Nongaseous Phase Etching Of Substrate Patents (Class 216/83)
  • Publication number: 20150027769
    Abstract: The method for producing a patterned layer of first material on a surface of a substrate comprises the following successive steps: arranging a particle on the surface of the substrate; depositing a resin by spin coating on the surface of the substrate so as to form the patterned layer of first material and a hole passing through the layer of first material and opening onto the particle; the material of the particle and the resin being chosen such that the particle exerts a repulsive interaction with respect to the resin.
    Type: Application
    Filed: July 29, 2014
    Publication date: January 29, 2015
    Inventors: Thomas SEBASTIEN, Messaoud BEDJAOUI, Aboubakr ENNAJDAOUI
  • Patent number: 8940177
    Abstract: A method of manufacturing a roll-shaped mold includes: an immersing step of immersing a roll-shaped mold main body into a treatment agent; a first removing step of exposing a portion of the mold main body from a liquid level of the treatment agent in which a central axis of the mold main body is inclined with respect to a horizontal surface; a second removing step in which the mold main body is moved in relation to the liquid level of the treatment agent in which a meniscus is sustained between the exposed portion of the mold main body and the liquid level of the treatment agent and thereby further exposing the mold main body; and a third removing step of removing the entire mold main body from the treatment agent in which the central axis of the mold main body is inclined with respect to the horizontal surface.
    Type: Grant
    Filed: June 20, 2012
    Date of Patent: January 27, 2015
    Assignee: Mitsubishi Rayon Co., Ltd.
    Inventors: Tokuho Maki, Masatoshi Kamata
  • Publication number: 20150021293
    Abstract: A method for providing a nanopattern of periodically ordered metal oxide nanostructures on a substrate is described. The method comprises the steps of providing a microphase separated block copolymer as a thin film on a substrate, the block copolymer comprising a first polymer having an affinity for a cations of the metal and a second polymer having a lower affinity for the cations than the first polymer, and selectively incorporating a salt of the metal cation into the first polymer of the block copolymer by means of a solvation process prior to or after formation of the microphase separated block copolymer. The block copolymer film is then treated to oxidise the metal ion salt and remove the polymers leaving a nanopattern of metal oxide nanostructures on the substrate.
    Type: Application
    Filed: November 16, 2012
    Publication date: January 22, 2015
    Inventors: Michael Morris, Dipu Borah, Tandra Ghoshal, Parvaneh Mokarian
  • Patent number: 8936730
    Abstract: An apparatus used for forming stud bumps may be formed by providing a first clamp plate comprising a clamping surface, forming a notcher on the clamping surface, and forming a contact stopper on the clamping surface. The apparatus may include a clamp that includes at least two opposing plates, and at least one of the opposing plates includes a protruding feature that intersects the wire when the wire is clamped forming a first notch in the wire. The method for forming stud bumps includes bonding wire to a bonding surface, releasing the wire from the clamp, passing the wire a notch pitch distance through the clamp, clamping the wire with the clamp forming a second notch in the wire, and breaking the wire leaving a bonded portion of the wire on the bonding surface.
    Type: Grant
    Filed: August 6, 2013
    Date of Patent: January 20, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Chung-Shi Liu, Mirng-Ji Lii, Chen-Hua Yu, Yi-Li Hsiao
  • Patent number: 8932473
    Abstract: The invention relates to a method for making a 3D nanostructure having a nanosubstructure, comprising the steps of: i) providing a mold comprising at least one sharp concave corner; ii) conformational depositing at least one structural material in the sharp concave corner; iii) isotropically removing structural material; iv) depositing at least one other structural material; v) removing earlier deposited structural material; vi) forming a nanosubstructure; and vii) removing the mold thereby providing the 3D nanostructure having the nanosubstructure.
    Type: Grant
    Filed: December 22, 2008
    Date of Patent: January 13, 2015
    Assignee: Universiteit Twente
    Inventors: Johan Willem Berenschot, Niels Roelof Tas
  • Patent number: 8927430
    Abstract: In one exemplary embodiment of the invention, a method includes: providing a structure having a first layer overlying a substrate, where the first layer includes a dielectric material having a plurality of pores; applying a filling material to a surface of the first layer; after applying the filling material, heating the structure to enable the filling material to at least partially fill the plurality of pores, where heating the structure results in residual filling material being left on the surface of the first layer; and after heating the structure, removing the residual filling material by applying a solvent wash.
    Type: Grant
    Filed: July 12, 2011
    Date of Patent: January 6, 2015
    Assignee: International Business Machines Corporation
    Inventors: Robert L. Bruce, Geraud Jean-Michel Dubois, Theo J. Frot, Willi Volksen
  • Patent number: 8926849
    Abstract: A diffraction-type 3D display element is arranged on an image output face of a 3D display device and comprises a first diffraction area and a second diffraction area. The first diffraction area has a plurality of first stepped gratings spaced apart from each other. The second diffraction area has a plurality of second stepped gratings spaced apart from each other. The second diffraction area is adjacent to the first diffraction area and is arranged symmetrically to the first diffraction area with a central line being the symmetric axis. The diffraction-type 3D display element of the invention diffracts the images output by the 3D display device and projects the diffracted images to two different viewing areas to provide 3D images for users.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: January 6, 2015
    Assignee: National Yunlin University of Science and Technology
    Inventors: Chien-Yue Chen, Wen-Chen Hung, Yao-Ru Chang
  • Patent number: 8926853
    Abstract: Aspects of the invention are directed to a method of forming graphene structures. Initially, a cluster of particles is received. The cluster of particles comprises a plurality of particles with each particle in the plurality of particles contacting one or more other particles in the plurality of particles. Subsequently, one or more layers are deposited on the cluster of particles with the one or more layers comprising graphene. The plurality of particles are then etched away without substantially etching the deposited one or more layers. Lastly, the remaining one or more layers are dried. The resultant graphene structures are particularly resistant to the negative effects of aggregation and compaction.
    Type: Grant
    Filed: August 23, 2012
    Date of Patent: January 6, 2015
    Inventors: Xin Zhao, Yu-Ming Lin
  • Patent number: 8920625
    Abstract: Provided is a particle that includes a first porous region and a second porous region that differs from the first porous region. Also provided is a particle that has a wet etched porous region and that does have a nucleation layer associated with wet etching. Methods of making porous particles are also provided.
    Type: Grant
    Filed: April 28, 2008
    Date of Patent: December 30, 2014
    Assignees: Board of Regents of the University of Texas System, The Ohio State University Research Foundation
    Inventors: Mauro Ferrari, Xuewu Liu, Ming-Cheng Cheng
  • Publication number: 20140374268
    Abstract: According to embodiments of the present invention, a method for forming a composite film is provided. The method includes providing a nanowire forming template, forming a plurality of nanowires through the nanowire forming template, removing material from a partial portion of the nanowire forming template to expose a portion of the plurality of nanowires, and forming a polymeric film between the plurality of nanowires to form a composite film.
    Type: Application
    Filed: June 24, 2014
    Publication date: December 25, 2014
    Applicant: Agency for Science, Technology and Research
    Inventors: Yongling WU, Wei HE
  • Patent number: 8916057
    Abstract: The present disclosure relates to a graphene roll-to-roll transfer method, a graphene roll-to-roll transfer apparatus, a graphene roll manufactured by the graphene roll-to-roll transfer method, and uses thereof.
    Type: Grant
    Filed: April 16, 2012
    Date of Patent: December 23, 2014
    Assignee: Graphene Square, Inc.
    Inventors: Byung Hee Hong, Jonghyun Ahn, Sukang Bae, Hyeong Keun Kim
  • Publication number: 20140367560
    Abstract: A scale for a photoelectric encoder includes a scale substrate and a reflection film formed at a predetermined pitch on the scale substrate. A surface of the reflection film forms a reflection surface. A low-reflection surface is formed by etching the scale substrate between reflection films. Accordingly, a scale can be provided which is lower in cost and has favorable yield rates.
    Type: Application
    Filed: May 22, 2014
    Publication date: December 18, 2014
    Applicant: MITUTOYO CORPORATION
    Inventor: Fujio MAEDA
  • Patent number: 8911636
    Abstract: A method of fabricating a micro-device having micro-features on glass is presented. The method includes the steps of preparing a first glass substrate, fabricating a metallic pattern on the first glass substrate, preparing a second glass substrate and providing one or more apertures on the second glass substrate, heating the first glass substrate and the second glass substrate with a controlled temperature raise, bonding the first glass substrate and the second glass substrate by applying pressure to form a bonded substrate, wherein the metallic pattern is embedded within the bonded substrate, cooling the bonded substrate with a controlled temperature drop and thereafter maintaining the bonded substrate at a temperature suitable for etching, etching the metallic pattern within the bonded substrate, wherein an etchant has access to the metallic pattern via the apertures, forming a void within the bonded substrate, wherein the void comprises micro-features.
    Type: Grant
    Filed: September 29, 2013
    Date of Patent: December 16, 2014
    Inventor: Viswanadam Gautham
  • Publication number: 20140360980
    Abstract: A method of preparing a solution capable of etching a platable plastic. The method comprises the steps of: (a) providing an electrolyte comprising a solution of manganese(II) in a solution of 9 to 15 molar sulfuric acid or phosphoric acid to an electrolytic cell; (b) applying a current to the electrolytic cell, wherein the electrolytic cell comprises an anode and a cathode; and (c) oxidizing the electrolyte to form manganese(III) ions, wherein the manganese(III) ions form a metastable sulfate complex. Thereafter, a platable plastic may be immersed in the metastable sulfate complex for a period of time to etch the platable substrate prior to subsequent plating steps.
    Type: Application
    Filed: August 25, 2014
    Publication date: December 11, 2014
    Inventors: Trevor Pearson, Craig Robinson
  • Publication number: 20140360981
    Abstract: A medical contrast agent made of microbubbles containing Au nanoclusters is provided. The shell of the microbubbles contains fluorescent Au nanocluster-albumin complex, and the core contains air or fluorocarbons. The method for preparing the microbubbles is also disclosed.
    Type: Application
    Filed: August 26, 2014
    Publication date: December 11, 2014
    Inventors: Cheng-An J. Lin, Walter Hong-Shong CHANG, Chih-Hsien LEE, Wen-Kai CHUANG
  • Patent number: 8900478
    Abstract: Disclosed are an etchant which is used for redistribution of a semiconductor substrate having an electrode and which is capable of selectively etching copper without etching nickel; and a method for manufacturing a semiconductor device using the same. Specifically disclosed are an etchant which is used for redistribution of a semiconductor substrate and which contains hydrogen peroxide and citric acid and has a content of hydrogen peroxide of from 0.75 to 12% by mass and a content of citric acid of from 1 to 20% by mass, with a molar ratio of hydrogen peroxide and citric acid being in the range of from 0.3 to 5; an etchant for selective etching of copper which is used for redistribution of a semiconductor substrate and which contains hydrogen peroxide and malic acid and has a content of hydrogen peroxide of from 0.75 to 12% by mass and a content of malic acid of from 1.5 to 25% by mass, with a molar ratio of hydrogen peroxide and malic acid being in the range of from 0.
    Type: Grant
    Filed: December 14, 2010
    Date of Patent: December 2, 2014
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Akira Hosomi, Kensuke Ohmae
  • Patent number: 8900472
    Abstract: A liquid agent for the surface treatment of monocrystalline wafers, which contains an alkaline etching agent and also at least one low-volatile organic compound. Systems of this type can be used both for the cleaning, damage etch and texturing of wafer surfaces in a single etching step and exclusively for the texturing of silicon wafers with different surface quality, whether it now be wire-sawn wafers with high surface damage or chemically polished surfaces with minimum damage density.
    Type: Grant
    Filed: June 2, 2010
    Date of Patent: December 2, 2014
    Assignee: Fraunhofer-Gesellschaft zur Föerderung der angewandten Forschung E.V.
    Inventors: Kuno Mayer, Mark Schumann, Daniel Kray, Teresa Orellana Peres, Jochen Rentsch, Martin Zimmer, Elias Kirchgässner, Eva Zimmer, Daniel Biro, Arpad Mihai Rostas, Filip Granek
  • Patent number: 8900464
    Abstract: A microelectronic interconnect element can include a plurality of first metal lines and a plurality of second metal lines interleaved with the first metal lines. Each of the first and second metal lines has a surface extending within the same reference plane. The first metal lines have surfaces above the reference plane and remote therefrom and the second metal lines have surfaces below the reference plane and remote therefrom. A dielectric layer can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines.
    Type: Grant
    Filed: June 10, 2013
    Date of Patent: December 2, 2014
    Assignee: Invensas Corporation
    Inventors: Chang Myung Ryu, Kimitaka Endo, Belgacem Haba, Yoichi Kubota
  • Publication number: 20140346930
    Abstract: The present invention relates to an electronic component package, an electronic component package sealing member, and a method for producing the electronic component package sealing member. A through hole 49 is formed in a base 4 so as to pass through between both main surfaces 42 and 43 of a base material of the base 4. An inner side surface 491 of the through hole 49 includes a curved surface 495 that expands outward in a width direction of the through hole 49.
    Type: Application
    Filed: September 28, 2012
    Publication date: November 27, 2014
    Inventor: Naoki Kohda
  • Publication number: 20140339192
    Abstract: A three-dimensional object fabrication method and apparatus to fabricate a three-dimensional object from a foamed material are provided. The method includes applying a solvent to dissolve the foamed material; dissolving and contracting the foamed material; and molding a three-dimensional object. The solvent is applied to a surface of the foamed material, thereby dissolving and contracting of the foamed material in a depth direction, or otherwise, the solvent is applied to an interior portion of the foamed material, thereby releasing air contained inside the foamed material and starting contraction of the foamed material itself. The method further includes adjusting an amount of the solvent depending on a thickness of the three-dimensional object, filling in a recess or a concavity formed in the foamed material with a molding material; solidifying the molding material as a mold; and transferring a shape of the recess or the concavity to the molding material.
    Type: Application
    Filed: May 9, 2014
    Publication date: November 20, 2014
    Applicant: RICOH COMPANY, LTD.
    Inventor: Satoshi Kitaoka
  • Publication number: 20140342156
    Abstract: A product formed from a first material including a geopolymer resin material, a geopolymer resin, or a combination thereof by contacting the first material with a fluid and removing at least some of the fluid to yield a product. The first material may be formed by heating and/or aging an initial geopolymer resin material to yield the first material before contacting the first material with the fluid. In some cases, contacting the first material with the fluid breaks up or disintegrates the first material (e.g., in response to contact with the fluid and in the absence of external mechanical stress), thereby forming particles having an external dimension in a range between 1 nm and 2 cm.
    Type: Application
    Filed: September 21, 2012
    Publication date: November 20, 2014
    Inventors: Dong-Kyun Seo, Dinesh Medpelli, Danielle Ladd, Milad Mesgar
  • Patent number: 8889025
    Abstract: This disclosure relates to a method for manufacturing a semiconductor device. The method includes etching a metal film on a semiconductor substrate with an etching composition; and rinsing the etched metal film with a rinse solvent. The etching composition includes at least one acid; at least one compound containing a halide anion, the halide anion being chloride or bromide; at least one compound containing a nitrate or nitrosyl ion; and water.
    Type: Grant
    Filed: January 2, 2014
    Date of Patent: November 18, 2014
    Assignees: Fujifilm Electronic Materials U.S.A., Inc., FujiFilm Corporation
    Inventors: Tomonori Takahashi, Tadashi Inaba, Atsushi Mizutani, Bing Du, William A. Wojtczak, Kazutaka Takahashi, Tetsuya Kamimura
  • Patent number: 8889559
    Abstract: A method of forming a pattern on a substrate includes forming spaced first material-comprising pillars projecting elevationally outward of first openings formed in second material. Sidewall spacers are formed over sidewalls of the first material-comprising pillars. The sidewall spacers form interstitial spaces laterally outward of the first material-comprising pillars. The interstitial spaces are individually surrounded by longitudinally-contacting sidewall spacers that are over sidewalls of four of the first material-comprising pillars.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: November 18, 2014
    Assignee: Micron Technology, Inc.
    Inventors: Shane J. Trapp, Ranjan Khurana, Kevin R. Shea
  • Patent number: 8883033
    Abstract: A method for removing silicon nitride material includes following steps. A substrate having at least a gate structure formed thereon is provided, and at least a silicon nitride hard mask is formed on top of the gate structure. A first removal is performed to remove a portion of the silicon nitride hard mask with a first phosphoric acid (H3PO4) solution. A second removal is subsequently performed to remove remnant silicon nitride hard mask with a second phosphoric acid solution. The first removal and the second removal are performed in-situ. A temperature of the second phosphoric acid solution is lower than a temperature of the first phosphoric acid solution.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: November 11, 2014
    Assignee: United Microelectronics Corp.
    Inventors: Chi-Sheng Chen, Shin-Chi Chen, Chih-Yueh Li, Ted Ming-Lang Guo, Bo-Syuan Lee, Tsung-Hsun Tsai, Yu-Chin Cheng
  • Patent number: 8883030
    Abstract: A substrate processing apparatus comprising a substrate holding rotating mechanism, a process liquid supply mechanism having a nozzle for dispensing a process liquid toward a principal face of the substrate, a processing liquid reservoir for holding sufficient process liquid to form a liquid film covering the whole principal face of the substrate, a liquid film forming unit for forming the liquid film by supplying the process liquid onto the principal face of the substrate in a single burst, and a control unit for controlling the liquid film forming unit and the process liquid supply mechanism such that the process liquid is dispensed from the process liquid nozzle toward the principal face of the substrate after formation of the liquid film covering the whole area of the principal face of the substrate by the liquid film forming unit.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: November 11, 2014
    Assignee: SCREEN Holdings Co., Ltd.
    Inventors: Masahiro Miyagi, Koji Hashimoto, Toru Endo
  • Publication number: 20140329052
    Abstract: The present invention provides implant devices comprising nanoscale structures on the surface thereof and methods of manufacturing such implant devices. In some embodiments, methods of manufacturing an implant device comprise exposing a surface of the implant device to an oxidative hydrothermal environment for a duration sufficient to generate nanoscale structures on the exposed surface(s) of the implant device.
    Type: Application
    Filed: December 7, 2012
    Publication date: November 6, 2014
    Inventors: Rolando A. Gittens Ibacache, Jonathan Vernon, Kenneth H. Sandhage, Barbara D. Boyan
  • Patent number: 8877077
    Abstract: A method of printing comprises the steps of: providing a solid state material having an exposed surface; applying an auxiliary layer to the exposed surface to form a composite structure, the auxiliary layer having a stress pattern; subjecting the composite structure to conditions facilitating fracture of the solid state material along a plane at a depth therein; and removing the auxiliary layer and, therewith, a layer of the solid state material terminating at the fracture depth, wherein an exposed surface of the removed layer of solid state material has a surface topology corresponding to the stress pattern.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: November 4, 2014
    Assignee: Siltectra GmbH
    Inventor: Lukas Lichtensteiger
  • Patent number: 8877071
    Abstract: A method of making a mold includes forming spaced mold cavities in a mold body. The mold cavities include geometrically similar portions, but have respective depths below an initial reference surface that vary as a function of position along a particular direction. The mold cavities can be formed using anisotropic etching of preferred crystal directions in single crystal materials such as silicon. A portion of the mold material adjacent the initial reference surface is removed to expose a new reference surface at a tilt angle with respect to the initial reference surface. The modified mold cavities have their respective axes at a new desired tilt angle relative to the new reference surface.
    Type: Grant
    Filed: May 17, 2012
    Date of Patent: November 4, 2014
    Assignee: Metadigm LLC
    Inventor: Victor B. Kley
  • Patent number: 8871108
    Abstract: A method of removing carbon materials, preferably amorphous carbon, from a substrate includes dispensing a liquid sulfuric acid composition including sulfuric acid and/or its desiccating species and precursors and having a water/sulfuric acid molar ratio of no greater than 5:1 onto an material coated substrate in an amount effective to substantially uniformly coat the carbon material coated substrate. The liquid sulfuric acid composition is exposed to water vapor in an amount effective to increase the temperature of the liquid sulfuric acid composition above the temperature of the liquid sulfuric acid composition prior to exposure to the water vapor. In preferred embodiments, amorphous carbon is selectively removed as compared to a silicon oxide (e.g., silicon dioxide) and/or silicon nitride.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: October 28, 2014
    Assignee: TEL FSI, Inc.
    Inventor: Jeffrey M. Lauerhaas
  • Patent number: 8852379
    Abstract: A carbonization catalyst for forming graphene may be exfoliated from a graphene sheet by etching. A binder layer may be formed on the graphene sheet on which a carbonization catalyst is formed, to support and fix all or part of the graphene sheet. Further, the graphene sheet from which the carbonization catalyst is exfoliated may be transferred to a device. When exfoliating the carbonization catalyst from the graphene sheet, an acid may be used together with a wetting agent.
    Type: Grant
    Filed: February 2, 2012
    Date of Patent: October 7, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hyeon Jin Shin, Jaeyoung Choi, Seonmi Yoon
  • Patent number: 8845911
    Abstract: A method is provided for producing a microstructured molded object that is intended for culturing of biological cells. According to this method, a plastically deformable first porous film is prepared, as well as a deformable second film and a deformable sacrificial film. The first, second and sacrificial film are placed in a stack. Next, the sacrificial film is subjected to pressure to press the stack into a mold. The mold has recesses, such that deformed regions in the form of cavities are produced in the sacrificial film, the first film and the second film, and undeformed regions remain. During the pressing of the film stack into the mold, the first film and the second film are joined to each other, so that they form a composite film. At least portions of the deformed regions of the second film are etched so that sections of the second film are chemically dissolved.
    Type: Grant
    Filed: April 12, 2013
    Date of Patent: September 30, 2014
    Assignee: Technische Universität Ilmenau
    Inventors: Joerg Hampl, Frank Weise, Gregor Schlingloff, Andreas Schober, Uta Fernekorn
  • Patent number: 8845910
    Abstract: The object of the present invention is to strongly join an aluminum alloy part with an FRP prepreg. An object obtained by subjecting an aluminum alloy to a suitable liquid treatment so as to form a surface having large, micron-order irregularities and also fine irregularities with a period of several tens of nanometers, eliminating the presence of sodium ions from the surface and additionally forming a surface film of aluminum oxide, which is thicker than a natural oxide layer, has been found to have a powerful adhesive strength with epoxy-based adhesives. By simultaneously curing an FRP prepreg which uses the same epoxy-based adhesive in the matrix, an integral composite or structure in which FRP and aluminum alloy have been united at a joining strength of unprecedented magnitude is produced.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: September 30, 2014
    Assignee: Taisei Plas Co., Ltd.
    Inventors: Masanori Naritomi, Naoki Andoh
  • Patent number: 8846537
    Abstract: A mold having an open interior volume is used to define patterns. The mold has a ceiling, floor and sidewalls that define the interior volume and inhibit deposition. One end of the mold is open and an opposite end has a sidewall that acts as a seed sidewall. A first material is deposited on the seed sidewall. A second material is deposited on the deposited first material. The deposition of the first and second materials is alternated, thereby forming alternating rows of the first and second materials in the interior volume. The mold and seed layer are subsequently selectively removed. In addition, one of the first or second materials is selectively removed, thereby forming a pattern including free-standing rows of the remaining material. The free-standing rows can be utilized as structures in a final product, e.g., an integrated circuit, or can be used as hard mask structures to pattern an underlying substrate. The mold and rows of material can be formed on multiple levels.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: September 30, 2014
    Assignee: Micron Technology, Inc.
    Inventor: Gurtej S. Sandhu
  • Publication number: 20140287019
    Abstract: An implantable delivery device and method for utilizing the device to delivery a bioactive agent to a subject in need thereof is described. The device includes a pattern of structures fabricated on a surface of the device to form a nanotopography. A random or non-random pattern of structures may be fabricated such as a complex pattern including structures of differing sizes and/or shapes. The device may be located adjacent tissue such as an endovascular implant or a perivascular implant, and may deliver the bioactive agent without triggering an immune or foreign body response to the bioactive agent.
    Type: Application
    Filed: October 16, 2012
    Publication date: September 25, 2014
    Applicant: Kimberly-Clark Worldwide, Inc.
    Inventors: Jeremy Ollerenshaw, Emily Reichart, Russell F. Ross
  • Patent number: 8840795
    Abstract: An apparatus and a method of manufacturing a micropatterned film are disclosed. More particularly, a method for manufacturing a master mold capable of forming a micropattern on a film applied to an exterior of a household appliance, an apparatus and a method for production of a micropatterned film using the above master mold, and appliances having such micropatterned films attached thereto are disclosed. The method for manufacturing a master mold used for forming a micropatterned film applied to an exterior of a household appliance includes, applying photoresist (110) to a surface of an STS substrate (100) and UV irradating the same through a patterned mask (140) to transfer the pattern of the mask (140) to the substrate (100), etching the STS substrate (100) to which the pattern has been transferred removing the photoresist (110) from the etched STS substrate (100), and reproducing the pattern of the STS substrate on a synthetic resin substrate (210).
    Type: Grant
    Filed: September 3, 2010
    Date of Patent: September 23, 2014
    Assignee: LG Electronics Inc.
    Inventors: Seok Jae Jeong, Young Kyu Kim, Ju Hyun Kim
  • Publication number: 20140263183
    Abstract: A fixture for etching PCD drill inserts is provided. The fixture design allows the fixture to be injection molded, significantly reducing costs and allowing the fixture to be disposed of after a single use. The fixture allows for faster use and more accurate etching of the PCD insert.
    Type: Application
    Filed: June 6, 2014
    Publication date: September 18, 2014
    Applicant: STINGRAY GROUP, LLC
    Inventor: Allen Turner
  • Patent number: 8828251
    Abstract: A method for finishing an exterior surface of an injection-molded product is provided, in which a metal layer is formed on the exterior surface of the injection-molded product, a photoresist layer is formed on the metal layer, a photomask is placed on the photoresist layer, light is projected onto the photomask, and remaining parts of the metal layer and the photoresist layer except for parts corresponding to a pattern formed on the photomask are removed by etching.
    Type: Grant
    Filed: May 25, 2011
    Date of Patent: September 9, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-Bae Park, Pil-Woo Lee, Jong-Hwa Kim, Hak-Ju Kim, Jung-Won Cho
  • Patent number: 8828249
    Abstract: An optical deflector has: a movable plate having a reflecting surface and a side surface; and a support portion that supports the movable plate in such a manner that the movable plate is able to rotate around a predetermined axis, in which the side surface of the movable plate is recessed toward the axis.
    Type: Grant
    Filed: November 5, 2012
    Date of Patent: September 9, 2014
    Assignee: Seiko Epson Corporation
    Inventors: Makiko Hino, Yasushi Mizoguchi
  • Patent number: 8828258
    Abstract: A method for surface treatment of a stainless steel separator for a fuel cell comprises preparing a stainless steel sheet containing nickel, chrome and iron, and having a passive film on a surface of the stainless steel sheet, and dipping the stainless steel sheet into a mixed etching solution of nitric acid (HNO3) and sulfuric acid (H2SO4) at a temperature of 50-70° C. for 30 seconds to 30 minutes to selectively lower an amount of Fe in the passive film formed on the surface of the stainless steel sheet.
    Type: Grant
    Filed: July 27, 2007
    Date of Patent: September 9, 2014
    Assignee: Hyundai Hysco
    Inventors: Yoo Taek Jeon, Yeon Soo Jeong
  • Patent number: 8821745
    Abstract: Disclosed are graphene oxide membrane materials of high surface area, which membranes suitably have a surface area of above about 200 ?m and exhibit electrical conductivity in excess of about 200 S/m. Also provided are methods of synthesizing such membranes, as well as devices and sensors that incorporate these novel grapheme materials.
    Type: Grant
    Filed: December 4, 2009
    Date of Patent: September 2, 2014
    Assignee: The Trustees Of The University Of Pennsylvania
    Inventors: Zhengtang Luo, Alan T. Johnson
  • Patent number: 8821751
    Abstract: A CMP composition and associated method are provided that afford good corrosion protection and low defectivity levels both during and subsequent to CMP processing. This composition and method are useful in CMP (chemical mechanical planarization) processing in semiconductor manufacture involving removal of metal(s) and/or barrier layer material(s) and especially for CMP processing in low technology node applications.
    Type: Grant
    Filed: June 7, 2011
    Date of Patent: September 2, 2014
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Xiaobo Shi, Ronald Martin Pearlstein
  • Patent number: 8822346
    Abstract: A reaction block having a plurality of reaction chambers defined therein is provided. A bottom surface of each of the reaction chambers is configured to provide a seal for a corresponding reaction region on the substrate and around a periphery of the substrate. The reaction block includes a plurality of inlet channels and provides a gap between a top surface of the substrate and a bottom surface of the reaction block. The gap accepts a fluid from the inlet channels, wherein the reaction block includes a plurality of vacuum channels having access to the bottom surface of the reaction block to remove the fluid from the gap. A method of selectively etching a substrate for combinatorial processing is also provided.
    Type: Grant
    Filed: June 10, 2008
    Date of Patent: September 2, 2014
    Assignee: Intermolecular, Inc.
    Inventor: Kurt Weiner
  • Publication number: 20140238956
    Abstract: A directed self-assembling composition for pattern formation includes a block copolymer. The block copolymer includes a polystyrene block having a styrene unit, and a polyalkyl (meth)acrylate block having an alkyl (meth)acrylate unit. The block copolymer has a group that is bound to at least one end of a main chain of the block copolymer and that includes a hetero atom.
    Type: Application
    Filed: May 8, 2014
    Publication date: August 28, 2014
    Applicant: JSR CORPORATION
    Inventors: Yuji NAMIE, Shinya MINEGISHI, Tomoki NAGAI, Takuo SONE
  • Publication number: 20140242369
    Abstract: A coating having a thickness between 0.1 and 2 mm is obtained from a mixture with the following composition: 10-25% by weight of micronized powder; 40-60% by weight of inorganic gravels of petrographic origin of sizes between 0.063-2 mm; 10-40% by weight of a polymerisable base resin selected from polyurethane, polyester, epoxy or acrylic, with additives, and optionally pigments. The proportion of the mentioned gravel and micronized powder of the coating being up to 90% in an inner most area of interphase between coating and surface of the petrous substrate, covering one third of the thickness of the coating. The method includes depositing the mentioned mixture on the substrate and vibrating the assembly, and subsequently proceeding to a step of curing and subsequent mechanical finishing of the surface.
    Type: Application
    Filed: May 31, 2012
    Publication date: August 28, 2014
    Applicant: SILICALIA, SL
    Inventors: Erik Schoneveld, Francisco Sanchis Brines, Alberto Ortola, Bernardo Sanchez Sevilla
  • Patent number: 8815111
    Abstract: The substrate treatment method is for treating a substrate with a chemical liquid in a treatment chamber. The method includes a higher temperature chemical liquid supplying step, and a rinse liquid supplying step after the higher temperature chemical liquid supplying step. The rinse liquid supplying step includes: a peripheral edge portion treating step of supplying the rinse liquid selectively onto a center portion of the front surface of the substrate so that a chemical liquid treatment is inhibited on the center portion while being allowed to proceed on a peripheral edge portion of the front surface of the substrate; and an entire surface rinsing step of spreading the rinse liquid over the entire front surface of the substrate to replace the chemical liquid with the rinse liquid on the entire front surface of the substrate after the peripheral edge portion treating step.
    Type: Grant
    Filed: September 8, 2011
    Date of Patent: August 26, 2014
    Assignee: Dainippon Screen Mfg. Co., Ltd.
    Inventor: Kazuki Nakamura
  • Patent number: 8815112
    Abstract: Disclosed is a method for processing a substrate including a first process and a second process. The first process comprises supporting the substrate formed with a titanium-containing film on its front surface and rear surface by a support unit which is rotatably installed; rotating the substrate along with the support unit; and supplying a first processing liquid containing hydrofluoric acid to the rear surface of the substrate thereby processing the rear surface of the substrate with the first processing liquid. The second process comprises supplying a second processing liquid containing ammonia hydrogen peroxide mixture to the rear surface of the substrate after the first process is completed, thereby processing the rear surface of the substrate with the second processing liquid.
    Type: Grant
    Filed: September 1, 2011
    Date of Patent: August 26, 2014
    Assignee: Tokyo Electron Limited
    Inventors: Tsuyoshi Mizuno, Hiromitsu Namba, Yuichiro Morozumi, Shingo Hishiya, Katsushige Harada, Fumiaki Hayase
  • Patent number: 8815108
    Abstract: A method of depositing a non-continuous coating of a first material on a substrate, comprising: a) the formation of a mask on this substrate, by forming at least two mask layers, and etching of at least one cavity in these layers, this cavity having an outline such that a coating, deposited on the substrate, through the cavities of the mask, has at least one discontinuity over said outline of the cavity; b) the deposition of the first material on the substrate, through the cavities of the mask, the coating thus deposited having at least one discontinuity over the outline of said cavity; and c) the mask is removed.
    Type: Grant
    Filed: April 3, 2008
    Date of Patent: August 26, 2014
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Bruno Remiat, Laurent Vandroux, Florent Souche
  • Publication number: 20140234198
    Abstract: Provided is an etching method including: (1) bringing a material containing at least one organic compound having an N—F bond into contact with the surface of a solid material; and (2) a step of heating the solid material; whereby etching can be performed safely and in a simple manner, at a higher etching rate, without the use of a high-environmental-load gas that causes global warming or highly reactive and toxic fluorine gas or hydrofluoric acid. The etching method may further include: (3) a step of exposing the solid material to light from the side of the material containing at least one organic compound having an N—F bond; and (4) a step of removing the material containing at least one organic compound having an N—F bond together with the residue remained between said material and the solid material.
    Type: Application
    Filed: August 10, 2012
    Publication date: August 21, 2014
    Applicants: DAIKIN INDUSTRIES, LTD., OSAKA UNIVERSITY
    Inventors: Mizuho Morita, Junichi Uchikoshi, Kentaro Tsukamoto, Takabumi Nagai, Kenji Adachi
  • Patent number: 8808555
    Abstract: Provided is a method of manufacturing a substrate for a liquid discharge head including a first face, energy generating elements which generate the energy to be used to discharge a liquid to a second face opposite to the first face, and liquid supply ports for supplying the liquid to the energy generating elements. The method includes preparing a silicon substrate having, at the first face, an etching mask layer having an opening corresponding to a portion where the liquid supply ports are to be formed, and having first recesses provided within the opening, and second recesses provided in the region of the second face where the liquid supply ports are to be formed, the first recesses and the second recesses being separated from each other by a portion of the substrate; and etching the silicon substrate by crystal anisotropic etching from the opening of the first face to form the liquid supply ports.
    Type: Grant
    Filed: July 29, 2010
    Date of Patent: August 19, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventors: Keiji Watanabe, Shuji Koyama, Hiroyuki Abo, Keiji Matsumoto
  • Patent number: 8808556
    Abstract: Chemical burnout is used on fabrics having beaded and/or glittered areas to create embroidery that realistically simulates hand-sewn embroidery. A chemical fluid etchant is printed only on selected areas of a pattern on a fabric of cellulose fibers. Preferably, the fabric is a composite fabric that also has non-cellulose fibers. A curable fluid adhesive is printed only on other selected areas of the pattern. Ornamental particles are deposited onto the curable adhesive. The composite fabric is heated to cure the adhesive and fix the particles to the other selected areas, and to simultaneously activate the etchant to dissolve the cellulose fibers at the selected areas. The chemical etchant is removed by rinsing the composite fabric.
    Type: Grant
    Filed: August 20, 2012
    Date of Patent: August 19, 2014
    Inventor: Michael Kukoff