Adhesive Or Autogenous Bonding Of Two Or More Self-sustaining Preforms Wherein At Least Two Of The Preforms Are Not Intended To Be Removed (e.g., Prefabricated Base, Etc.) Patents (Class 216/33)
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Publication number: 20130047734Abstract: A resonant pressure sensor including one or more resonant-type strain gauges arranged on a diaphragm may include a sensor substrate made of silicon and including one surface on which one or more resonant-type strain gauge elements are arranged and the other surface which is polished to have a thickness corresponding to the diaphragm, a base substrate made of silicon and including one surface directly bonded with the other surface of the sensor substrate, a concave portion formed in a portion of the base substrate bonding with the sensor substrate, substantially forming the diaphragm in the sensor substrate, and including a predetermined gap that does not restrict a movable range of the diaphragm due to foreign substances and suppresses vibration of the diaphragm excited by vibration of the resonant-type strain gauge elements, one or more conducting holes, and a fluid.Type: ApplicationFiled: August 23, 2012Publication date: February 28, 2013Applicant: YOKOGAWA ELECTRIC CORPORATIONInventors: Yuusaku YOSHIDA, Takashi YOSHIDA, Hiroshi SUZUKI, Shuhei YOSHITA, Hisashi TERASHITA
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Patent number: 8377319Abstract: Techniques are provided for forming nozzles in a microelectromechanical device. The nozzles are formed in a layer prior to the layer being bonded onto another portion of the device. Forming the nozzles in the layer prior to bonding enables forming nozzles that have a desired depth and a desired geometry. Selecting a particular geometry for the nozzles can reduce the resistance to ink flow as well as improve the uniformity of the nozzles across the microelectromechanical device.Type: GrantFiled: February 7, 2008Date of Patent: February 19, 2013Assignee: FUJIFILM Dimatix, Inc.Inventors: Zhenfang Chen, Andreas Bibl, Paul A. Hoisington
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Patent number: 8372296Abstract: Provided is a manufacturing method for a thermal head, including: bonding a flat upper substrate in a stacked state onto a flat supporting substrate including a heat-insulating concave portion open to one surface thereof so that the heat-insulating concave portion is closed (bonding step (SA2)); thinning the upper substrate bonded onto the supporting substrate by the bonding step (SA2) (plate thinning step (SA3)); measuring a thickness of the upper substrate thinned by the plate thinning step (SA3) (measurement step (SA4)); deciding a target resistance value of heating resistors based on the thickness of the upper substrate, which is measured by the measurement step (SA4) (decision step (SA5)); and forming, at positions of a surface of the upper substrate thinned by the plate thinning step (SA3), the heating resistors having the target resistance value determined by the decision step (SA5), the positions being opposed to the heat-insulating concave portion (resistor forming step (SA6)).Type: GrantFiled: August 3, 2010Date of Patent: February 12, 2013Assignee: Seiko Instruments Inc.Inventors: Noriyoshi Shoji, Norimitsu Sanbongi, Toshimitsu Morooka, Keitaro Koroishi
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Patent number: 8361334Abstract: Plasma etching of a polymeric dielectric material such as polyurethane results in volatile byproducts that are deposited onto the surface of an inert substrate. The surface treatment increases adhesiveness so that the surface of the inert material may be bonded to another material. Portions of a medical device comprising an inert substrate such as a fluoropolymer may therefore be securely affixed to other portions of the medical device formed of polymeric, metallic, or ceramic materials.Type: GrantFiled: March 18, 2009Date of Patent: January 29, 2013Assignee: Medtronic, Inc.Inventor: Greg Garlough
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Publication number: 20130022809Abstract: A unique and cost-effective method for producing a multilayer ceramic structure by using a first green film that contains a ceramic material, and the multilayer ceramic structure produced thereby. The method including the steps of: (a) producing at least one porous region in the first green film, the at least one porous region extending from the surface of the first green film; (b) applying a first layer, in sections, to the surface of the first green film, wherein one section of the first layer is located above the at least one porous region produced in step (a); (c) positioning at least one additional green film on the surface of the first green film, to which the first layer has been applied; (d) laminating the first green film and the at least one additional green film to form a green film composite; and (e) sintering the green film composite.Type: ApplicationFiled: July 6, 2012Publication date: January 24, 2013Applicants: TECHNISCHE UNIVERSITAET WIEN, MICRO SYSTEMS ENGINEERING GMBHInventors: Thomas Haas, Dieter Schwanke, Achim Bittner, Ulrich Schmid
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Patent number: 8349702Abstract: A semiconductor substrate is provided by a method suitable for mass production. Further, a semiconductor substrate having an excellent characteristic with effective use of resources is provided.Type: GrantFiled: April 20, 2009Date of Patent: January 8, 2013Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Sho Kato, Satoshi Toriumi, Fumito Isaka
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Publication number: 20130001191Abstract: A method for securing a micro-object to a substrate by redeposition. The method includes ion-beam milling the substrate in proximity of the micro-object such that the material milled away from the substrate sprays onto the micro-object and covers its base, effectively attaching it to the substrate. Since no carrier gases are used, the ion beam chamber and its contents are not exposed to undesirable contaminants.Type: ApplicationFiled: January 19, 2007Publication date: January 3, 2013Applicant: FIBICS INCORPORATEDInventors: Ken Guillaume Lagarec, Michael William Phaneuf, Michael Anthony Anderson
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Publication number: 20120325772Abstract: An ink-jet recording head includes a plurality of recording element substrates each having an ejection pressure generating element configured to generate pressure for ejecting ink from an ink discharge port. The plurality of recording element substrates each include a first surface on which the corresponding ejection pressure generating element is disposed and a second surface, serving as an end surface intersecting with the first surface, being at least partially formed by etching.Type: ApplicationFiled: September 5, 2012Publication date: December 27, 2012Applicant: CANON KABUSHIKI KAISHAInventor: Hirotaka Miyazaki
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Patent number: 8329053Abstract: In accordance with an illustrative embodiment, a method of fabricating a transducer is described. The method comprises providing a transducer over a first surface of a substrate, wherein the substrate comprises a thickness. The method further comprises patterning a mask over a second surface. The mask comprises an opening for forming a scribe etch. The method comprises etching through the opening in the mask and into but not through the thickness of the substrate to provide the scribe etch.Type: GrantFiled: November 23, 2009Date of Patent: December 11, 2012Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.Inventors: David Martin, Joel Philliber
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Patent number: 8323519Abstract: A method for manufacturing a liquid discharge head including a flow path forming member to form a flow path communicating with a discharge port for discharging liquids includes forming an organic material layer on a substrate, applying a soluble resin on the organic material layer to form a resin layer, patterning the resin layer to form a pattern with a shape of the flow path, forming a cover layer as the flow path forming member on the pattern, forming the discharge port to expose a part of the pattern from the cover layer, eluting the pattern from the discharge port to form the flow path, irradiating a substance sticking to a surface of the flow path forming member on which the discharge port is formed with ultraviolet light, wherein the substance contains at least the organic material, and removing the sticking substance.Type: GrantFiled: June 19, 2008Date of Patent: December 4, 2012Assignee: Canon Kabushiki KaishaInventors: Mitsunori Toshishige, Yoshinori Tagawa, Hideo Tamura, Taichi Yonemoto
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Publication number: 20120298623Abstract: The present disclosure relates to a method for making a thermoacoustic element. In the method, a graphene film is arranged on a metal substrate. A nonmetal substrate is stacked with the graphene film located on the metal substrate to form a laminate structure. The graphene film is sandwiched between the nonmetal substrate and the metal substrate. The metal substrate is removed from the stacked structure. A number of through-holes are formed in the nonmetal substrate. The graphene film is exposed through the plurality of through-holes.Type: ApplicationFiled: November 23, 2011Publication date: November 29, 2012Applicants: HON HAI PRECISION INDUSTRY CO., LTD., TSINGHUA UNIVERSITYInventors: KAI-LI JIANG, XIAO-YANG LIN, LIN XIAO, SHOU-SHAN FAN
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Patent number: 8314029Abstract: A method for manufacturing a polishing pad containing substantially spherical cells and having high thickness accuracy includes preparing a cell-dispersed urethane composition by a mechanical foaming method; continuously discharging the cell-dispersed urethane composition from a single discharge port to a substantially central portion in the width direction of a face material A, while feeding the face material A; laminating a face material B on the cell-dispersed urethane composition; then uniformly adjusting the thickness of the cell-dispersed urethane composition by thickness adjusting means; curing the cell-dispersed urethane composition with the thickness adjusted in the preceding step without applying any additional load to the composition so that a polishing sheet including a polyurethane foam is formed; and cutting the polishing sheet.Type: GrantFiled: February 29, 2008Date of Patent: November 20, 2012Assignee: Toyo Tire & Rubber Co., Ltd.Inventors: Junji Hirose, Takeshi Fukuda, Masato Doura, Akinori Sato, Kenji Nakamura
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Patent number: 8303829Abstract: A method of fabricating an apparatus of fabricating a flat panel display device and method of fabricating flat panel display device is disclosed, which enables simplification of process by performing a patterning process without a photo process, the method for fabricating an apparatus of fabricating flat panel display device comprising, preparing a master mold including a thin film pattern, coating a liquid-type molding material including oligomer on the master mold, forming a soft mold including a groove provided with a pattern in a shape corresponding to the thin film pattern of the master mold and adhering the soft mold to a mold support plate, wherein the soft mold is adhered to the mold support plate by a covalent bonding in the interface between the oligomer and the mold support plate.Type: GrantFiled: December 4, 2007Date of Patent: November 6, 2012Assignee: LG Display Co., Ltd.Inventors: Jin Wuk Kim, Mi Kyung Park
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Publication number: 20120275731Abstract: Slide bearings and methods of producing slide bearings are disclosed. The slide bearing has a metal support, an adhesive layer and a sliding layer. The adhesive layer is applied directly to the metal support. The adhesive layer comprises a blend of at least two fluoropolymers P1 and P2, wherein P1 is selected from perfluoroalkoxyethylene (PFA) or tetrafluoroethylene-hexafluoropropylene (FEP). P2 is different from P1 and can be a fluoropolymer.Type: ApplicationFiled: April 27, 2012Publication date: November 1, 2012Applicant: SAINT-GOBAIN PERFORMANCE PLASTICS CORPORATIONInventors: Julia Ziegler, Olaf Schmitjes, Joerg Heldmann
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Manufacturing method of flexible display panel and manufacturing method of electro-optical apparatus
Patent number: 8298431Abstract: A first etching stop layer and an active layer are formed on an inner surface of a first glass substrate, and a second etching stop layer and a cover layer are formed on an inner surface of a second glass substrate. A display media is formed between the first glass substrate and the second glass substrate. A first passivation layer is formed on an outer surface of the second glass substrate. A first etching process is performed to expose the first etching stop layer. A first flexible substrate is formed on the exposed first etching stop layer, and a second passivation layer is formed on the first flexible substrate. The first passivation layer is removed. A second etching process is performed to expose the second etching stop layer. A second flexible substrate is formed on the exposed second etching stop layer, and the second passivation layer is removed.Type: GrantFiled: December 8, 2008Date of Patent: October 30, 2012Assignee: Au Optronics CorporationInventors: Jong-Wen Chwu, Chao-Cheng Lin, Che-Yao Wu, Yu-Chen Liu, Wei-Chieh Yang -
Publication number: 20120261263Abstract: A three-dimensional nanochannel device and a method of manufacturing the same are provided. In the device, a first substrate, a second substrate, and a channel layer sandwiched by the first and the second substrates are included. At least one channel is constituted by the first and the second substrates and the channel layer and includes a fluid inlet, a fluid outlet, and at least one condensed channel between the fluid inlet and the fluid outlet. The condensed channel at least has a first size and a second size on an X-Y plane and has a third size and a fourth size on an X-Z plane. A difference between the first size and the second size is about at least two orders in scale, and a difference between the third size and the fourth size is about at least two orders in scale.Type: ApplicationFiled: August 9, 2011Publication date: October 18, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Liang-Ju Chien, Chi-Han Chiou
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Publication number: 20120248062Abstract: A microchip for forming an emulsion has a first glass substrate, a second glass substrate and a silicon substrate. The silicon substrate has formed therein a first fluid flow path through which a first fluid flows and a second fluid flow path through which a second fluid that is not mixed with the first fluid flows. The first fluid flow path has a plurality of branched flow paths that join at a joint portion. The second fluid flow path communicates with the joint portion. The silicon substrate has formed therein an emulsion formation flow path that faces an edge portion of the second fluid flow path at the joint portion. An emulsion composed of the first fluid and the second fluid that is surrounded by the first fluid is formed in the emulsion formation flow path.Type: ApplicationFiled: June 18, 2012Publication date: October 4, 2012Applicant: Dai Nippon Printing Co., Ltd.Inventors: Yutaka OZAWA, Ryoichi OHIGASHI, Koji FUJIMOTO, Shoji TAKEUCHI
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Patent number: 8262298Abstract: The invention is directed to a method for repairing a damaged composite fiber component of an aircraft having at least one integrated fiber optic, the damaged area including both a damaged composite structure and a damaged optical fiber, comprising mechanically removing material from the damaged area, to form a removed area, exposing ends of the damaged composite fiber component in an edge area of the removed area, splicing-in a bridging fiber optic portion for restoring an optical connection, laying the bridging fiber optic along an edge area of the removed area, and pressing and gluing-in a repair patch into the removed area.Type: GrantFiled: December 15, 2009Date of Patent: September 11, 2012Assignee: Airbus Operations GmbHInventor: Alexander Weisser
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Publication number: 20120194811Abstract: A nano particle tracking device includes a channel structure. The channel structure of the nano particle tracking device includes a pair of microchannels in which a specimen including nano particles is accommodated and which face each other, at least one nano channel which is between the pair of microchannels, which connects the pair of microchannels to each other and through which the nano particles in the specimen are moved, and a nano grating below the nano channel and crossing the nano channel perpendicularly.Type: ApplicationFiled: June 15, 2011Publication date: August 2, 2012Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: June-young LEE, Hee-jeong JEONG, Seong-ho CHO, Su-hyeon KIM
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Publication number: 20120183740Abstract: A plate attachment system and method comprising an image bearing plate, which may take the form of a cameo, substantially permanently adhered to a memorial substrate is disclosed. The system and method of the invention comprises a plate, an adhesive in contact with the plate, and a substrate in contact with the adhesive such that the plate is substantially permanently bonded to the substrate. The adhesive may comprise a very high bond acrylic foam tape or other suitable adhesive. The image may be engraved into the plate by an impact carving process. The plate attachment system is weather resistant, and may be installed from a kit in the field without the necessity of engaging skilled labor.Type: ApplicationFiled: October 11, 2011Publication date: July 19, 2012Applicant: Granite Graphics, Inc.Inventor: Ilya Tetelman
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Publication number: 20120177943Abstract: A metal substrate for a solar battery capable of inhibiting power generation efficiency of a unit solar cell from decrease due to a defect of the unit solar cell is provided. This metal substrate (1) for a solar battery includes a cladding material having a first metal layer (11) with a first surface (11a) formed with a unit solar cell (2) and a second metal layer (12) bonded to the first metal layer on a second surface (11b) opposite to the first surface, while a kurtosis (Rku) serving as an index indicating surface roughness of the first surface is not more than 7.Type: ApplicationFiled: January 12, 2011Publication date: July 12, 2012Applicant: NEOMAX MATERIALS CO., LTD.Inventors: Shinji Yamamoto, Ryouji Inoue, Keita Watanabe, Masaaki Ishio
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Publication number: 20120145667Abstract: A process for fabricating an acoustic wave resonator comprising a suspended membrane comprising a piezoelectric material layer, comprises the following steps: production of a first stack comprising at least one layer of first piezoelectric material on the surface of a first substrate; production of a second stack comprising at least one second substrate; production of at least one non-bonding initiating zone by deposition or creation of particles of controlled sizes leaving the surface of one of said stacks endowed locally with projecting nanostructures before a subsequent bonding step; direct bonding of said two stacks creating a blister between the stacks, due to the presence of the non-bonding initiating zone; and, thinning of the first stack to eliminate at least the first substrate.Type: ApplicationFiled: December 8, 2011Publication date: June 14, 2012Applicant: Commissariat A L'Energie Atomique et aux Energies AlternativesInventors: Bruno IMBERT, Emmanuel DEFAY, Chrystel DEGUET, Hubert MORICEAU, Mathieu PIJOLAT
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Publication number: 20120142118Abstract: Microreactors, methods of fabricating, and using such microreactors comprises a substrate having an outer periphery and composing two monolithic sections, each of said monolithic sections comprising two opposed main surfaces and one or more edges extending between the main opposed surfaces. One of the main surfaces from each of the monolithic sections are joined together at a substantially planar junction. The microreactor further comprises at least one microcapillary flow passage defined by surfaces within said substrate and having first and second ends. One or more inlets connect the outer periphery of said substrate with the first end of said microcapillary flow passage. One or more outlets connect the outer periphery of said substrate with the second end of said microcapillary flow passage, which may narrowingly taper. The substrate can be made from high purity fused silica. A metallic reagent and/or catalyst can be incorporated in the micro capillary passage.Type: ApplicationFiled: May 27, 2010Publication date: June 7, 2012Applicant: Cornell UniversityInventors: J. Thomas Brenna, Herbert J. Tobias
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Publication number: 20120111829Abstract: A method for producing a device, with a graphical element, including: a) producing a stack including at least one sacrificial layer positioned between a first substrate and a protective layer, and a graphical element produced in a first face of the protective layer opposite a second face of the protective layer, such that the second face is positioned against the sacrificial layer; b) attaching the stack to at least one second substrate such that the graphical element is positioned between the first substrate and the second substrate; and c) separating the sacrificial layer from the protective layer.Type: ApplicationFiled: July 20, 2010Publication date: May 10, 2012Applicant: COMMISSARIAT A I'energie atomique et aux ene altInventors: Chrystel Deguet, Alain-Marcel Rey, Thomas Signamarcheix
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Publication number: 20120115209Abstract: The present invention thus aims to propose a bioreactor which has an improved yield (concentration, productivity), which is capable of culturing microorganisms sensitive to mechanical stresses, and which is energy-saving. The subject matter of the invention is a method for culturing microorganisms in suspension in a culture medium, in which the microorganism suspension is made to flow in a channel which has means for generating mixing by Lagrangian chaos when the microorganism suspension circulates in said channel.Type: ApplicationFiled: October 14, 2009Publication date: May 10, 2012Inventors: Karine Loubiere, Jérémy Pruvost, Jack Legrand
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Publication number: 20120097636Abstract: A micromachined microphone or speaker embedded within, or positioned on top of, a substrate suitable for carrying microelectronic chips and components. The acoustic element converts sound energy into electrical energy which is then amplified by electronic components positioned on the surface of the substrate. Alternatively, the acoustic element may be driven by electronics to produce sound. The substrate can be used in standard microelectronic packaging applications.Type: ApplicationFiled: December 29, 2011Publication date: April 26, 2012Inventors: Mark Bachman, Guann-Pyng Li
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Publication number: 20120081228Abstract: Tapes for marking valuable components and their housings and supporting posts are described along with a process for utilizing the tapes including the steps of sequentially marking the copper and the equipment with a MR marking (e.g. barcodes, Q-R codes and/or EF transmitters). EF or related broadcasting transmitters or their equivalent would be thin enough and responsive to a signal; machine reading a MR sequence on copper that is brought; marking the copper sold before, after or at the point of sale; identifying the location and coding the copper as stolen at the point of theft, utilizing a nationwide system of copper marking tied to the buyer's information; visually marking the copper in a non-sequential way, potentially by region or state in order to minimize the amount of overlap and would also include the concepts of mandatory scanning of copper products at installation or recycling.Type: ApplicationFiled: September 30, 2011Publication date: April 5, 2012Inventor: Gregory M. Friedlander
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Publication number: 20120074095Abstract: A method for evaluating center segregation of a continuous cast slab is provided. The method of the present invention includes (A) creating a center segregation image of a slab using an etching solution comprising a picric acid (C6H3N3O7), a cupric chloride (CuCl2), sodium laurylbenzenesulfonate (C18H29SO3Na) and the remainder of distilled water; and (B) evaluating the center segregation of a slab by scanning the image and applying the following Formula. The method creates an image of center segregation even for low-carbon steel having carbon (C) in an amount of 0.04 wt % or less as well as ultra low-sulfur steel having sulfur (S) in an amount of 50 ppm or less.Type: ApplicationFiled: December 2, 2011Publication date: March 29, 2012Applicant: HYUNDAI STEEL COMPANYInventors: Sukhyun YOO, Wonjae CHO, Jutae CHOI, Kaeyoung LEE, Kyoungho SO
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Publication number: 20120064278Abstract: A package of environmental sensitive element including a first substrate, a second substrate, an environmental sensitive element and a filler is provided. The second substrate is disposed above the first substrate and has a first barrier structure. The first barrier structure is located between the first substrate and the second substrate. The first barrier structure and the second substrate are integrally formed and made of the same material. The environmental sensitive element is disposed on the first substrate and located between the first substrate and the second substrate. The first barrier structure surrounds the environmental sensitive element. The filler is disposed between the first substrate and the second substrate and covers the environmental sensitive element and the first barrier structure.Type: ApplicationFiled: October 29, 2010Publication date: March 15, 2012Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventor: Kuang-Jung Chen
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Patent number: 8101091Abstract: An introducer assembly includes a sheath having a sheath proximal end and distal end, and a passage therethrough. The introducer assembly further includes a handle assembly that is mechanically and/or bonded coupled with a tubular sheath.Type: GrantFiled: April 2, 2007Date of Patent: January 24, 2012Assignee: Greatbatch Ltd.Inventors: Grant A Mauch, Brian Anderson, Kevin Pietsch, Steve Moreland
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Publication number: 20120006783Abstract: The invention relates to a method for producing a device with a membrane used to encapsulate a fluid contained in a cavity, in which: two substrates (110, 120) are provided; a membrane (111) is placed on one and/or on the other of the substrates; one or more walls (113) are formed, helping to laterally define the cavity (114), in which said walls are located on or in one of the substrates and/or on or in the other of the substrates, and said cavity is intended to contain the fluid, the two substrates (110, 120) are assembled together by superimposing one on the other so as to complete the cavity, in which the or each membrane (111) also helps to define the cavity, the fluid (117) is encapsulated in the cavity between the substrates, and the or each membrane is soaked by the fluid, at least a portion of one of the substrates and/or the other of the substrates is removed insofar as one and/or the other of the substrates are equipped with a membrane, in order to release the membrane at least in the central poType: ApplicationFiled: July 7, 2011Publication date: January 12, 2012Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENE ALTInventors: Arnaud Pouydebasque, Sébastien Bolis, Fabrice Jacquet
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Patent number: 8092702Abstract: A method of multi-stage substrate etching and a terahertz oscillator manufactured by using the method are provided. The method comprises the steps of forming a first mask pattern on any one surface of a first substrate, forming a hole by etching the first substrate using the first mask pattern as an etching mask, bonding, to the first substrate, a second substrate having the same thickness as a depth to be etched, forming a second mask pattern on the second substrate bonded, forming a hole by etching the second substrate using the second mask pattern as an etching mask, and removing an oxide layer having the etching selectivity between the first substrate and the second substrate, whereby the etched bottom is made uniformly even in a deep step, the edge curvature is minimized, and a T-shape is prevented from being formed on the etched wall face to thereby improve the etching quality.Type: GrantFiled: February 4, 2008Date of Patent: January 10, 2012Assignee: Samsung Electronics Co., Ltd.Inventors: Chan Wook Baik, Jong Seok Kim, Seong Chan Jun, Sun Il Kim, Jong Min Kim, Chan Bong Jun, Sang Hun Lee
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Publication number: 20110310711Abstract: The invention relates to an overcoil balance spring (1) including a hairspring (3) formed in a single silicon part, coaxially with a collet (5), the balance spring including a silicon terminal curve (7) and a silicon elevation device (9) between the outer coil (15) of said hairspring and said terminal curve so as to form a Breguet® overcoil balance spring. According to the invention, the elevation device (9) has a cross-shaped mechanical fastener (17) including at least two opposite arms (12, 12?, 14, 14?), which cooperate with clamping means (23, 25) respectively secured to the terminal curve (7) and the outer coil (15) of said hairspring.Type: ApplicationFiled: June 18, 2010Publication date: December 22, 2011Applicant: MONTRES BREGUET SAInventors: Christophe Bifrare, Alain Zaugg, Pierre Cusin
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Publication number: 20110304998Abstract: In accordance with an embodiment, a substrate layout comprises a ground plane of a first power loop on a layer of a substrate, a first trace rail on the layer extending along a first periphery of the ground plane, and a first perpendicular trace coupled to the first trace rail. The ground plane is between the first trace rail and a die area, and the first perpendicular trace extends perpendicularly from the first trace rail. The first trace rail and the first perpendicular trace are components of a second power loop.Type: ApplicationFiled: June 11, 2010Publication date: December 15, 2011Applicants: Global Unichip Corp., Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chin-Sung Lin, Li-Hua Lin, Yu-Yu Lin
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Publication number: 20110300338Abstract: Methods of preparing graphene nano ribbons may include forming a graphene sheet on at least one surface of a substrate, forming a plasma mask having a nano pattern on the graphene sheet, and forming a nano pattern on the graphene sheet by plasma treating a stack structure on which the plasma mask is formed.Type: ApplicationFiled: June 6, 2011Publication date: December 8, 2011Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyeon-jin Shin, Jae-young Choi, Young-hee Lee, Gang-hee Han
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Patent number: 8070969Abstract: A method of fabricating microelectromechanical systems devices is disclosed. A silicon substrate having a plurality of microelectromechanical systems elements formed on a first surface thereof is provided. A guard layer defining a plurality of recesses is applied to the silicon substrate such that respective microelectromechanical systems elements are located within respective recesses. The silicon substrate is then segmented into discrete parts and an adhesive layer is bonded to a second surface of the silicon substrate. The guard layer is next segmented into discrete parts corresponding to the discrete parts of the silicon substrate, thereby forming individual microelectromechanical systems devices. Finally, the adhesive layer is selectively exposed to a light source allowing removal of individual microelectromechanical systems devices.Type: GrantFiled: November 11, 2008Date of Patent: December 6, 2011Assignee: Silverbrook Research Pty LtdInventor: Kia Silverbrook
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Patent number: 8066891Abstract: The present invention provides a laminate comprising an insulating layer having suppressed dusting properties, an insulating film comprising the insulating layer, and an electronic circuit component comprising a pattern of the insulating layer. The laminate has a layer construction of first inorganic material layer-insulating layer-second inorganic material layer or a layer construction of inorganic material layer-insulating layer. The insulating layer comprises a laminate of two or more wet etchable insulating unit layers. At the interface between the inorganic material layer and the insulating layer, surface irregularities of the inorganic material layer have been transferred onto the surface of the insulating layer. The average height of the surface irregularities transferred onto the insulating layer is less than the thickness of the outermost insulating unit layer in the insulating layer.Type: GrantFiled: October 6, 2006Date of Patent: November 29, 2011Assignee: Dai Nippon Printing Co., Ltd.Inventors: Katsuya Sakayori, Terutoshi Momose, Tomoko Togashi, Shigeki Kawano, Michiaki Uchiyama, Kazuto Okamura, Kazutoshi Taguchi, Kazunori Ohmizo, Makoto Shimose
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Publication number: 20110286885Abstract: A microfluidic device includes a microvalve formed by disposing a thin elastic film and a valve seat in a microfluidic channel of the microfluidic device. The microvalve is a normally open type valve in which the elastic film does not contact the valve seat. According to the microvalve of the microfluidic device, an additional process for separating the elastic film from the valve seat is not required. Accordingly, the microfluidic device may have a relatively simple manufacturing process. Also, since an initialization operation to use the microfluidic device is not required, the flow of a fluid in the microfluidic device may be efficiently controlled without additional processing steps.Type: ApplicationFiled: December 3, 2010Publication date: November 24, 2011Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Chin-sung PARK, Won-jong JUNG, Jae-young KIM, Joon-ho KIM
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Publication number: 20110286895Abstract: A microvalve device comprises: a first substrate having a first surface, wherein at least one fluidic channel are formed into the first surface of the first substrate; and at least one valve seat are formed in the fluidic channel; a second substrate having a second surface, the second substrate comprising at least one air channel and at least one air chamber formed on the second surface of the second substrate, wherein the air chamber is connected to the air channel; and an elastic film interposed between the first substrate and the second substrate, where an upper portion of the valve seat is lower than the first surface of the first substrate.Type: ApplicationFiled: May 18, 2011Publication date: November 24, 2011Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Chin-sung PARK, Won-jong JUNG, Jae-young KIM, Joon-ho KIM
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Publication number: 20110284188Abstract: A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.Type: ApplicationFiled: November 15, 2010Publication date: November 24, 2011Inventors: Qingjun Cai, Chung-Lung Chen, Chialun Tsai
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Publication number: 20110239763Abstract: A vibratory sensor is fabricated as a three-dimensional batch-micromachined shell adapted to vibrate and support elastic wave propagation and wave precession in the shell or membrane and at least one driving electrode and preferably a plurality of driving electrodes directly or indirectly coupled to the shell to excite and sustain the elastic waves in the shell. The pattern of elastic waves is determined by the configuration of the driving electrode(s). At least one sensing electrode and preferably a plurality of sensing electrodes are provided to detect the precession of the elastic wave pattern in the shell. The rotation of the shell induces precession of the elastic wave pattern in the shell which is usable to measure the rotation angle or rate of the vibratory sensor.Type: ApplicationFiled: September 29, 2010Publication date: October 6, 2011Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIAInventors: Andrei M. Shkel, Alexander A. Trusov, Igor P. Prikhodko, Sergei A. Zotov
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Publication number: 20110226732Abstract: In one embodiment, an apparatus for reducing adherence in a micro-electromechanical system (MEMS) device comprises a substrate. A MEMS is disposed outwardly from the substrate. The MEMS comprises structures and corresponding landing pads. Dibs are disposed outwardly from the substrate. Each dib has a surface with depressions. An adherence-reducing material is disposed within each depression. The adherence-reducing material reduces adherence between at least a portion of a structure and a corresponding landing pad.Type: ApplicationFiled: May 27, 2011Publication date: September 22, 2011Applicant: TEXAS INSTRUMENTS INCORPORATEDInventor: Walter M. Duncan
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Publication number: 20110215678Abstract: A piezoelectric vibration device includes a piezoelectric vibration plate where an excitation electrode is formed, and an upper lid member and a lower lid member that hermetically seal the excitation electrode, the piezoelectric vibration plate having a region where the upper lid member is joined and a region where the lower lid member is joined, on front and back main surfaces, the upper lid member having a region on one main surface where the piezoelectric vibration plate is joined, and the lower lid member having a region on one main surface where the piezoelectric vibration plate is joined. At least one of a substrate of the joining region of the piezoelectric vibration plate, a substrate of the joining region of the upper lid member, and a substrate of the joining region of the lower lid member has a roughened surface.Type: ApplicationFiled: December 24, 2009Publication date: September 8, 2011Applicant: DAISHINKU CORPORATIONInventors: Naoki Kohda, Hiroki Yoshioka
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Patent number: 8012362Abstract: Disclosed is an electronic shielding light-transmitting member having an adhesive (2) and an electromagnetic shielding material (3) between two release films (1) and (4). By removing one of the release films (1) and (4) from the electronic shielding light-transmitting member and bonding the member to an optical filter or a plasma panel, there can be obtained an optical filter or a plasma panel having an electromagnetic shielding layer of excellent transparency.Type: GrantFiled: June 1, 2006Date of Patent: September 6, 2011Assignee: Toppan Printing Co., Ltd.Inventors: Shinichi Usui, Yukihiro Ueda, Toshinori Machida, Naotoshi Nakamura, Shigemoto Kato, Kazuhito Tokutome
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Publication number: 20110210250Abstract: This invention provides a standard member allowing magnification calibration for use in an electron microscope to be performed with high precision. A (110) or (100) oriented silicon substrate including a magnification calibration pattern comprised of a constant pitch periodic pattern and a (110) or (100) oriented silicon substrate not including the constant pitch periodic pattern are bonded together by means of bonding without using an adhesive agent, while aligning the plane directions of the surfaces of the two substrates in the same orientation. Then, the thus bonded substrates are cleaved or diced so that their (111) surfaces or (110) surfaces become cross-section surfaces. Further, by selectively etching one side of the constant pitch periodic pattern, a standard member with no level difference and no damage to superlattice patterns and having a constant pitch concavity and convexity periodic pattern in a cross-section surface vertical to the substrate surface is created.Type: ApplicationFiled: October 22, 2009Publication date: September 1, 2011Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATIONInventors: Yoshinori Nakayama, Takashi Tase, Jiro Yamamoto
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Publication number: 20110204022Abstract: A method of manufacture includes an electrochemical cell structure having a first conductive member and a second conductive member. The first conductive member is spaced from the second conductive member. An adhesive is disposed between the first conductive member and the second conductive member. The adhesive has a solid state and a liquid state. The adhesive is liquefied to form a seal between the first conductive member and the second conductive member.Type: ApplicationFiled: April 29, 2011Publication date: August 25, 2011Inventors: Andrei Leonida, Robert J. Roy, Kurt Matthew Critz
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Publication number: 20110174772Abstract: A micro-fluid ejection device is assembled by wafer-to-wafer bonding at a temperature below about 150° C. a first silicon oxide layer of a first wafer, having flow features patterned in the first silicon oxide layer on an actuator chip in a first silicon substrate of the first wafer, to a second silicon oxide layer of a second wafer, defining a nozzle plate on a second silicon substrate of the second wafer. Nozzle holes are formed in the nozzle plate in alignment with actuator elements of the actuator chip of the first wafer either before or after bonding the first and second wafers together. The second silicon substrate of the second wafer is used as a handle and then removed from the silicon oxide layer of the second wafer after bonding the first and second wafers together.Type: ApplicationFiled: March 28, 2011Publication date: July 21, 2011Inventor: Zachary Justin Reitmeier
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Patent number: 7981237Abstract: A micro- or nano-fluidic chip fabricated with a Norland Optical Adhesive (NOA), an acrylated polyurethane-based UV-polymerizable optical adhesive. The micro- or nano-fluidic chip has sequentially an inlet, a channel, and an outlet. The channel has a pillar in the region of the outlet to prevent beads from flowing out, and the surface of the channels in the micro- or nano-fluidic chip is hydrophilic, which generates spontaneous flow in the channels by a capillary force without any extra external pumping.Type: GrantFiled: October 12, 2007Date of Patent: July 19, 2011Assignee: Ewha University-Industry Collaboration FoundationInventors: Sung Su Park, So Hyun Kim, Youn Sang Kim, Seong Won Nam, Kang Mu Lee
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Publication number: 20110141649Abstract: The present disclosure relates to a method for producing an insulated electrode comprising a conductive material coated with an electrically insulating material.Type: ApplicationFiled: August 20, 2009Publication date: June 16, 2011Inventors: Julien Villemejane, Bruno Le Pioufle, Luis Maria Mir, Olivier Francais, Jean-Pierre Lefevre
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Publication number: 20110134188Abstract: A nozzle plate includes: a nozzle plate main body made of metal, the nozzle plate main body having nozzle rows formed of nozzles arranged in parallel and penetrating the nozzle plate main body in a thickness direction, wherein at the outer edge of the nozzles on a droplet discharge surface of the nozzle plate main body, a water-repellent film is provided, and primer treatment is performed on at least part of the periphery of the droplet discharge surface of the nozzle plate main body, the periphery outside the water-repellent film.Type: ApplicationFiled: December 8, 2010Publication date: June 9, 2011Applicant: SEIKO EPSON CORPORATIONInventor: Katsuji ARAKAWA