plating a single surface of a thin foil are described. In one aspect, a metal foil is wrapped tightly at least partially around a plating solution drum. The drum is partially immersed in a plating solution such that the waterline of the metal plating solution is below a break point where the metallic foil strip begins to unwind from the plating solution drum. With this arrangement, one side of the metallic foil strip is exposed to the metal plating solution, while the opposing back side of the metallic foil strip does not come in substantial contact with the metal plating solution. In this manner, the exposed side of the foil is plated while the back surface of the foil is not plated. The drum may be rotated to convey the foil through the plating solution.Type: GrantFiled: September 26, 2012Date of Patent: June 10, 2014Assignee: Texas Instruments IncorporatedInventors: Jaime Bayan, Nghia Tu, Will Wong
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Patent number: 8721863Abstract: A method for plating a belt substrate including conveying a belt substrate through a plating tank, contacting an immersed cathode power-supply device and/or an auxiliary cathode power-supply device with the belt substrate conveyed into the interior of the plating tank such that the belt substrate becomes a cathode, and electrically plating a surface of the belt substrate in the interior of the plating tank while the immersed cathode power-supply device and/or the auxiliary cathode power-supply device maintains cathode power-supply to the belt substrate conveyed into the interior portion of the plating tank. The immersed cathode power-supply device and the auxiliary cathode power-supply device are positioned in the interior portion of the plating tank and are electrically connected by a short circuit wiring.Type: GrantFiled: November 30, 2011Date of Patent: May 13, 2014Assignee: Ibiden Co., Ltd.Inventors: Yasuaki Tachi, Shigeki Sawa, Toshiyuki Kasuga
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Patent number: 8557099Abstract: An electrically conductive protective coating or film is provided over the surface of a reflective coating of a solar mirror by flowing or directing a cation containing liquid and an anion containing liquid onto the conductive surface. The cation and the anion containing liquids are spaced from, and preferably out of contact with one another on the surface of the reflective coating as an electric current is moved through the anion containing liquid, the conductive surface between the liquids and the cation containing liquid to coat the conductive surface with the electrically conductive coating.Type: GrantFiled: October 25, 2010Date of Patent: October 15, 2013Assignee: PPG Industries Ohio, Inc.Inventors: Benjamin Kabagambe, Donald W. Boyd, Michael J. Buchanan, Patrick Kelly, Luke A. Kutilek, James W. McCamy, Douglas A. McPheron, Gary R. Orosz, Raymond D. Limbacher
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Patent number: 8545687Abstract: Apparatus for the electrolytic treatment of the product L using a treatment agent is used to make the treatment of a plate-shaped product more uniform. This apparatus includes devices 40, 42 for retaining the product L in the apparatus, one or more flow devices 10, which each include at least one nozzle 15 and are disposed situated opposite the product L, one or more counter electrodes 30, which are inert relative to the treatment agent and are disposed parallel to at least one treatment surface, eccentric motor means for generating a relative movement 44 between the product L, on the side, and the flow devices 10 and/or the counter electrodes 30, on the other side, in at least one direction parallel to a treatment surface. The product L can be immersed in the treatment agent during treatment.Type: GrantFiled: June 3, 2008Date of Patent: October 1, 2013Assignee: Atotech Deutschland GmbHInventors: Reinhard Schneider, Henry Kunze, Ferdinand Wiener
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Publication number: 20130240363Abstract: The present invention relates to CIGS solar cell fabrication. The invention discloses a method for fabricating CIGS thin film solar cells using a roll-to-roll apparatus. The invention discloses method to fabricate semiconductor thin film Cu(InGa)(SeS)2 by sequentially electroplating a stack of multiple precursor layers comprising of copper, indium, gallium, and selenium elements or their alloys followed by selenization at a temperature between 450° C. and 700° C.Type: ApplicationFiled: March 25, 2013Publication date: September 19, 2013Inventor: Delin Li
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Patent number: 8529746Abstract: This method enables the use of nanowire or nano-textured forms of Polyaniline and other conductive polymers in energy storage components. The delicate nature of these very high surface area materials are preserved during the continuous electrochemical synthesis, drying, solvent application and physical assembly. The invention also relates to a negative electrode that is comprised of etched, lithiated aluminum that is safer and lighter weight than conventional carbon based lithium-ion negative electrodes. The invention provides for improved methods for making negative and positive electrodes and for energy storage devices containing them. The invention provides sufficient stability in organic solvent and electrolyte solutions, where the prior art processes commonly fail. The invention further provides stability during repetitive charge and discharge. The invention also provides for novel microstructure protecting support membranes to be used in an energy storage device.Type: GrantFiled: February 1, 2011Date of Patent: September 10, 2013Assignee: Nanoscale Components, Inc.Inventors: Robert W. Grant, Matthew Sweetland
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Patent number: 8486237Abstract: An apparatus for continuously forming thin ceramic coatings on metal sheets, foils or wires. The apparatus has a reaction chamber, perforated nylon sheets, nylon bar guides, copper rods attached to a power supply, nylon collecting rods, and an inlet and an outlet. The reaction chamber is capable of containing an electrolytic solution. The copper rods are separately connected to the R, Y, or B phase of the power supply. Each phase is provided with two thyristors and the output of the thyristors is connected to the copper rods using current transformers. A process for continuously forming thin ceramic coatings on metal sheets, foils or wires is also provided.Type: GrantFiled: October 14, 2009Date of Patent: July 16, 2013Assignee: International Advanced Research Centre for Powder Metallurgy and New Materials (ARCI)Inventors: Lingamaneni Rama Krishna, Nitin Pandurang Wasekar, Govindan Sundararajan
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Patent number: 8419917Abstract: An electroplating head is disposed above and proximate to an upper surface of a wafer. Cations are transferred from an anode to an electroplating solution within the electroplating head. The electroplating solution flows downward through a porous electrically resistive material at an exit of the electroplating head to be disposed on the upper surface of the wafer. An electric current is established between the anode and the upper surface of the wafer through the electroplating solution. The electric current is uniformly distributed by the porous electrically resistive material present between the anode and the upper surface of the wafer. The electric current causes the cations to be attracted to the upper surface of the wafer.Type: GrantFiled: June 10, 2009Date of Patent: April 16, 2013Assignee: Lam Research CorporationInventors: Yezdi Dordi, Bob Maraschin, John Boyd, Fred C. Redeker
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Patent number: 8394245Abstract: An object of the present invention is to provide a production apparatus for electro-deposited metal foil or the like that can reduce thickness fluctuation of electro-deposited metal foil. To achieve the object, a production apparatus for electro-deposited metal foil or the like in which a cathode and an insoluble anode apart from each other, supplying an electrolytic solution through a gap between the cathode and the anode, making the cathode move along to the insoluble anode, electrodepositing a metal component on an electro-deposition surface of the moving cathode is applied.Type: GrantFiled: March 31, 2010Date of Patent: March 12, 2013Assignee: Permelec Electrode Ltd.Inventors: Yusuke Ozaki, Akira Kunimatsu
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Patent number: 8377267Abstract: Arrangements for plating a single surface of a thin foil are described. In one aspect, a metal foil is wrapped tightly at least partially around a plating solution drum. The drum is partially immersed in a plating solution such that the waterline of the metal plating solution is below a break point where the metallic foil strip begins to unwind from the plating solution drum. With this arrangement, one side of the metallic foil strip is exposed to the metal plating solution, while the opposing back side of the metallic foil strip does not come in substantial contact with the metal plating solution. In this manner, the exposed side of the foil is plated while the back surface of the foil is not plated. The drum may be rotated to convey the foil through the plating solution.Type: GrantFiled: September 30, 2009Date of Patent: February 19, 2013Assignee: National Semiconductor CorporationInventors: Jaime A. Bayan, Nghia Thuc Tu, Will K. Wong
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Publication number: 20120298518Abstract: Provided is an electroplating apparatus including: a copper electrode plate that is disposed with a gap from an upper surface of an insulating substrate on which seed electrodes are formed; a driving unit that makes the copper electrode plate move along a rectilinear line; a power supply that applies electric current between the copper electrode plate and each of the seed electrodes; and spacers that are provided on the lower surface of the copper electrode plate to thereby make an electrolyte stay by surface tension between the copper electrode plate and the insulating substrate, and that maintains the gap between the copper electrode plate and the insulating substrate so that the electrolyte may move together with the copper electrode plate. Accordingly, a uniform copper film can be formed on the surface of a large substrate.Type: ApplicationFiled: July 14, 2011Publication date: November 29, 2012Inventor: Seung Ki JOO
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Patent number: 8318552Abstract: A process for forming gate structures is described. A web comprises a substrate, a plurality of conductive elements disposed on the substrate, and a conductive anodization bus. The web is moved through an anodization station to form a plurality of gate structures comprising a plurality of gate dielectrics adjacent to a plurality of gate electrodes. A process for forming electronic devices further providing a semiconductor, a source electrode, and a drain electrode is described.Type: GrantFiled: May 20, 2008Date of Patent: November 27, 2012Assignee: 3M Innovative Properties CompanyInventors: Jeffrey H. Tokie, Michael A. Haase, Robert J. Schubert, Michael W. Bench, Donald J. McClure, Grace L. Ho
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Patent number: 8298384Abstract: A method and apparatus for plating parts like lug nuts or other metal parts that have both an easily plated outside surface as well as a recessed cavity. The invention works in combination with a standard multi-station plating process. Also, a method and apparatus for preventing areas of electrode contact on a part from being non-plated. The present invention drains and plates a part containing a cavity by moving the part from a position where the cavity is facing around 45 degrees down to a position where the cavity is facing around 45 degrees up and then back down at various times during the process. The moving is generally initiated when the rack moving along a track above the fluid tanks encounters a roller. The roller causes a depression bar to activate a mechanical mechanism that shifts the position of the part. Other embodiments of the present invention can also rotate the part on an electrode finger as a roller on the track is encountered by the rack to avoid non-plated regions on the part.Type: GrantFiled: January 29, 2009Date of Patent: October 30, 2012Assignee: Century Plating Co.Inventors: George Koltse, Victor LaPorta
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Patent number: 8282805Abstract: An improved process for treating an electrically conductive surface of a workpiece by cleaning or coating the surface is provided, comprising the steps of deploying the electrically conducting surface of the workpiece to form a cathode in an electrolytic cell; establishing a DC voltage between the cathode and an anode; forming a working gap between the anode and the cathode, and establishing a seal around the working gap to form a sealed treatment zone; delivering into the working gap an electrically conductive medium selected from the group consisting of: (A) an aqueous electrolyte from which a foam is created; (B) a foam; and a mixture of components (A) and (B), so that electrically conductive medium consisting of a foam comprising a gas/vapor phase and a liquid phase fills the working gap, wherein said electrically conductive medium enters the electrolytic cell through tubes having discharge ends oriented at approximately ten degrees from parallel to the workpiece, and wherein turbulence is created withinType: GrantFiled: November 2, 2005Date of Patent: October 9, 2012Inventor: Edward O. Daigle
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Patent number: 8253035Abstract: A plating processing method comprises performing a continuous electrolytic plating of the surface of a film having a surface resistivity in the range of 1 ?f/Sq to 1000 ?/Sq, wherein a distance between the lowest contacting part of a negative electrode with the film and a plating liquid is in the range of 0.5 cm to 15 cm.Type: GrantFiled: March 14, 2006Date of Patent: August 28, 2012Assignee: FUJIFILM CorporationInventor: Jun Matsumoto
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Patent number: 8246809Abstract: An apparatus and a method deposits a metal coating on an electrically conductive substrate in a continuous way. The apparatus includes at least one plating vessel for receiving an electrolyte solution and at least one plating unit. The plating unit includes a first zone comprising at least one first electrode (anode) connected to a positive pole of a power supply; a second zone comprising at least one second electrode (cathode) connected to a negative pole of the power supply; and an intermediate zone between the first zone and the second zone. The intermediate zone separates the first zone from the second zone by a predetermined distance larger than zero. The substrate functions as a cathode having a current density Jc when the substrate is facing the first electrode, and as an anode having a current density Ja when the substrate is facing the second electrode.Type: GrantFiled: June 19, 2007Date of Patent: August 21, 2012Assignee: NV Bekaert SAInventors: Roger Francois, Luc Hofman
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Publication number: 20120205249Abstract: To provide a barrel electroplating method which is less prone to bare spots and adhesion failure such as blisters and peeling, and which makes it possible to obtain uniform plated coatings free from burnt deposits and poor brightness, irrespective of the amount of workpieces. The present invention provides a method for performing barrel electroplating by use of an aluminum or aluminum alloy plating bath, the method comprising rotating, swinging, or vibrating an anode (6) placed inside a barrel (4) receiving workpieces, and simultaneously rotating, swinging, or vibrating the barrel, with a voltage being applied between the anode and a cathode provided on an inner wall surface of the barrel.Type: ApplicationFiled: October 19, 2010Publication date: August 16, 2012Applicants: HONDA MOTOR CO., LTD., DIPSOL CHEMICALS CO., LTD.Inventors: Manabu Inoue, Tadahiro Ohnuma, Toshiki Inomata, Tsutomu Miyadera
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Patent number: 8231771Abstract: An apparatus and system for electromotively coating a part can include a conveyor that has a plurality of hangars that are configured to be positively connected to respective parts that are to be coated. An attachment mechanism can be provided on the hangar and the part, the attachment mechanism being configured to exert force in more than a single direction. The part can be a conductive plastic part and can include an attachment structure that is formed thereon, for example, screw threads integrally formed in the part. The hangar can include a similar fastener that is configured to connect to the attachment structure of the part. For example, the fastener of the hangar can be a screw thread that mates with threads integrally or otherwise formed on the part.Type: GrantFiled: August 31, 2007Date of Patent: July 31, 2012Assignee: Honda Motor Co., Ltd.Inventors: Carmen Crowley, Thomas H. Croyle, Todd Fitz, James Paul Ryan, Masahiro Ishikawa
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Patent number: 8221608Abstract: Methods for plating substrates are herein defined. One method includes providing a plating assembly having a plating source in a plating fluid and a plating facilitator in the plating fluid, and defining a plating meniscus between the plating source and the plating facilitator. The plating meniscus being contained in a path of the plating assembly. The method further includes traversing a substrate through the path of the plating assembly. The substrate being charged so that plating ions are attracted to a surface of the substrate when the plating meniscus is present on the surface of the substrate, wherein the substrate traversing through the path of the plating assembly enables plating across the surface of the substrate. And, inducing a uniform charge in the path where the plating meniscus is formed, such that charge from the plating source is substantially uniformly directed toward the plating facilitator as the substrate that is charged moves through the path of the plating assembly.Type: GrantFiled: October 6, 2010Date of Patent: July 17, 2012Assignee: Lam Research CorporationInventors: Carl A. Woods, Yezdi N. Dordi, Jacob Wylie, Robert Maraschin
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Publication number: 20120061244Abstract: An electric contact in the outer edge thereof, is used for electroplating substrates, e.g. as a wafer in a cup plater. In order to obtain an even electroplating result, at least two electrolytic partial cells are formed which are supplied with current by respective electroplating current sources (9?) and (9?) that can be individually adjusted. The partial cathode (12?) and the associated partial anode (7?) are supplied in the region of the diametrically remote partial cathode (12?). Conversely, the partial cathode (12?) is supplied via the base layer of the partial cathode (12?). The required levelling of the layer thickness distribution is inter alia carried out by alternate different adjustments of the quantity of the electroplating current of the two partial cells and by the electrodes (7,12) that rotate relative to each other.Type: ApplicationFiled: May 18, 2010Publication date: March 15, 2012Applicant: SOMONT GMBHInventor: Egon Engmark Hübel
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Patent number: 8110076Abstract: An improved apparatus and method of producing metal foam is provided which involves optimizing the natural convection of electrolyte through a foam being electroplated by inclining the foam during plating. A diagonal flow of electrolyte though the foam enhances electrolyte turnover within the foam while increasing electroplating efficiency. Further increases in plating efficiency are provided by shifting current density from higher plating zones to lower plating zones.Type: GrantFiled: June 5, 2006Date of Patent: February 7, 2012Assignee: Inco LimitedInventor: Victor Ettel
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Patent number: 8097143Abstract: A plating method comprising: continuously electroplating a surface of a film having a surface resistivity of from 1 to 1,000?/? in a plurality of times, wherein the plurality of times are equally divided into a former half stage and a latter half stage, and wherein an average plating time of the former half stage of the electroplating step is shorter than an average plating time of the latter half stage of the electroplating step or an average plating voltage at the latter half stage of the electroplating step is 60% or less of an average plating voltage at the former half stage of the electroplating step.Type: GrantFiled: June 6, 2006Date of Patent: January 17, 2012Assignee: Fujifilm CorporationInventor: Yoshihiro Fujita
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Patent number: 8080147Abstract: A disclosed electrolytic plating method includes a first step of immersing a substrate in electrolytic plating liquid including copper salt to form a first Cu layer on the substrate; and a second step of forming a second Cu layer over the first Cu layer. The first step is continued for ten seconds or less after the immersion. In the first step, the substrate is rotated at a first speed N (rpm) which satisfies D×N×??6000×? (mm/min), where D is the diameter of the substrate (mm), and D×N×? represents the peripheral speed of the substrate, and a current is supplied to the substrate at a first density of 10 mA/cm2 or less. In the second step, the substrate is rotated at a second speed higher than the first speed, and the current is supplied to the substrate at a second density higher than the first density.Type: GrantFiled: January 29, 2009Date of Patent: December 20, 2011Assignee: Fujitsu Semiconductor LimitedInventor: Motonobu Sato
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Publication number: 20110259751Abstract: The present invention provides a method for producing solar cells, comprising the steps of—providing silicon containing vitreous substrates, each provided with an electrically conductive material on at least one side thereof, —successively transporting at least a portion of each substrate through an electrolytic solution that is present in an electrolytic bath, —connecting said electrically conductive material as the cathode during the transport of the substrates through the electrolytic bath for the purpose of electrodepositing material from the electrolytic solution onto the electrically conductive material during said transport, wherein the substrates are suspended from a conveyor element during transport and extend in the transport direction. The invention further provides a device for producing solar cells.Type: ApplicationFiled: April 7, 2009Publication date: October 27, 2011Applicant: MECO EQUIPMENT ENGINEERS B.V.Inventors: Ronald Langereis, Gregorius Johannes Bertens
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Patent number: 8029660Abstract: Manufacture of semiconductor products such as LCD driver requires a bump plating step for forming a gold bump electrode having a size of from about 15 to 20 ?m. This bump plating step is performed by electroplating with a predetermined plating solution, but projections intermittently appear on the bump electrode during a mass production process. In the invention, abnormal growth of projections over the gold bump electrode is prevented by adding, prior to the gold bump plating step, a step of circulating and stirring a plating solution while erecting a plating cup and efficiently dissolving/discharging a precipitate. This step is performed for each wafer to be treated.Type: GrantFiled: October 23, 2008Date of Patent: October 4, 2011Assignee: Renesas Electronics CorporationInventors: Tota Maitani, Taku Kanaoka
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Patent number: 8012330Abstract: A plating method, employing a face-down manner of plating and using a resistor body between a substrate and an anode, can securely bring an entire surface to be plated of the substrate into contact with a plating solution without permitting intrusion of air bubbles to the surface to be plated. A resistor body is disposed above the anode and immersed in the plating solution, allowing the plating solution to flow along an upper surface of the resistor body from the periphery toward the center of the resistor body. Thus, a raised portion of the plating solution is created in the center of the upper surface of the resistor body. The substrate is then lowered with the surface facing downwardly so as to fill the space between the surface to be plated of the substrate and the upper surface of the resistor body with the plating solution.Type: GrantFiled: February 25, 2008Date of Patent: September 6, 2011Assignee: Ebara CorporationInventors: Takashi Kawakami, Tsutomu Nakada
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Patent number: 7955487Abstract: The invention relates to a device and method for electrolytically treating flat work pieces (1), more especially for electrolytically treating electrically conductive structures S that are electrically insulated against each other on the surfaces of the work pieces. The method comprises conveying and processing the work pieces (1) on the conveying paths T?, T? in the device, said device comprising at least one assembly A located between tow conveying paths, said assembly including a first and a second rotatable contacting electrode (2, 8) with the contacting electrodes being associated each with one of the conveying paths, and first contacting electrodes (2) abutting against the work pieces being conveyed in a first conveying path T?, and being spaced from the second conveying path T? and second contacting electrodes (8) abutting against the work pieces being conveyed in the second conveying path T? and being spaced to the first conveying path T?.Type: GrantFiled: June 15, 2005Date of Patent: June 7, 2011Assignee: Atotech Deutschland GmbHInventors: Franz Kohnle, Klaus Hechler
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Publication number: 20110073483Abstract: A method and apparatus for plating a metal onto a substrate. One embodiment of the present invention provides an apparatus for electroplating a substrate. The apparatus comprises a fluid basin, an anode disposed near a bottom of the fluid basin, a restrictor disposed above the anode, and a substrate support member configured to move the substrate within the fluid basin among different elevations relative to the restrictor. Plating profiles on the substrate may be adjusted by changing the elevation of the substrate during plating.Type: ApplicationFiled: December 7, 2010Publication date: March 31, 2011Inventors: HOOMAN HAFEZI, Aron Rosenfeld
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Patent number: 7906430Abstract: A peeling prevention layer for preventing an insulation film and a protection layer from peeling is formed in corner portions of a semiconductor device. The peeling prevention layer can increase its peeling prevention effect more when formed in a vacant space of the semiconductor device other than the corner portions, for example, between ball-shaped conductive terminals. In a cross section of the semiconductor device, the peeling prevention layer is formed on the insulation film on the back surface of the semiconductor substrate, and the protection layer formed of a solder resist or the like is formed covering the insulation film and the peeling prevention layer. The peeling prevention layer has a lamination structure of a barrier seed layer and a copper layer formed thereon when formed by an electrolytic plating method.Type: GrantFiled: April 25, 2008Date of Patent: March 15, 2011Assignees: Sanyo Electric Co., Ltd., Kanto Sanyo Semiconductors Co., Ltd.Inventors: Mitsuo Umemoto, Kojiro Kameyama, Akira Suzuki
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Publication number: 20110017605Abstract: Methods for plating substrates are herein defined. One method includes providing a plating assembly having a plating source in a plating fluid and a plating facilitator in the plating fluid, and defining a plating meniscus between the plating source and the plating facilitator. The plating meniscus being contained in a path of the plating assembly. The method further includes traversing a substrate through the path of the plating assembly. The substrate being charged so that plating ions are attracted to a surface of the substrate when the plating meniscus is present on the surface of the substrate, wherein the substrate traversing through the path of the plating assembly enables plating across the surface of the substrate. And, inducing a uniform charge in the path where the plating meniscus is formed, such that charge from the plating source is substantially uniformly directed toward the plating facilitator as the substrate that is charged moves through the path of the plating assembly.Type: ApplicationFiled: October 6, 2010Publication date: January 27, 2011Inventors: Carl A. Woods, Yezdi N. Dordi, Jacob Wylie, Robert Maraschin