Methods Patents (Class 219/121.72)
  • Patent number: 8884183
    Abstract: A welding arrangement and a welding process for forming a weld seam between two edge portions, wherein the edge portions form a Y joint having a root portion and a bevel portion, said root portion being welded by a hybrid laser electric arc welding process including directing a laser beam and an electric arc in a single interaction zone of plasma and molten metal. A hybrid laser electric arc welding head and welding submerged arc welding head are arranged on a common carrier structure for welding the Y joint.
    Type: Grant
    Filed: December 16, 2009
    Date of Patent: November 11, 2014
    Assignee: ESAB AB
    Inventors: Johan Tolling, Kari Erik Lahti
  • Publication number: 20140327182
    Abstract: One aspect of the present invention is a container that includes a microwave interactive web at least partially overlying and joined to a three-dimensional support, wherein the three-dimensional support may be formed prior to having the microwave interactive web mounted thereto. The three-dimensional support may be a preformed container that is sufficiently rigid and dimensionally stable for use in containing food.
    Type: Application
    Filed: June 24, 2014
    Publication date: November 6, 2014
    Inventors: Brian R. O'Hagan, Laurance M.C. Lai, Joseph Walsh, William Cox, George Hackel, Neilson Zeng, Michael Shaw, Timothy Henry Bohrer
  • Patent number: 8872063
    Abstract: The present invention provides a method for producing a blank printing sleeve for laser engraving, comprising: (1) a step of laminating a photosensitive resin composition layer (a) on a hollow cylindrical support (b); (2) a step of photo-curing the laminated photosensitive resin composition layer (a) to form a cured photosensitive resin layer (c); and (3) a step of cutting the hollow cylindrical support (b) and the cured photosensitive resin layer (c) approximately in a circumferential direction of the hollow cylindrical support (b) by a laser cutting method and/or a water beam cutting method.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: October 28, 2014
    Assignee: Asahi Kasei E-Materials Corporation
    Inventors: Hiroshi Yamada, Miyoshi Watanabe
  • Patent number: 8869914
    Abstract: Workover and completion systems, devices and methods for utilizing 10 kW or more laser energy transmitted deep into the earth with the suppression of associated nonlinear phenomena. Systems and devices for the laser workover and completion of a borehole in the earth. These systems and devices can deliver high power laser energy down a deep borehole, while maintaining the high power to perform laser workover and completion operations in such boreholes deep within the earth.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: October 28, 2014
    Assignee: Foro Energy, Inc.
    Inventors: Mark S. Zediker, Charles C. Rinzler, Brian O. Faircloth, Yeshaya Koblick, Joel F. Moxley
  • Publication number: 20140312016
    Abstract: A laser cutting device is configured for cutting an original product. The original product includes a stub bar and an optical element. The laser cutting device includes a support member and a cutting member. The original product is moveably placed on the support member. The cutting member includes a checking unit and a laser cutting unit, and defines a cutting area. The checking unit checks whether the original product moves in the cutting area. The laser cutting unit cuts the original product, thereby separating the stub bar from the optical element if the original product moves in the cutting area.
    Type: Application
    Filed: April 15, 2014
    Publication date: October 23, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: YUNG-LUN HUANG
  • Publication number: 20140314995
    Abstract: A method of pulsed laser processing of solid surface for enhancing surface hydrophobicity is disclosed wherein the solid surface is covered with a transparent medium during laser processing and the laser beam incidents through the covering medium and irradiates the solid surface. Two effects are obtained simultaneously. One is the laser-induced texture formation directly under the laser irradiation. The other is the deposition of the laser-removed materials along the laser scan lines. Both effects introduce surface roughness on nanometer scales, and both enhance surface hydrophobicity, rendering superhydrophobicity on the surfaces of both the laser-irradiated solid and the covering medium. Because the beam scan line spacing can be larger than a single scan line width by multiple times, this method provides a high processing speed of square inch per minute and enables large area processing.
    Type: Application
    Filed: July 3, 2014
    Publication date: October 23, 2014
    Applicant: IMRA AMERICA, INC.
    Inventors: Bing LIU, Yuki ICHIKAWA
  • Patent number: 8866044
    Abstract: A magnesium alloy panel for a vehicle includes a first region and a second region extending from the first region to an edge. The first region has a first microstructure having a first corrosion resistance. The second region has a second microstructure different than the first microstructure and has a second corrosion resistance greater than the first corrosion resistance. A system for mass producing magnesium alloy panels includes a forming apparatus and a laser cutting apparatus. The forming apparatus forms a panel having a first microstructure having a first corrosion resistance. The laser cutting apparatus cuts the panel to form the edge using a laser, and forms the second microstructure while forming the edge. The second microstructure is different than the first microstructure and has a second corrosion resistance greater than the first corrosion resistance. A method for mass producing magnesium alloy panels is also provided.
    Type: Grant
    Filed: May 4, 2011
    Date of Patent: October 21, 2014
    Assignee: GM Global Technology Operations LLC
    Inventors: Anil K. Sachdev, Jon T. Carter
  • Publication number: 20140309587
    Abstract: Disclosed herein are a tube continuum robot and a method for manufacturing a tube. More particularly, disclosed are a tube continuum robot and a method for manufacturing a tube, which is used in the tube continuum robot having a plurality of overlapping tubes and has anisotropic patterns for controlling the bending rigidity and torsional rigidity of the tube. In an embodiment, a tube continuum robot has a plurality of overlapping tubes, one or more of the plurality of overlapping tubes having a curved shape, wherein a plurality of anisotropic patterns are formed on the outer circumferential surface of the one or more tubes along the lengthwise or circumferential direction of the tubes.
    Type: Application
    Filed: June 28, 2013
    Publication date: October 16, 2014
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Keri KIM, Sung Chul KANG, Kyu-Jin CHO, Dae-Young LEE, Ji-Suk KIM, Yong-Jai PARK
  • Publication number: 20140307394
    Abstract: Disclosed are apparatus and methods related to conformal coating of radio-frequency (RF) modules. In some embodiments, a module can include an overmold formed over an RF component mounted on a packaging substrate. The overmold can also cover a surface-mount device (SMD) such as an RF filter implemented as a chip size surface acoustic wave (SAW) device (CSSD). The module can further include a conductive layer formed over the overmold and configured to provide RF shielding functionality for the module. The conductive layer can be electrically connected to a ground plane of the packaging substrate through the SMD. An opening can be formed in the overmold over the SMD; and the conductive layer can conform to the opening to electrically connect the conductive layer with an upper surface of the SMD and thereby facilitate the grounding connection.
    Type: Application
    Filed: April 14, 2014
    Publication date: October 16, 2014
    Inventors: Anthony James LOBIANCO, Howard E. CHEN, Robert Francis DARVEAUX, Hoang Mong NGUYEN, Matthew Sean READ, Lori Ann DEORIO
  • Publication number: 20140305917
    Abstract: A laser processing apparatus includes a chuck table for holding a workpiece. A laser beam is applied to the workpiece. A laser beam oscillating unit oscillates the laser beam and a processing head having a focusing lens focuses the laser beam. A dust collecting unit collects debris generated by the application of the laser beam. The dust collecting unit includes a suction passage having an opening for allowing passage of the laser beam to be focused onto the workpiece by the focusing lens. The suction passage extends symmetrically with respect to the opening, and a vacuum source draws the debris. The suction passage has a first end and a second end selectively connected to the vacuum source.
    Type: Application
    Filed: April 9, 2014
    Publication date: October 16, 2014
    Applicant: Disco Corporation
    Inventor: Michael Gadd
  • Patent number: 8859934
    Abstract: A method of removing slag formed during laser cutting a hypotube may include flowing cooling gas into a laser nozzle, directing flow of the cooling gas onto an external surface of the hypotube, and injecting cooling fluid into an inner lumen of the hypotube at a velocity. Flowing the cooling gas and injecting the cooling fluid may at least partially remove slag from the external surface of the hypotube.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: October 14, 2014
    Assignee: Insera Therapeutics, Inc.
    Inventors: Vallabh Janardhan, Vikram Janardhan
  • Publication number: 20140299785
    Abstract: Method for manufacturing a sample for microstructural materials diagnostics, especially for transmission electron microscopy examinations, for scanning electron microscopy examinations for transmission electron-backscatter diffraction, for Rutheford backscatter diffraction, for elastic recoil detection analysis, for X-ray absorption spectroscopy or for X-ray diffraction, comprising detaching a basic structure from a preferably flat substrate by irradiating the substrate with a high energy beam, preferably with a laser beam, wherein the basic structure comprises a supported structure being supported by a supporting structure, preferably a cantilever beam which is supported at least at one of its both ends, preferably at both of its ends, by the supporting structure, the supporting structure being configured to be held by a jig, preferably to be clamped in the jig, and thinning the supported structure at least in sections by cutting, preferably by grazing, its surface, preferably at least at one of its lateral
    Type: Application
    Filed: April 2, 2014
    Publication date: October 9, 2014
    Applicant: Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V.
    Inventors: Michael Krause, Thomas Hoeche
  • Publication number: 20140302340
    Abstract: A sheet metal component bent from a sheet metal blank having a triangular corner comprises a first and a second sheet metal member bent along bending lines from a base member to form two edges of the triangular corner. Two outer edges are weldable to each other to form a third edge. A recess extends into the base member, formed by a curved and/or polygonal first and second edge which protrudes towards the first edge. The second edge extends with a projection beyond a straight line defined by the bending line of the first sheet metal member. A projection tip is spaced from the first edge at least by a thickness of the sheet metal. When the sheet metal members are bent the projection is surrounded by the first edge and the recess is at least substantially closed by the projection.
    Type: Application
    Filed: April 8, 2014
    Publication date: October 9, 2014
    Applicant: TRUMPF Werkzeugmaschinen GmbH + Co. KG
    Inventor: Joerg Heusel
  • Patent number: 8852698
    Abstract: It is an object to provide a laser beam machining method which can easily cut a machining target. The laser beam machining method irradiates laser light while positioning a focus point at the inside of a machining target to thereby form a treated area based on multiphoton absorption along a planned cutting line of the machining target inside the machining target and also form a minute cavity at a predetermined position corresponding to the treated area in the machining target.
    Type: Grant
    Filed: September 24, 2009
    Date of Patent: October 7, 2014
    Assignee: Hamamatsu Photonics K.K.
    Inventor: Kenshi Fukumitsu
  • Publication number: 20140291307
    Abstract: The invention relates to a method for producing a guide bevel on a workpiece, in particular a cutting tool. The workpiece to be machined is clamped in a clamping device which is rotationally driven about a rotational axis, and at least one laser unit is provided. The clamping device and the laser unit can be moved relative to each other by means of at least one CNC-controlled axis. The laser unit is of a type that is suitable for machining the workpiece by removing material. In order to produce the margin, the laser unit and the clamping device are controlled such that the workpiece in the clamping device is continuously rotated about the rotational axis of the clamping device at least by a specified angular amount while the laser unit and the clamping device are moved relative to each other at least by a specified distance in order to remove material from the workpiece so as to produce the guide bevel.
    Type: Application
    Filed: October 25, 2012
    Publication date: October 2, 2014
    Applicant: Vollmer Werke Maschinenfabrik GmbH
    Inventors: Manfred Saegmueller, Arndt Hauger
  • Publication number: 20140291306
    Abstract: A mask substrate that includes a first area and a second area surrounding the first area is provided. Then, a laser beam is irradiated on the mask substrate to at least partly remove a material of the second area. After that, a physical force is applied to the mask substrate to separate the first area from the mask substrate thereby forming an opening through the mask substrate.
    Type: Application
    Filed: September 9, 2013
    Publication date: October 2, 2014
    Applicant: Samsung Display Co., Ltd.
    Inventors: Doh-Hyoung LEE, Jun Ho JO
  • Publication number: 20140290827
    Abstract: The invention relates to a system and method for forming sleeved containers. The system includes a conveyor for transporting a row of containers, a sleeving unit for arranging sleeves around containers and a heat oven for attaching the sleeve around the container by heat shrinking. The conveyed containers are provided with a sleeve and the sleeved container is transported in the oven to allow the sleeve to shrink. According to the invention, part of the sleeve is removed using a removal unit. The part is removed after heat shrinking. Removing the part allows to uncover part of the container otherwise covered by sleeve.
    Type: Application
    Filed: November 7, 2012
    Publication date: October 2, 2014
    Inventor: Frederik Gerardus Heeman
  • Patent number: 8847104
    Abstract: A method for cutting a semiconductor wafer by generating a crack within the wafer, and a system thereof, are provided. The method comprises irradiating a laser beam towards a surface of the wafer and converging the laser beam to form a focal point so that a focal volume defined by the focal point and a boundary of the laser beam within the wafer is formed. Energy encompassed within the focal volume causes the wafer located at the periphery of the focal volume to contract faster than the wafer located within the focal volume, thereby generating a crack within the wafer.
    Type: Grant
    Filed: December 4, 2009
    Date of Patent: September 30, 2014
    Assignee: Agency for Science Technology and Research
    Inventors: Zhongke Wang, Tao Chen, Hongyu Zheng
  • Patent number: 8847111
    Abstract: A system, method, and device for etching an indicia onto a substrate includes a compact laser etching device having a delivery head, an emitter housing, a RF cable, and a communication cable. The delivery head has a beam steering mechanism and a hood assembly positioned between the beam steering mechanism and the substrate. The emitter housing has a laser for generating a laser beam, and a fold mirror positioned in an optical path of the laser beam for redirecting the laser beam into the beam steering mechanism. A remote RF electronics package drives the laser. Control electronics cause the beam steering mechanism to steer the laser beam into a pattern of the indicia. The delivery head may further include a plurality of suction cups for holding the compact laser etching device in engagement with the substrate.
    Type: Grant
    Filed: October 29, 2013
    Date of Patent: September 30, 2014
    Inventors: Timothy J. Miller, Cathy H. DeRossett
  • Patent number: 8841579
    Abstract: A processing system includes a common base, an object mount configured to hold an object for inspection or processing, and at least one aperture plate provided on the object mount. The aperture plate has at least one aperture The processing system also includes a laser device mounted on the common base and configured to scan a laser beam across a scan region, and a transport device configured to displace the object mount relative to the common base from a first position to a second position. When the object mount is in the first position, the object and the at least one aperture are positioned within the scan region of the laser device. The processing system also includes at least one light guide provided on the object mount. The light guide has an input port provided by the at least one aperture, and an output port.
    Type: Grant
    Filed: February 17, 2011
    Date of Patent: September 23, 2014
    Assignee: Carl Zeiss Microscopy GmbH
    Inventor: Holger Doemer
  • Patent number: 8839497
    Abstract: A machining process and apparatus capable of increasing removal rates achievable when machining titanium and its alloys. The process includes heating a portion of a workpiece with a laser beam, cryogenically cooling a cutting tool with a cryogenic fluid without flowing the cryogenic fluid onto the workpiece, and machining the heated portion of the workpiece with the cutting tool. The apparatus includes a cutting tool, a device for heating a portion of a workpiece with a laser beam prior to being machined with the cutting tool, and a device for cryogenically cooling the cutting tool with a cryogenic fluid without flowing the cryogenic fluid onto the workpiece. The cryogenic fluid is circulated around the cutting tool to achieve a temperature differential between the workpiece and the cutting tool that is capable of improving removal rates and extending tool life at cutting speeds of, for example, above 100 m/min.
    Type: Grant
    Filed: February 19, 2010
    Date of Patent: September 23, 2014
    Assignee: Purdue Research Foundation
    Inventor: Yung C. Shin
  • Publication number: 20140277382
    Abstract: A method for manufacturing a stent includes forming a stent blank from a first material, the stent blank comprising a plurality of struts and a plurality of crowns, each crown connecting at least two struts, and a plurality of slots in at least some of the plurality of struts and/or the plurality of crowns, depositing a second material over outer surfaces of the struts and the crowns and in the slots to encase the stent blank in the second material, creating at least one opening through the second material, and removing the first material to form a stent comprising the second material, the stent having a continuous lumen from one end of the stent to the other end of the stent, the continuous lumen being partitioned in portions corresponding to the locations of the slots in the stent blank. The lumen may then be filled with a therapeutic substance.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Applicant: Medtronic Vascular, Inc.
    Inventors: Mark Dolan, Stuart Kari, Christopher W. Storment
  • Publication number: 20140261844
    Abstract: A fluid conduit includes a flexible member having a tubular wall and a plurality of geometric segments located adjacent to the tubular wall. The geometric segments are disposed about a central axis of the conduit and spaced apart relative to each other to define a gap therebetween. The gap is sized to be closed by contact between adjacent geometric segments upon a predetermined flexure of the flexible member. A method of forming the conduit includes forming a flexible member with a tubular wall and forming a plurality of grooves about the central axis in the tubular wall. The geometric segments in one embodiment are formed from the intersections of a first plurality of helical grooves formed at a first angle relative to the central axis and a second plurality of helical grooves formed at a second angle mutually opposite from the first angle.
    Type: Application
    Filed: March 10, 2014
    Publication date: September 18, 2014
    Applicants: Robert Bosch GmbH, Robert Bosch Tool Corporation
    Inventors: Timothy J. Orow, Lawrence P. Heren
  • Publication number: 20140263191
    Abstract: A system and method of welding stainless steel to copper is provided. The method includes providing a first workpiece composed of stainless steel and providing a second workpiece composed of copper. The method also includes heating by using a laser a root area of a joint created by the workpieces. The heating by the laser creates a keyhole in at least one of the first workpiece and the second workpiece. The method also includes providing a consumable electrode that is composed of nickel to the joint and creating an arc between the consumable electrode and the joint using a welding current. The preheating of the arc using the keyhole eliminates the need to preheat the second workpiece.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Inventors: Alvaro ZAPATA, Paul E. Denney, Michael D. Latessa, Maxwell Radke
  • Publication number: 20140261977
    Abstract: Vascular treatment and methods include a plurality of self-expanding bulbs and a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Joints between woven structures and hypotubes include solder. Woven structures include patterns of radiopaque filaments measureable under x-ray. Structures are heat treated to include at least shapes at different temperatures. A catheter includes a hypotube including interspersed patterns of longitudinally spaced rows of kerfs. Heat treating systems include a detachable flange. Laser cutting systems include a fluid flow system.
    Type: Application
    Filed: January 29, 2014
    Publication date: September 18, 2014
    Applicant: Insera Therapeutics, Inc.
    Inventors: Vallabh Janardhan, Vikram Janardhan
  • Publication number: 20140277562
    Abstract: A prosthesis that includes a stent comprising a plurality of circumferential bands, a plurality of linking members, at least one anchor, or a prosthesis that includes a stent comprising at least one anchoring section comprising a first circumferential band, a second circumferential band, and at least one anchor. Optionally, the prosthesis further includes at least one cover.
    Type: Application
    Filed: March 10, 2014
    Publication date: September 18, 2014
    Applicant: Boston Scientific Scimed, Inc.
    Inventors: Dane T. Seddon, Sean P. Fleury, Mark D. Wood, Burns P. Doran, Daniel Ross
  • Publication number: 20140263217
    Abstract: A method of laser machining a polymer construct to form a stent that includes a bioresorbable polymer and an absorber that increases absorption of laser energy during laser machining. The laser cuts the tubing at least in part by a multiphoton absorption mechanism and the polymer and absorber have a very low absorbance or are transparent to light at the laser wavelength.
    Type: Application
    Filed: March 13, 2013
    Publication date: September 18, 2014
    Applicant: Abbott Cardiovascular Systems Inc.
    Inventors: Stephen D. Pacetti, Joel Harrington
  • Publication number: 20140263219
    Abstract: A telecentric F-theta lens is added to the optical chain of a laser used to cut stent patterns into a stent tube to facilitate positioning and alignment of the laser beam and to compensate for lateral and angular shift of the beam spot.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Applicant: ABBOTT CARDIOVASCULAR SYSTEMS INC.
    Inventor: Li Chen
  • Publication number: 20140263220
    Abstract: A laser system including various optical components providing for beam alignment and process monitoring of a stent cutting process is described. The various aspects of the invention provide for monitoring of a beam of laser light reflected from the surface of a stent tube so as monitor the properties of the cutting beam, location of the beam, system cleanliness, optical defects in the system, and cutting efficiency of the laser.
    Type: Application
    Filed: March 14, 2014
    Publication date: September 18, 2014
    Applicant: ABBOTT CARDIOVASCULAR SYSTEMS INC.
    Inventors: Li Chen, Yongjin Xie
  • Publication number: 20140263218
    Abstract: An apparatus and a method using a laser beam to produce a substantially vertical edge on a workpiece using a laser beam. The apparatus comprises a galvanometer for directing the laser beam and at least one substantially straight minor disposed in a substantially vertical position. The substantially straight mirror being positioned to redirect the laser beam on the workpiece at a selected incline, the incline being sufficient to produce the substantially vertical edge.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Inventor: Preco, Inc.
  • Patent number: 8835803
    Abstract: A laser cutting method includes providing a multi-layered substrate, such that the multi-layered substrate includes a circuit pattern between stacked first and second substrates, and removing a part of the second substrate by irradiating a laser beam on the second substrate, the laser beam being irradiated at an oblique angle with respect to an upper surface of the second substrate.
    Type: Grant
    Filed: December 28, 2010
    Date of Patent: September 16, 2014
    Assignee: Samsung Display Co., Ltd.
    Inventors: Won-Kyu Lim, Hyun-Chul Lee, Alexander Voronov, Jae-Seok Park, Cheol-Lae Roh
  • Publication number: 20140251962
    Abstract: The head (9) of the cutting apparatus (4) of the laser comprises a gas supply through a device such as a barrel dispenser which chops the blowing flow rate, which produces a better discharge of the liquid slag melt by the laser beam (16, 18) out of the plate (19) to be cut. A measurement (36) of backscattered light is made in order to check the good quality of cutting, the amount measured being smaller if the cutting actually passes through the plate (19), and the frequency or the pressure of the blowing pulses is adjusted by a controlling device (39) to keep the measure to a minimum by optimizing the slag discharge conditions.
    Type: Application
    Filed: October 11, 2012
    Publication date: September 11, 2014
    Inventor: Jean-Pascal Alfille
  • Publication number: 20140250562
    Abstract: A multi-spectral concealment assembly includes a garnish panel having a panel perimeter and a web spanning the panel perimeter. The web includes garnish bands extending across the panel perimeter. Gaps are positioned between each of the garnish bands. A method for assembling a garment panel includes joining the garnish panel with a liner. Joining includes fixing a garnish panel first location to a liner first location, gathering the garnish panel at the garnish panel first location, and fixing a garnish panel second location at a liner second location. A method for cutting plies of a multi-spectral concealment laminate includes stacking the laminate into plies and interposing an isolation sheet between each ply. The garnish panels are laser cut from the plies, and seared along respective edges. The searing of the edges of each garnish panel is isolated from searing along edges of other garnish panels with the isolation sheet.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 11, 2014
    Inventors: Brad Lee Matthies, Cody John Christenson, Patricia Mary Beernink, Charlene Gertrude Rust, Jennifer Joi Ellis, Wilma Kay Morrison, Francis James Farke, John Calvin Zumhofe, Brian Everett Pearson
  • Patent number: 8829391
    Abstract: A laser processing method of processing an object to be processed. The object to be processed has a modified portion and a non-modified portion. A modified layer forming step forms a modified layer of the object to be processed by scanning an inner portion of the object with a condensing point of first laser light. The modified layer (i) has a processing speed with second laser light that is lower than a processing speed of a non-modified portion and (ii) is formed below the non-modified portion. A removing step removes a portion of the non-modified portion. The portion of the non-modified portion ranges from a surface of the object to the modified layer. The removing step includes irradiating the portion of the non-modified portion with the second laser light.
    Type: Grant
    Filed: October 19, 2010
    Date of Patent: September 9, 2014
    Assignee: Canon Kabushiki Kaisha
    Inventors: Kosuke Kurachi, Masahiko Kubota, Akihiko Okano, Atsushi Hiramoto
  • Patent number: 8829389
    Abstract: A method of manufacturing a helical bar concave from a flat, rolled laser cut arrangement that provides a net helical concave functionality. Laser cutting a flat metal sheet to form helical cutouts defining a percent open area having a helical geometry in combination with configurable rub bars mounted in a helical fashion results in a configurable helical bar concave in which the number or aggressiveness of the threshing surface on the inside radius of the grate may be changed and/or the rub bars may be moved to the outside of the grate to change the percent open area and hence the separation characteristics of the concave.
    Type: Grant
    Filed: October 4, 2012
    Date of Patent: September 9, 2014
    Assignee: CNH Industrial America LLC
    Inventors: Wayne T. Flickinger, Herbert M. Farley, Jonathan E. Ricketts, Joshua D. Werning
  • Publication number: 20140243993
    Abstract: Compositions comprising a cartilage sheet comprising a plurality of interconnected cartilage tiles and a biocompatible carrier are provided. Methods of manufacturing cartilage compositions comprising a cartilage sheet comprising a plurality of interconnected cartilage tiles are also provided.
    Type: Application
    Filed: February 21, 2014
    Publication date: August 28, 2014
    Applicant: AlloSource
    Inventors: Carolyn Barrett, Yaling Shi
  • Publication number: 20140238984
    Abstract: A rupture disc (10) is provided comprising a line of opening (16) formed in at least one face thereof. The line of opening (16) is formed by laser machining of the disc's face and includes at least one disc opening control feature (20). The disc opening control feature (20) may be an opening-initiation feature configured to assist with initial rupture of the disc (10). Alternatively, the opening control feature (20) may be an anti-fragmentation feature configured to dissipate the energy acting upon the disc (10) so as to prevent separation of the petal formed upon opening of the disc.
    Type: Application
    Filed: February 28, 2013
    Publication date: August 28, 2014
    Applicant: FIKE CORPORATION
    Inventor: Joe Walker
  • Patent number: 8816247
    Abstract: A method of modifying a hypotube may include cutting the hypotube with a laser cut pattern, winding the hypotube in a spiral collector, and flowing gas into the spiral collector. Flowing the gas into the spiral collector may include cooling the hypotube. Flowing the gas into the spiral collector may include flowing the gas into the spiral collector at a temperature between 20° C. and 25° C. The gas may include air or inert gas. The method may include holding the hypotube at a height using a bushing, a plurality of collets, and a hypotube clamp. The bushing and plurality of collets may be configured to inhibit sag of the hypotube to be less than 3% of the height. The method may include inhibiting forming fissures in the hypotube. The pattern may include a plurality of patterns each comprising longitudinally-spaced rows.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: August 26, 2014
    Assignee: Insera Therapeutics, Inc.
    Inventors: Vallabh Janardhan, Vikram Janardhan
  • Publication number: 20140231398
    Abstract: There are provided high power laser and laser mechanical earth removing equipment, and operations using laser cutting tools having stand off distances. These equipment provide high power laser beams, greater than 1 kW to cut and volumetrically remove targeted materials and to remove laser affected material with gravity assistance, mechanical cutters, fluid jets, scrapers and wheels. There is also provided a method of using this equipment in mining, road resurfacing and other earth removing or working activities.
    Type: Application
    Filed: December 23, 2013
    Publication date: August 21, 2014
    Applicant: FORO ENERGY, INC.
    Inventors: Mark S. Land, John F. Volkmar, Mark S. Zediker, Shararth Kolachalam, Ryan J. Norton, Brian O. Faircloth, Daryl L. Grubb, Ronald A. De Witt
  • Publication number: 20140231085
    Abstract: There is provided high power laser systems, high power laser tools, and methods of using these tools and systems for cutting, sectioning and removing structures objects, and materials, and in particular, for doing so in difficult to access locations and environments, such as offshore, underwater, or in hazardous environments, such as nuclear and chemical facilities. Thus, there is also provided high power laser systems, high power laser tools, and methods of using these systems and tools for removing structures, objects, and materials located offshore, under bodies of water and under the seafloor.
    Type: Application
    Filed: August 2, 2012
    Publication date: August 21, 2014
    Inventors: Mark S. Zediker, Daryl L. Grubb, Ronald A. De Witt, Paul D. Deutch, Joel F. Moxley, Scott A. Marshall, Eugene J. Linyaev, Sam N. Schroit, Sharath K. Kolachalam
  • Patent number: 8806747
    Abstract: Methods and apparatus of an improved cooling structure having cooling passages are provided. A method includes forming pilot holes with an electrical discharge machine (EDM) drill near a heated flow surface. The pilot holes are then shaped with a wire EDM into cooling passages having a desired shape.
    Type: Grant
    Filed: July 30, 2009
    Date of Patent: August 19, 2014
    Assignee: Alliant Techsystems Inc.
    Inventors: Daniel P. Guinan, James B. Philpott, Henry K. Webster, Christopher Gettinger
  • Publication number: 20140224779
    Abstract: The invention relates to a protective device (1) for the laser machining of holes (3) in at least one component (2) by means of a laser beam (5), wherein the protective device (1) is positionable in the beam direction downstream of the beam-exit-side end (8) of a hole (3) to be machined in the component wall (10), in order to protect an adjoining rear space having a component wall (11), opposite the hole (3), of the component (2) from the incident laser beam. The protective device (1) according to the invention is formed from a composite made of a matrix composed of polyether ether ketone plastics material and fibres embedded therein, wherein the fibres are embedded such that, with respect to their particular fibre extending direction, they extend in a criss-cross manner in the plastics material and are distributed at approximately the same density in the volume of the plastics material of the protective device (1).
    Type: Application
    Filed: June 21, 2012
    Publication date: August 14, 2014
    Applicant: ROBERT BOSCH GMBH
    Inventors: Thorsten Bauer, Ulrich Graf
  • Publication number: 20140227889
    Abstract: In a particular embodiment, a relatively high-energy thulium fiber laser operating at the wavelength ?=2 ?m may be used to selectively modify a front and/or a back surface of silicon and gallium arsenide wafers. The processing regime was studied in terms of the process parameters variation, and the corresponding modification fluence thresholds were determined. The results revealed considerable differences in morphology between front and back surface modifications, and that the back surface modification threshold of Si is significantly higher than at the front surface. Basic analytic modeling and z-scan measurements were performed to study the absorption mechanisms. In a broader embodiment the processing regime is not specifically limited to a thulium fiber laser.
    Type: Application
    Filed: February 12, 2014
    Publication date: August 14, 2014
    Applicant: University of Central Florida Research Foundation, Inc.
    Inventors: Lawrence Shah, Martin C. Richardson, Ilya Mingareev, Mark Ramme, Tobias Bonhoff, Pankaj Kadwani
  • Patent number: 8791387
    Abstract: To provide a laser cutting method that is capable of cutting the substrates high accurately with high throughput at a low cost. It is a laser cutting method for cutting a laminated substrate that is formed by laminating at least a pair of substrates. The method comprises the steps of: providing a pattern member with a characteristic of absorbing light of a wavelength that transmits each of the substrates, between each of the substrates along a cutting position of the laminated substrate; and irradiating a laser of the wavelength that transmits the substrates along the pattern member, whereby the laminated substrate is cut along the pattern member.
    Type: Grant
    Filed: March 23, 2007
    Date of Patent: July 29, 2014
    Assignee: NLT Technologies, Ltd.
    Inventors: Tsutomu Hiroya, Kouji Shigemura
  • Patent number: 8791386
    Abstract: This invention relates to a method for cutting materials using a laser beam, which emerges from a cutting head comprising a cutting nozzle with an inner edge, and is absorbed by the cutting front. The axis of the laser beam is displaced in relation to a workpiece along a cutting line with a fixed orientation in the cutting direction of said workpiece. In this method the position (p) of the cutting head is modulated with regard to its time averaged value, or the laser power and gas pressure in the cutting head are modulated.
    Type: Grant
    Filed: October 11, 2005
    Date of Patent: July 29, 2014
    Assignee: Fraunhofer-Gesellschaft zur-Foerderung der Angewandten Forschung E.V.
    Inventors: Wolfgang Schulz, Reinhart Poprawe, Stefan Kaierle, Dirk Petring
  • Patent number: 8790997
    Abstract: While reliably cutting an object to be processed, the strength of the resulting chips is improved. An object to be processed 1 is irradiated with laser light L, so as to form modified regions 17, 27, 37, 47 extending along lines to cut 5 and aligning in the thickness direction in the object 1. Here, modified regions 17 are formed such that modified region formed parts 17a and modified region unformed parts 17b alternate along the lines, and modified regions 47 are formed such that modified region formed parts 47a and modified region unformed parts 47b alternate along the lines. This can inhibit formed modified regions 7 from lowering the strengths on the rear face 21 side and front face 3 side of chips obtained by cutting. On the other hand, modified regions 27, 37 located between the modified regions 17, 47 are formed continuously from one end side of the lines 5 to the other end side thereof, whereby the cuttability of the object 1 can be secured reliably.
    Type: Grant
    Filed: August 17, 2010
    Date of Patent: July 29, 2014
    Assignee: Hamamatsu Photonics K.K.
    Inventors: Aiko Nakagawa, Takeshi Sakamoto
  • Publication number: 20140205461
    Abstract: A method of injecting laser-blocking material into a workpiece includes communicating molten laser-blocking material through the workpiece as the workpiece is subjected to at least a partial vacuum within an enclosed environment such that the partial vacuum expands any air bubbles in the laser-blocking material and transports the air bubbles out of the workpiece.
    Type: Application
    Filed: December 12, 2013
    Publication date: July 24, 2014
    Applicant: United Technologies Corporation
    Inventor: Kim Wei Cheah
  • Patent number: 8785814
    Abstract: Systems and methods for the protection of optics are provided. In one example embodiment, a laser processing system is provided, the laser processing system comprising a laser source and an optic. The laser processing system may further comprise at least one of a liquid delivery mechanism configured to deposit liquid on the optic and an evacuation mechanism.
    Type: Grant
    Filed: May 5, 2009
    Date of Patent: July 22, 2014
    Assignee: LSP Technologies, Inc.
    Inventors: Steven M. Toller, Ronald L. Johnson
  • Patent number: 8785811
    Abstract: Systems and methods are described for efficient laser processing of a moving web-based material. In one embodiment, a moving web is provided at a selected speed. A laser beam is generated having a focal point positioned to provide either a score or cut in the web. The focal point of the laser beam is moved at a speed less than the selected speed for a selected distance thereby producing a discreet score or cut in the web in the machine direction. The focal point is repositioned to form another discreet score or cut once the prior discreet score or cut is formed. The repositioned focal point is moved at a speed less than the selected speed for another selected distance. The step of repositioning is repeated to form a plurality of discreet scores or cuts in the web moving at the selected speed. The laser beam is therefore able to be generated using less power than would be needed to produce the same type of discreet score or cut if the focal point were stationary as the web is moved at the selected speed.
    Type: Grant
    Filed: September 28, 2010
    Date of Patent: July 22, 2014
    Assignee: Preco, Inc.
    Inventors: James J. Bucklew, Kurt Hatella
  • Patent number: 8785812
    Abstract: The present invention relates to a device for the treatment of a workpiece, in particular of a substantially flat substrate, comprising a table (2) for supporting the workpiece (5), a flow generation apparatus (6, 11) producing a gas flow (22) on a top face (17.1, 17.2) of the table (2) in a region between the workpiece (5) and the top face (17.1, 17.2) of the table (2), on which gas flow the workpiece (5) is supported during the treatment.
    Type: Grant
    Filed: May 27, 2005
    Date of Patent: July 22, 2014
    Assignee: Tel Solar AG
    Inventors: Richard Grundmüller, Johannes Meier, Arthur Büchel