Abstract: A gate operator for opening and closing an exterior gate includes an elongate hollow housing for rigid vertical mounting relative to the ground. First and second spaced-apart hinge assemblies for securing to the gate are mounted within the housing for pivoting relative to the housing. A motor is mounted within the housing and is coupled to at least one of the first and second hinge assemblies for causing the at least one of the first and second hinge assemblies to pivot between first and second positions and thus cause the gate to pivot between opened and closed positions. A method for manufacturing the gate operator and a folded gate assembly utilizing the gate operator are provided.

Abstract: Apparatus, method and system for cutting a polymeric stent including the use of a polymeric mandrel as a laser shielding device. The polymeric mandrel is allowed to roll freely within a polymeric tube that is cut into a polymeric stent.

Abstract: Chain bar apparatus and methods are disclosed that may be formed from plastic, metal or other materials. Laser cutting of a chain bar core can provide improved structural characteristics, for example when adhesive is used to assemble the chain bar. Flow diversion elements can be used to optimize flow throughout the chain bar.

Abstract: A method and system for cleaving a film of material utilizing thermal flux. The method includes providing a substrate having a face and an underlying cleave region including a prepared initiation region. Additionally, the method includes subjecting the initiation region to a first thermal flux to form a cleave front separating the cleave region of the substrate to a film portion and a bulk portion. The method further includes subjecting an area of the bulk portion substantially in the vicinity of the cleave front to a second thermal flux to cause a temperature difference above and below the cleave region for inducing a propagation of the cleave front expanding the film portion to the area at the expense of the bulk portion. Furthermore, the method includes determining a scan path for the second thermal flux based on the cleave front. Moreover, the method includes scanning the second thermal flux to follow the scan path to further propagate the cleave front.

Abstract: A laser processing machine for processing workpieces, in particular, metal sheets, has a laser processing head having a nozzle receiving member for a laser nozzle and a workpiece support for workpieces that are intended to be processed and/or for processed workpieces. The workpiece support forms a workpiece support plane. A nozzle changing device is arranged at the lower side of the workpiece support plane remote from the laser processing head. In order to change a nozzle, a laser nozzle can be transferred between a nozzle magazine of the nozzle changing device and the nozzle receiving member of the laser processing head and can be assembled on or disassembled from the nozzle receiving member.

Abstract: The present invention provides an apparatus for laser cutting that comprises a rigid support table frame having a X-axis and a Y-axis, and one or more bridge rail modules running across the Y-axis of the table frame, each bridge rail module comprising at least one hold-down device module. The present invention further provides a process for laser cutting a metal plate using this apparatus.

Abstract: In an assembly for filling medicine dispensers (11) with administering units (12/i) which are to be taken daily by patients, a deblistering apparatus (39) is provided for the separating, automatic removal of the medicines from the respective blister pack, the blister film (33) of which can be subjected to a notching or cutting pretreatment, only after which the medicine is removed. A transport device (18) is provided which supplies the medicine dispensers (11) to a feeding device, at which the individual medicines can be loaded into receiving compartments (14/1 to 14/4) of the medicine dispenser (11). The assembly comprises modules (17/i) which have in each case a blister shaft (62), a punching device and a feeding device and are arranged along the transport device (18) at spacings from one another which correspond to the spacing of the receiving compartments (14/i) of the dispensers (11/i) or to an integral multiple of said spacing.

Abstract: A laser dicing method for a substrate to be processed having a metal film on a surface thereof includes a metal film removing step for placing the substrate to be processed on a stage, irradiating the metal film with a defocused pulse laser beam, and removing the metal film, and a crack forming step for irradiating a region where the metal film is removed of the substrate to be processed with a pulse laser beam, and forming a crack in the substrate to be processed.

Abstract: A method for drilling holes in a component according to an optimized sequence is provided. The sequence is determined so as to minimize a total displacement of all axes of a hole drilling machine that is required for moving between each hole in the sequence.

Abstract: The surface of a material is textured and by exposing the surface to pulses from an ultrafast laser. The laser treatment causes pillars to form on the treated surface. These pillars provide for greater light absorption. Texturing and crystallization can be carried out as a single step process. The crystallization of the material provides for higher electric conductivity and changes in optical and electronic properties of the material. The method may be performed in vacuum or a gaseous environment. The gaseous environment may aid in texturing and/or modifying physical and chemical properties of the surfaces. This method may be used on various material surfaces, such as semiconductors, metals and their alloys, ceramics, polymers, glasses, composites, as well as crystalline, nanocrystalline, polycrystalline, microcrystalline, and amorphous phases.

Abstract: The invention relates to an unloading device for a processing device for processing pipes by cutting, having a catching lance which is movable in the longitudinal direction of a pipe and which is insertable into the interior of a pipe to be processed. The unloading device includes at least one vertically movable, especially roller-shaped, support element for supporting the catching lance and/or includes a vertically movable depositing surface for depositing at least one pipe portion to be severed from the pipe during processing by cutting. The invention also relates to a method for processing a pipe by cutting by a processing device with which such an unloading device is associated.

Abstract: A method irradiates an interaction region of an inhabitable structure with laser light to remove material from the structure. The method includes releasably affixing an anchoring mechanism to the structure by vacuum pressure. The method further includes releasably affixing the anchoring mechanism to a laser head configured to receive laser light from a laser generator, such that the laser head is in a drilling position relative to the interaction region. The method further includes receiving the laser light from the laser generator and directing the laser light to the interaction region of the structure. The method further includes confining the material and removing the material from the interaction region resulting from irradiating the structure with the laser light.

Abstract: A laser cutting nozzle configured such that a laser beam is irradiated through a nozzle hole formed in a nozzle main body from an opening of the nozzle hole, and an assist gas surrounding the laser beam is emitted. The nozzle hole includes a first control flow path, a second control flow path, and a third control flow path formed in a coaxial cylindrical shape, in sequence from upstream toward downstream in a flow direction of the assist gas. If a diameter of the first control flow path is ?A, a diameter of the second control flow path is ?B, and a diameter of the third control flow path is ?C, an equation ?A<?C<?B is satisfied.

Abstract: In a method for producing a grain-oriented electrical steel sheet, grooves each having a given length and extending in a direction including a direction perpendicular to a transportation direction of the grain-oriented electrical steel sheet are formed at given intervals in the transportation direction by irradiating the surface of the grain-oriented electrical steel sheet with a laser beam while scanning the surface of the grain-oriented electrical steel sheet with the laser beam. Further, in the method for manufacturing a grain-oriented electrical steel sheet, the laser beam is a continuous-wave laser beam having a laser wavelength ? of 1.0 ?m to 2.1 ?m, power density Pd [W/mm2] which is obtained by dividing laser beam intensity P by a focused beam area S is 5×105 W/mm2 or more, and the power density Pd [W/mm2] and scanning speed V [mm/s] of a focused spot of the laser beam on the surface of the grain-oriented electrical steel sheet satisfy a relationship of 0.005×Pd+3000?V?0.005×Pd+40000.

Abstract: In an embodiment, a bearing assembly includes superhard bearing elements distributed circumferentially about an axis. At least one of the superhard bearing elements may include a first arcuate end portion, a second arcuate end portion, a first substantially planar face, a second substantially planar face, and a bearing surface. The first and second arcuate end portions may be generally opposite each other. The first substantially planar face may extend between the first and second arcuate end portions. The second substantially planar face may be generally opposite the first substantially planar face. The first substantially planar face may have a length greater than a length of the second substantially planar face. The bearing surface may extend between the first arcuate end portion, the second arcuate end portion, the first substantially planar face, and the second substantially planar face. The bearing assembly includes a support ring that carries the superhard bearing elements.

Abstract: A laser processing apparatus for cutting substrates comprises a laser head for generating a laser beam and first and second work holders on which substrates are mountable. A diverter positioned along a path of the laser beam is operative to selectively direct the laser beam towards a first substrate mounted on the first work holder to cut the first substrate, or towards a second substrate mounted on the second work holder to cut the second substrate, so that contemporaneous operations may be conducted on one substrate while the other substrate is being cut.

Abstract: A method is provided for separating or dividing strengthened glass articles, particularly strengthened glass sheets, into at least two pieces, one of which has a predetermined shape and/or dimension. A flaw is initiated in the glass at a depth that is greater than the depth of the strengthened surface layer of the glass, and a vent extending from the flaw is created at a vent depth that is greater than the depth of and outside the strengthened surface layer to at least partially separate the glass. In one embodiment, the vent is generated by treating the glass with a laser to heat the glass to a temperature in a range from about 50° C. below the strain point of the glass up to a temperature between the strain point and the anneal point of the glass. A glass article having at least one strengthened surface and at least one edge having an average edge strength of at least 200 MPa is also described.

Abstract: A method for material removal to a predetermined removal depth from a workpiece employs a laser beam consisting of one or more sub-beams, each of the latter having a defined beam axis. The axis of the laser beam or the individual axes of the sub-beams are guided along a removal line at a predetermined travelling speed and the laser beam has a predetermined spatial energy flow density that defines a Poynting vector S with a value I0f (x) and a direction s, the spatial energy flow density creating a removal face with an apex formed by the leading part of the removal face in the removal direction and the face, creating a removal edge.

Abstract: A method and apparatus is presented for laser machining complex features in workpieces using programmable laser focal spot shapes. A deformable mirror is inserted into the laser beam path of a laser machining system and programmed to alter the shape of the laser beam focal spot in real time as the workpiece is being laser machined in order to achieve improved control over the shape and size of laser machined features.

Abstract: A method for laser-cutting a carbon fiber substrate such as a preform is configured from fabric material comprising at least carbon fibers, characterized by cutting the carbon fiber substrate at initial conditions which have been set so that the state of the substrate that is being cut with a laser can be suppressed with or prevented from deviating from a target state. By the method, it is possible to effectively solve various problems such as dissipation of heat, positional shifting from the focal length range of the laser, and soot, and the carbon fiber substrate can be stably cut at the target desired state.

Abstract: A set (50) of laser pulses (52) is employed to sever a conductive link (22) in a memory or other IC chip. The duration of the set (50) is preferably shorter than 1,000 ns; and the pulse width of each laser pulse (52) within the set (50) is preferably within a range of about 0.1 ps to 30 ns. The set (50) can be treated as a single “pulse” by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a set (50) of laser pulses (52) at each link (22). Conventional IR wavelengths or their harmonics can be employed.

Abstract: A condensing optical system having a condensed light spot with a small size and a large focal depth without causing a problem of a decrease in intensity of the condensed light spot or discontinuity of an intensity distribution in front and rear areas of a focal position is provided. The condensing optical system that condenses a laser beam generated by a laser source at a predetermined focal length is designed to satisfy Expressions (a) to (d), thereby producing 3rd and 5th spherical aberrations: |Z8|?0.1? or |Z15|?0.05?,??(a) Z8/Z15?3 or Z8/Z15<1,??(b) |Z8|<1.4?, and??(c) |Z15|<0.5?,??(d) where ? is a wavelength, Z8 is an 8th coefficient of coefficients of the Zernike fringe polynomial of wavefront aberration corresponding to a 3rd order spherical aberration, and Z15 is a 15th coefficient of the coefficients of the Zernike fringe polynomial of wavefront aberration corresponding to a 5th spherical aberration.

Abstract: A method for making a device includes providing a tubular member which will be formed into the device, masking at least a portion of the inner surface of the tubular member with a removable sacrificial material, selectively removing a portion of the tubular member and sacrificial material using a laser device, and mechanically removing the sacrificial material from the inner surface of the tubular member. Ultrasonic energy could be applied to a workpiece which is being laser cut to prevent any generated slag from welding itself to an exposed surface of the workpiece. A compressed fluid or gas, such as air, could be used to clean the surface of the laser-cut workpiece to remove slag formation which adheres to the surface of the cut workpiece.

Abstract: A substrate processing system includes a first, movable surface tension gradient device, a dicing device and a system controller. The first, movable surface tension gradient device is capable of supporting a first process within a first meniscus. The first meniscus being supported between the first surface tension gradient device and a first surface of the substrate. The first movable surface tension gradient device capable of being moved relative to the first surface of the substrate. The dicing device is oriented to a desired dicing location. The desired dicing location being encompassed by the meniscus. The system controller is coupled to the dicing device and the surface tension gradient device. The system controller includes a process recipe. A method for dicing a substrate is also described.

Abstract: The invention discloses a control method of optical cutting. A laser processing module is used to generate a cutting heat source and an auxiliary heat source. The control method of optical cutting includes the steps of determining a cutting path on the work piece first; then calculating a thermal stress distribution along the cutting path according to a heating condition; next determining an irradiation condition for the auxiliary cutting heat source according to the thermal stress distribution induced by the cutting heat source; and irradiating the work piece along the cutting path with the cutting heat source and simultaneously irradiating the work piece with the auxiliary cutting heat source. The cutting of the work piece is therefore finished.

Abstract: A method, system and scan lens for use therein are provided for high-speed, laser-based, precise laser trimming at least one electrical element along a trim path. The method includes generating a pulsed laser output with a laser, the output having one or more laser pulses at a repetition rate. A fast rise/fall time, pulse-shaped q-switched laser or an ultra-fast laser may be used. Beam shaping optics may be used to generate a flat-top beam profile. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance, high absorption and reduced or eliminated heat-affected zone (HAZ) along the trim path, but not so short so as to cause microcracking. In this way, resistance drift after the trimming process is reduced.

Abstract: A method for heating a wafer that has at least one layer to be heated and a sub-layer. The method includes applying at least one light flux pulse to the wafer for heating the at least one layer in a manner such that the absorption coefficient of the flux by the layer is low as long as the temperature of the layer to be heated is in the low temperature range (PBT) but the absorption coefficient increases significantly when the temperature of the layer enters a high temperature range (PHT). Also, a sub-layer is selected such that the absorption coefficient of the applied light flux at the selected wavelength is high in the low temperature range (PBT) and the temperature enters the high temperature range (PHT) when the sub-layer is subjected to the light flux. The application of the light flux achieves improved heating of the wafer.

Abstract: The present invention provides a manufacturing method for accurate, fine and efficient processing of a work piece to be processed and prevention of graphitization of the work piece to be processed, when sintered diamond is processed by a laser beam. The method provides process comprising steps of (a) irradiating outer circumference of a scribing wheel 2 with a laser beam from the side of the wheel, (b) moving the laser beam relative to the wheel 2, (c) forming continuously along the circumferential direction in the required space fine grooves with openings directed radially on a ridge site, (d) irradiating the laser beam onto the site to be processed at a speed of the laser beam relative to the work piece, and (e) forming the work piece into a minute shape within a depth of less than 200 ?m.

Abstract: A laser machining device 1 includes a laser light source 10, a spatial light modulator 20, a controller 22, a converging optical system 30, and a shielding member 40. The phase-modulating spatial light modulator 20 inputs a laser beam outputted from the laser light source 10, displays a hologram modulating a phase of the laser beam at each of a plurality of pixels arranged two-dimensionally, and outputs the phase-modulated laser beam. The controller 22 causes the spatial light modulator 20 to display a plurality of holograms sequentially, lets the converging optical system 30 converge the laser beam outputted from the spatial light modulator 20 at converging positions having a fixed number of M, selectively places N converging positions out of the M converging positions into a machining region 91, and machines an object to be machined 90.

Abstract: A laser processing method of applying a pulsed laser beam to a workpiece formed from a transparent member, thereby performing laser processing to the workpiece. The laser processing method includes a first laser processing step of applying a first pulsed laser beam to a subject area of the workpiece to roughen the subject area and a second laser processing step of applying a second pulsed laser beam to the subject area roughened by the application of the first pulsed laser beam immediately after performing the first laser processing step, thereby forming a recess in the subject area. The first laser processing step and the second laser processing step are repeated to thereby form a continuous groove in the subject area.

Abstract: The present invention is a probe having a distal end made of one material, a tip and a portion disposed between the distal end and the tip that is a different second material. The probe is laser machined manufactured using a nanosecond or picosecond laser.

Abstract: A method of processing a work material using a laser can include directing a laser beam of optical energy from a laser to a work material; processing the work material with the laser beam of optical energy in accordance with at least one processing parameter to modify the work material, the processing of the work material having associated therewith an optical signature; sensing a characteristic of the optical signature; and varying the at least one processing parameter responsive to the sensing of the characteristic of the optical signature. Other related methods are disclosed, as are laser processing systems, which systems can be used to practice the methods.

Abstract: A laser mold removing method of the invention is for processing a composite material composed of a plurality of materials having different reflectances to a laser beam, and includes emitting laser beam in which a processing laser beam for processing the processing object and a measurement laser beam adapted to irradiate the processing object and having an output smaller than that of the processing laser beam are emitted, measuring a reflected light quantity of the measurement laser beam reflected by the processing object, and controlling based on the reflected light quantity.

Abstract: A stent is formed by encasing or encapsulating metallic rings in an inner polymeric layer and an outer polymeric layer. At least one polymer link connects adjacent metallic rings. The stent is drug loaded with one or more therapeutic agent or drug, for example, to reduce the likelihood of the development of restenosis in the coronary arteries. The inner and outer polymeric materials can be of the same polymer or different polymer to achieve different results, such as enhancing flexibility and providing a stent that is visible under MRI, computer tomography and x-ray fluoroscopy.

Abstract: Methods of fabricating coated components using multiple types of fillers are provided. One method comprises forming one or more grooves in an outer surface of a substrate. Each groove has a base and extends at least partially along the outer surface of the substrate. The method further includes disposing a sacrificial filler within the groove(s), disposing a permanent filler over the sacrificial filler, disposing a coating over at least a portion of the substrate and over the permanent filler, and removing the first sacrificial filler from the groove(s), to define one or more channels for cooling the component. A component with a permanent filler is also provided.

Abstract: Performing a high precision dicing without being affected by a step on a wafer surface, and preventing a particle generation caused by ablation is enabled. A laser dicing apparatus (10), which forms a reformed layer in a wafer (W) by irradiating the wafer (W) with a laser beam, includes: a condensing lens (26) that condenses the laser beam; an astigmatic optical measuring section (29) that measures an unevenness of a surface of the wafer (W) based on the laser beam radiated by a laser oscillating apparatus (21); an actuator (27) that moves the condensing lens (26) to adjust the position of the condensing point of the laser beam; and a control section (50) that controls the actuator (27). The control section (50) switches between a control based on the unevenness measured by the astigmatic optical measuring section (29) and a control for maintaining the position of the condensing lens (26) constant, in accordance with the position of the laser beam.

Abstract: A method for dicing a wafer stack having a first wafer and a second wafer stacked under the first wafer includes the steps of cutting the first wafer by a cutting blade to form a first cutting location on the first wafer, then cutting the first wafer by a laser stealth dicing process to form a second cutting location on the first wafer, and then removing the portion defined by the first and second cutting locations. In this way, it can avoid the to-be-removed portion from flying off from the first wafer during cutting.

Abstract: A machine for machining workpieces, especially metal sheets, comprises a machining device, a main drive and an auxiliary drive which is different therefrom. Both drives serve to generate a relative movement between the machining device and a workpiece for the purpose of machining the workpiece, wherein the machining device is movable relative to the workpiece and/or the workpiece is movable relative to the machining device with a main movement by means of the main drive and wherein the machining device is movable relative to the workpiece with an auxiliary movement by means of the auxiliary drive.

Abstract: A laser processing apparatus is provided. The laser processing apparatus removes and extracts debris generated by irradiating a transparent resin layer formed on a substrate with laser light during a patterning process, and includes a debris extraction module provided on the upper side of the substrate, wherein the debris extraction module sucks and extracts debris due to sublimation, thermal processing and composite action thereof generated from the transparent resin layer on the substrate irradiated with the laser light from the lower side thereof.

Abstract: A device for maintaining a cutting edge, e.g. a focused laser beam at a constant distance from a surface of the work piece as the cutting edge imposes a cut line in a coating on the surface of the work piece. The device includes a constant force spring connecting a tube to a support and a surface follower mounting an end of the tube. The positions of a surface of the surface follower and the cutting edge have a predetermined relationship to one another. Gas moving out of the tube provides a first gas bearing between the surface follower and inner surface of the tube, and gas moving through passageways in the surface follower provide a second gas bearing between the surface of the surface follower and a surface of the coating. The thicknesses of the bearings remain constant as the follower moves over the surface of the piece to maintain the cutting edge at a constant distance from the surface of the coating.

Abstract: A method for creating a metal reinforcement for a leading or trailing edge of a turbine engine blade including a reinforcement foot and head, the method including: creating a plurality of V-shaped tapered elements that form different parts of the metal reinforcement so that the metal reinforcement is divided into a plurality of parts distributed between the foot and the head; positioning the parts on equipment that is shaped like the leading or trailing edge of the turbine engine blade; and rigidly connecting the different parts so as to form the complete profile of the one-piece metal reinforcement the by recombining the different parts.

Abstract: A method for trimming a tube with at least one stiffening element placed on its tube wall to a target bending stiffness, wherein the tube has first an interim bending stiffness, which is greater than the target bending stiffness. For the purpose of reducing the interim bending stiffness of the tube to the target bending stiffness, it is provided in the method of the invention that volume of the stiffening element is removed, for instance, by means of a laser.

Abstract: Methods of fabricating coated components using multiple types of fillers are provided. One method comprises forming one or more grooves in an outer surface of a substrate. Each groove has a base and extends at least partially along the outer surface. A sacrificial filler is deposited within the groove, a second filler is deposited over the sacrificial filler, and a coating is disposed over at least a portion of the outer surface and over the second filler. The method further includes removing the sacrificial filler and at least partially removing the second filler from the groove(s), to define one or more channels for cooling the component.

Abstract: A laser processing apparatus is provided for patterning with laser light a resin film or a metal film formed on a substrate. The apparatus includes a laser light source; and a debris collection device having a transmission window through which the laser light is transmitted, a vortex generation mechanism generating a vortex gas flow by allowing gas to flow into a region near a laser light-irradiated area of the resin film or the metal film, and a screening device having an opening through which the incident laser light passes and screening a flow of debris. The mechanism is placed close to the resin film or the metal film on the substrate. Debris generated by laser light irradiation and before and after being stacked on the object film is entrained in the vortex gas flow generated by the vortex generation mechanism and is exhausted to outside through the screening device.

Abstract: A biosensor is disclosed comprising a support; a conductive layer composed of an electrical conductive material such as a noble metal, for example gold or palladium, and carbon; slits parallel to and perpendicular to the side of the support; working, counter, and detecting electrodes; a spacer which covers the working, counter, and detecting electrodes on the support; a rectangular cutout in the spacer forming a specimen supply path; an inlet to the specimen supply path; a reagent layer formed by applying a reagent containing an enzyme to the working, counter, and detecting electrodes, which are exposed through the cutout in the spacer; and a cover over the spacer. The biosensor can be formed by a simple method, and provides a uniform reagent layer on the electrodes regardless of the reagent composition.

Abstract: The invention relates to method for cutting a part using a laser beam, involving the use of laser beam generation means comprising at least one ytterbium-based fibre having a wavelength of between 1 and 4 ?m in order to generate the laser beam. The laser beam is selected to have a power of less than 100 kW, a power density of at least 1 MW/cm2, a focused beam diameter of at least 0.1 mm and a quality factor (BPP) of less than 10 mm·mrad.

Abstract: A method for making a device includes providing a tubular member which will be formed into the device, masking at least a portion of the inner surface of the tubular member with a removable sacrificial material, selectively removing a portion of the tubular member and sacrificial material using a laser device, and mechanically removing the sacrificial material from the inner surface of the tubular member. The method may also include applying a chemical solution to the tubular member and sacrificial material which primarily attacks the either the tubular member or sacrificial material.

Abstract: While six rows of molten processed regions 131, 132 to become a cutting start point are formed within a silicon wafer 11 along a line to cut 5, a weakened region 18 is formed in a rear face 21 of an object to be processed 1 along the line to cut 5 when forming the molten processed region 131 closest to the rear face 21. Since the molten processed regions 131, 132 are thus formed within the silicon wafer 11, particles can be prevented from occurring from the molten processed regions 131, 132. Also, since the weakened region 18 having a predetermined depth is formed on the rear face 21 of the object 1 along the line to cut 5, the object 1 can be cut along the line to cut 5 with a relatively small external force.

Abstract: A method which processes a work-piece by a laser machining apparatus, the method includes: forming a groove by laser light irradiated from the laser machining apparatus along a target line of the work-piece which is the boundary between a first area remaining after laser machining and a second area to be removed in the laser machining under a first machining condition in which the work-piece is not penetrated by the laser machining; and irradiating the work-piece with the laser light at a position that is in the second area and at least partially overlaps the groove under a second machining condition in which the work-piece is penetrated.

Abstract: A conductive terminal member is disposed at a portion between an insulating base film and an insulating cover film while insulating intermediate members are disposed at other portions therebetween. In this event, the intermediate members are formed in predetermined shapes and are located so as not to overlap the terminal member. The base film and the cover film are each melt-fixed to the intermediate members so that the terminal member is fixedly held between the base member and the cover film.