Methods Patents (Class 219/121.72)
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Patent number: 9006607Abstract: A scanning apparatus for scanning a light beam includes a mirror configured to reflect an incident light beam, a motor configured to rotate the mirror to change a direction along which the light beam reflected by the mirror travels, and a detector configured to obtain a detection value corresponding to a tilt of a detected region of the mirror, with the detection value being changed in accordance with a rotation angle of the mirror. In addition, a processor is configured to obtain a tilt angle of the mirror based on the detection value obtained by the detector and the rotation angle of the mirror.Type: GrantFiled: May 7, 2009Date of Patent: April 14, 2015Assignee: Canon Kabushiki KaishaInventor: Shinji Ueda
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Publication number: 20150090570Abstract: An illuminated metal keycap having a legend diffuser material that may diffuse light through a legend opened in a background layer. The background layer may be opaque and the legend may be transparent. The metal keycap is adhered to a scissor mechanism positioned above electrical switch circuitry. Included within, below, or adjacent to the scissor mechanism may be one or more light sources positioned to emit light through the metal keycap, around the perimeter of the metal keycap, and/or through the background layer.Type: ApplicationFiled: September 30, 2014Publication date: April 2, 2015Inventors: Hilbert T. Kwan, Jeffrey L. Yen, Craig C. Leong, James J. Niu, Keith J. Hendren, Yanyang Yuan, Feng Zhao, Wanshan Li, Derrick T. Jue, Ze Hong
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Patent number: 8993924Abstract: There is provided a target object processing method capable of self-breaking a target object with a laser beam. The target object processing method includes: generating a laser beam from a laser beam source; correcting a divergence angle of the generated laser beam; and forming a spot by condensing the corrected laser beam to the inside of the target object. A shape or a size of the spot is adjusted by correcting the divergence angle of the laser beam, a phase transformation area is formed within the target object by the spot, and the target object is subject to self-breaking with the phase transformation area as the starting point.Type: GrantFiled: April 29, 2011Date of Patent: March 31, 2015Assignees: QMC Co., Ltd., Beng So RyuInventors: Beng So Ryu, Byong Shik Lee, Hyeon Sam Jang, Bum Joong Kim
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Patent number: 8986317Abstract: A process for producing the actuating part of an instrument for endoscopic applications, which instrument comprises a tubular member having a handling end portion with a flexible portion and an actuating device located at another end portion, which actuating device comprises a cylindrical part connected to the handling end portion, a cylindrical part connected to the actuating device and a number of longitudinal elements for transferring the movement of the actuating device to the handling end portion, the actuating device being made beginning with a full cylindrical tube which is provided with a number of longitudinal slits thereby forming the longitudinal elements.Type: GrantFiled: June 30, 2008Date of Patent: March 24, 2015Assignee: Fortimedix Surgical B.V.Inventor: Marcel Antonius Elisabeth Verbeek
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Publication number: 20150076375Abstract: A photon collimator, suitable for use in medical imaging equipment, is constructed from a block of photon-attenuating material, such as solid tungsten or molybdenum alloy that defines a plurality of integrally formed septa slats. Each slat has an elongated length dimension greater than thickness and depth dimensions, and is oriented in an opposed pattern array that is laterally spaced relative to its respective thickness dimension. An aperture channel is defined between each pair of opposed slats. Rows of integrally formed slats in one block or separately affixed blocks may be stacked on each other at skewed angles to form two-dimensional grids of apertures having polygonal cross sections. The slats may be formed by electric discharge or laser thermal ablation machining, such as by a sequential passing of an EDM wire cutting head along the pattern array, repeating sequential cutting of respective channel depth and width.Type: ApplicationFiled: November 19, 2014Publication date: March 19, 2015Inventor: Ronald E. Malmin
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Patent number: 8981258Abstract: Laser cutting processes are provided which are controlled using as a reference signal one or more emission lines which are characteristic of the radiation emitted by a gas or, more generally, by an emitting element present in the volume irradiated by the laser beam focussed by a laser head and adjusting, on the basis of this reference signal, at least one of the following process control parameters: the power of the laser, the frequency and the duty cycle of the laser pulse, the pressure of an assisting gas emitted by a nozzle forming part of the laser head, the relative speed of the laser head with respect to the workpiece, the distance between the laser head and the surface of the workpiece, and the distance between the focal point of the laser beam and the surface of the workpiece. Laser cutting devices are also provided.Type: GrantFiled: April 20, 2012Date of Patent: March 17, 2015Assignee: Adige S.p.A.Inventors: Maurizio Sbetti, Stefano Bertoldi, Daniele Colombo, Barbara Previtali, Giovanni Riva, Matteo Danesi, Lorenzo Molinari Tosatti, Diego Parazzoli
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Publication number: 20150060420Abstract: The invention relates to methods and an apparatus for cutting planar substrates charged with pharmaceutically active agents. In particular, the planar substrates comprise transdermal systems or orally dissolvable films.Type: ApplicationFiled: November 11, 2014Publication date: March 5, 2015Inventor: Roland Anton Weber
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Patent number: 8969761Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.Type: GrantFiled: October 26, 2010Date of Patent: March 3, 2015Assignee: Hamamatsu Photonics K.K.Inventors: Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda
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Patent number: 8969756Abstract: A workpiece cutting apparatus includes a laser source, a first suction system, and a first finger configured to guide a workpiece as it moves past the laser source. The first finger includes a first end provided adjacent a point where a laser from the laser source cuts the workpiece, and the first end of the first finger includes an aperture in fluid communication with the first suction system.Type: GrantFiled: December 14, 2009Date of Patent: March 3, 2015Assignee: Johnson Controls—SAFT Advanced Power Solutions LLCInventor: Thomas J. Dougherty
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Patent number: 8969752Abstract: The present invention provides a laser processing method comprising the steps of attaching a protective tape 25 to a front face 3 of a wafer 1a, irradiating a substrate 15 with laser light L while employing a rear face of the wafer 1a as a laser light entrance surface and locating a light-converging point P within the substrate 15 so as to form a molten processed region 13 due to multiphoton absorption, causing the molten processed region 13 to form a cutting start region 8 inside by a predetermined distance from the laser light entrance surface along a line 5 along which the object is intended to be cut in the wafer 1a, attaching an expandable tape 23 to the rear face 21 of the wafer 1a, and expanding the expandable tape 23 so as to separate a plurality of chip parts 24 produced upon cutting the wafer 1a from the cutting start region 8 acting as a start point from each other.Type: GrantFiled: September 11, 2003Date of Patent: March 3, 2015Assignee: Hamamatsu Photonics K.K.Inventors: Kenshi Fukumitsu, Fumitsugu Fukuyo, Naoki Uchiyama
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Patent number: 8969757Abstract: A relief manufacturing apparatus includes: a laser beam irradiating device configured to irradiate laser beam on an engraving material; a scanning device configured to move at least one of the engraving material and the laser beam irradiating device; a numerical value acquiring device configured to acquire a numerical value including a first inclination angle indicating inclination of the inclined face of the relief; a control device configured to control the scanning device and the laser beam irradiating device so that the laser beam is irradiated on a surface of the engraving material to form an initial inclined face having a second inclination angle smaller than the first inclination angle and thereafter the laser beam is irradiated on the initial inclined face to enlarge the inclination of the inclined face from the second inclination angle to the first inclination angle.Type: GrantFiled: February 16, 2011Date of Patent: March 3, 2015Assignee: FUJIFILM CorporationInventors: Masashi Norimatsu, Ichirou Miyagawa, Osamu Shimazaki
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Publication number: 20150052751Abstract: A system for manufacturing an airfoil includes an unfocused laser beam and a first fluid column surrounding the unfocused laser beam to create a confined laser beam directed at the airfoil. A sensor inside the airfoil detects penetration of the confined laser beam through the surface of the airfoil. A method for manufacturing an airfoil includes confining an unfocused laser beam inside a first fluid column to create a confined laser beam, directing the confined laser beam at a surface of the airfoil, and penetrating the surface of the airfoil with the confined laser beam. The method further includes detecting penetration of the confined laser beam through the surface of the airfoil.Type: ApplicationFiled: August 20, 2013Publication date: February 26, 2015Applicant: General Electric CompanyInventors: Zhaoli Hu, Douglas Anthony Serieno, Mark Joel Kromer
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Publication number: 20150047305Abstract: Separation device comprising a swirler (1, 20, 30) of a sheet material comprising a plurality of vanes (4) with a flow entrance side edge (6) defining an entrance angle (?) and a flow exit side edge (8) defining an exit angle (?). The flow entrance side edge and flow exit side edge extend from a center section (3) to a peripheral edge (9), which extends between end points of the flow entrance edge and the flow exit edge. The entrance angle is larger than the exit angle. The swirler can me made from a blank (10) by cutting out cutting lines defining the peripheral edges, the flow entrance edges and flow exit edges of a plurality of vanes (4) of a swirler. The vanes are subsequently bent to define the exit and entrance angles. Optionally, the swirler can be stacked with one or more correspondingly cut and bent swirlers to form a single stacked swirler (20, 30).Type: ApplicationFiled: December 17, 2012Publication date: February 19, 2015Inventors: Hugo Altorf, Jannes Koppen, Joost Jacobus Kroon
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Patent number: 8957349Abstract: A laser machining device is provided with a laser light source, a spatial light modulator, a driving unit, a control unit, and a condensing optical system. The control unit selects a basic hologram corresponding to each basic machining pattern included in a whole machining pattern in a workpiece from a plurality of basic holograms stored by the storage unit, and determines a display region of the basic hologram in the spatial light modulator so that the deviation of the value of “I?/n” becomes small for the selected respective basic hologram when the intensity of a laser beam input to a display region of the basic hologram in the spatial light modulator is defined as I, the diffraction efficiency of the laser beam in the basic hologram is defined as ?, and the number of condensing points in a basic machining pattern corresponding to the basic hologram is defined as n.Type: GrantFiled: July 1, 2009Date of Patent: February 17, 2015Assignee: Hamamatsu Photonics K.K.Inventors: Naoya Matsumoto, Norihiro Fukuchi, Naohisa Mukozaka, Takashi Inoue, Yuu Takiguchi
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Publication number: 20150034616Abstract: A laser system includes a laser configured to emit pulse bursts and a motion device in optical communication with the laser. The motion device moves a laser beam along a process path on a substrate and is configured to have a natural frequency that is greater than an operating frequency of the laser system. The laser system enables high and constant speed processing along tight radii in the process path, which is useful to form laser induced channels along the process path with equal spacing.Type: ApplicationFiled: August 5, 2014Publication date: February 5, 2015Inventors: Niels A. Olesen, David A. Bender, Donald L. Bareman
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Publication number: 20150034603Abstract: Components, such as turbine blades or vanes, are formed to a desired shape and dimensions by ablation machining a work piece surface. Recast layer material created on the work piece surface during the ablation machining is subsequently removed by fluoride ion cleaning (FIC). Exemplary ablation machining methods include laser machining and electric discharge machining (EDM). The work piece material may include superalloys commonly used for fabrication of turbine blades or vanes, which are susceptible to recast layer formation during EDM or laser machining. Post ablation FIC recast layer removal is easier than known methods, such as mechanical grinding, secondary EDM machining of the layer at lower speeds and/or current intensity, or chemical etching processes. Ablation machining processes can be optimized for speed and efficiency without regard for recast layer avoidance, with knowledge that the recast layer will be subsequently removed by the complimentary FIC process.Type: ApplicationFiled: July 30, 2013Publication date: February 5, 2015Inventor: Ivan F. Oliver Vargas
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Publication number: 20150038313Abstract: Systems and methods are described for forming continuous laser filaments in transparent materials. A burst of ultrafast laser pulses is focused such that a beam waist is formed external to the material being processed without forming an external plasma channel, while a sufficient energy density is formed within an extended region within the material to support the formation of a continuous filament, without causing optical breakdown within the material. Filaments formed according to this method may exhibit lengths exceeding 10 mm. In some embodiments, an aberrated optical focusing element is employed to produce an external beam waist while producing distributed focusing of the incident beam within the material. Various systems are described that facilitate the formation of filament arrays within transparent substrates for cleaving/singulation and/or marking. Optical monitoring of the filaments may be employed to provide feedback to facilitate active control of the process.Type: ApplicationFiled: July 21, 2014Publication date: February 5, 2015Applicant: ROFIN-SINAR TECHNOLOGIES INC.Inventor: S. ABBAS HOSSEINI
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Patent number: 8946592Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cutting line on the surface of the work to cause multiple photon absorption and with a condensed point located inside of the work, and a modified area is formed inside the work along the predetermined determined cutting line by moving the condensed point along the predetermined cut line, whereby the work is cut with a small force by cracking the work along the predetermined cutting line starting from the modified area and, because the pulse laser beam is hardly absorbed onto the surface.Type: GrantFiled: March 28, 2012Date of Patent: February 3, 2015Assignee: Hamamatsu Photonics K.K.Inventors: Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda
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Patent number: 8946590Abstract: Methods of forming scribe vents in a strengthened glass substrate having a compressive surface layer and an inner tension layer are provided. In one embodiment, a first and second defect is formed to partially expose the inner tension layer. A first scribe vent may be generated in a first scribing direction by translating a laser beam and a cooling jet on a surface of the strengthened glass substrate at a first scribing speed. A second scribe vent intersecting the first scribe vent may be generated in a second scribing direction by translating the laser beam and the cooling jet on the surface of the strengthened glass substrate at a second scribing speed that is greater than the first scribing speed. The defects may be perpendicular to the scribing directions. In another embodiment, the first scribe vent may be fused at an intersection location prior to generating the second scribe vent.Type: GrantFiled: November 23, 2010Date of Patent: February 3, 2015Assignee: Corning IncorporatedInventor: Xinghua Li
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Patent number: 8946589Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.Type: GrantFiled: October 1, 2010Date of Patent: February 3, 2015Assignee: Hamamatsu Photonics K.K.Inventors: Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda
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Patent number: 8946591Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cutting line on the surface of the work to cause multiple photon absorption and with a condensed point located inside of the work, and a modified area is formed inside the work along the predetermined determined cutting line by moving the condensed point along the predetermined cut line, whereby the work is cut with a small force by cracking the work along the predetermined cutting line starting from the modified area and, because the pulse laser beam is hardly absorbed onto the surface.Type: GrantFiled: March 23, 2012Date of Patent: February 3, 2015Assignee: Hamamatsu Photonics K.K.Inventors: Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda
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Publication number: 20150028008Abstract: Systems and methods for improving the cutting efficiency and cut profile of stent strut is provided. A means for altering the energy distribution of a laser beam is provided, along with various ways of controlling a laser to provide for improved strut configurations are provided. A method for improved cutting speeds using a combination of laser sources is also provided.Type: ApplicationFiled: September 25, 2014Publication date: January 29, 2015Inventors: Li Chen, Travis Yribarren, Randolf Von Oepen, Yu-Chun Ku
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Patent number: 8941029Abstract: The invention relates to methods and systems for keyhole-free fusion cutting of a workpiece, wherein the workpiece is melted by a laser beam along a cutting joint and the molten mass produced is expelled from the produced cutting joint, e.g., by a gas jet at high pressure. According to the new methods at least one laser beam follows the laser beam in the cutting direction and influences the molten mass in such a manner that at least one of the two cutting flanks of the workpiece has a better cutting quality than when cutting without the trailing laser beam.Type: GrantFiled: June 10, 2010Date of Patent: January 27, 2015Assignee: TRUMPF Werkzeugmaschinen GmbH + Co. KGInventor: Tobias Hofmann
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Publication number: 20150020358Abstract: The present invention discloses a method of motor vehicle sheet blanking and a system of the same, wherein the blanking method comprises: firstly, nesting for motor vehicle sheet material, and cutting it into group sheets with a shape and size confirmed by the multi length of the sheet; next, designing a backing die depending on scraps to be cut from the group sheet, and hollowing in areas corresponding to blanking openings in the backing die, in which the dimensions of the blanking openings are greater than that of the actual scraps to be cut; then, placing a group sheet onto the backing die; laser cutting the group sheet based on the shape of motor vehicle sheet, the cut scraps dropping through the blanking openings in the backing die onto a scrap conveyor belt underneath; stacking the cut sheets. The present invention can effectively process scraps cut from sheets and improve the blanking efficiency.Type: ApplicationFiled: March 8, 2012Publication date: January 22, 2015Applicant: BAOSHAN IRON & STEEL CO., LTD.Inventors: Ruimin Wu, Wenhai Jin, Qi Yan, Chengguo Jin, Saidan Yang, Yuming Wang, Junliang Qiao, Shengbo Pan, Changqing Lv
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Patent number: 8936108Abstract: Downhole cutting systems, devices and methods for utilizing 10 kW or more laser energy transmitted deep into the earth with the suppression of associated nonlinear phenomena. Systems and devices for the laser cutting operations within a borehole in the earth. These systems and devices can deliver high power laser energy down a deep borehole, while maintaining the high power to perform cutting operations in such boreholes deep within the earth.Type: GrantFiled: March 13, 2013Date of Patent: January 20, 2015Assignee: Foro Energy, Inc.Inventors: Mark S. Zediker, Charles C. Rinzler, Brian O. Faircloth, Yeshaya Koblick, Joel F. Moxley
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Patent number: 8937264Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.Type: GrantFiled: March 28, 2012Date of Patent: January 20, 2015Assignee: Hamamatsu Photonics K.K.Inventors: Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda
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Publication number: 20150014889Abstract: Provided are a machining device (10), a machining unit, and a machining method that irradiate a workpiece (8) with a laser beam to perform cutting or boring machining of the workpiece (8). The invention has a laser output device (12), a guiding optical system (14) that guides a laser beam, and an irradiating head (16) that guides a laser beam and irradiates the workpiece (8) with the laser beam. The irradiating head (16) integrally rotates a first prism (52) and a second prism (54) with a rotation mechanism, thereby rotating a light path of the laser beam around a rotational axis of the rotation mechanism and irradiating the workpiece (8) while rotating the position of irradiation to the workpiece.Type: ApplicationFiled: February 28, 2013Publication date: January 15, 2015Inventors: Saneyuki Goya, Masato Kinouchi, Toshiya Watanabe
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Publication number: 20150014288Abstract: A highly elastic stent is made of an alloy that exhibits superelasticity at body temperature. At least a part of the highly elastic stent has such a property that load increases with displacement without exhibiting a distinct yield on a load-displacement curve obtained by a compression test and a bending test.Type: ApplicationFiled: August 14, 2014Publication date: January 15, 2015Inventor: Kiyoshi YAMAUCHI
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Publication number: 20150017066Abstract: A testing device has a base and multiple strips connected to the base. Multiple antigens are placed on each strip. The testing device or strips may be affixed to a sheet under a shield. Fluid can be applied to the testing device or the strips. The testing device can be used for biochemical testing, such as line immunoassay (LIA) testing.Type: ApplicationFiled: July 9, 2014Publication date: January 15, 2015Inventors: Kishore MALYAVANTHAM, Lakshmanan SURESH, William MAGGIO
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Patent number: 8931322Abstract: A material handling system for feeding sheet material to a laser cutting system. The material handling system including a shuttle having a number of roller pairs corresponding to a number of material coils. Each roller pair holding a leading end of one of the material coils. The shuttle translating the leading end of a selected material coil to a location at which sheet material from the selected material is fed to the laser cutting system.Type: GrantFiled: June 23, 2009Date of Patent: January 13, 2015Assignee: ADC Telecommunications, Inc.Inventors: Marlon E. Holmquist, John E. Ihrke, Daniel Peckskamp
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Patent number: 8933368Abstract: A modified region is accurately formed at a desirable position with respect to a laser light irradiation surface of an object to be processed. When an average difference ? has a value exceeding a predetermined threshold during trace recording, a particle segment Z including a line segment S where the average difference ? exceeds the predetermined threshold is defined. This determines that a particle exists on a line to cut 5 and randomly reflects measuring laser light, whereby a segment where the presence of the particle affects a control signal in a line segment to cut is detected as the particle segment Z. Correcting the control signal in the particle segment Z inhibits a converging lens from moving more than necessary because of an error included in the signal value under the influence of the presence of the particle, thus allowing the converging point of the processing laser light to accurately follow a front face 3.Type: GrantFiled: September 25, 2007Date of Patent: January 13, 2015Assignee: Hamamatsu Photonics K.K.Inventors: Kazuhiro Atsumi, Koji Kuno, Tatsuya Suzuki
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Patent number: 8933369Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.Type: GrantFiled: October 8, 2010Date of Patent: January 13, 2015Assignee: Hamamatsu Photonics K.K.Inventors: Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda
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Publication number: 20150008950Abstract: Embodiments relate to the formation of test probes. One method includes providing a bulk sheet of an electrically conductive material. A laser is used to cut through the bulk sheet in a predetermined pattern to form a test probe. Other embodiments are described and claimed.Type: ApplicationFiled: December 31, 2011Publication date: January 8, 2015Inventors: Roy E. Swart, Paul B. Fischer, Charlotte C. Kwong
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Patent number: 8927900Abstract: A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.Type: GrantFiled: October 18, 2010Date of Patent: January 6, 2015Assignee: Hamamatsu Photonics K.K.Inventors: Fumitsugu Fukuyo, Kenshi Fukumitsu, Naoki Uchiyama, Toshimitsu Wakuda
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Publication number: 20150000484Abstract: Disclosed herein is a method of manufacturing one or more kinds of rectangular unit pieces from a long base material sheet at a predetermined angle through a continuous cutting process using a cutting frame, the method including (a) manufacturing a base material sheet of a laminate structure having two or more stacked sheets and winding the base material sheet on a roll, (b) continuously feeding the base material sheet, wound on the roll, (c) cutting the fed base material sheet using a cutting frame having cutters mounted or formed therein in a structure in which the cutters correspond to rectangular unit pieces to be manufactured, the cutters being arranged such that the shapes of opposite side ends of the cutters coincide with each other when the cutters are successively arranged, the cutting being carried out while the base material sheet is partially overlapped such that a length (‘pitch’) for a one-time cutting process is equal to a spacing distance between the opposite side ends of the cutters in the loType: ApplicationFiled: September 16, 2014Publication date: January 1, 2015Applicant: LG CHEM, LTD.Inventors: Hokyung LEE, Jaein CHOI, Soonki HEO, Jongku LEE
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Patent number: 8921734Abstract: A laser cutting machine includes a platform and a motion system. The motion system includes a first prismatic joint facilitating a first motion of the platform along a first direction and a second prismatic joint facilitating a second motion of the platform along a second direction. A galvano arranged on the platform, such that a motion of the platform causes a motion of the galvano, the galvano including a first mirror, wherein a third motion of the first mirror positions the laser beam along a third direction, and a second mirror, wherein a fourth motion of the second mirror positions the laser beam along a fourth direction. A control module controls concurrently the motion system and the galvano, such that a position of the laser beam on the workpiece is a vector sum of the first motion, the second motion, the third motion, and the fourth motion.Type: GrantFiled: November 10, 2011Date of Patent: December 30, 2014Assignee: Mitsubishi Electric Research Laboratories, Inc.Inventors: William S. Yerazunis, John C. Barnwell, III, Scott A. Bortoff, Vijay Shilpiekandula, Abraham Goldsmith
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Publication number: 20140373358Abstract: A method of manufacturing a trailer including a frame supporting a trailer bed and having rotatable wheels and a tongue for pivotal attachment to a land vehicle hitch. The method includes forming a plurality of structural members. Each structural member is made by cutting desired shapes having a desired perimeter edge outline and fastener holes from a metal sheet having galvanized protective coatings on both sides thereof, and bending the shapes for thereby forming into structural members. The structural members are secured together with rivets extending through the fastener holes thereby forming the trailer frame. The galvanized coatings are preferably one of zinc, aluminum or zinc and aluminum. The desired shapes are preferably cut by laser.Type: ApplicationFiled: June 21, 2013Publication date: December 25, 2014Inventor: Steven P. Bermes
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Patent number: 8916798Abstract: A laser machining apparatus and method for producing from a workpiece a rotating cutting tool having a cutting edge and a flank. The laser machining apparatus works in two different operating modes. In the first operating mode, a first laser head is used for machining the workpiece at high advance speeds of the workpiece relative to the first laser head to form a rough desired contour with pulses having a duration in the nanosecond range resulting in laser melt cutting. Subsequently, the laser machining apparatus is operated in the second operating mode generating laser pulses with having a pulse duration in the picosecond range. In the second operating mode, a second laser head is activated by means of an optical scanner system and directs the laser pulses onto a two-dimensional pulse area on the surface of the workpiece, the material removal is accomplished by laser ablation.Type: GrantFiled: February 14, 2012Date of Patent: December 23, 2014Assignee: Ewag AGInventor: Christoph Plüss
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Publication number: 20140363545Abstract: A package for a food product is provided and includes a fin seal, where the package is configured for controlled opening using an opening feature. The opening feature may include an integral flap separable from the remainder of the package to form an access opening to an interior of the package. The flap may be defined by one or more score or scribed lines that extend only partially through the package. The flap may have a portion extending into the fin seal area. Opening of the flap may expose adhesive of the fin seal area which can be utilized for attaching the flap to reclose the package.Type: ApplicationFiled: August 22, 2014Publication date: December 11, 2014Inventors: Paul Veternik, Stefan Scheuch, Ronald H. Exner, Olay Dagestad, Paul E. Doll, Deborah A. Lyzenga
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Publication number: 20140360992Abstract: An impact-absorbing pressure-sensitive adhesive sheet according to an embodiment of the present invention includes an impact-absorbing pressure-sensitive adhesive layer including an impact-absorbing layer. A side surface of the impact-absorbing pressure-sensitive adhesive layer includes a tapered surface; and the tapered surface has a taper angle of 65° or more.Type: ApplicationFiled: August 27, 2014Publication date: December 11, 2014Applicant: NITTO DENKO CORPORATIONInventors: Tomonori Noguchi, Atsushi Hino, Kanji Nishida, Kazuo Kitada, Takaichi Amano
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Publication number: 20140352833Abstract: A method for cutting a wound hose (1), made form mutually engaging windings (11, 12, 13, 14) of a metallic tape (2), with the wound hose (1) being welded in a predetermined axial area (10) and then cut within the area (10) essentially in a plane (6) extending radially, with the wound hose (1) being axially compressed in the predetermined area prior to welding such that in the area (10) a mutual contacting of the windings (11, 12, 13, 14) occurs. The welding is performed along a predetermined number of windings (11-14) in the area (10), and the welding energy required for welding the windings is introduced via the area of the winding hose into it. Additionally, an accordingly produced wound hose (1) is provided and a device suitable for its production.Type: ApplicationFiled: June 2, 2014Publication date: December 4, 2014Applicant: WITZENMANN GMBHInventor: Matthias Farr
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Publication number: 20140353297Abstract: A laser cutting device for cutting an original product includes a laser device which is movable along a first direction and a second direction perpendicular to the first direction, and rotatable reflecting mirrors. The original product includes a stub bar, optical lenses, and connection portions corresponding to the optical lenses. The rotatable reflecting mirrors correspond to the connection portions and are positioned above the original product and aligned with the connection portions. At least two rotatable reflecting mirrors are arranged in a straight line. The laser device is located on the straight line and is configured for emitting laser beams. Each of the rotatable reflecting mirrors is configured for reflecting laser beams from the laser device toward the corresponding connection portion and is configured for rotating so as to allow the laser beams from the laser device to reach the next rotatable reflecting mirror on the straight line.Type: ApplicationFiled: October 30, 2013Publication date: December 4, 2014Applicant: HON HAI PRECISION INDUSTRY CO., LTD.Inventor: CHEN-HAN LIN
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Publication number: 20140357973Abstract: A biocompatible, implantable electrode for electrically active medical devices. The implantable medical electrode has a surface geometry which optimizes the electrical performance of the electrode, while mitigating the undesirable effects associated with prior art porous surfaces. The electrode has an optimized surface topography for improved electrical performance. Such a electrode is suitable for devices which may be permanently implanted in the human body as stimulation electrodes, such as pacemakers, or as sensors of medical conditions. Such is achieved by the application of ultrafast high energy pulses to the surface of a solid, monolithic electrode material for the purpose of increasing the surface area and thereby decreasing its after-potential polarization.Type: ApplicationFiled: May 30, 2013Publication date: December 4, 2014Applicant: PULSE TECHNOLOGIES, INC.Inventor: Andrew E. Fisk
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Patent number: 8901452Abstract: A system and method for precision cutting using multiple laser beams is described, The system and method includes a combination of optical components that split the output of a single laser into multiple beams, with the power, polarization status and spot size of each split beam being individually controllable, while providing a circularly polarized beam at the surface of a work piece to be cut by the laser beam. A system and method for tracking manufacture of individual stents is also provided.Type: GrantFiled: June 10, 2013Date of Patent: December 2, 2014Assignee: Abbott Cardiovascular Systems, Inc.Inventors: Li Chen, Randolf Von Oepen
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Publication number: 20140346154Abstract: The invention is to a device and method, for cutting a can blank in which case an end section of the can blank is severed. The can blank is moved by means of a conveyor arrangement at a constant speed about a first axis of rotation. Preferably, a laser beam is used as the cutting means. A deflecting arrangement deflects the laser beam to a focal point where the side surface of the can blank is located. Due the rotation of the can blank about its longitudinal axis, the axial end section of said can blank is severed. The focal point of the laser beam does not change relative to the longitudinal axis of the can blank during the laser cutting operation.Type: ApplicationFiled: March 23, 2012Publication date: November 27, 2014Applicant: SCHULER PRESSEN GMBHInventors: Klaus Blei, Uwe Gunther
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Publication number: 20140339207Abstract: A laser cutting method and a laser cutting apparatus cut a metallic work with a laser beam of a one-micrometer waveband. The method and apparatus carry out the laser cutting of the work with a ring beam RB passed through a focus position of a condenser lens 13 and having inner and outer diameters that tend to expand. The outer diameter of the ring beam is in a range of 300 ?m (micrometers) to 600 ?m, an inner diameter ratio of the same is in a range of 30% to 70%, and a focal depth of the condenser lens is in a range of 2 mm to 5 mm.Type: ApplicationFiled: September 13, 2012Publication date: November 20, 2014Applicant: AMADA COMPANY, LIMITEDInventors: Akihiko Sugiyama, Hiroaki Ishiguro
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Patent number: 8890027Abstract: An object to be processed 1 is irradiated with laser light L with a standard pulse waveform, so as to form a molten processed region 131, which has a larger size in the thickness direction of the object 1 and is easy to generate a fracture 24 in the thickness direction of the object 1, within a silicon wafer 111, and with laser light L with a retarded pulse waveform, so as to form a molten processed region 132, which has a smaller size in the thickness direction of the object 1 and is hard to generate the fracture 24 in the thickness direction of the object 1, within a silicon wafer 112.Type: GrantFiled: March 6, 2007Date of Patent: November 18, 2014Assignee: Hamamatsu Photonics K.K.Inventors: Fumitsugu Fukuyo, Etsuji Ohmura, Kenshi Fukumitsu, Masayoshi Kumagai, Kazuhiro Atsumi, Naoki Uchiyama
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Publication number: 20140332510Abstract: Coating removal systems for optical fibers are disclosed. Related methods and optical fibers processed with these methods and coating removal systems are also disclosed. An optical fiber includes a glass fiber, having a cladding and core, surrounded by a protective coating which does not contribute to the optical performance of the optical fiber. By removing the coating at an end portion of the optical fiber, the end portion may be precisely positioned and secured to enable reliable optical communications. A laser beam may be directed at the protective coating to remove the protective coating by one or more ablating, melting, vaporizing, and/or thermal decomposing processes. The optical fiber may also be optionally cleaved. In this manner, the coating may be efficiently removed while retaining at least fifty percent of the tensile strength of the optical fiber.Type: ApplicationFiled: May 20, 2014Publication date: November 13, 2014Applicant: CORNING OPTICAL COMMUNICATIONS LLCInventors: Jeffrey Dean Danley, Robert Bruce Elkins, II, Darrin Max Miller, Zhaoxu Tian, Stephan T. Toepper, Kipp David Yeakel
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Publication number: 20140336680Abstract: Compositions and methods for making a three dimensional structure comprising: designing a three-dimensional structure; melting the three-dimensional structure from two or more layers of a metal powder with a high energy electron or laser beam is described herein. The position where the metal is melted into the structure is formed along a layer of metal powder, wherein the location and intensity of the beam that strikes the metal layer is based on the three-dimensional structure and is controlled and directed by a processor. The instant invention comprises a novel dry state sonication step for removing metal powder that is not melted from the three dimensional structure.Type: ApplicationFiled: July 28, 2014Publication date: November 13, 2014Inventors: Frank Medina, Lawrence Murr, Ryan Wicker, Sara Gaytan
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Publication number: 20140336620Abstract: Medical devices and methods for making and using the same. A medical device may include an elongate tubular member. The tubular member may include a first circumferential tube segment, a second circumferential tube segment disposed next to the first circumferential tube segment, and a third circumferential tube segment disposed next to the second circumferential tube segment. The first tube segment and the second tube segment may be separated by a first set of slots formed in the tubular member. The second tube segment and the third tube segment may be separated by a second set of slots formed in the tubular member. The second tube segment may be connected to the first tube segment with a proximally-extending beam formed in the tubular member. The second tube segment may also be connected to the third tube segment with a distally-extending beam formed in the tubular member. A ring may be defined in the second tube segment between the proximally-extending beam and the distally-extending beam.Type: ApplicationFiled: July 25, 2014Publication date: November 13, 2014Inventors: TED LAYMAN, CLAY NORTHROP