Abstract: A continuous plating system with mask registration is disclosed herein that uses drums and rollers with protruding pins which engage with guide holes in a masking belt and a lead frame. Through engagement with the pins the masking belt is keyed to the lead frame as the lead frame passes through a plating solution tank.

Abstract: A method for manufacturing a plated film by bringing a film having a conductive surface into electrical contact with a cathode roll with a liquid film interposed between the film and the cathode and forming a metal plating on the conductive surface of the film, characterized in that the relation E0>[(I/Cs)×d]/? where E0 is the reduction potential of the metal forming the plating, I is the value of the current flowing through the cathode roll for plating, Cs is the area of the conductive surface of the film in electrical contact with the cathode roll with a liquid film interposed therebetween, d is the thickness of the gap between the cathode roll and the conductive film, and ? is the conductivity of the liquid forming the liquid film present in the gap. A cathode roll having a surface roughness Rmax of 1 ?m or less is also disclosed. Further a cathode roll having a Vickers hardness of the surface of 200 or more is disclosed.

Abstract: The invention relates to an apparatus and to a method for depositing a metal coating on an electrically conductive substrate in a continuous way. The apparatus comprises at least one plating vessel for receiving an electrolyte solution; at least one plating unit, and means to pass said substrate through said at least one plating vessel. The plating unit comprises—a first zone comprising at least one first electrode (anode) said first electrode being connected to a positive pole of a power supply; —a second zone comprising at least one second electrode (cathode) said second electrode being connected to a negative pole of a power supply; —an intermediate zone between said first zone and said second zone, said intermediate zone separating said first zone from said second by a predetermined distance being larger than zero.

Abstract: There is provided a plating method and device having a fixed drum (20) in which an anode (21) is exposed on the external peripheral surface; a rotating drum provided on the external periphery of the fixed drum, onto which a workpiece W transported in the longitudinal direction is wound; an annular opening (35) formed at the bottom of the rotating drum and provided so as to penetrate from the external periphery of the rotating drum to the internal periphery continuously in the peripheral direction of the rotating drum; a plating solution feeding channel (22) that leads into the fixed drum and is formed in a position on the external periphery of the fixed drum corresponding to the angle position (52a) of the prescribed arc of contact of the rotating drum onto which the workpiece is wound; a plating device for feeding the plating solution to the flow channel using the tunnel-shaped space (52) enclosed by the workpiece wound on the external periphery of the rotating drum, the peripheral wall of the annular openin

Abstract: A process for hydrogenating carbon dioxide to generate methanol. In the process, a strip of copper base plate is transported by the groups of rotating drive rollers to deposit porous metallic zinc on the copper base plate. Hydrogen is generated from the porous metallic zinc upon electrochemical reactions in the inner space sealed with the above groups of rollers. Simultaneously, zinc oxide and copper oxide catalysts are formed on the porous metallic zinc. Carbon dioxide is introduced into the sealed inner space under high-temperature and high-pressure to generate methanol by hydrogenation.

Abstract: A photosensitive film, which has a transparent support and a silver salt emulsion layer containing a silver salt formed thereon, is exposed and developed to form a metallic silver portion. The base material to be plated is electrified in an electrolytic solution free of plating substances, using the metallic silver portion as a cathode. Then, the electrified base material is subjected to an electroless plating treatment to form a first plated layer only on the metallic silver portion. The base material is subjected to an electroplating treatment to form a second plated layer on the first plated layer, further form a third plated layer on the second plated layer.

Abstract: The present invention is provided to manufacture a low magnetic loss metal tape with biaxial texture and a manufacturing method thereof. The low magnetic loss metal tape has a non-magnetic metal layer deposited on a nickel layer in the form of stack. The low magnetic loss metal tape with biaxial texture is manufactured by the following steps. A biaxially textured nickel layer is formed on a surface of cathode rotating in an electroplating bath including a cathode with single crystalline structure or similarly high orientation, and an anode made of high purity nickel. The nickel layer formed on the cathode is then washed in a water bath. Subsequently, a non-magnetic metal layer is formed on the washed nickel layer rotating in a plating bath with a non-magnetic metal solution. The metal tape is finally manufactured by delaminating and winding the nickel/non-magnetic metal layers.

Abstract: Disclosed herein are a biaxially textured pure metal or alloy layer deposited by electroplating process on the surface of a single-crystalline or quasi-single-crystalline metal substrate, and a method for manufacturing the biaxially textured pure metal or alloy layer.

Abstract: A producing method of a flexible wired circuit board that can prevent the formation of a gap between an elongate substrate and a stiffener sheet bonded thereto to prevent contamination of the flexible wired circuit board obtained. In the process subsequent to the process of forming a conductive pattern 3 on a surface of the elongate substrate 1 by the semi-additive process using electrolysis plating and then annealing the elongate substrate 1 with the conductive pattern 3 in its wound up state, a stiffener sheet 9 having a width narrower than the elongate substrate 1 is bonded to the back side of the elongate substrate 1. Thereafter, an oxidized film formed on a surface of the conductive pattern 3 is removed and then a solder resist 11 is formed thereon. This prevents the strip of the stiffener sheet 9 from the elongate substrate 1 and in turn prevents etching solution or developing solution from entraining in a gap therebetween.

Abstract: A method of improving the material properties of a composite by electrodepositing various polymers, organic compounds or inorganic compounds onto each individual carbon (graphite) fiber strand, whether individual fiber or as a fabric to form an homogeneous chemically-bonded composite as opposed to the formation of a heterogeneous, non-chemically bonded composite. Thus, electrodeposition forms a unique discrete interface at the molecular layer (nanolayer) between the reinforcement (fiber) and the matrix (resin) over as opposed to any previous resin infusion process.

Abstract: There is provided a semiconductor device comprising: a first plating layer formed on one surface of an interconnect pattern; a second plating layer formed within through holes in the interconnect pattern; a semiconductor chip electrically connected to the first plating layer; an anisotropic conductive material provided on the first plating layer; and a conductive material provided on the second plating layer, wherein the first plating layer has appropriate adhesion properties with the anisotropic conductive material, and the second plating layer has appropriate adhesion properties with the conductive material.

Abstract: A plating machine for plating a film carrier tape for mounting electronic parts includes a plating tank for plating wiring patterns of a film carrier tape and also has a bubble adhesion prevention means that is position adjustable with respect to the surface of a plating solution contained in the plating tank. The process for producing film carrier tapes for mounting electronic parts comprises partially immersing a film carrier tape in a plating solution contained in a plating tank and selectively plating wiring patterns formed in the immersed area while adsorbing bubbles generated in the plating solution to a bubble adhesion prevention means arranged at the surface of the plating solution.

Abstract: A plating apparatus includes a plating vessel for holding a plating bath containing at least metal ions, a conveying device for conveying a long conductive substrate and immersing the long conductive substrate in the plating bath, a facing electrode disposed in the plating bath so as to face one surface of the conductive substrate, a voltage application device for performing plating on the one surface of the conductive substrate by applying a voltage between the conductive substrate and the facing electrode, and a film-deposition suppression device fixedly disposed in the plating vessel so that at least a portion of the film-deposition suppression means is close to shorter-direction edges of the conductive substrate. At least a portion of the film-deposition suppression device close to the shorter-direction edges of the conductive substrate is conductive.

Abstract: A method for electroplating a strip of foam having two opposite sides and an electrically conductive surface, including: (a) continuously applying the strip of foam onto a moving cathode immersed in an electroplating bath so that the strip travels through the bath in contact with the moving cathode to electroplate metal on the strip of foam, a first side of the strip of foam facing a working surface of the moving cathode, and (b) continuously removing the electroplated strip of foam from the moving cathode when metal has been plated to a desired thickness; A metal foil is continuously formed by electrodeposition on the working surface of the moving cathode in such a way that the strip of foam is applied at step (a) onto the moving cathode over the metal foil; and, after step (b), the metal foil is continuously removed from the moving cathode.

Abstract: For electrolytic treatment of circuit boards and foils LP, a method and a device are used in which the sheets and foils are transported through a treatment unit and brought thereby in contact with treatment fluid 3. The sheets and foils are guided during transportation past at least one electrode arrangement, which comprises respectively cathodically polarized electrodes 6 and anodically polarized electrodes 7, the cathodically and anodically polarized electrodes also being brought in contact with the treatment fluid. The cathodically polarized electrodes and the anodically polarized electrodes are connected to a current/voltage source 8, so that a current flows through the electrodes 6, 7 and the electrically conductive surfaces 4.

Abstract: The apparatus is provided with a wire guiding means disposed in a liquid bath for turning the direction of a wire to feed the wire into and out of the bath contained by the liquid. The wire guiding means includes a tubular conduit having a first open end disposed in the liquid, a second open end disposed above the liquid, and a middle curved portion for guiding the wire through the tubular conduit. The tubular conduit can be at least partially filled with the liquid. Preferably, the treatment liquid is an electrodeposition liquid. A plurality of the tubular conduits may be disposed in the bath substantially parallel with each other. Preferably the first open end is connected to a bottom portion of the bath through a coupling such that the treatment liquid in the bath can flows into the tubular conduit. The second open end is positioned higher than the first open end.

Abstract: Method for the electrolytic coating of a metal strip, in which the strip forms a cathode and is moved in its longitudinal direction relative to an anode, an electrolyte flowing at least between the strip and the anode, characterized in that the flow of the electrolyte is influenced by holding a body between the strip and the anode. A device for the electrolytic coating of a metal strip is also enclosed.

Abstract: An electrolytic process for depositing copper on a steel wire in which the wire travels through an acidic electrolytic bath of an aqueous solution of Cu2+ ions in the form of a salt of an acid. A direct electric current passes through the solution between at least one anode and the wire acting as cathode. The bath also has from 1.9 to 6 mM/l of a thiourea and from 1.9 to 6 mM/l of an amino acid.

Abstract: The invention relates to a method for producing a textured metal strip. In order to be able to implement a method of this type in a comparatively simple manner and thus cost-effectively, a metal layer (4) is galvanically produced on a textured substrate (1) having electrical conductivity, and the metal layer (4), while producing the textured strip (4a), is removed from the substrate (1).

Abstract: A continuous strip is electrochemically processed in an electrolytic processing bath using either a thin flexible or resilient dielectric wiping blade or an open web, plastic mesh to wipe bubbles of gas from the surface, sever dendritic material, if such is present, and to remove a surface layer of partially depleted electrolytic solution, replacing with fresh solution and to stabilize strip portions extending between support rolls. The resilient dielectric wiper blade is preferably used with perforated anodes which allow fresh electrolytic solution to flow into the space between the anodes and the strip surface after being expelled by passage of the strip past the wiping blade. The wiping blades may also be angularly oriented with respect to the strip to increase the wiping effectiveness.

Abstract: A process for use in a continuous electrochemical treating line for electrochemically treating at least one surface of a continuous web moving through an electrolyte solution contained within a tank. The process includes the steps of providing at least one electrode extending across the surface of the continuous web in combination with at least one rigid non-flexible and non-conductive bumper devices also extending across the continuous web surface. The bumper devices include a contact surface positioned against the continuous web surface at spaced apart locations that prevent the continuous web from moving outside a pass-line through the electrolyte solution and arcing against the electrode. The bumper devices may comprise either a bumper strip or a conduit.

Abstract: A phosphate coating apparatus for depositing a phosphate coating on a metal material by electrolyzing the metal material in a predetermined electrolysis solution includes a positive electrode and a negative electrode, of which one electrode being disposed in contact with the metal material and the other electrode being disposed away from the metal material with a predetermined distance, and the other electrode being formed into a tubular shape so as to cover the entire length of the metal material.

Abstract: The present invention provides a web conveying apparatus for conveying a web while holding the web and applying tension to the web, wherein the conveying apparatus has a plurality of rollers with which the web contacts to be conveyed, and at least one roller of the plurality of rollers has a mechanism for limiting deformation of the web within Y/E, and a web conveying method using a web conveying apparatus for conveying a web while holding the web and applying tension to the web, wherein the conveying apparatus has a plurality of rollers with which the web contacts to be conveyed, and the web is conveyed while the deformation of the web is limited within Y/E by a mechanism that is provided for at least one roller of the plurality of rollers. The apparatus and the method prevent meandering of the web.

Abstract: Disclosed are a process for producing a zinc oxide film comprising the steps of transporting a conductive long substrate via above at least one electrode comprised of zinc in an electrodeposition bath held in an electrodeposition tank and applying an electric field between the electrode and the conductive long substrate, thereby forming a zinc oxide film on the conductive long substrate, the process comprising a first step of forming the zinc oxide film on a part of the conductive long substrate; a second step of stopping the application of the electric field and the transportation; and a third step of bringing at least a region of a part of the conductive long substrate being in contact with the electrodeposition bath in the second step into non-contact with the electrodeposition bath, and an apparatus suitably used for the process. The process and apparatus enables high-quality zinc oxide films to be produced.

Abstract: A method of manufacturing a positive electrode foil of an aluminum electrolytic capacitor is provided in which anodizing conditions are optimally determined and automatically set to minimize the loss of production and to produce a constant quality of the positive electrode foil. The method comprises an etching process and an anodizing process. An etched foil produced in the etching process is subjected to a constant current inspection, and then, the anodizing conditions are determined from the result of the constant current inspection. The anodizing conditions are transferred to a control panel in the anodizing process where they are automatically registered as its settings. Also, an apparatus for manufacturing the positive electrode foil is provided which has a voltage sensor connected between an output running roller and cathode electrodes in an anodizing tank. A voltage measured by the voltage sensor is fed back to a direct-current source for controlling its output voltage.

Abstract: Method for the electrolytic coating of a metal strip, in which the strip forms a cathode and is moved in its longitudinal direction relative to an anode, an electrolyte flowing at least between the strip and the anode, characterized in that the flow of the electrolyte is influenced by holding a body between the strip and the anode.

Abstract: The present invention is directed to methods and compositions for depositing a noble metal alloy onto a microelectronic workpiece. In one particular aspect of the invention, a platinum metal alloy is electrochemically deposited on a surface of the workpiece from an acidic plating composition. The plated compositions when combined with high-k dielectric material are useful in capacitor structures.

Abstract: A method of producing a hollow metal member and an apparatus for producing the same wherein a hollow metal member has uniform thickness of the electrodeposited metal material on the core wires, uniform outer diameter and high accuracy of roundness and coaxiality.

Abstract: A method for electroplating a strip of foam, the strip of foam having two opposite sides and an electrically conductive surface, comprises the steps of: continuously applying the strip of foam onto a moving cathode immersed in an electroplating bath so that the strip travels through the bath in contact with the moving cathode to electroplate metal on the strip of foam, a first side of the strip of foam facing a working surface of the moving cathode, and continuously removing the electroplated strip of foam from the moving cathode when metal has been plated to a desired thickness.

Abstract: The invention concerns a method for making safety labels which consists in producing a base deposit on the film (100), then in defining a label shape (101). It further consists in producing (102) a printed window preferably by photogravure with cells bordered by a stripe forming the window outline; printing (103) the printing window on the base deposit with a passivation coating, and developing the window (104) by a physico-chemical operation.

Abstract: An electrochemical reaction assembly and methods of inducing electrochemical reactions, such as for deposition of materials on semiconductor substrates. The assembly and method achieve a highly uniform thickness and composition of deposition material or uniform etching or polishing on the semiconductor substrates by retaining the semiconductor substrates on a moving cathode immersed in an appropriate reaction solution wherein a wire mesh anode rotates about the moving cathode during electrochemical reaction.

Abstract: A composite for use in forming a multi-layer printed circuit board, comprised of an INVAR® sheet having a thickness of between 0.5 mil and 5 mil; and a layer of electrodeposited copper on at least one side thereof. The copper has a thickness of between 1&mgr; and 50&mgr;, wherein the composite has a thermal coefficient of expansion (TCE) of about 2.8 to 6.0 ppm at temperatures between 0° F. and 200° F.

Abstract: A process for cleaning an electrically conducting surface (3) by arranging for the surface to form the cathode of an electrolytic cell in which the anode (1) is maintained at a DC voltage in excess of 30V and an electrical arc discharge (electro-plasma) is established at the surface of the workpiece by suitable adjustment of the operating parameters, characterized in that the working gap between the anode and the cathode is filled with an electrically conductive medium consisting of a foam (9) comprising a gas/vapor phase and a liquid phase. The process can be adapted for simultaneously coating the metal surface by including ions of the species required to form the coating in the electrically conductive medium.

Abstract: In a process for manufacturing a conductive wire that is suitable for use in semiconductor packages, a core wire of an extensible metal other than gold is first prepared to have a diameter ranging from 300 &mgr;m to 500 &mgr;m. Thereafter, a gold-containing outer layer having a thickness ranging from 2.5 &mgr;m to 25 &mgr;m is plated onto an outer surface of the core wire so as to form a gold-plated core wire. Subsequently, the gold-plated core wire is drawn to result in the conductive wire having a diameter ranging from 1 &mgr;m to 50 &mgr;m.

Abstract: The invention relates to a method for touching up and/or repairing minor surface damage in a large-format pressing plate or an endless strip 3 made of steel sheet, with a textured surface 4, for surface embossing of wood materials or laminate panels, whereby the damaged surface is subjected to microgalvanic treatment, In order to simply repair the damage locations and to allow a longer tool life of the pressing sheets, it is provided, according to the invention, that an electrolyte solution that contains metal ions and iron is used, which is coordinated with the base material of the pressing plate or the endless strip 3. This yields the particular advantage that no color deviations are formed as compared with the damaged locations and that a conventional chrome-plating process can be used, whereby the damaged locations 2 are not washed out and thereby become visible again, during subsequent touch-up chrome-plating, because of the electrolyte used.

Abstract: An object of the present invention is to provide a copper foil having excellent adhesion to an etching resist layer, without performing physical polishing such as buffing in pre-treatment of an etching process to form a circuit from the copper foil. To attain the object, in electroforming, a titanium material having a grain size number of 6.0 or more is employed as a copper deposition surface of the rotating drum cathode, and glue and/or gelatin is added in an amount of 0.2-20 mg/l to a copper sulfate solution, thereby producing a drum foil. An electrodeposited copper foil obtained from the drum foil, wherein 20% or more of the crystals present in a shiny side surface of the electrodeposited copper foil have a twin-crystal structure, is used for producing copper-clad laminates.

Abstract: A method of producing copper foil, and more particularly, in an electrochemical cell containing organic substituents, is provided herein. The metal may be deposited on an electrode that comprises an electrode base having at least one undercoating layer of an active coating and at least one topcoating layer of no significant activity. The copper electrodeposition cell can operate without an adverse affect on electrode potential.

Abstract: Apparatus for use in a continuous electrochemical treating line and a method for electrochemically treating at least one surface of a continuous web moving through an electrolyte solution contained within a tank. The apparatus includes at least one electrode extending across the surface of the continuous web in combination with at least two rigid, non-conductive, and non-polar bumper devices also extending the continuous web surface. The bumper devices include a slick contact surface positioned against the continuous web surface at spaced apart locations that prevent the continuous web from moving outside a pass-line through the electrolyte solution and arcing against the electrode. The bumper devices may comprise either a bumper strip or a conduit.

Abstract: A continuous electrocoat apparatus is provided for applying a coating onto a substantially flat substrate, e.g., an electroconductive substrate in coil or blank form. In one embodiment, the apparatus includes a first electrocoat tank having a coating region and a non-conductive conveyor extending at least partially into the first electrocoat tank and defining a conveyor path. A plurality of electrically conductive supports are carried on the conveyor. A connecting system is configured to selectively place at least a portion of the supports in electrical contact with an electrical power source when the selected supports are in the coating region of the first electrocoat tank.

Abstract: There is disclosed an electrodeposition method capable of suppressing the drop in the power supply voltage and minimizing the heat loss by the electrodeposition current, thereby achieving uniform film formation with satisfactory characteristics. A conductive substrate is dipped in an electrodeposition bath held in an electrodeposition tank, and an oxide is electrolytically deposited on the conductive substrate.

Abstract: This invention provides an electrodeposition apparatus, comprising at least one electrodeposition vessel for supplying a current between a substrate and an electrode in an electrodeposition bath to form an oxide film or the substrate and a rinsing means for rinsing the substrate after passing the electrodeposition tank with water, wherein a humidifying means for preventing drying of at least the film forming surface of the substrate is provided along the transporting path of the substrate at least at the exit side of the electrodeposition vessel and an oxide film forming method. Thus a uniform oxide film without unevenness can be formed on the substrate.

Abstract: Electro-plating apparatus 1 has an electro-plating bath 2 containing electrolyte 3, an anode configuration immersed in electrolyte 3 being a planar anode 4 and an arcuate solid anode 5. In use, a continuous web of flexible substrate 6 (onto both side of which material is to be deposited) is passed along a transport system 7 in a direction shown by arrow A. Transport system 7 comprises a set of rollers 8, 9 of which rollers 8 are generally cylindrical, driving rollers while rollers 9 are cathode connectors and have a number of circumferential projections 10 which ensure electrical contact with unconnected or discreet regions on substrate 6. Another electro-plating apparatus 20 has a cathode connector configuration 21 with four comb electrodes 22 each having a main portion 23 with a plurality of teeth 24 each of which has end 25 inclined in the direction of the movement fo the substrate.

Abstract: An apparatus for producing metal foil, comprising a drum cathode having an outer plating surface. The drum cathode is partially immersed to a set level in an electrolyte bath and is rotatable in a fixed direction about a generally horizontal axis. A main anode assembly having a main anode is immersed in the electrolyte bath, the main anode having a semi-cylindrical curved anode surface facing the drum cathode. The main anode is dimensioned to be spaced from the plating surface of the drum cathode so as to define a generally uniform gap therebetween. An energy source is connected to the main anode for energizing the main anode. A chamber containing an electrolyte solution is disposed above the electrolyte bath and adjacent the cathode drum where the cathode drum exits the electrolyte bath. A treatment anode is immersed in the electrolyte solution in the chamber adjacent the drum cathode. An energy source is connected to the treatment anode for energizing the treatment anode.

Abstract: A one-step, integrated process and apparatus for producing electrolytic copper foil having a dual-layer copper bond-enhancing treatment electrodeposited on the matte side of the foil, which employs two “super anodes” on a rotating drum cathode to deposit the treatment.

Abstract: The present invention is directed to processes and devices for performing the processes comprising electroplating one or more metallic or non-metallic continuous products with metals or metal alloys in a continuous process from aprotic electrolytes free of water and oxygen, wherein the continuous product is passed through a lock system (1) into an encapsulated coating plant under inert gas atmosphere, and the following steps are performed at temperatures ≦120° C.: activating the continuous product to be coated; rinsing the continuous product to be coated; contacting the continuous product to be coated; electroplating the continuous product to be coated using a metal or metal alloy; drying the coated continuous product; discharge of the coated continuous product from the plant through a lock system.

Abstract: A method of manufacturing a metallic fiber in which from a convergent extended wire, which is formed by a metallic fiber and a matrix member which is formed of a metallic material and whose dissolvability is higher than the dissolvability of the metallic fiber, the matrix member is continuously dissolved and removed by an electrolytic processing in a plurality of electrolytic tanks which are arranged in the conveying direction of the convergent extended wire, wherein: the convergent extended wire is passed through electrolytes in the plurality of electrolytic tanks, which are arranged in the shape of a gentle convex arch at the vertical direction upper side which includes the conveying passage of the convergent extended wire, the convergent extended wire is passed above a plurality of feeding devices which are provided at the outer sides of the electrolytes and which are disposed in the same arch-shape so as to correspond to the electrolytic tanks, in each of the plurality of electrolytic tanks, the metallic

Abstract: An electrochemical reaction assembly and methods of inducing electrochemical reactions, such as for deposition of materials on semiconductor substrates. The assembly and method achieve a highly uniform thickness and composition of deposition material or uniform etching or polishing on the semiconductor substrates by retaining the semiconductor substrates on a moving cathode immersed in an appropriate reaction solution wherein a wire mesh anode rotates about the moving cathode during electrochemical reaction.

Abstract: A simplified process and apparatus for electrodepositing a bond-enhancing copper treatment layer on a surface of copper foil, preferably wherein a single treatment layer is uniformly applied on raw copper foil using a current density of from about 40 to about 100 A/ft2, a plating time of greater than 30 seconds, and the electrolyte is a copper sulfate-sulfuric acid solution containing arsenic, chloride ions and 2 imidazalidinethione. The raw foil is transferred to a station for applying the treatment directly from a rotating drum cathode machine on which it is produced, at the same speed at which the raw foil is produced, and then to a barrier layer station, a stainproofing station and a chemical adhesion promoter station, after which it is dried and coiled.

Abstract: A one-step, integrated process and apparatus for producing electrolytic copper foil having a dual-layer copper bond-enhancing treatment electrodeposited on the matte side of the foil, which employs two “super anodes” on a rotating drum cathode to deposit the treatment.

Abstract: A gold bonding wire fabrication method, which includes the steps of (a) drawing a non-gold wire rod, for example, a pure silver wire rod or pure palladium wire rod into a core wire of thickness within about 1 &mgr;m˜500 &mgr;m, (b) electroplating the core wire with a layer of gold plating of thickness within about 0.025 &mgr;m˜25 &mgr;m.