Abstract: An energy beam assisted solid-state welding welds a wire material to a substrate. A wire of coating or repairing material is placed in contact with a surface or surfaces of a substrate. A beam is directed into an outer flat surface of the wire, which heats the wire through flat outer surface of the wire with beam energy. Beam energy produces compression stress-waves that drive molecules of the material flat wire into a surface of the substrate, joining the material and the substrate with strong wave shaped interfaces.

Abstract: A solar cell is formed using a solar cell ablation system. The ablation system includes a single laser source and several laser scanners. The laser scanners include a master laser scanner, with the rest of the laser scanners being slaved to the master laser scanner. A laser beam from the laser source is split into several laser beams, with the laser beams being scanned onto corresponding wafers using the laser scanners in accordance with one or more patterns. The laser beams may be scanned on the wafers using the same or different power levels of the laser source.

Abstract: A method and apparatus for annealing semiconductor substrates is disclosed. The apparatus has a pulsed energy source that directs pulsed energy toward a substrate. A homogenizer increases the spatial uniformity of the pulsed energy. A pulse shaping system shapes the temporal profile of the pulsed energy. A pulse circulator may be selected using a bypass system. The pulse circulator allows a pulse of energy to circulate around a path of reflectors, and a partial reflector allows a portion of the pulse to exit the pulse circulator with each cycle. The pulse circulator may have delaying elements and amplifying elements to tailor the pulses exiting from the circulator.

Abstract: There is provided an improved laser shock hardening method and apparatus which can eliminate spattering of a liquid and waving of the liquid surface upon laser irradiation, and can stably irradiate a workpiece with a laser beam. Thus, the present invention provides in a laser shock hardening method for carrying out surface processing of a workpiece in contact with a liquid by irradiating through the liquid the surface of the workpiece with a pulsed laser beam intermittently emitted from a laser irradiation device, the improvement comprising: providing a solid transparent to the wavelength of the laser, serving as an entrance window to the surface of the liquid; allowing the liquid to be present in the light path of the laser beam between the solid and the surface of the workpiece; and allowing the laser beam to enter through the solid and irradiating through the liquid the surface of the workpiece with the laser beam, thereby shock-hardening the surface of the workpiece.

Abstract: A method for heating a wafer that has at least one layer to be heated and a sub-layer. The method includes applying at least one light flux pulse to the wafer for heating the at least one layer in a manner such that the absorption coefficient of the flux by the layer is low as long as the temperature of the layer to be heated is in the low temperature range (PBT) but the absorption coefficient increases significantly when the temperature of the layer enters a high temperature range (PHT). Also, a sub-layer is selected such that the absorption coefficient of the applied light flux at the selected wavelength is high in the low temperature range (PBT) and the temperature enters the high temperature range (PHT) when the sub-layer is subjected to the light flux. The application of the light flux achieves improved heating of the wafer.

Abstract: A laser processing apparatus having a holding unit for holding a workpiece to be processed and a processing unit for applying a laser beam to the workpiece held by the holding unit. The processing unit includes an oscillator for oscillating the laser beam, a focusing lens for focusing the laser beam oscillated by the oscillator toward the workpiece, and a focal position adjusting mechanism for adjusting the focal position of the laser beam focused by the focusing lens. The focal position adjusting mechanism includes a movable unit having a permanent magnet and supporting the focusing lens, a fixed portion having a coil for moving the movable unit in a direction perpendicular to the workpiece and a gas bearing for supporting the movable unit by using a gas, and a supporting member for supporting the movable unit from the under side by using a magnetic repulsive action.

Abstract: The present invention relates to a laser additive in the form of particles comprising a white core and a shell which comprises elemental carbon, to a process for the preparation thereof, and to the use of a laser additive of this type in organic polymers, in particular in plastics, coatings, automobile paints, powder coatings, printing inks, paper coatings and papermaking stocks for the production of durable pale laser markings, preferably on a dark background

Abstract: A method of using Joule heating to regenerate nanowire based biosensors. The nanowire based biosensor contains various detection molecules, such as nucleic acids, bound to the surface of the nanowire. Binding of analyte nucleic acids to the detection molecules alters the electrical properties of the nanowire, producing a detectable signal. By passing a Joule heating effective amount of electrical current through the nanowire, the nanowire may be heated to a temperature sufficient to dissociate the bound analyte from the detection molecule, without damaging the detection molecules or the bond between the detection molecules and the nanowire surface. The Joule heated nanowires may thus be regenerated to an analyte-free “fresh” state and used for further sensing. In alternate embodiments, the specificity of the nanowire for a particular analyte may be modulated by using Joule heating to heat the nanowire to an intermediate temperature where some analytes bind and some do not.

Abstract: The present invention relates to an ultrashort pulse laser processing device. The ultrashort pulse laser includes a stage a transfer member, a front confocal microscope, a front laser generating unit, and a front highpowered lens. A sample is provided on the stage to be processed, the transfer member transfers the stage, and the front confocal microscope is provided above the stage. The front laser generating unit is provided between the front confocal microscope and the stage to generate an ultrashort pulse laser, and the front high-powered lens focuses the laser provided from the front laser generating unit.

Abstract: A laser welding pressure unit comprises a housing, a rotating element, and a foot. The housing may attach to a laser head. The rotating element may include an outer ring rotatably coupled to an inner ring, wherein the outer ring is coupled to the housing. The foot may couple to the inner ring such that the foot rotates with respect to the housing. The foot may also be configured to contact an upper surface of a metal sheet and may be oriented such that while the metal sheet is being welded, the foot rotates about a central vertical axis and the laser welding pressure unit is able to move in any direction without the foot breaking contact with the surface.

Abstract: A temperature controller for a gas laser which controls temperatures of a plurality of temperature-controlled apparatuses including a first temperature-controlled portion requiring a high-precision temperature-control and a second temperature-controlled portion requiring a low-precision temperature-control as compared with the first temperature-controlled portion and allowing a temperature-control with a low or high temperature as compared with the first temperature-controlled portion, comprises a first temperature control portion generating a cooling agent or a heating agent for adjusting a temperature of each first temperature-controlled portion, a second temperature control portion generating a cooling agent or a heating agent for adjusting a temperature of each second temperature-controlled portion, a first piping system connecting the first temperature control portion and each first temperature-controlled portion in parallel, and a second piping system connecting the second temperature control portion an

Abstract: The present invention relates to a laser processing method and the like having a structure for making it possible to process an object to be processed in various ways while accurately adjusting the installation state of the object. The method irradiates the object with plural adjustment laser light beams that are set in a specific positional relationship against a converging point of processing laser light beam, and adjusts the state of installation of the object while monitoring irradiation areas of the adjustment laser light beams on the surface of the object. Each irradiation directions of adjustment laser light beams is different from that of the processing laser light beam. By reflecting the irradiation condition of the adjustment laser light beam and monitored information of the irradiation areas in positional adjustment of the object, the installation state of the object can be adjusted in accordance with various kinds of processing.

Abstract: In a contact for a connector, a metal material id processed to be bent in a predetermined shape in a manner so that a terminal portion is formed in the vicinity of an end and a contacting portion is formed in the vicinity of the other end. A nickel plating layer as a foundation plating layer and a gold plating layer are formed on substantially entire surface of the contact including the terminal portion and the contacting portion. Laser beams are irradiated at a portion between the terminal portion and the contacting portion, and especially in the vicinity of the terminal portion so that the nickel plating layer as the foundation plating layer is unsheathed by removing the gold plating layer or gold in the gold plating layer and nickel in the foundation layer are alloyed. Nickel and the alloy of nickel and gold respectively have low wetting property with respect to solder, so that diffusion of melted solder stops at the portion.

Abstract: A Dynamically Variable Spot Size (DVSS) laser system for bonding metal components includes an elongated housing containing a light entry aperture coupled to a laser beam transmission cable and a light exit aperture. A plurality of lenses contained within the housing focus a laser beam from the light entry aperture through the light exit aperture. The lenses may be dynamically adjusted to vary the spot size of the laser. A plurality of interoperable safety devices, including a manually depressible interlock switch, an internal proximity sensor, a remotely operated potentiometer, a remotely activated toggle and a power supply interlock, prevent activation of the laser and DVSS laser system if each safety device does not provide a closed circuit. The remotely operated potentiometer also provides continuous variability in laser energy output.

Abstract: A laser system for the marking of metallic and non-metallic materials comprising a laser oscillator (1), characterized in that said laser oscillator (1) comprises: an active optical means (13) of the crystal laser type, a laser pump (10) to provide a pump energy to said active optical means (13); a mirror (14) disposed upstream said active optical means (13); an optical switch, apt to provide a pulsed laser beam, disposed downstream said active optical means (13); a mode adaptor (18) coupled to said optical switch (16); a predetermined length single-mode optical fibre (19), coupled to said mode adapter (18); a Bragg Grating type reflector coupled to said optical fibre (19).

Abstract: There is obtained a laser processing method by which an excellent shape of a cut surface can be achieved and an increase in cost can be suppressed. A laser processing method includes the steps of: preparing a material to be processed; and forming a modified area in the material to be processed, by irradiating the material to be processed with laser beam. In the aforementioned step, pulsed laser beam having a continuous spectrum is focused with a lens, thereby forming a focusing line constituted by a plurality of focuses that are obtained by predetermined bands forming the continuous spectrum of the laser beam, and the material to be processed is irradiated with the laser beam such that at least a part of the focusing line is located on a surface of the material to be processed, thereby forming the modified area on an axis of the focusing line.

Abstract: There is provided a method for manufacturing a grain-oriented electromagnetic steel sheet whose iron losses are reduced by laser beam irradiation, capable of improving the iron losses in both the L-direction and the C-direction while easily ensuring high productivity. The method for manufacturing a grain-oriented electromagnetic steel sheet reduces iron losses by scanning and irradiating a grain-oriented electromagnetic steel sheet with a continuous-wave laser beam condensed into a circular or elliptical shape at constant intervals in a direction substantially perpendicular to a rolling direction of the grain-oriented electromagnetic steel sheet, wherein when an average irradiation energy density Ua is defined as Ua=P/(Vc×PL) (mJ/mm2), where P (W) is average power of the laser beam, Vc (m/s) is a beam scanning velocity, and PL (mm) is an irradiation interval in a rolling direction, PL and Ua are in the following ranges: 1.0 mm?PL?3.0 mm, 0.8 mJ/mm2?Ua?2.0 mJ/mm2.

Abstract: An apparatus and method are described that use a cylindrical drum type vacuum drum and allows accurately registered, high resolution laser patterning of thin films on discrete lengths or flexible substrate material that are unwound from an unwind reel and after processing are rewound onto a rewind reel. Length compensator units are provided either side of the drum to accommodate variations in the length of the substrate due to differential rotation of the drum and the unwind and rewind reels.

Abstract: A system that allows a material to be marked while still on the CNC tooling table and allows an operator to input marking information just prior to, or even during, the tooling cycle. The present invention comprises a sequence controller associated with a computer readable medium and adapted for communication with the CNC controller. An HMI device and a marker controller are also connected with the sequence controller. A lifter assembly is connected with the sequence controller to raise and lower a marker assembly. The lifter assembly is connected to the gantry of the CNC tooling system with an adaptor block. The present invention provides the advantage of reduced time when compared to marking the part at a separate station remotely located from the CNC system, and allows the operator to input marking information just prior to or during the CNC tooling cycle.

Abstract: The present invention provides an efficient heat treatment such as activation treatment of impurities on a substrate such as a thick silicon wafer with large heat capacity by laser annealing. Provided is a laser annealing apparatus 1 for heat-treating a surface of a substrate 30 comprising: a pulse oscillation laser source 10 which generates a pulse laser with gentle rise time and long pulse width; a continuous wave laser source 20 which generates a near-infrared laser for assisting annealing; optical systems 12, 22 which shape and guide beams 15, 25 of the two types of lasers respectively so as to irradiate the surface of the substrate 30 therewith; and a moving device 3 which moves the substrate 30 relatively to the laser beams 15, 25 to allow scanning of the combined irradiation of the two types of laser beams.

Abstract: A thermal processing apparatus and method in which a first laser source, for example, a CO2 emitting at 10.6 ?m is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the wafer as a larger beam surrounding the line beam. The two beams are scanned in synchronism in the direction of the narrow dimension of the line beam to create a narrow heating pulse from the line beam when activated by the larger beam. The energy of GaAs radiation is greater than the silicon bandgap energy and creates free carriers. The energy of the CO2 radiation is less than the silicon bandgap energy so silicon is otherwise transparent to it, but the long wavelength radiation is absorbed by the free carriers.

Abstract: A technique for machining work pieces with a laser apparatus and an electric arc apparatus includes generating a plasma gas jet with the electric arc apparatus, generating a laser beam with the laser apparatus, generating an electric arc with the electric arc apparatus, guiding the electric arc through the laser beam to a machined spot inside or on a work piece, and cutting the work piece with the electric arc or the plasma gas jet.

Abstract: A thermal processing apparatus and method in which a first laser source, for example, a CO2 emitting at 10.6 ?m is focused onto a silicon wafer as a line beam and a second laser source, for example, a GaAs laser bar emitting at 808 nm is focused onto the wafer as a larger beam surrounding the line beam. The two beams are scanned in synchronism in the direction of the narrow dimension of the line beam to create a narrow heating pulse from the line beam when activated by the larger beam. The energy of GaAs radiation is greater than the silicon bandgap energy and creates free carriers. The energy of the CO2 radiation is less than the silicon bandgap energy so silicon is otherwise transparent to it, but the long wavelength radiation is absorbed by the free carriers.

Abstract: In accordance with an aspect of the invention, a solder paste feeding device feeds solder paste to a ring-like terminal surrounding a through-hole and a rod terminal fitted in the through-hole so as to fill in the through-hole, the laser beam irradiation device irradiates the solder past with a laser beam, and wire solder is further fed from above the solder past at the same time as melting of the solder paste is started, thereby fusing the wire solder and the solder paste to solder the ring-like terminal and the rod terminal.

Abstract: A processing method of forming a through-hole in a workpiece by means of a pulsed laser beam includes the steps of providing a removable sacrifice layer on the workpiece, forming a through-hole in the workpiece by the laser beam in a state where the sacrifice layer is provided, and removing the sacrifice layer from the workpiece after the step of forming the through-hole.

Abstract: A laser processing machine for processing workpieces, in particular metal sheets, includes a workpiece support and a beam receiver for the laser beam used as a processing tool. The distance between a workpiece lying on the workpiece support and the beam receiver is variable, owing to the fact that the workpiece support and the beam receiver are positionable relative to one another along the beam axis of the laser beam by means of an adjusting drive of an adjusting device with a positioning movement of a variably definable magnitude. A method for processing workpieces, in particular metal sheets, is also provided.

Abstract: A random laser comprising a substrate and a rare earth-doped glass fabricated on the substrate in the form of a waveguide, wherein the glass comprises a germanium glass, a titanium glass, or a chalcogenide glass.

Abstract: A first laser working method includes a step of irradiating the metallic work held by a rotation holding mechanism, with a nanosecond laser beam from a first laser oscillation mechanism, to form a through hole, and a step of irradiating, when the metallic work is rotated under the action of the rotation holding mechanism, the inner wall of the through hole with a picosecond laser beam from a second laser oscillation mechanism, thereby to finish the same. While forming the through hole, metal vapor is sucked from the outside of the metallic work. Then, the gas is fed from the outside of the metallic work, and the inside of the metallic work is suctioned. In a second laser working method, when a lower hole made through is radially enlarged, the exit side of the lower hole is kept lower in pressure than the laser incident (or entrance) side.

Abstract: Disclosed are systems and methods for directing laser energy to surfaces of materials via elements which have sharp points, and for reducing the adverse effects of particles which become dislodged by scribing and laser machining of materials.

Abstract: A beam shaper is implemented to seal an OLED. The beam shaper comprises a first and second lens and a beam shaper. Changing the relative position of the first, second lens and beam shaper relative to each other enables the beam shaper to generate laser beams with different shapes and intensity profiles.

Abstract: Certain example embodiments relate to substrates or assemblies having laser-fused frits, and/or methods of making the same. In certain example embodiments, a pattern is formed or written on a stock glass sheet by laser fusing frit material to the glass sheet. An optional thin film coating is disposed on and supported by the stock glass sheet. The stock glass sheet with the pattern and the optional thin film coating is cut prior to heat treatment (e.g., heat strengthening and/or thermal tempering). A YAG or other type of laser source may be used to directly or indirectly heat the frit material, which may be wet applied to the substrate. In certain instances, the laser firing of the frit raises the temperature of the glass substrate to no more than 100 degrees C. and, preferably, the temperature is kept even lower.

Abstract: Certain example embodiments relate to substrates or assemblies having laser-fused fits, and/or methods of making the same. In certain example embodiments, a pattern is formed or written on a stock glass sheet by laser fusing frit material to the glass sheet. An optional thin film coating is disposed on and supported by the stock glass sheet. The stock glass sheet with the pattern and the optional thin film coating is cut prior to heat treatment (e.g., heat strengthening and/or thermal tempering). A YAG or other type of laser source may be used to directly or indirectly heat the frit material, which may be wet applied to the substrate. In certain instances, the laser firing of the frit raises the temperature of the glass substrate to no more than 100 degrees C. and, preferably, the temperature is kept even lower.

Abstract: A method for manufacturing a semiconductor light emitting element from a wafer in which a gallium nitride compound semiconductor has been laminated on a sapphire substrate having an orientation flat, comprises of: laminating a semiconductor layer on a first main face of the sapphire substrate having an off angle ? in a direction Xo parallel to the orientation flat; forming a first break groove that extends in a direction Y substantially perpendicular to the direction Xo, on the semiconductor layer side; forming a second break line that is shifted by a predetermined distance in the ±Xo direction from a predicted split line within the first break groove and parallel to the first break groove in the interior of the sapphire substrate and corresponding to the inclination of the off angle ?; and splitting the wafer along the first and/or second break line.

Abstract: A laser method of printing a pattern on works which is read at a high read rate by optical readers and a system for implementing the laser processing method are described. Print pattern data is generated based on printing conditions including at least an original print pattern such as a character string that are specified by users and then converted into data representing an actual print pattern to be actually printed on works according to a three dimensional profile of the works so that an orthogonal projection of that actual print pattern is identical with the original print pattern.

Abstract: An object is irradiated with a laser light modulated by a reflection type spatial light modulator such that aberration of the laser light converged inside the object becomes a predetermined aberration or less. Therefore, aberration of the laser light generated at a position on which a converging point of the laser light is located is made as small as possible, to enhance the energy density of the laser light at that position, which makes it possible to form a modified region with a high function as a starting point for cutting. In addition, because the reflection type spatial light modulator is used, it is possible to improve the utilization efficiency of the laser light as compared with a transmissive type spatial light modulator.

Abstract: A tube matrix and the corresponding method of joining a plurality of tubes to a base plate to create the tube matrix. The tube matrix has a base plate from which a plurality of parallel tubes extend. The base plate has holes formed though it to receive the tubes. The tubes are placed into the holes on the base plate. The tubes may have end flares that abut against the base plate and prevent the tubes from completely passing through the base plate. Once the tubes are in place in the holes of the base plate, the tubes and base plate are welded together with individual laser welds. The laser welds enable a very dense matrix of tubes to be welded to the base plate without damaging or obstructing the tubes.

Abstract: A micromechanical device includes a micromechanical functional structure and an electromagnetic radiation heating associated with the micromechanical functional structure, which is formed to cause a spatially and temporally defined temperature or a spatially and temporally defined temperature course in the micromechanical functional structure.

Abstract: A method of forming articles having closed microchannels includes the steps of providing a substrate including a composite material, the composite having metal nanoparticles dispersed in a polymer matrix. The substrate is irradiated with a laser beam at an intensity and time sufficient to selectively remove the polymer below a surface of said substrate to form at least one microchannel, wherein the intensity and time is low enough to avoid removing the polymer above the microchannel, wherein an article having at least one closed microchannel is formed. A metal nanoparticle/polymer composite composition can have functionality that can undergo addition reactions to seal or join pieces of polymers or composites upon irradiation of the composition placed on one or more pieces.

Abstract: A method and apparatus for fabricating a foam container by using a laser cutting apparatus to precisely cut and remove portions of foam in order to form custom and predetermined text, indentations and protective compartments in the foam, and more particularly a method of controlling the laser relative to high density foam to create precise cuts completely through the foam without subsequently adjusting the focal point of the laser, the cuts being made according to exterior dimensions of an object to be supported and protected in the high density foam.

Abstract: It is an object of the present invention to provide a laser irradiation apparatus being able to irradiate the irradiation object with the laser beam having homogeneous energy density without complicating the optical system. The laser irradiation apparatus of the present invention comprises a laser oscillator, an optical system for scanning repeatedly a beam spot of the laser beam emitted from the laser oscillator in a uniaxial direction over the surface of the irradiation object, and a position controlling means for moving the position of the irradiation object relative to the laser beam in a direction perpendicular to the uniaxial direction.

Abstract: A system for laser shock peening includes a laser positioned to direct a laser pulse at a first side of a work piece and a coupler on a second side of the work piece. The system further includes a Doppler shift detector positioned to measure a velocity of the coupler. A method for laser shock peening includes depositing an amount of energy from a laser pulse into a first side of a work piece and transmitting a pulse having a first frequency at a second side of the work piece. The method further includes receiving a reflected pulse having a second frequency from the second side of the work piece and determining the velocity of the work piece based on the difference between the first frequency and the second frequency.

Abstract: To provide a nozzle welding method which can be performed automatically and efficiently, and which can also be performed under the condition of a high-exposure amount.

Abstract: A photovoltaic thin-film module is provided that includes a substrate on which a transparent front electrode layer, a semiconductor layer, and a rear electrode layer are deposited as functional layers, which are provided with cell dividing lines for forming series-connected cells. The functional layers are ablated using a laser in the edge area. An insulation dividing line is formed in the edge region for the insulation between the front and rear electrode layers using a second laser. The ablation of the functional layers and the forming of the insulation dividing line are performed jointly in one step.

Abstract: A method of operating a laser to obtain an output pulse having a single wavelength, comprises inducing an intracavity loss into a laser resonator having an amount that prevents oscillation during a time that energy from the pump source is being stored in the gain medium. Gain is built up in the gain medium with energy from the pump source until formation of a single-frequency relaxation oscillation pulse in the resonator. Upon detection of the onset of the relaxation oscillation pulse, the intracavity loss is reduced, such as by Q-switching, so that the built-up gain stored in the gain medium is output from the resonator in the form of an output pulse at a single frequency. An electronically controllable output coupler is controlled to affect output pulse characteristics. The laser acts a master oscillator in a master oscillator power amplifier configuration. The laser is used for laser peening.

Abstract: A selective layer melting or other additive layer fabrication method in which powdered material is fused by heating it with a pulsed laser, the pulses being modulated whilst the laser is traversing the substrate so as to control the thickness and/or width of the layer being formed. Initial layers of the fabrication structure may be formed more thickly than subsequent layers, e.g. by means of a CW laser, to reduce distortion. This aspect of the invention may be employed independently of the use of a pulsed laser to form the subsequent layers.

Abstract: A stress treatment device has an operating unit including a head unit performing peening by irradiating an inside of a hole formed in a structure with laser to form a compressive stress region in the hole; a laser unit having an optical fiber guiding the laser to the head unit; a jetting unit jetting liquid into the hole; and a support part supporting the optical fiber in a manner of allowing the jetted liquid to flow through and being fixed in the head unit.

Abstract: A method of forming a pattern (700) on a work piece (1260) includes placing a pattern mask (1210) over the work piece, placing an aperture (100, 500, 600, 1220) over the pattern mask, and placing the work piece in a beam of electromagnetic radiation (1240). The aperture includes three adjacent sections. A first section (310) has a first side (311), a second side (312), and a first length (313). A second section (320) has a third side (321) adjacent to the second side, a fourth side (322), a second length (323), and a first width (324). A third section (330) has a fifth side (331) adjacent to the fourth side, a sixth side (332), and a third length (333). The first and third lengths are substantially equal. The first and third sections are complementary shapes, as defined herein.

Abstract: Laser processing is enhanced by using endpointing or by using a charged particle beam together with a laser. End-pointing uses emissions, such as photons, electrons, ions, or neutral particles, from the substrate to determine when the material under the laser has changed or is about to change. Material removed from the sample can be deflected to avoid deposition onto the laser optics.

Abstract: A laser processing head mounted on a robot arm moves from with a constant speed in a direction from a welding point to a next welding point, while a reflection mirror continuously turns in order to maintain laser beams focused on the welding point until the welding at the welding point is completed, and the reflection mirror quickly turns to shift the focus of the laser beams onto the next welding point when the welding at the welding point is completed.

Abstract: A system for encoding information on a movable object including a laser optically coupled to a moveable object, wherein the moveable object includes a circumferential surface and a longitudinal axis. The laser is configured to project concentrated electromagnetic radiation onto the moveable object. The concentrated electromagnetic radiation heats a portion of the surface of the moveable object affected by the radiation so as to anneal the portion of the surface affected by the radiation, thereby modifying the reflective characteristics of the annealed portion. The system also includes a mounting apparatus configured to adaptively position the moveable object relative to the laser. The system further includes a controller in communication with the laser and the mounting apparatus and configured to control one or more of the mounting apparatus and the laser to project a desired encoding pattern onto the moveable object.