Abstract: The invention discloses a method and apparatus for transferring nano-carbon material. The nano-carbon material is grown, by chemical vapor deposition, on a catalyst layer provided between a first and a second oxide layer of a multilayer film structure grown on a first substrate through chemical vapor deposition, and then separated from the first substrate by etching away the first and second oxide layers by a wet etching process. The separated nano-carbon material floats on the etchant, and is then pulled up by an etch-resistant continuous conveyance device and transferred to a second substrate. And, in a further imprinting process, large area nano-carbon material can be continuously imprinted onto the second substrate to show a particularly designed pattern.

Abstract: A method of fabricating a multilayer substrate may include bonding a front face of a donor substrate to a front face of a receiver substrate by molecular adhesion to form a stack and applying a heat treatment to the stack to consolidate a bond interface between the donor substrate and the receiver substrate. The method may further include thinning a back face of the donor substrate, trimming a periphery of the donor substrate and at least a portion of a periphery of the receiver substrate, and etching the back face of the donor substrate, the periphery of the donor substrate, and the at least a portion of the periphery of the receiver substrate subsequent to thinning the back face of the donor substrate and trimming the periphery of the donor substrate and the at least a portion of the periphery of the receiver substrate.

Abstract: A fabricating method and structure form a wafer level module with a solid adhesive film. A first solid adhesive film includes a first release film and a second release film that respectively cover a first surface and a second surface of the first solid adhesive film. Openings are patterned through the first solid adhesive film. After removing parts of the first release film to expose the first surface of the first solid adhesive film, the exposed first surface of the first solid adhesive film is aligned and adhered to a first substrate.

Abstract: An object of the invention is to provide a method of manufacturing a stacked crystal resonator whereby a large number of stacked crystal resonators formed on a wafer can be easily broken away from the wafer, and the risk of damage to the outside surfaces and the like of the stacked crystal resonators is reduced. There is formed a framed crystal plate connected to a first wafer by a first support section, a cover connected to a second wafer by a second support section, and a base connected to a third wafer by a third support section, and a thickness of at least one of the first support section through third support section is thinner than a thickness the connected wafer.

Abstract: A method for reducing the roughness of a free surface of a semiconductor wafer that includes establishing a first atmosphere in an annealing chamber, replacing the first atmosphere with a second atmosphere that includes a gas selected to and in an amount to substantially eliminate or reduce pollutants on a wafer, and exposing the free surface of the wafer to the second atmosphere to substantially eliminate or reduce pollutants thereon. The second atmosphere is then replaced with a third atmosphere that includes pure, and rapid thermal annealing is performed on the wafer exposed to the third atmosphere in the annealing chamber to substantially reduce the roughness of the free surface of the wafer.

Abstract: Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to bound the layer being created and thereafter adding additional layers to previously formed layers. The first and second depositions may be of the blanket or selective type. The repetition of the formation process for forming successive layers may be repeated with or without variations (e.g. variations in: patterns; numbers or existence of or parameters associated with depositions, etchings, and or planarization operations; the order of operations, or the materials deposited). Other embodiments form multi-layer structures using operations that interlace material deposited in association with some layers with material deposited in association with other layers.

Abstract: Disclosed are materials of variable density or tiered porosity micro-fluidic porous media structures of sintered metal or other materials, and methods of making same. An embodiment discloses an aluminum porous media element of variable density having a tiered porosity micro-fluidic media structure. A method of making the aluminum porous media element disclosed herein includes mixing a binding agent with a metal powder to generate a first mixture, heating the first mixture to a sub metal sintering temperature to get a homogeneous composite of the metal powder and heating the homogeneous composite to a metal sintering temperature to sinter-bond the metal powder to get a porous media of first porosity.

Abstract: A method for making a plurality of electromechanical devices including attaching a laminar electromechanical structure to a receiving substrate using a not appreciably cured adhesive in a liquid state, laser cutting the laminar electromechanical structure while the adhesive is not appreciably cured to form a plurality of electromechanical devices, and curing the adhesive.

Abstract: An object including at least one graphic element, including at least one at least partly transparent substrate, at least one face of which includes recesses forming a pattern of the graphic element filled with the at least one material, the face of the substrate being fixed to at least one face of at least one support by wafer bonding, the substrate and the support forming a monolithic structure.

Abstract: Novel catheter technology enabling use by individuals having limited dexterity are disclosed. The improvements include an apparatus and methods for emptying fluid from a fluid collection bag, a flow indicator on the fluid collection bag, and a convenient packaging for a catheterization kit containing these components. The apparatus and methods for emptying fluid from a fluid collection bag employ a drainage system including a plurality of tear off portions that expose drain tubes having different flow rates. Further, a flow indicator may be provided in the inlet port of the fluid collection bag. An attaching member is coupled to the fluid collection bag, enabling the fluid collection bag to be hung from a frame of a chair that a patient or user is sitting in.

Abstract: A micromachined thermal and mechanical isolator for MEMS die that may include two layers, a first layer with an active temperature regulator comprising a built-in heater and temperature sensor and a second layer having mechanical isolation beams supporting the die. The isolator may be inserted between a MEMS die of a disc resonator gyroscope (DRG) chip and the leadless chip carrier (LCC) package to isolate the die from stress and temperature gradients. Thermal and mechanical stress to the DRG can be significantly reduced in addition to mitigating temperature sensitivity of the DRG chip. The small form can drastically reduce cost and power consumption of the MEMS inertial sensor and enable new applications such as smart munitions, compact and integrated space navigation solutions, with significant potential cost savings over the existing inertial systems.

Abstract: The disclosure is directed to a barrier structure including a fluoropolymer layer, a polymeric layer, and an adhesive layer. The barrier structure has a chemical permeation breakthrough detection time greater than about one hour for hazardous chemicals as measured by ASTM F739. The disclosure is further directed to a method of forming the aforementioned barrier structure. The barrier material is designed to be suitable for construction of shelters, clothing, containers and other articles requiring barrier properties.

Abstract: A single layer micromachined thermal and mechanical isolator may be bonded between a microelectromechanical system (MEMS) die and package. Small bond pads of the isolator are attached to the periphery of the die. The isolator material may be chosen to match that of the die, reducing CTE mismatch. Long thin isolation beams can be used to provide thermal isolation against external temperature changes, which may be conducted through the package. Weak and flexible beams can be used to tolerate large displacements with very little resistance. Thus, excessive stress or distortion to the package, from either CTE mismatch or external stress, may be absorbed by the isolator and will not be transmitted to the MEMS die. Beam rigidity may be designed to attenuate vibration of particular frequency range. The isolator can be readily inserted into an existing disc resonator gyroscope package in one thermal compression bond step.

Abstract: Patterned layers including height control features are stacked and bonded to form microchannels in a micro-fluidic device. The heights of the microchannels are determined by the height control features of the patterned layers. Side walls of the microchannels are partially formed or completely formed by the height control features. Layers are bonded together with a bonding agent disposed between the layers and outside the microchannels near the microchannel side walls. This approach provides numerous significant advantages. Material consumption can be reduced by up to 50%. Mass production can be made easier. Lateral dimensions of microchannels can be more readily controlled. Erosion of the bonding agent by flow through the microchannels can be greatly reduced.

Abstract: A method of coarse enameling material, such as the surface of conventional rebar, which increases adhesion between the surface and a matrix, such as a cement-based mortar or concrete, in which the material is embedded. In one embodiment, a glass fit is fired onto a surface to achieve an enamel finish, the finish is then cooled and heat softened. A refractory material, such as dry portland cement, is applied to the heat softened enamel, and the resultant coarse coating is then fired and cooled to produce a final hard coarse enameled surface. The reaction of the refractory component in the coarse enameled surface upon insertion in fresh mortar or concrete prevents the formation of soft precipitates at the interface of the cementitious matrix and the coarse-enameled reinforcement. One embodiment involves adding portland cement Type I-II to a softened glass frit as a final coating over an initial base coating that if fired on the steel to prevent corrosion of the underlying steel.

Abstract: A method for forming a micromachined device is disclosed that includes providing a first silicon layer and a second silicon layer. A coating is provided on a first portion of the first layer. The first layer and the second layer are bonded to each other to form a micromachined device, the coating being effective to prevent the coated first portion of the first layer from bonding to the second layer.

Abstract: The present invention conveniently and practically addresses a significant need. The invention provides pens that are clearly labeled with a phrase to indicate that the pens contain GMP-compliant indelible ink. In one aspect, the invention provides an apparatus for writing, comprising: (i) indelible ink; (ii) a construction suitable for containing the indelible ink; and (iii) a text-based label on an outer surface of the construction, wherein the label comprises a word or phrase intended to validate the apparatus for GMP compliance, FDA compliance, and/or EMEA compliance. In another aspect, a method is disclosed for providing a writing procedure that is GMP-compliant, FDA-compliant, and/or EMEA-compliant. In yet another aspect, the invention describes a method for labeling a pen containing indelible ink.

Abstract: A sheet 1 for shielding soft X-rays comprises a first outer sheet, an interlayer sheet, and a second outer sheet. In the first outer sheet a port for supplying ionized air is formed. In the interlayer sheet a passage for the ionized air, which passage communicates with the port for supplying the ionized air, is formed. In the second outer sheet a port for discharging the ionized air, which port communicates with the passage for the ionized air, is formed. The sheets 2, 3, and 4 are stacked and adhered so that the sheet 1 has one or more portions 9 for transmitting the ionized air, which portions connect the port for supplying the ionized air, the passage for the ionized air, and the port for discharging the ionized air.

Abstract: It is aimed to promote further integration of channels in a reactor. A channel forming body of a reactor is provided with a base plate, a first sealing member bonded to one surface of the base plate while covering the one surface, and a second sealing member bonded to the other surface of the base plate while covering the other surface. A plurality of first inlet grooves for forming the first inlet paths are formed in parallel and side by side and a plurality of reaction grooves for forming the reaction grooves are formed in parallel and side by side in the one surface of the base plate. On the other hand, a plurality of second inlet grooves for forming the second inlet paths are formed in parallel and side by side in the other surface of the base plate.

Abstract: A method for manufacturing a susceptor includes: forming a concave pattern in a surface of a substrate to be processed; applying a SiC paste containing a SiC powder and a sintering agent to the surface of the substrate to be processed to fill the concave pattern to form a SiC coating layer; laminating a SiC substrate on the SiC coating layer; and firing the SiC coating layer to form a SiC layer having at least one convex section on the surface of the SiC substrate.

Abstract: An object of the present invention is to create, from a titanium alloy and an FRP prepreg, a composite of a titanium alloy and an FRP material that is suitable for bolt fastening. The composite can bring out excellent characteristics in CFRP members in mobile electronic-electric devices, mobile equipment, medical instruments, marine devices and the like. It has been found that titanium alloy having a special constant surface shape adheres strongly with an epoxy adhesive. In a composite obtained using this technique to integrate a titanium alloy member as a cover material and a CFRP material, the metal alloy portion deforms and disperses locally strong forces so that the CFRP material is not damaged, even when the composite is assembled to another metal member through bolt-fastening. As a result, the composite is expected to be effective for applications in mobile equipment or mobile device casings, where lightweightness, corrosion resistance, toughness and ease of assembly are required.

Abstract: The invention relates to a method that is particularly suitable for the repair of damaged composite fibre components with integrated fibre optics on aircraft. The method involves: a) pre-treating damaged area, in particular by mechanical removal of material, at least in certain areas; b) disclosing fibre optic in an edge area of damaged area, in particular by a chemical etching process, c) splicing in a bridging fibre optic for restoring the optical connection; and d) gluing in and/or over a repair patch. The invention also relates to a device with two containers connected by a valve and a contact body connected by a flexible pipe to second container. The container contains an acid for carrying out the actual etching process, and second container is filled with lye for neutralising the acid after completion of the etching process.

Abstract: An object of the present invention is to manufacture a lightweight and strong composite of a magnesium alloy and a CFRP, by strongly bonding the magnesium alloy and the CFRP using an epoxy adhesive. The magnesium alloy having specific ultra-fine irregularities is compatible with an epoxy resin adhesive and exhibits thus strong adhesion. A magnesium alloy composite plate material 23, in which magnesium alloy plates 25 and a CFRP 24 are integrated by exploiting this technique, can be used in ordinary assembly structures with other metal members 28 and bolts 27. The magnesium alloy plates 25 can withstand strong local forces, and hence the CFRP 24 is not damaged. As a result, the composite is effective for applications in, for instance, casings, bodies and parts in mobile equipment such as automobiles or in mobile devices, where lightweightness, toughness and ease of assembly are required.

Abstract: The object of the present invention is to strongly join an aluminum alloy part with an FRP prepreg. An object obtained by subjecting an aluminum alloy to a suitable liquid treatment so as to form a surface having large, micron-order irregularities and also fine irregularities with a period of several tens of nanometers, eliminating the presence of sodium ions from the surface and additionally forming a surface film of aluminum oxide, which is thicker than a natural oxide layer, has been found to have a powerful adhesive strength with epoxy-based adhesives. By simultaneously curing an FRP prepreg which uses the same epoxy-based adhesive in the matrix, an integral composite or structure in which FRP and aluminum alloy have been united at a joining strength of unprecedented magnitude is produced.

Abstract: A method for producing a micromechanical component is proposed, a trench structure being substantially completely filled up by a first filler layer, and a first mask layer being applied on the first filler layer, on which in turn a second filler layer and a second mask layer are applied. A micromechanical component is also proposed, the first filler layer filling up the trench structure of the micromechanical component and at the same time forming a movable sensor structure.

Abstract: A mirror package is provided which can reflect a laser to an external screen according to a video signal when the laser enters from outside, and a method of manufacturing the mirror package. The mirror is packaged with a glass to protect from external contamination, an inlet and an outlet are formed by, for example, an anisotropic etching on the glass and blocks a reflected light reflected from the glass. The mirror package is formed as a set, combined on a wafer using a wafer level package and diced to individual chips. Subsequently, a productivity is improved and a ghost image or phenomenon is removed.

Abstract: A microfluidic structure includes a first layer (1) containing an active fluidic device (4); a second layer (3) containing an interconnect channel (6) for connecting the device (4) to a fluid source and/or outlet and/or another device and an intermediate layer (2) for defining at least one via (5) defining a fluid passage way between the device (4) and the interconnect channel (6) wherein the flow paths through the device (4) and the interconnect channel (6) are generally parallel.

Abstract: An information storage medium and method of manufacturing such a medium, particularly applicable to computer hard disks. An information storage medium includes an approximately plane front face and a back face, the medium being read and/or written by a device placed facing the front face. The back face includes recessed areas and all or part of sidewalls and/or the bottom of the recessed areas is covered with a magnetic deposit, the distance separating the front face from the deposit being such that the device can read and/or write information in the deposit.

Abstract: A method of manufacturing bonded substrate structures. The method includes providing a first substrate comprising a first surface region and processing the first surface region to form a first pattern region using a first photolithographic stepper characterized by a first tolerance criteria for alignment. The method also includes providing a second substrate comprising a second surface region and processing the second surface region through at least one masking process to form a second pattern region using a second photolithographic stepper characterized by a second tolerance criteria for alignment.

Abstract: Polyimide substrates are bonded to germanium wafers having an epitaxially grown III-V layer and a metal layer. The polyimide substrate and the Ge wafer are subsequently thinned by grinding and etching to reach a final thickness of 25 ?ms Ge on 25 ?ms adhesive layer on 50 ?ms polyimide substrate. The choice of adhesive is of paramount importance. There are several requirements for the adhesive layer to act as a permanent carrier of the thin fragile multijunction solar cell. The adhesive must remain flexible after curing and have a low CTE. It is desired to use an adhesive that cures without the addition of heat, preferably at room temperature. Furthermore, the adhesive layer should have a uniform thickness preferably less than 25 ?ms (1 mil) and be void-free. It is desired to use a clear adhesive which does not contain any particles in order to obtain a smooth uniform void-free bondline. However, clear adhesives have CTE's that are larger than 80 ppm/° C. and which can be as high as 200 ppm/° C.

Abstract: A method for preparing TEM sample, comprising the following steps: providing a sample with two pits and a failure region between the two pits, the failure region comprising a semiconductor device; milling the first surface of the failure region, till the cross section of the semiconductor device is exposed; etching the first surface of the failure region; cleaning the sample; milling the second surface of the failure region, till the failure region can be passed by electron beam. A sample can be prepared for a high resolution TEM through above steps. When the sample is observed, it is easy to distinguish the lightly doped drain, source/drain regions from the silicon substrate and observe the pattern and defects in the lightly doped drain, source/drain regions clearly; in addition, it is easy to distinguish the BPSG from the non-doped silicon dioxide in the failure region.

Abstract: The present invention provides a laminated material for metal key-sheet to be used for input button portion of information terminal devices, the laminated material for metal key-sheet including: at least a transparent resin sheet and a metal plate, wherein cut-out letters and so on are formed in the laminated material by etching. The present invention also provides a metal key-sheet in which cut-out letters with a lot of flexibility of design can be formed, and a metal keypad which can be produced by simple methods.

Abstract: A method for preparing an oxidized surface of a first wafer for bonding with a second wafer. The method includes treating the oxidized surface with a solution of NH4OH/H2O2 at treatment parameters sufficient to etch about 10 ? to about 120 ? from the wafer surface, followed by treating the etched surface with hydrochloric acid species at a temperature below about 50° C. for a duration of less than about 10 minutes to remove isolated particles from the oxidized surface. This method cleans the wafer surface without increasing roughness or creating rough patches thereon, and thus provides a cleaned surface capable of providing an increased bonding energy between the first and second wafers when those surfaces are bonded together. This cleaning process is advantageously used in a thin layer removal process to fabricate a semiconductor on insulator structure.

Abstract: A method of forming an actuator and a relay using a micro-electromechanical (MEMS)-based process is disclosed. The method first forms the lower sections of a square copper coil, and then forms an actuation member that includes a core section and a horizontally adjacent floating cantilever section. The core section, which lies directly over the lower coil sections, is electrically isolated from the lower coil sections. The method next forms the side and upper sections of the coil, along with first and second electrodes that are separated by a switch gap. The first electrode lies directly over an end of the core section, while the second electrode lies directly over an end of the floating cantilever section.

Abstract: Embodiments of method of manufacturing an implantable pump, including providing an upper layer comprising a dome structure for housing a drug chamber and a cannula in fluid communication with the drug chamber, providing a middle deflection layer adjacent the drug chamber, providing a bottom layer comprising electrolysis electrodes, and bonding the upper layer, middle deflection layer, and bottom layer to form the pump.

Abstract: Provided is a method of forming a nanostructure having a nano-sized diameter and a high aspect ratio through a simple and economical process. To form the nanostructure, a polymer thin film is formed on a substrate and a mold is brought to contact the polymer thin film. Then, a polymer patterning is formed to contact the background surface of an engraved part of the mold, and then the polymer pattern is extended out by removing the mold out of the polymer thin film. The nanostructure forming method of the present research can reproduce diverse cilia optimized in the natural world. Also, it can be used to develop new materials with an ultra-hydrophobic property or a high adhesiveness. Further, it can be applied to a nanopattern forming process for miniaturizing electronic devices and to various ultra-precise industrial technologies together with carbon nanotube, which stands in the highlight recently.

Abstract: A piezoelectric element comprises a first laminated structure body and a second laminated structure body. Side surfaces of the first and the second laminated structure bodies that are parallel to a laminating direction both have at least a portion etched to form a recess so that a step distance is formed between sides of the two adjacent electrode layers that are parallel to the laminating direction. The design of the step distance of the present invention increases insulation resistance between the two adjacent electrode layers on the opposite surfaces of the piezoelectric layer, lowers reject rate, and reduce manufacture cost. The first and the second laminated structure bodies are symmetrically laminated and bonded together, thus optimizing force balancing performance. The recess of the first and second laminated structure body may be filled with insulation resin, which also increases insulation resistance between the two adjacent electrode layers of the piezoelectric layer.

Abstract: A housing for an electronic device comprises a thin film defining concave portions thereon; a decorative pattern having a mirror-effect formed in the concave portions; and a substrate attached to the decorative pattern and the thin film. A method for manufacturing the housing and an electronic device using the housing are also disclosed.

Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

Abstract: Submounts for mounting optical devices which have an excellent heat radiating property and can be formed in a wafer state in batch are provided. A metallized electrode including optical device mounting parts and wiring parts is formed on a surface of a first substrate containing an insulating material as a main component, a through hole is formed in a glass substrate serving as a second substrate, the optical device mounting parts of the first substrate are aligned to be located inside the through hole of the second substrate, and the first substrate and the second substrate are joined together by use of a method such as anodic bonding.

Abstract: Embodiments of the present invention provide mesoscale or microscale three-dimensional structures (e.g. components, device, and the like). Embodiments relate to one or more of (1) the formation of such structures which incorporate sheets of dielectric material and/or wherein seed layer material used to allow electrodeposition over dielectric material is removed via planarization operations; (2) the formation of such structures wherein masks used for at least some selective patterning operations are obtained through transfer plating of masking material to a surface of a substrate or previously formed layer, and/or (3) the formation of such structures wherein masks used for forming at least portions of some layers are patterned on the build surface directly from data representing the mask configuration, e.g. in some embodiments mask patterning is achieved by selectively dispensing material via a computer controlled inkjet nozzle or array or via a computer controlled extrusion device.

Abstract: Provided is a microchip including a substrate, a channel on the substrate, a lid sealing the channel, and an upper lid bonded to the lid. The lid is formed of an elastic material. The lid is detachable from the substrate. The upper lid is formed of a material harder than the elastic material. The area of the upper lid surface that is bonded to the lid is smaller than the area of the upper surface of the lid.

Abstract: A ceramic-copper foil bonding method includes wet-oxidizing a copper foil such that a surface of the copper foil is oxidized to a copper oxide layer, contacting the copper oxide layer with a surface of a ceramic substrate, and bonding the copper oxide layer of the copper foil to the surface of the ceramic substrate by heat treatment. Preferably, a protective layer is provided on an opposite surface of the copper foil so that the opposite surface is not oxidized during wet-oxidizing the copper foil.

Abstract: A method of multi-stage substrate etching is provided.

Abstract: A method of eliminating, using a beam of laser radiation, defects lying within a laminate formed from at least a first substrate and from at least a second substrate. The laminate incorporates, between the first and second substrates, at least one smart active system. The method locates at least one defect lying within the active system and ablates the defect, by circumscribing the defect using a laser beam.

Abstract: Means for enabling plating on sites of complex configuration, etching for fine complex pattern, etc. through reduction of the viscosity resistance brought about by walls of fine liquid channel of microreactor. In particular, a microreactor comprising a liquid inlet, a fine liquid channel and a liquid discharge zone characterized in that the liquid channel is formed of a magnetic barrier of band ferromagnet so that a magnetic liquid introduced through the inlet undergoes at least one operation of chemical reaction, mixing, extraction and absorption in the liquid channel. Further, there is provided means for plating or etching performed by causing a plating solution or an etching solution to flow through the liquid channel.

Abstract: Methods of forming a fluid channel in a semiconductor substrate may include applying a material layer to at least one surface of the semiconductor substrate. The method may further include manipulating the material layer to form a surface topography corresponding to a channel, the surface topography being configured to control directionality of ion bombardment of said substrate along electromagnetic field lines in a plasma sheath coupled to said surface topography.

Abstract: A method for producing a nozzle plate comprises a liquid-repellant coat removal step for conducting a plasma treatment to each chip from a same side as a liquid droplet ejecting surface under an atmospheric pressure, while supplying a gaseous mask material for protection of the liquid-repellant coat through nozzle holes from an opposite side of the liquid droplet ejecting surface in such a manner that the gaseous mask material is leaked out over the liquid droplet ejecting surface around the nozzle holes, to thereby remove the liquid-repellant coat exposed outside the mask material; and a bonding step for bonding each chip to the nozzle plate body at the area from which the liquid-repellant coat is removed by the liquid-repellant coat removal step.

Abstract: A method for manufacturing an electronic component includes preparing an element substrate having a function section for providing a function of an electronic component, and an external-connection electrode; bonding a low-sandblast-resistant case plate to the element substrate through a high-sandblast-resistant adhesive layer; forming, by sandblast processing, a hole in the case plate above the external-connection electrode so that the adhesive layer is exposed to the outside; removing, by etching, an adhesive layer portion that is exposed in the hole; forming an electrode film so as to be electrically connected to the exposed external-connection electrode; and forming, by mechanical machining, a projection having a leading end surface on which a terminal electrode resulting from the electrode film is defined.

Abstract: A nozzle structure is provided comprising a monolithic body having an array of nozzles. The nozzles having openings with sectional openings having heights of about 100 nm or less. The nozzles are generally associated with one or more well structures.