Abstract: The present disclosure relates to a metal machining apparatus having a gas nozzle for generating a gas jet. The apparatus also has a nozzle exit opening on one end on the outside; an electronic camera for acquiring a digital image of the end of the gas nozzle with the nozzle exit opening. The apparatus also includes a pattern recognition module for mapping the digital image to at least one nozzle pattern from the group of nozzle state and/or nozzle type.

Abstract: A laser machining apparatus includes: a laser oscillator to emit a laser beam; a focusing lens to irradiate a workpiece with the laser beam; a focus position control mechanism disposed between the laser oscillator and the focusing lens and disposed on the optical path of the laser beam and that controls the divergence angle of the laser beam and the incident diameter of the laser beam incident on the focusing lens; a laser beam deflector to deflect the laser beam before the laser beam is incident on the focusing lens; and an emitting angle control mechanism to control the emitting angle of the laser beam that exits from the focusing lens after being deflected by the laser beam deflector.

Abstract: A laser cutting apparatus and method, and a method of manufacturing a display panel by using a laser cutting method are provided. A laser cutting method includes: providing a panel in which a second substrate is stacked on a first substrate including a conductive wiring; and removing a portion of the second substrate to expose the conductive wiring by emitting a laser beam to the second substrate, and the laser beam is emitted to the second substrate at an incident angle equal to or greater than a threshold angle at which total reflection occurs in the second substrate.

Abstract: An aspect of the invention provides a device, comprising: a laser machining head configured to deflect laser radiation onto an optical system comprising a substrate, the device being configured to carry out a method for separating the substrate using the optical system, the optical system being configured to provide the laser radiation, a thickness of the substrate not exceeding 2 mm in a region of a separating line, the method comprising: applying pulsed laser radiation having a pulse duration (t) to a substrate material of the substrate using the optical system, the substrate material being transparent at least in part to a laser wavelength of the pulsed laser radiation, the pulsed laser radiation being focused using the optical system at an original focal depth (f1), an intensity of the pulsed laser radiation leading to a modification of the substrate along a beam axis (Z) of the pulsed laser radiation.

Abstract: A laser cutting device comprises: a conveying mechanism (1) comprising a feeding end and a discharging end; a working platform (2) disposed at the discharging end of the conveying mechanism (1); a first counter (3) and a second counter (4) oppositely disposed at a side of the working platform (2) near the discharging end of the conveying mechanism (1) and driven respectively by two opposite side edges of a substrate (6) to rotate for counting; a laser cutter (5) disposed above the working platform (2); a control device (13) for determining a modified cutting motion path of the laser cutter according to a set cutting path, and starting and ending times of counting values of the first counter (3) and second counter (4), and for controlling the laser cutter to cut the substrate (6) according to the modified cutting motion path.

Abstract: Disclosed herein are systems and methods for using microlens arrays for parallel micropatterning of features. A method includes emitting a laser beam providing the laser beam to a lenslet array including a plurality of lenslets, and generating, from the laser beam, a plurality of laser sub-beams using the lenslet array. Each one of the plurality of laser sub-beams is generated by a corresponding one of the plurality of lenslets. Each lenslet of the plurality of lenslets has the same shape.

Abstract: There is provided a method of manufacturing a washer capable of suppressing reduction in a sliding area, which includes: a preparing step of preparing a panel-shaped member N; a cutting step of cutting the panel-shaped member N with a laser L2 to thereby obtain a longitudinal member N1; and a forming step of obtaining an arc-shaped washer by using the longitudinal member N1. The panel-shaped member N has an equal width to a longitudinal width of the longitudinal member N1. The cutting step is a step of cutting the panel-shaped member N from one end to the other end in a width direction to thereby obtain the longitudinal member N1 and the forming step is a step of deforming the longitudinal member N1 into an arc shape so that cut faces of the longitudinal member N1 form an outer peripheral face and an inner peripheral face.

Abstract: A laser weapon system is described. Particularly, embodiments describe subsystems of a laser weapon system including those necessary for laser generation, operational control, optical emission, and heat dissipation configured to provide a lightweight unit of reduced dimensions.

Abstract: Discussed is an apparatus for notching an electrode sheet for an electrode tab, the apparatus including: a transfer unit including first and second transfer rollers to continuously, transfer the electrode sheet at regular intervals; a jig unit disposed between the first and second transfer rollers, and supporting a non-coating portion of the electrode sheet; and a notching unit to notch the non-coating portion supported on the jig unit, wherein the jig unit includes: a rotation member provided between the first and second transfer rollers and rotated in a direction perpendicular to a transfer direction of the electrode sheet; and two or more jigs to support the non-coating portion disposed between the first and second transfer rollers, and the jig unit is able to improve a supporting force of the electrode sheet, to prevent the electrode sheet from vibrating, and accurately notch an electrode tab to the electrode sheet.

Abstract: A wafer held on a chuck table is processed by applying a laser beam to the wafer. The laser processing method includes positioning a height detecting unit in a work area of the wafer where the laser beam is to be applied, relatively moving the chuck table and the height detecting unit along a forward path in an X direction, detecting the height of the upper surface of the wafer along the forward path by using the height detecting unit, and storing height information at plural X coordinates on the forward path into a memory; and relatively moving the chuck table and the height detecting unit along a backward path in the X direction, detecting the height of the upper surface of the wafer along the backward path by using the height detecting unit, and storing height information at plural X coordinates on the backward path into the memory.

Abstract: Provided is an electrode sheet manufacturing apparatus that forms an electrode sheet by cutting a sheet stack including an electrode composite material layer and a separator provided on the electrode composite material layer. The electrode sheet manufacturing apparatus includes a laser irradiation device that irradiates the sheet stack with a first laser beam having a wavelength to be absorbed by the separator and a second laser beam having a wavelength to be absorbed by the electrode composite material layer, and a controller that controls driving of the laser irradiation device. The controller moves an irradiation position of the first laser beam relative to the sheet stack and moves an irradiation position of the second laser beam so as to follow a track of the irradiation position of the first laser beam.

Abstract: Embodiments are directed to microscale and millimeter scale multi-layer structures (e.g., probe structures for making contact between two electronic components for example in semiconductor wafer, chip, and electronic component test applications). One or more layers of the structures include shell and core regions formed of different materials wherein the core regions are offset from a symmetric, longitudinally extending position.

Abstract: A laser processing method which can efficiently perform laser processing while minimizing the deviation of the converging point of a laser beam in end parts of an object to be processed is provided.

Abstract: Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits involves forming a mask above the semiconductor wafer, the mask composed of a layer covering and protecting the integrated circuits. The mask is then patterned with a split laser beam laser scribing process, such as a split shaped laser beam laser scribing process, to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then plasma etched through the gaps in the patterned mask to singulate the integrated circuits.

Abstract: A laser processing method for a substrate with a device formed on a front surface thereof and including an electrode pad, the method including: a laser beam applying step of applying the laser beam to the back surface of the substrate to form a fine hole in the substrate at a position corresponding to the electrode pad; a detecting step of detecting first plasma light emitted from the substrate at the same time that the fine hole is formed in the substrate by the laser beam applied thereto, and second plasma light emitted from the electrode pad; and a laser beam irradiation finishing step of stopping application of the laser beam when the second plasma light is detected in the detecting step. A peak power density of the laser beam to be applied is set in a range from 175 GW/cm2 or less to 100 GW/cm2 or more.

Abstract: A plasma-torch cutting machine gantry moves in a first axis and the torch mounted through a pantograph to a drive box moves along the gantry in a second axis. The drive box rotates the torch about a third axis, and tilts the torch about a fourth axis. The drive box moves vertically in a fifth axis. The torch is mountable with tip at pantograph focal point or in an extended position. A controller firmware computes and apply offsets in the first, second and fifth axis to maintain the plasma torch tip in desired position despite the torch being mounted in extended position, rotation and tilt of the torch. In embodiments the torch is rotatable ?/+90 degrees from vertical; and a laser scanner maps surfaces and edges of beams to determine movements and rotations for cutting beams.

Abstract: A process arrangement and a process for the production of a fiber-reinforced plastics component made of at least one continuous-fiber-reinforced semifinished textile fiber product with reactive thermoplastic matrix material, where during the manufacture of the semifinished fiber product trimming residues (mR, mA) arise, composed of a composite made of fibers and of the reactive thermoplastic matrix material, and during finishing of the finished plastics component final-trimming residues (mE) arise, composed of a composite of fibers and of polymerized thermoplastic matrix material, and are further processed in a recycling unit to give a recyclate. The trimming residues arising during the manufacture of the semifinished fiber product are polymerized in a preparatory unit and then are delivered in the invention to the recycling unit.

Abstract: The transfer of devices or device components from a carrier substrate to a further carrier substrate or to a plurality of further carrier substrates can be performed with little effort (few transfer steps) to the at least one further carrier substrate. The method comprises producing first devices on the first carrier substrate in a two-dimensional grid. It comprises defining positions on the second carrier substrate on the basis of the two-dimensional grid for at least some of the first devices. It comprises releasing a plurality of the first devices from the first carrier substrate while maintaining the two-dimensional grid. Finally, the plurality of first devices are applied to the second carrier substrate in the defined positions while maintaining the two-dimensional grid or a multiple thereof in at least one of the two directions.

Abstract: A method for applying AOI to copper coils thinned by laser etching includes placing a half-finished product under a scanning unit; scanning the half-finished product to generate an image; sending the image to an image analysis unit which is activated to analyze the image, identify cutting boundaries of the half-finished product, compare the cutting boundaries with an original processing path file, and identify defects of the half-finished product; activating the image analysis unit to find points around the half-finished product; activating the image analysis unit to simulate an optimum path; activating the image analysis unit to convert the optimum path into an optimum processing path file; activating the image analysis unit to send the optimum processing path file to a program unit; conveying the half-finished product to dispose under a laser processing unit; and activating the program unit to instruct the laser processing unit to process the half-finished product.

Abstract: The present disclosure generally relates to a method for processing optical fibers supported by a multi-fiber ferrule. The method can include laser cutting first and second rows of optical fibers in a first fiber cutting step by directing a laser beam in a first direction relative to the ferrule. The laser beam can cut the second row of optical fibers to a first fiber extension length and cut the first row of optical fibers to a second fiber extension length. The method can also include laser cutting the first row of optical fibers by directing a laser beam in a second direction relative to the multi-fiber ferrule. The laser beam cuts the first row of optical fibers to the first fiber extension length and by-passes the second row of optical fibers such that optical fibers of the second row of optical fibers remain at the first fiber extension length.

Abstract: A method and a control device for deflection of a laser beam for laser-based additive manufacturing processes includes first and second orthogonally rotatable mirrors designed to reflect the laser beam and guide the laser beam to an irradiation field. The first mirror and the second mirror are secured on respective first and second shafts, with the first mirror performing a continuous first vibration with a first frequency, and the second mirror performing a continuous second vibration with a second frequency different from the first frequency and/or with a phase difference with respect to the first vibration. Each of the two shafts has a known position such that the first vibration is synchronous with the second vibration. The laser is activated/deactivated upon reaching/leaving an irradiation point. The generated vibrations of the mirrors describe a continuous Lissajous curve.

Abstract: A method for sawing a semiconductor wafer is provided. The method includes sawing a semiconductor wafer to form a first opening. In addition, the semiconductor wafer includes a dicing tape and a substrate attached to the dicing tape by a die attach film (DAF), and the first opening is formed in an upper portion of the substrate. The method further includes sawing through the substrate and the DAF of the semiconductor wafer from the first opening to form a middle opening under the first opening and a second opening under the middle opening, so that the semiconductor wafer is divided into two dies. In addition, a slope of a sidewall of the middle opening is different from slopes of sidewalls of the first opening and the second opening.

Abstract: When water jet guided laser drilled through the first body, there is a confined embodiment between the first body and the second body. To prevent water jet guided laser to continue in this direction and create damage on the second body, a volume vibrator is connected to the embodiment and media that filled embodiment get pumped in and pumped out from the embodiment at adjustable frequency and cycle volume. Mechanical energy is then transferred into the embodiment to generate local media vibration. The laminar flowing state of the water jet is interrupted and the laser beam confined in the water jet is dispersed. Plugging method is also involved to insure when there are multiple holes on the embodiment, there will be enough mechanical energy get transferred to the laser breakthrough location.

Abstract: A method for creating a detachment area in a solid, in particular for detaching the solid along the separating region. Said solid portion that is to be detached is thinner than the solid body from which the solid portion has been removed. Said method preferably comprises at least the following steps: the crystal lattice of the solid is modified by means of a modifying agent, in particular by means of at least one laser, in particular a pico- or femtosecond laser. The modifications, in particular the laser beams penetrate into the solid via a surface of the solid portion which is to be detached, several modifications are created in the crystal lattice, said crystal lattice penetrates, following said modifications, in the areas surrounding the modifications, at least in one particular part.

Abstract: An achromatic 3D STED measuring optical process and optical method, based on a conical diffraction effect or an effect of propagation of light in uniaxial crystals, including a cascade of at least two uniaxial or conical diffraction crystals creating, from a laser source, all of the light propagating along substantially the same optical path, from the output of an optical bank to the objective of a microscope. A spatial position of at least one luminous nano-emitter, structured object or a continuous distribution in a sample is determined. Reconstruction of the sample and its spatial and/or temporal and/or spectral properties is treated as an inverse Bayesian problem leading to the definition of an a posteriori distribution, and a posteriori relationship combining, by virtue of the Bayes law, the probabilistic formulation of a noise model, and possible priors on a distribution of light created in the sample by projection.

Abstract: A laser processing device includes: a support table; a laser light source; a converging optical system; an imaging unit configured to image a front surface of an object; a candidate line setting unit configured to set a plurality of candidate lines; an operation controller configured to control operation of at least one of the support table, the laser light source, and the converging optical system such that a modified region is formed inside the object along each of the plurality of candidate lines, and a crack reaches the front surface of the object from the modified region; and a reference line setting unit configured to set a reference line determined as a line indicating a crystal orientation of the object on the basis of an image of the crack.

Abstract: A method of manufacturing a semiconductor device, includes irradiating a division region of a semiconductor wafer with laser to form a plurality of modified portions arranged in a direction along the division region in the semiconductor wafer, and splitting the semiconductor wafer into a plurality of semiconductor chips using a groove generated from the plurality of modified portions in the semiconductor wafer. The plurality of modified portions is at a first interval in a first part of the division region and at a second interval smaller than the first interval in a second part of the division region.

Abstract: In one aspect, methods of fabricating cutting tools employing ultrahard materials are described herein. A method of making a cutting tool comprises electronically loading a cutting tool pattern into a laser machining system and providing a blank to the laser machining system, the blank comprising a layer of ultrahard material. The cutting tool pattern is administered to the blank via a single laser processing step to form the cutting tool including at least one as-formed cutting edge comprising the ultrahard material and having an edge radius less than 10 ?m. The single laser processing step can provide the cutting tool in final form, thereby obviating further processing steps.

Abstract: Laser systems and methods are disclosed. One laser system comprises: a plurality of laser resonators, each resonator being operable to discharge an input laser beam; a relay assembly including at least one curved reflective surface that redirects each input laser beam, and reduces a beam size of the redirected beam; a galvo including a curved reflective surface that receives each redirected beam, and outputs a combined laser beam at power level greater than a power level of each laser input beam; and a coupling assembly that reduces spherical aberrations in the combined laser beam, and directs the combined laser beam into an optical fiber. In this system, the combined laser beam may have a maximum beam parameter product lower than a minimum beam parameter product of the optical fiber. Related systems and methods are also disclosed.

Abstract: A lap welding method of a steel sheet includes spot welding in a state in which the flange portion of a second steel sheet member having the flange portion and a standing wall portion is overlapped with the first steel sheet member, thereby forming a nugget between a first steel sheet member and a flange portion; and, after the spot welding, laser welding a region between an R stop of the standing wall portion and the nugget, thereby forming a weld bead, and, in the weld bead, a length dimension is equal to or longer than a diameter of the nugget, and a width dimension is 0.5 to 3.0 mm.

Abstract: The present invention generally relates to multi-layer, flat glass structures and a method of manufacturing multi-layer, flat glass structures.

Abstract: Methods, machines, and computer-readable mediums for determining distance correction values of a desired distance between a laser processing nozzle on a laser processing head and a workpiece during laser processing of the workpiece are provided. In some implementations, the workpiece is scanned along a desired path of a surface of the workpiece separately by the laser processing nozzle and a measurement head arranged in place of the laser processing nozzle on the laser processing head, with a capacitively measured distance identical to the desired distance. The measurement head has a lower lateral sensitivity of a capacitance measurement than the laser processing nozzle. Respective scanned movement paths of the laser processing nozzle and the measurement head are determined. The distance correction values for the desired distance of the laser processing nozzle are then determined from the scanned movement paths determined with the laser processing nozzle and the measurement head.

Abstract: The invention relates to a device for producing an adhesive tape (2), comprising a supply unit (5) for supplying a strip-type textile carrier (3) of the adhesive tape (2), and a coating unit (6) for applying an at least lamellar adhesive coating (4) to at least one side of the carrier (3). The invention also relates to an ultrasound unit (9 and 10) and/or a laser unit for producing perforations and/or cut edges in the carrier (3).

Abstract: A laser cutting and machining method for plated steel plated, when irradiating a laser beam LB on to the upper surface of a plated steel plate W and laser cutting and machining same: a plating layer-containing metal that has been melted and/or evaporated by the irradiation of the laser beam LB is caused to flow on to a cut surface of the plated steel plate W as a result of assist gas that is jetted towards a laser machining units; and the plating layer-containing metal is coated on the cut surface.

Abstract: A method includes cutting an outer diameter into a glass substrate. An inner diameter within the outer diameter is also cut into the glass substrate. A first region inside the outer diameter and a second region inside the inner diameter are heated. The second region inside the inner diameter is cooled, wherein the cooling causes the second region to detach from the first region.

Abstract: An apparatus for cutting brittle material comprises an aspheric focusing lens, an aperture, and a laser-source generating a beam of pulsed laser-radiation. The aspheric lens and the aperture form the beam of pulsed laser-radiation into an elongated focus having a uniform intensity distribution along the optical axis of the aspheric focusing lens. The elongated focus extends through the full thickness of a workpiece made of a brittle material. The workpiece is cut by tracing the optical axis along a cutting line. Each pulse or burst of pulsed laser-radiation creates an extended defect through the full thickness of the workpiece.

Abstract: A laser-machining device includes an arrangement for producing and guiding a working laser beam. The arrangement includes a nozzle having an opening for emission of the working laser beam to a machining zone. An optical axis is defined in the arrangement and at least one element focuses the working laser beam near the opening of the nozzle. The machining process is monitored via at least one group of detector arrangements for a radiation characteristic of the machining process and an associated evaluating unit. The detector arrangements of each group are arranged in a ring shape about the optical axis. The observation direction of the detector arrangements extends, at least in a sub-region, between the focusing element closest to the machining zone and the machining zone, at a polar angle, in relation to the optical axis of the working laser beam.

Abstract: The present invention has as its object to inhibit fracture due to a HAZ softened part in substantially circular laser lap welding taking the place of resistance spot welding for joining a superposed plurality of steel sheets including a high strength steel sheet. To solve this problem, the inventors discovered lap welding comprising superposing a plurality of steel sheets and firing a laser to form a substantially circular laser weld (1), which lap welding firing the laser in a straight line through an outer edge of the substantially circular laser weld (1) so as to form a hardened part (8) at the steel sheets and thereby suppressing fracture arising from the HAZ softened part.

Abstract: A method of cleaving off a daughter single crystal substrate from a parent single crystal substrate includes providing a stress-mandrel and the parent a single crystal substrate. The parent single crystal substrate has a major surface and an edge surface that intersects the major surface. The major surface extends along a major surface plane. The stress-mandrel has a stress-mandrel coefficient of thermal expansion that is higher than the parent single crystal coefficient of thermal expansion. The method includes bonding the stress-mandrel to the major surface, and cooling the parent single crystal substrate and the stress-mandrel. The cooling of the parent single crystal substrate bonded to the stress-mandrel provides a thermal stress in the parent single crystal substrate sufficient to cleave the parent single crystal substrate. The cleaving extends substantially along a plane parallel to the plane of the major surface. In one embodiment the cleaved daughter substrate was used to make a photovoltaic cell.

Abstract: A method for separating a thin glass, in which method the thin glass is progressively heated along a path which forms a parting line, wherein the heating of the glass is realized by way of the energy of at least one energy source within an area of action of the energy source on the thin glass, and, by way of a temperature gradient of the glass heated by way of the at least one energy source in relation to the surrounding glass, a mechanical stress is generated in the glass, by way of which mechanical stress, a crack propagates, following the mechanical stress, along the parting line.

Abstract: Disclosed are a display device and a method of manufacturing a display device. The method of a display device according to an exemplary embodiment of the present disclosure includes: a first transferring step of transferring a plurality of LEDs disposed on a wafer onto a plurality of donors; and a second transferring step of transferring the plurality of LEDs transferred onto the plurality of donors onto a display panel, in which in the second transferring step, an area where one of the plurality of donors overlaps the display panel partially overlaps an area where the other one of the plurality of donors overlaps the display panel. Therefore, the plurality of LEDs having different wavelengths is uniformly transferred to reduce a boundary caused by the difference in wavelengths and improve color uniformity.

Abstract: Methods, systems, and apparatuses are disclosed for the protection of optical components used during laser bond inspection. In one embodiment, an optic surface wetting enhancement is provided on a protective optic to assist in forming a substantially flat film of transparent liquid from transparent liquid applied to a surface of a protective optic. A flat film of transparent liquid on a surface of a protective optic may be used to retain debris and effluent backscatter produced during a laser bond inspection process.

Abstract: A microscope includes a holder for holding a sample, an objective for imaging at least apart of a sample held by the holder, a detection module, a control unit for setting the focus position of the objective in a first direction for the recording by means of the detection module, and a focusing module for maintaining a set focus position of the objective. The focusing module includes the control unit, a second detector and first focusing optics with adjustable focal length. The focusing module is switchable into a focus-hold mode, wherein an intensity-modulated object is imaged into the sample via the first focusing optics and the objective, and an image of the imaged object is recorded by means of the second detector. The control unit holds the focus position of the objective on the set focus position, based upon the recording of the second detector.

Abstract: While conveying a flat plate material X, a laser blanking apparatus 100 for cutting the plate material X into a blank material with laser light emitted from a laser nozzle 11 includes an endless conveyor 1 for feeding the plate material X, a pair of upstream and downstream support rollers 21a and 21b provided below the laser nozzle 11, and a drawing roller 21c provided below the upstream and downstream support rollers 21a and 21b, wherein the upstream and downstream support rollers 21a and 21b and the drawing roller 21c guide the endless conveyor 1.

Abstract: The present disclosure relates to a process, system and apparatus for multi-material additive manufacturing process comprising: extruding an extrudable material through a nozzle capable of moving along one or more axis and concurrently extruding one or more filaments, wherein the filament is embedded in, on or about the extrudable material from the nozzle.

Abstract: A rotor of an exhaust-gas turbocharger includes a rotor hub and rotor blades disposed on the rotor hub. The rotor blades have a blade thickness distribution selected in such a way that the rotor blades have along their extent from a fluid inlet or leading edge to a fluid outlet or trailing edge at least one transition between a stiffness or rigidity-oriented blade thickness distribution and an inertia and stress-oriented blade thickness distribution over the height of the blade.

Abstract: There is provided an optical measurement device, a load handling apparatus, a method for protecting an optical measurement device and a method for updating a load handling apparatus, where the optical measurement device comprises a permeable surface for communicating light to and from the optical measurement device. A hydrophilic coating is arranged on the permeable surface.

Abstract: A method for severing a glass sheet includes preferentially heating a region of the glass sheet to form a softened region. A slit is formed in the softened region of the glass sheet to form a slit region. The slit extends at least partially into a thickness of the glass sheet. Heat is preferentially applied to the slit region of the glass sheet.

Abstract: A method of forming an electrode structure for a capacitive touch sensor in a transparent conductive layer located on a transparent non-conductive layer which is located on a color filter layer by a direct write laser scribing process using a pulsed solid state laser, the laser wavelength, pulse length and beam profile at the substrate being selected to have a wavelength in the range 257 nm to 266 nm, a pulse length in the range 50 fs to 50 ns, and a top hat beam profile having a uniformity of power or energy density between a value (Emax) and a minimum value (Emin) of less than 10%, where uniformity is defined as (Emax?Emin)/(Emax+Emin). 1 Grooves can thus be formed in the transparent conductive layer to electrically isolate areas of the transparent conductive layer on opposite sides of each groove with substantially no damage to the transparent non-conductive layer or the color filter layer beneath the transparent conductive layer.

Abstract: A method of separating a wafer including rows of light emitting devices is described. Dicing streets are provided on the wafer such that a respective one of the dicing streets is provided between each of the rows of light emitting devices on the wafer. The wafer is broken along a first one of the dicing streets to separate a first portion of the wafer from a remaining portion of the wafer. The first portion of the wafer includes more than one of the rows of light emitting devices. The first portion of the wafer is broken along a second one of the dicing streets to separate a second portion of the wafer from the first portion of the wafer.