Abstract: A method for processing a PCBa panel to individualize the PCBa's on the PCBa panel and depanel the PCBa panel in substantially one step is described. The PCBa panel initially comprises a number of PCBa's having components and traces common to a number of different product SKUs. During processing, the PCBa panel is loaded into a machine containing a first and second laser. The first laser severs extra traces on each PCBa to individualize the PCBa's for specific SKUs and the second laser cuts the links between each PCBa, thereby depaneling the PCBa panel.

Abstract: An apparatus for the determination of geometric parameters of a laser beam, such as, for example, the beam diameter or the focus diameter. The apparatus includes a device for the emission of a laser beam into an active region, a detector arrangement, which can be positioned in the active region, a device for the provision of a relative movement between the laser beam and the detector arrangement, and a device for the registration and evaluation of a temporally varying signal of the detector arrangement. The detector arrangement includes at least one light guide, at least two flight-diffusing structures, and at least one light-sensitive sensor. The light guide has a light-emitting surface and a light-conducting region, with an elongated shape. The at least two light-diffusing structures are essentially extended along two different directions.

Abstract: A backplane optionally having stepped horizontal surfaces and optionally embedding metal interconnect structures is provided. First conductive bonding structures are formed on first stepped horizontal surfaces. First light emitting devices on a first transfer substrate are disposed on the first conductive bonding structures, and a first subset of the first light emitting devices is bonded to the first conductive bonding structures. Laser irradiation can be employed to selectively disconnect the first subset of the first light emitting devices from the first transfer substrate while a second subset of the first light emitting devices remains attached to the first transfer substrate.

Abstract: A single-crystal substrate having a film deposited on a surface thereof is processed to divide the single-crystal substrate along a plurality of preset division lines, including a shield tunnel forming step of applying a pulsed laser beam having such a wavelength that permeates through the single-crystal substrate to the single-crystal substrate from a reverse side thereof along the division lines to form shield tunnels, each including a fine hole and an amorphous region shielding the fine hole, in the single-crystal substrate along the division lines, a film removing step of removing the film deposited on the single-crystal substrate along the division lines, and a dividing step of exerting an external force on the single-crystal substrate to which the shield tunnel forming step and the film removing step are performed to divide the single-crystal substrate along the division lines along which the shield tunnels have been formed.

Abstract: Methods and apparatus for cutting a glass sheet along a cutting line into a desired shape. A laser source is configured to apply a laser beam to a beam location on the cutting line of the glass sheet. A source of cooling fluid is configured to apply a cooling fluid to a cooling band on the glass sheet to reduce a temperature of the glass sheet along the cooling path while elevating the temperature of the glass sheet at the beam location with the laser beam. The source of cooling fluid is configured to apply the cooling path as a cooling ring to circumscribe the beam location on the cutting line with the cooling band circumferentially spaced from the beam location while the cooling path and the beam location move simultaneously together in order to propagate a fracture in the glass sheet along the cutting line.

Abstract: A laser processing device forms a modified region in an object to be processed by converging ultrashort pulse laser light at the object and comprises a laser light source emitting the laser light, a converging optical system converging the laser light emitted from the laser light source at the object, and an aberration providing part imparting an aberration to the laser light converged at the object by the converging optical system.

Abstract: LED module chips are assembled by preparing red, green and blue LED substrates in regions partitioned at predetermined intervals. A module substrate has on its upper face a plurality of module chips each having an accommodation region for accommodating the red, green and blue LEDs therein. The front face of the LED substrate on which the LEDs are formed is opposed to the upper face of the module substrate. One of the LEDs is positioned to a predetermined one of the accommodation regions of the module chip, and a laser beam is irradiated from a rear face of the LED substrate to a buffer layer of LED with a condensing point of the laser beam positioned to the buffer layer to peel off the LED from an epitaxy substrate and accommodate the LED into the predetermined accommodation region of the module chip.

Abstract: A method of manufacturing a polymeric stent by forming a pattern on a polymer tube with a laser, where the pattern formed on the polymer tube comprises a plurality of repeating units comprising a plurality of unit cells, each having a V-shaped configuration and polymeric stents formed by the methods. The pattern may be formed on the polymer tube (e.g., polylactic acid tube) using a second harmonic generator laser in which a wavelength ranging from 940 nm to 1552 nm is converted.

Abstract: A laser processing machine employs a step of forming a pierced hole at a sheet material portion on an inner or outer side of a closed route when a processing to form a hole in the sheet material by cutting along a closed route is carried out. Following this pierced hole a step to perform a cutting process to cut to a predetermined position with a center of the laser beam traversing the closed route and a step of returning, in a condition in which laser irradiation is interrupted, a position of the laser processing head relative to the sheet material to assume a start position lying on the route during a step of cutting to the predetermined position and on the closed route are employed. Thereafter, a step of performing the cutting process from the start position along the closed route is carried out.

Abstract: The present application discloses methods, and systems for laser-scribing a solar panel and the solar panels. The method for laser-scribing the solar panel may comprise: capturing consecutively images of parts of a first line on the solar panel, the first line having a pre-designed shape; acquiring location information of each of the captured images of the first line; and laser-scribing parts of a second line on the solar panel consecutively, according to the acquired location information of the first line, so that the scribed second line has the pre-designed shape of the first line and maintains a fixed distance from the first line.

Abstract: Methods of dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a method of dicing a semiconductor wafer having a plurality of integrated circuits involves forming a mask above the semiconductor wafer, the mask composed of a layer covering and protecting the integrated circuits. The mask is then patterned with a split laser beam laser scribing process, such as a split shaped laser beam laser scribing process, to provide a patterned mask with gaps, exposing regions of the semiconductor wafer between the integrated circuits. The semiconductor wafer is then plasma etched through the gaps in the patterned mask to singulate the integrated circuits.

Abstract: A laser machining method includes a first piercing process of forming a non-through piercing hole extending from a top surface to a central portion of a workpiece; a workpiece cooling process; a second piercing process of making the piercing hole pierce to a bottom surface of the workpiece; and a workpiece cutting process. The second piercing process includes performing piercing by irradiating the workpiece with a laser beam while changing the output of the laser beam from a second output value to a third output value, which is smaller than the first output value and larger than the second output value, the focal position from a first in-focus position to a second in-focus position having a larger in-focus amount than the first in-focus position, and the depth of focus from a second depth deeper than a first depth to a third depth deeper than the second depth.

Abstract: The invention relates to a method for producing a shaped sheet metal part including the following steps, continuous feeding of a sheet metal band unwound from a coil to a jet cutter, concurrent cutting, by means of the jet cutter, of a blank out of the sheet metal band as it moves at a constant speed, the time required to produce the blank defining a cycle, picking up the blank by means of a first transfer device operating in time with the cycle, transferring the blank by means of a first transfer device to a shaping system operating in time with the cycle, and shaping the blank into a shaped sheet metal part by means of the shaping system.

Abstract: Systems and techniques for optimizing the operation of a beam emitter during material processing maintain an optimal polarization of the beam with respect to the material throughout processing—e.g., even as the beam path varies or the nature or thickness of the material changes.

Abstract: Use of a laser beam (1) which has one external and one internal laser beam area (4,7) with different intensities enables a higher temperature gradient to be produced in the z-direction.

Abstract: A laser system comprising a laser that produces a pulsed laser beam is configured to form a laser-induced channel in a multi-layer substrate including first and second material layers. The material layers may have different refractive indices. The laser-induced channel includes a uniform distribution of self-focus damage volumes through at least a portion of the thickness of one or both of the material layers. One of the material layers may be partially transparent or non-transparent. An optical assembly of the laser system can be configured to produce uniformly distributed self-focus damage volumes at an effective focal region corresponding to the substrate thickness. The distribution of damage volumes can be tailored to include areas or peaks of high damage volume density where it is desired to ablate material.

Abstract: A method of laser machining a polymer construct to form a stent that includes a bioresorbable polymer and an absorber that increases absorption of laser energy during laser machining. The laser cuts the tubing at least in part by a multiphoton absorption mechanism and the polymer and absorber have a very low absorbance or are transparent to light at the laser wavelength.

Abstract: A method and system for laser pre-cutting a layered material (31) with a laser beam (14) is disclosed. The layered material (31) comprises at least one tensile stress layer (TSL), at least one compression stress layer (CSL1, CSL2), and at least one interface region (IR1, IR2) between the at least one tensile stress layer (TSL) and the at least one compression stress layer (CSL1, CSL2) and is transparent to allow propagation of the laser beam (14) through the layered material (31).

Abstract: Embodiments of the invention are directed to a method of separating a wafer of light emitting devices. The light emitting devices are disposed in rows. The method includes dividing the wafer into a plurality of regions. Each region comprises a plurality of rows of light emitting devices and a first region is wider than a second region. For each region, the method includes determining a position of first and second dicing streets. The dicing streets are located between the rows of light emitting devices. The method includes determining, using the position of the first and second dicing streets, positions of a plurality of dicing streets disposed between the first and second dicing streets. The method includes cutting the wafer along streets.

Abstract: An apparatus for removing a semiconductor chip from a board may include: a laser configured to irradiate the board with a laser beam to heat bumps mounting the semiconductor chip on the board; a picker configured to separate the semiconductor chip from the board; a vacuum portion configured to provide a vacuum to the picker; and an intake. If solder pillars, that are residues of the bumps, are melted by the laser beam, the intake removes the solder pillars using the vacuum provided from the vacuum portion. An apparatus for removing a semiconductor chip from a board may include: a stage configured to support the board on which the semiconductor chip is mounted by bumps; a laser configured to irradiate the board with a laser beam to heat the bumps mounting the semiconductor chip on the board; and a picker configured to separate the semiconductor chip from the board.

Abstract: A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.

Abstract: An apparatus for and a method of forming a plurality of groups of laser beams (2, 2?, 2?) are defined. Each group (2, 2?, 2?) may comprise two or more laser beams. The apparatus comprises a first diffractive optical element (3, referred as DOE) and a second diffractive optical element (8), the first DOE (3) being arranged to receive a first laser beam (1) and to divide this into a plurality of second laser sub-beams and the second DOE (8) being arranged to receive said plurality of second laser sub-beams and to divide each of these into two or more groups of third laser sub-beams (2, 2?, 2?), the separation of the groups in a direction perpendicular to a first axis being adjustable by rotation of the first DOE (3) about its optical axis and the separation of the third laser sub-beams (2, 2?, 2?) within each group in a direction perpendicular to the first axis being adjustable by rotation of the second DOE (8) about its optical axis.

Abstract: A method of fabricating a solar cell is disclosed. The method can include forming a dielectric region on a surface of a solar cell structure and forming a metal layer on the dielectric layer. The method can also include configuring a laser beam with a particular shape and directing the laser beam with the particular shape on the metal layer, where the particular shape allows a contact to be formed between the metal layer and the solar cell structure.

Abstract: Methods and apparatus provide for supporting a source glass sheet and defining an at least partially non-straight cutting line that establishes a closed pattern that circumscribes a desired final shape; scoring the glass sheet at an initiation line using a mechanical scoring device; applying a laser beam to the glass sheet starting at the initiation line and continuously moving the laser beam relative to the glass sheet along the cutting line to elevate a temperature of the glass sheet at the cutting line to a substantially consistent temperature, where the laser beam is of a circular shape; and applying a cooling fluid simultaneously with the application of the laser beam, such that the cooling fluid at least reduces the temperature of the glass sheet in order to propagate a fracture in the glass sheet along the cutting line.

Abstract: A device and a method for performing and monitoring a plastic laser transmission welding process includes a processing beam source for emitting a processing radiation into a joining zone between two joining members so that a weld seam is formed, a measuring beam source for irradiating a measuring zone with a measuring radiation, a detection unit for detecting the measuring radiation reflected by an interface between the weld seam and its surroundings in the joining members, and an evaluation unit connected to the detection unit for determining the depth position of the interface in the joining members from the detected reflected measuring radiation.

Abstract: A laser apparatus for welding is disclosed. The laser apparatus includes: a laser optic head adapted and configured to modify a spot size of a laser beam oscillated by a laser oscillator and to project the laser beam into a joining portion of joining members, wherein the laser optic head is adapted and configured to modify the spot size to selectively perform brazing or welding. A method of selectively brazing or welding according to one or more exemplary embodiments of the present invention includes: providing a laser apparatus of as described herein; and actuating the laser optic head to modify the spot size of the laser beam and project the laser beam into the joining portion of the joining members to selectively perform brazing or welding.

Abstract: There is provided a laser beam processing method in which generation of foreign substances from cut can be suppressed and contamination of a surface of a work can be decreased when performing the processing method using a laser beam on the work made of a polymer material, and a laser processed product. Further, the present invention is to provide a laser beam processing apparatus that is used in the laser beam processing method. The present invention relates to a laser beam processing method for processing the work made of a polymer material using a laser beam, wherein the work is irradiated with a laser beam in a state that the optical axis of the laser beam is tilted in the advancing direction of processing by a prescribed angle with respect to the vertical direction of the work.

Abstract: A plate-like object processing method for processing a plate-like object including a substrate and a laminate formed on a front surface of the substrate, includes a substrate exposing step of exposing the substrate by removing the laminate by irradiating a region in which the laminate of the plate-like object is desired to be removed with a laser beam set at an energy density that destroys the laminate but does not destroy the substrate.

Abstract: Provided is a cutting method for a glass sheet, comprising radiating a laser beam to a cutting portion (C) of a glass sheet (G) having a thickness of 500 ?m or less to fuse the glass sheet (G), wherein a narrowest gap between fused end surfaces (Ga1 and Gb1) of the glass sheet (G), which face each other in the cutting portion (C), is managed to satisfy a relationship of 0.1?b/a?2, where “a” is a thickness of the glass sheet (G) and “b” is the narrowest gap.

Abstract: There are provided high power laser connectors and couplers and methods that are capable of providing high laser power without the need for active cooling to remote, harsh and difficult to access locations and under difficult and harsh conditions and to manage and mitigate the adverse effects of back reflections.

Abstract: A method of dicing a plurality of integrated devices included in a semiconductor substrate using laser energy comprises the steps of directing a first laser beam onto a cutting line along the substrate to ablate a portion of the substrate located along the cutting line to be diced, the portion of the substrate that is ablated forming a recast material adjacent to the cutting line of the substrate that has been diced. A second laser beam is directed onto another portion of the substrate adjacent to the cutting line to conduct heat processing of the recast material formed adjacent to the cutting line.

Abstract: A planar object to be processed 1 comprising a hexagonal SiC substrate 12 having a front face 12a forming an angle corresponding to an off-angle with a c-plane is prepared. Subsequently, the object 1 is irradiated with pulse-oscillated laser light L along lines to cut 5a, 5m such that a pulse pitch becomes 10 ?m to 18 ?m while locating a converging point P of the laser light L within the SiC substrate 12. Thereby, modified regions 7a, 7m to become cutting start points are formed within the SiC substrate 12 along the lines 5a, 5m.

Abstract: A method of preparing an apparatus for material processing by generating optical breakthroughs in an object. The apparatus includes a variable focus adjustment device. A contact element is mounted to the apparatus, the contact element has a curved contact surface having a previously known shape. The position of the contact surface is determined prior to processing the object, by focusing measurement laser radiation near or on the surface by the variable focus adjustment device, and the focus position is adjusted in a measurement surface intersecting the expected position of the contact surface. Radiation from the focus of the measurement laser radiation is confocally detected. The position of points of intersection between the measurement surface and the contact surface is determined from the confocally detected radiation to determine the position of the contact surface from the position of the points of intersection and the previously known shape of the contact surface.

Abstract: Apparatus, method and system for cutting a polymeric stent including the use of a polymeric mandrel as a laser shielding device. The polymeric mandrel is allowed to roll freely within a polymeric tube that is cut into a polymeric stent.

Abstract: Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.

Abstract: Various flexible heat sealable decorative articles and methods of making the same are described. The flexible heat sealable decorative articles are lightweight and can be combined with other decorative elements, such as metalized films. Various decorative are mixed or combined with one another to form highly attractive flexible heat sealable decorative articles.

Abstract: A laser processing method for a nonlinear crystal substrate having a plurality of crossing division lines which includes the step of applying a pulsed laser beam to a work surface of the nonlinear crystal substrate along the division lines to thereby form a plurality of laser processed grooves on the work surface along the division lines. The pulse width of the pulsed laser beam is set to 200 ps or less and the repetition frequency of the pulsed laser beam is set to 50 kHz or less.

Abstract: A wafer processing method including a modified layer forming step of applying a laser beam having a transmission wavelength to a substrate from the back side of the substrate along division lines. The modified layer forming step includes the steps of making the polarization plane of linearly polarized light of the laser beam parallel to the direction perpendicular to each division line, shifting the beam center of the laser beam from the optical axis of a focusing lens of a focusing unit for focusing the laser beam, in the direction perpendicular to each division line, and shifting the focal point of the laser beam by the focusing lens in the same direction as the direction where the beam center of the laser beam has been shifted.

Abstract: A dividing method for a workpiece having a substrate with a film formed on the front side thereof. A first laser beam is applied to the film from the front side of the workpiece along the streets formed on the film, thereby forming a plurality of laser processed grooves along the streets to cut the film along the streets. Thereafter, an adhesive tape is attached to the front side of the workpiece. Thereafter, a second laser beam is applied to the substrate from the back side of the workpiece along the streets in the condition where the focal point of the second laser beam is set inside the substrate, thereby forming a plurality of modified layers inside the substrate along the streets. Thereafter, the adhesive tape is expanded to thereby divide the substrate along the streets, thereby obtaining a plurality of individual devices. Thereafter, the back side of the substrate of each device is ground to remove the modified layers and reduce the thickness of each device to a predetermined thickness.

Abstract: A method for forming an identification mark on a silicon carbide single crystal substrate according to the present invention includes: (a) scanning a principal surface of a silicon carbide single crystal substrate with a laser beam at a first energy density such that a groove is formed in the principal surface of the silicon carbide single crystal substrate, thereby forming an identification mark which is constituted of one or more grooves in the principal surface of the silicon carbide single crystal substrate; and (b) scanning an inside of the groove formed in the principal surface of the silicon carbide single crystal substrate with a laser beam at a second energy density that is lower than the first energy density.

Abstract: A ceramic substrate for an electronic part inspecting apparatus that can be manufactured in accordance with predetermined specifications, regardless of the number and location of pins required, relatively quickly and inexpensively is provided. In certain embodiments the ceramic substrate is configured to connect to a probe for inspecting an electronic component, and the ceramic substrate comprises a plurality of vias located in a center area of the ceramic substrate that penetrate through the ceramic substrate in its thicknesswise direction, pads located in an outer periphery that surrounds the center area where the vias are located, the pads being configured to connected to the probes, and a conductive layer located only over the front surface of the ceramic substrate and connects the vias to the respective pads. Certain embodiments comprise a greater number of vias than pins. A method of manufacturing the ceramic substrate is also provided.

Abstract: In a method and device for machining material, an unfocused beam of laser radiation is focused and directed at the material surface, creating an interface of laser radiation and material to be machined. The beam waist, which results from the focusing the laser radiation, is held in the region of the interface of laser radiation and material. The spacing of the beam waist from the upper or lower side of the interface in the axial direction corresponds at most to triple the value of the penetration depth of the interface into the material. The focusing is effected such that components of the laser radiation are made divergent not just in the propagation direction downstream of the beam waist but also in the beam waist itself and/or also in the propagation direction upstream of the beam waist.

Abstract: A process for fabricating a device capable of random lasing comprising a substrate and a rare earth-doped glass fabricated on the substrate in the form of a waveguide, wherein the glass comprises a germanium glass, a titanium glass or a chalcogenide glass, where the process comprises ablating a target glass with incident radiation from an ultrafast laser in the presence of the substrate to deposit a quantity of the target glass on the substrate and applying rastering to ablate the target glass uniformly. The ultrafast laser emits pulses of 15 ps or less and the relative position of the laser spot on the target glass with respect to the substrate is constant during the ablation and wherein the Gaussian intensity profile of the laser beam has a spot area less than 3000 ?m2.

Abstract: While reliably cutting an object to be processed, the strength of the resulting chips is improved. An object to be processed 1 is irradiated with laser light L, so as to form modified regions 17, 27, 37, 47 extending along lines to cut 5 and aligning in the thickness direction in the object 1. Here, modified regions 17 are formed such that modified region formed parts 17a and modified region unformed parts 17b alternate along the lines, and modified regions 47 are formed such that modified region formed parts 47a and modified region unformed parts 47b alternate along the lines. This can inhibit formed modified regions 7 from lowering the strengths on the rear face 21 side and front face 3 side of chips obtained by cutting. On the other hand, modified regions 27, 37 located between the modified regions 17, 47 are formed continuously from one end side of the lines 5 to the other end side thereof, whereby the cuttability of the object 1 can be secured reliably.

Abstract: An opening radial dimension is set as a radial direction permissible dimension K of the metal coil as expressed by the following equation or lower. K = Yp × Z 2 ? EI ? R 2 ? ( ? - sin ? ? ? ? ? cos ? ? ? ) Wherein: K is a radial direction permissible dimension at the load action point position in mm; Yp is a yield stress of the metal sheet, in kgf/mm2; Z is a section modulus of the metal sheet, in mm3; R=(a metal coil radius r)?½(the plate thickness t of the metal sheet), in mm; E is a Young's modulus of the metal sheet, in kgf/mm2; I is a second moment of area of the metal sheet in mm4; and ? is an angle in radians about the axis of the metal coil from the load action point to the nearest restraining roll along a rewind direction of the metal coil.

Abstract: A method of producing a document of value, the method including providing a single lamina or multi-laminate sheet carrying data relating to one or more documents of value; selecting the shape of at least part of the edge of the or each document using the data relating to the document; and operating a cutting tool to cut out the or each security document from the sheet by cutting along the edge of the or each security document such that the at least part of the edge has the selected shape.

Abstract: An apparatus and method of operation for a high power broad band elongated thin beam laser annealing light source, which may comprise a gas discharge seed laser oscillator having a resonance cavity, providing a seed laser output pulse; a gas discharge amplifier laser amplifying the seed laser output pulse to provide an amplified seed laser pulse output; a divergence correcting multi-optical element optical assembly intermediate the seed laser and the amplifier laser. The divergence correcting optical assembly may adjust the size and/or shape of the seed laser output pulse within a discharge region of the amplifier laser in order to adjust an output parameter of the amplified seed laser pulse output. The divergence correcting optical assembly may comprise a telescope with an adjustable focus. The adjustable telescope may comprise an active feedback-controlled actuator based upon a sensed parameter of the amplified seed laser output from the amplifier laser.

Abstract: A converging point of processing laser light is made to accurately follow a laser light irradiation surface of an object to be processed. An object to be processed 1 is irradiated with measuring laser light along a line to cut 5, astigmatism is added to a reflected light component of the measuring laser light reflected by a front face 3 of the object 1 irradiated with the measuring laser light, a displacement sensor signal corresponding to a converged light image of the reflected light component having the astigmatism added thereto is detected, and the displacement sensor signal is made to become a feedback reference value corresponding to the quantity of the reflected light component, so as to locate the converging point of the processing laser light at a predetermined position with respect to the front face 3.

Abstract: A system and method for precision cutting using multiple laser beams is described. The system and method includes a combination of optical components that split the output of a single laser into multiple beams, with the power, polarization status and spot size of each split beam being individually controllable, while providing a circularly polarized beam at the surface of a work piece to be cut by the laser beam. A system and method for tracking manufacture of individual stents is also provided.

Abstract: A method of fabricating an electronic device, the device including a plurality of layers on a substrate, the layers including an upper conductive layer and at least one patterned underlying layer between said conductive layer and said substrate. The method includes patterning said underlying layer, and patterning said upper conductive layer by laser ablation using a stepwise process in which successive areas of said upper conductive layer are ablated by successively applied laser patterns. The successively applied laser patterns overlap one another in an overlap region. The method further includes configuring a said laser pattern and said patterned underlying layer with respect to one another such that in a said overlap region said patterned underlying layer is substantially undamaged by said stepwise laser ablation.