Abstract: A laser-based workpiece processing system includes sensors connected to a sensor controller that converts sensor signals into focused spot motion commands for actuating a beam steering device, such as a two-axis steering mirror. The sensors may include a beam position sensor for correcting errors detected in the optical path, such as thermally-induced beam wandering in response to laser or acousto-optic modulator pointing stability, or optical mount dynamics.

Abstract: There is provided a laser dicing apparatus comprising: a first position detecting device detecting a position of the surface of a wafer at an incident point of laser light; second position detecting device detecting in advance a position of the surface of the wafer; and a control section controlling the position in the thickness direction of a condensing point inside the wafer, wherein the control section, when scanning the laser light from the outside of a periphery of the wafer to the inside of the periphery of the wafer, performs control based on data obtained with the second position detecting device detecting the position of the condensing point at the periphery of the wafer, and after scanning a predetermined distance, switches to perform control based on data obtained by the first position detecting device.

Abstract: The present invention provides a process for laser cutting a metal plate that comprises a) providing at least a laser cutting device, b) providing a metal plate to be cut from a metal coil, c) providing at least a holding apparatus holding and maintaining the metal plate, d) cutting said metal plate by means of at least a laser beam delivered by said at least one laser cutting device In this process, during step d), the metal plate is first cut by a first line comprising at least a first cutting machine, into at least one peripheral blank, and at least one peripheral blank is subsequently fed to at least a second line comprising at least a second cutting machine, to be cut into several smaller individual final blanks. With regard to this process, the first line produces peripheral blanks faster than at least one second cutting machine of the second line can cut them into several smaller individual final blanks.

Abstract: The invention relates to a method for laser-cutting sheet steel (1), wherein a sheet steel (1) is gradually inserted in a defined position into the cutting area (2) of a laser cutter in a direction of advance V in order to machine it. The sheet steel (1) is machined by laser cutting in a machinable area corresponding to the length of the cutting area (2), in the entire machinable area or only in a section thereof. The machined part (8) and the non-machined part (8) of the sheet steel may also only overlap in some sections (10). An automatic discharge device is also provided. The manufactured parts and the remaining grid are likewise cut from the sheet steel (1) by laser cutting. The method can be repeated in several machining steps until the sheet steel (1) is completely machined, the results of the preceding machining step being taken into consideration for the subsequent machining step. The invention allows to optimally utilize the sheet steel (1) even when using smaller laser cutters.

Abstract: A rotatable workpiece holder for holding a hollow cylindrical workpiece thereon functions as a chiller for cooling the hollow cylindrical workpiece. A coolant, e.g., water, is supplied to the hollow cylindrical workpiece through second coolant passages and branch passageways defined in the workpiece holder, thereby cooling the hollow cylindrical workpiece. The coolant forms a film in a clearance between the outer surface of an annular side wall of the workpiece holder and the inner circumferential surface of the hollow cylindrical workpiece.

Abstract: A system and method for making a golf ball having a patterned surface is disclosed. The pattern may be made by a method including machining a pattern of feed marks on the surface of a golf ball mold and using the golf ball mold to mold a golf ball cover layer. The pattern may be configured to create capillary action to substantially counteract gravity and/or other forces acting on a substantially liquid coating material applied to the cover layer of the golf ball.

Abstract: Provided is a metal ring manufacture method and a metal ring metal device capable of manufacturing a plurality of metal rings at good efficiency without damaging the metal rings. The metal rings (R) are detached from a drum retaining unit (16) by a metal ring holding unit (28) with the arrangement state thereof being maintained; thereafter, each metal ring (R) clamped in the arrangement state by a pair of fingers (45, 46) of a metal ring clamping unit (29) is delivered sequentially in the arrangement direction by a ring delivering unit disposed in the second finger (46).

Abstract: A method of dividing a workpiece includes: forming a pre-machining alteration region in the inside of a region in which no device is formed; detecting the position of the pre-machining alteration region through infrared imaging by imaging means, to thereby recognize a deviation between the pre-machining alteration region and a planned dividing line as machining position correction information; and forming a main machining alteration region by utilizing the machining position correction information, whereby the workpiece can be accurately divided along the planned dividing lines into individual devices.

Abstract: Processing workpieces such as semiconductor wafers or other materials with a laser includes selecting a target to process that corresponds to a target class associated with a predefined temporal pulse profile. At least one of the predefined temporal pulse profiles may be triangular. The target class may include, for example unpassivated electrically conductive links or other bare metal structures. Based on the target class associated with the selected target, a laser pulse is generated having a triangular temporal pulse profile. The generated laser pulse is used to process the selected structure.

Abstract: Inventive single cavities for use in a high power fiber laser systems are described that include a high reflective grating, a gain fiber, an output coupler having a bandwidth in the range of 1 nm to 2 nm; and an output fiber connected to the single cavity that supplies power from the single cavity. The single cavity can be used in a wide variety of applications, including welding, cutting, brazing or drilling a material, or to seed a downstream amplifier.

Abstract: A laser machining method for metallic workpiece, including providing a metallic workpiece, heating the metallic workpiece with a heater controller, and machining the metallic workpiece with a laser beam.

Abstract: In a laser processing method, a workpiece is set with respect to a jig having a laser passage hole and a relative position of the jig and the workpiece is determined so that the laser passage hole can face toward a target processing point on the workpiece. Then, laser light is irradiated on the target processing point through the laser passage hole while creating a stream of an inert gas flowing from a peripheral area of the target processing point toward the target processing point and flowing away from the workpiece through the laser passage hole.

Abstract: The laser cutting method for cutting a pair of plate materials, each of which has a different thickness and melting point, by irradiating them with a laser is provided with a plate material placement process for placing the pair of plate materials side by side so that, out of the pair of plate materials, an opposite surface of a laser irradiated surface of a plate material with a lower melting point protrudes more than an opposite surface of a laser irradiated surface of a plate material with a higher melting point, a focus adjustment process for aligning a focus position of the laser with an undersurface opposite the laser irradiated surface of the plate material with a higher melting point out of the pair of plate materials, and a plate material cutting process for cutting the pair of plate materials through irradiation with the laser according to a series of operations while sustaining a focus position of the laser to the pair of plate materials.

Abstract: An anti-spatter composition for use with the laser cutting of titanium or titanium containing materials. The anti-spatter composition includes Lecithin and one or more organic solvents. The one or more organic solvents are absent halogen and halogen containing compound. The anti-spatter composition can also include surfactant and water. The surfactant is generally halogen free.

Abstract: An object is to obtain a laser cutting device and a laser cutting method with which a thick processing item can be cut by using laser light whose wavelength is shorter than that of CO2 laser light. With a laser cutting device (10), a laser emitting unit (24) emits a laser beam (YAG-based laser light whose wavelength is shorter than that of CO2 laser light) for cutting a processing item (30), an optical system (26) focuses the laser beam so that the laser beam has an elliptical cross-sectional shape and so that a long-axis direction of the ellipse is aligned with a direction in which cutting of the processing item (30) progresses, and thus, the elliptically-focused laser beam contributes to raising the temperature of a molten pool inside the processing item (30).

Abstract: Systems and methods are provided for adjusting a laser beam applied to a workpiece in a processing operation. A laser processing system receives the laser beam that is associated with a beam quality property. The laser processing system adjusts the laser beam to change the beam quality property based on a characteristic of the workpiece, a characteristic of the processing operation, or a combination thereof. The adjusted laser beam can also be delivered to the workpiece.

Abstract: The present disclosure relates to laser processing and a laser processing apparatus for processing materials using laser. Processing performed after loading a wafer on a work stage and a laser processing apparatus for implementing such processing, among others, are disclosed. The laser processing includes loading a wafer on a work stage; determining the number of chips formed on the wafer loaded on the work stage, performing chip defect inspection and aligning the wafer while moving the work stage; measuring a height of a surface of the wafer loaded on the work stage using a displacement sensor; monitoring output power of a processing laser using a power meter; and shifting the work stage while irradiating a laser beam on the wafer to process the wafer.

Abstract: An ablation method including a steps of ablating a region of a substrate (1) by a laser beam (3); and removing debris ablated from the region (1) by a flow of a fluid (7), namely, a gas or vapor, a liquid or a combination of the fluids. The flow of fluid (7) is directed to flow over the region so as to entrap debris and thereafter remove the entrapped debris from the region by directing the flow of fluid, with any entrapped debris, away from region along a predetermined path (6) avoiding subsequent deposition of entrapped debris on the substrate.

Abstract: A modulation device for directing a mobile tracking device away from an asset is provided. The modulation device includes a continuous wave laser source whose output is directed at a seeker head of the mobile tracking device. The modulation device causes the generation of localized sources within the mobile tracking device and confuses the mobile tracking device as to the true location of the asset. A portable cutting device is disclosed. The portable cutting device may include a portable power supply and a laser source. The portable power supply and laser source of the portable cutting device may be positioned within a backpack and carried by a user. A handheld unit which is coupled to the laser source may be supported by the hands of the operator. The handheld unit provides power generated by the laser source to a barrier to be cut.

Abstract: An improved apparatus and method for laser assisted machining are provided, by utilizing a computer to develop interrelated heating and machining plans, from a variety of input data describing the material to be machined, the properties of lasers and pyrometers used for heating the material, and computer models of the machining arrangement, workpiece and final part to be produced. An iterative process continues until the machining and heating plans result in the cutting zone of the workpiece being maintained at a desired temperature with no obstruction in the line-of-sight of at least one laser and pyrometer throughout the machining process, while also maintaining the cutting tool at or below a desired maximum temperature.

Abstract: Laser machining systems and methods may use one or more moving laser scanning stages with force cancellation. The force cancellation is provided by moving masses linearly with equal and opposition motion. One or more of the masses may be a laser scanning stage. The laser machining systems may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost.

Abstract: Implantable medical grafts fabricated of metallic or pseudometallic films of biocompatible materials having a plurality of microperforations passing through the film in a pattern that imparts fabric-like qualities to the graft or permits the geometric deformation of the graft. The implantable graft is preferably fabricated by vacuum deposition of metallic and/or pseudometallic materials into either single or multi-layered structures with the plurality of microperforations either being formed during deposition or after deposition by selective removal of sections of the deposited film. The implantable medical grafts are suitable for use as endoluminal or surgical grafts and may be used as vascular grafts, stent-grafts, skin grafts, shunts, bone grafts, surgical patches, non-vascular conduits, valvular leaflets, filters, occlusion membranes, artificial sphincters, tendons and ligaments.

Abstract: A substrate cutting apparatus includes a stage configured to support a substrate to be cut along a virtual cutting line, a laser generator configured to emit an ultraviolet (UV)-based laser beam for cutting the substrate by removing part of the substrate along the cutting line, and a beam oscillator disposed on a beam path of the laser beam and configured to perform a beam swing on the laser beam in a direction parallel to the length direction of the cutting line by oscillating a tilt angle of the laser beam toward the cutting line.

Abstract: A portable cutting device and related method of use are disclosed. The method may include the steps of providing a laser source and a battery power supply, and housing the laser source and the battery power supply in at least one storage container carried by a user. The method may further include the step of cutting a barrier with optical energy produced by the laser source and delivered by a handheld laser directing device.

Abstract: Cutting a workpiece with a laser beam includes using the laser beam to melt and/or vaporize at least a portion of the workpiece, and moving at least one of the workpiece and the laser beam relative to one another to form a cutting front on the workpiece, in which the laser beam includes either at least two different radially polarized beam portions offset relative to each along an advancing direction of the laser beam, or multiple laser beam strips extending along the advancing direction of the laser beam. Each laser beam strip has a different linear polarization direction, and the advancing direction corresponds to a direction along which the workpiece is cut by the laser beam.

Abstract: A laser cutting machine includes a platform and a motion system. The motion system includes a first prismatic joint facilitating a first motion of the platform along a first direction and a second prismatic joint facilitating a second motion of the platform along a second direction. A galvano arranged on the platform, such that a motion of the platform causes a motion of the galvano, the galvano including a first mirror, wherein a third motion of the first mirror positions the laser beam along a third direction, and a second minor, wherein a fourth motion of the second mirror positions the laser beam along a fourth direction. A control module controls concurrently the motion system and the galvano, such that a position of the laser beam on the workpiece is a vector sum of the first motion, the second motion, the third motion, and the fourth motion.

Abstract: A mechanical device is used for mounting and/or dismounting a laser nozzle on and/or from a nozzle mount of a laser processing machine for processing workpieces, especially metal sheets. The mechanical device includes a nozzle magazine having a nozzle holder support on which a nozzle holder for a laser nozzle is supported. In addition, the mechanical device has a support positioning drive by means of which the nozzle holder support is positionable together with the nozzle holder in a support positioning direction. A lifting device of the mechanical device serves to position the nozzle holder, when positioned in the support positioning direction in a lifting stand-by position, relative to the nozzle holder support in a positioning lifting direction extending perpendicular to the support positioning direction.

Abstract: According to embodiments of the present invention, there are disclosed a laser repairing apparatus and a laser repairing method for a substrate. The laser repairing apparatus comprises: a laser emitter; and a light transmission sheet with a light-shielding pattern, wherein a laser emitted by the laser emitter is used to cut a superfluous remainder of an electrode on the substrate, the light transmission sheet is located between the laser emitter and the substrate, and as compared with a pattern of the electrode on the substrate, the light-shielding pattern on the light transmission sheet has the same shape and a size at a predetermined ratio.

Abstract: An optical device wafer processing method including a laser processed groove forming step of applying a laser beam for performing ablation to the front side or back side of a substrate of an optical device wafer along streets, thereby forming a laser processed groove as a break start point on the front side or back side of the substrate along each street, and a wafer dividing step of applying an external force to the optical device wafer after performing the laser processed groove forming step to thereby break the wafer along each laser processed groove, thereby dividing the wafer into individual optical devices. In performing the laser processed groove forming step, an etching gas atmosphere for etching a modified substance produced by applying the laser beam to the substrate is generated, whereby an etching gas in the etching gas atmosphere is converted into a plasma by the application of the laser beam to thereby etch away the modified substance.

Abstract: A lancet structure for making an incision at a skin site and transporting an amount of blood from the incision away from the skin site and methods of utilizing and making such a lancet structure are disclosed. The lancet structure may comprise an elongated body having a first surface and a second surface, a skin penetrating end for making the incision, a through bore extending from the first surface to the second surface, and a blood transport portion extending from the skin penetrating end to the through bore along the first surface. The blood transport portion is configured to transport the amount of blood away from the skin site via a capillary force to the through bore, and the through bore is configured to transport the blood to the second surface.

Abstract: Embodiments of methods for fabricating refractory-metal articles (e.g., implantable medical devices), and honing and blasting apparatuses for use in such methods are disclosed. Methods for fabricating refractory-metal-containing articles include laser cutting in a vacuum environment and/or at least one mechanical or chemical finishing step configured to remove at least one region affected by the fabrication process (e.g., the laser cutting process) to provide a substantially defect-free surface finish.

Abstract: A method for producing a double-layer or triple-layer sound-absorbing panel (10) is specified, said panel consisting of a support panel (20) and at least one cover panel or coating (30, 35) of the support panel (20), the cover panel or coating (30, 35) being fixedly connected to the support panel (20). In this case, an open-pore (121) support panel is provided as the support panel (20) and the sound-absorbing panel (10) is arranged on each side (12, 13) provided with a cover panel or coating (30, 35) with a device opposing said side emitting a laser beam, the upper face (12) of said panel (10) being subjected to the laser beam, which is designed to burn away material from the cover panel or coating (30, 35) facing said laser beam over the depth in the direction of the laser beam in a plurality of holes (31).

Abstract: A method and apparatus for processing substrate edges is disclosed that overcomes the limitations of conventional edge processing methods and systems used in semiconductor manufacturing. The edge processing method and apparatus of this invention includes a laser and fiber-optic system to direct laser radiation onto a rotating substrate supported by a chuck. A laser beam is transmitted into a bundle of optical fibers, and the fibers accurately and precisely direct the beam to remove or transform organic or inorganic films, film stacks, residues, or particles, in atmosphere, from the top edge, top bevel, apex, bottom bevel, and bottom edge of the substrate in a single process step. Reaction by-products are removed by means of an exhaust tube enveloping the reaction site. This invention permits precise control of an edge exclusion width, resulting in an increase in the number of usable die on a wafer.

Abstract: A composite knife blade includes a cutting-edge piece of a first alloy, a back piece of a second alloy different from the first alloy, the cutting-edge piece and the back piece are brazed together at a serpentine joint. The cutting-edge piece has a high Rockwell hardness value, as compared to a hardness of the back piece. A method of manufacture of the knife blade includes fine blanking the back piece of from a sheet of the second alloy, laser cutting the cutting-edge piece from a sheet of the first alloy, and brazing the first piece to the second piece to form a composite blade. The composite blade is then cooled from the brazing temperature to an austenizing temperature of the cutting-edge piece, and quenched, to harden the cutting-edge piece.

Abstract: A method for determining a reference focal position of a focused laser beam passing through an opening in a nozzle body of a laser processing nozzle relative to a workpiece, in which the method includes: simultaneously cutting off a portion of the workpiece using the focused laser beam to form an edge on the workpiece and altering a distance between a focal point of the focused laser beam and the workpiece in a direction of an axis of the laser beam; determining coordinates of the edge formed on the workpiece; based on the determined coordinates, determining a section of the edge that protrudes the furthest from the workpiece; and establishing a reference focal position FL of the laser beam based on the determined coordinates corresponding to the section of the edge that protrudes the furthest from the workpiece.

Abstract: A photon collimator, suitable for use in medical imaging equipment, is constructed from a block of photon-attenuating material, such as solid tungsten or molybdenum alloy that defines a plurality of integrally formed septa slats. Each slat has an elongated length dimension greater than thickness and depth dimensions, and is oriented in an opposed pattern array that is laterally spaced relative to its respective thickness dimension. An aperture channel is defined between each pair of opposed slats. Rows of integrally formed slats in one block or separately affixed blocks may be stacked on each other at skewed angles to form two-dimensional grids of apertures having polygonal cross sections. The slats may be formed by electric discharge or laser thermal ablation machining, such as by a sequential passing of an EDM wire cutting head along the pattern array, repeating sequential cutting of respective channel depth and width.

Abstract: The present invention relates to the production of a series of holes in a layer of material, in particular to the production of a target rupture line in a first layer of an airbag cover. The radiation of a plasma that forms during the production of each hole is detected from the surface that is being machined. From the signal pattern derived, the time of the beginning of the signal and the time of the appearance of a falling edge that meets a predetermined edge criterion are detected and stored. The point in time at which the falling edge appears is a switching criterion for switching off the laser. The difference between the two points in time stored for each hole constitutes a quality criterion for the respective hole.

Abstract: In a process for cutting a work piece 10 by irradiating a front surface 11 of the work piece 10 with first heating light 43 and second heating light 44 and moving the irradiation regions 100 and 200 of each light along a planned cutting line 12 on the front surface 11, the first heating light 43 has a width W1 extending in a direction orthogonal to the moving direction thereof on a certain area of the front surface 11, the width of the first heating light being set so as to be smaller than a width W2 of the second heating light 44 extending in a direction orthogonal to the moving direction of the second heating light, and the irradiation region 100 of the first heating light 43 being moved in tandem with the irradiation region 200 of the second heating light 44, which precedes the first irradiation region.

Abstract: The invention relates to a device (10, 32, 56) for cutting a workpiece (12) by means of a working laser beam (14), comprising a housing (16), through which a path is made for the working laser beam (14) and which has a focusing lens (18) for focusing the working laser beam (14) onto the workpiece (12) to be cut within a working area (48), a lighting device (44) with a light source (46) for the incoherent lighting of the working area (48) of the workpiece (12) to be cut, a camera (32), coupled coaxially into the path of the working laser beam, for observing the working area (48) of the workpiece (12) to be cut, wherein an optical filter, which is substantially opaque to the working laser beam (14), is arranged ahead of the camera (32) in the path of the observation beam (22), and comprising a processing unit (56), which is designed for processing image data from the camera (32), in order to determine the geometry and quality of a slit (50) produced in the workpiece (12) by the working laser beam (14), wherein

Abstract: To provide a laser processing method which is capable of enhancing the dividing performance according to a required quality. By irradiating an object to be processed with a laser light L having a pulse waveform in which its half width and its bottom width are equal to one another, a plurality of modified spots are formed along a line to cut inside the object, and a modified region is formed with the plurality of modified spots. Here, a laser light source 101 controls a drive power source 51 by a laser light source controller 102, to switch among a pulse waveform among first to third pulse waveforms according to a PE value of the laser light L. In the case of a low PE value, a first pulse waveform formed such that a peak value is located on its first half side and into a saw-blade shape is set as the pulse waveform, and in the case of a high PE value, a second pulse waveform formed such that a peak value is located on its latter half side and into a saw-blade shape is set as the pulse waveform.

Abstract: A method and system for dicing semiconductor devices from a semiconductor film. A semiconductor film, backed by a metal layer, is bonded by an adhesive layer to a flexible translucent substrate. Reference features on the film are used to describe a cutting path like a scribe line. An infrared laser beam is aligned to the scribe lines from the back surface of the flexible substrate. The infrared laser beam cuts through the flexible substrate and the majority of the thickness of the adhesive layer, cutting a first trough of a backside street along a scribe line defined by the reference features. An ultraviolet laser beam is aligned to the backside street, or to the scribe line as mapped to the back surface of the flexible substrate. The ultraviolet laser cuts through the metal layer and the semiconductor film, cutting a second trough along the scribe line. The second trough extends from the bottom of and deepens the first trough, cutting through the semiconductor film.

Abstract: A method of manufacturing a printed circuit board is disclosed. The method in accordance with an embodiment of the present invention includes providing an insulation layer having a first area and a second area formed thereon, forming a solder resist layer on the insulation layer, in which the solder resist layer has a first opening formed thereon and the first opening exposes the first area, forming a first surface treatment layer on the first area inside the first opening, forming a second opening on the solder resist layer, in which the second opening exposes the second area, and forming a second surface treatment layer on the second area inside the second opening.

Abstract: A lead employing a connection between a conductor and an electric element is provided. The connection includes a conductive pad electrically connected to at least one conductor and the electric element electrically connected to the conductive pad. The conductive pad can further include an elongated element to connect the pad to the electric element. The method for connecting a conductor to an electric element is also provided. The method includes forming a groove in the insulator of a lead body to expose the conductor. Placing a conductive pad within the groove and electrically connecting a conductive pad to the conductor. An electric element is then placed over the conductive pad and the electric element is electrically connected to the conductive pad.

Abstract: A method for laser drilling of holes in a substrate (44) with varying simultaneity including operating a laser (22) to produce a single output beam (24) whose pulses have a total energy, dividing the single output beam into plural beams (41) to an extent which varies over time and applying the plural beams to plural hole drilling locations (209, 210, 212, 214, 216, 218, 220, 222) on the substrate including simultaneously drilling first parts of multiple holes using corresponding ones of the plural beams having a pulse energy which is a first fraction of the total energy and thereafter drilling at least one second part of at least one of the multiple holes using at least one of the plural beams each having a pulse energy which is at least a second fraction of the total energy, the second fraction being different from the first fraction.

Abstract: A method of forming a surface feature extending into a sample includes providing a laser operable to emit an output beam and modulating the output beam to form a pulse train having a plurality of pulses. The method also includes a) directing the pulse train along an optical path intersecting an exposed portion of the sample at a position i and b) focusing a first portion of the plurality of pulses to impinge on the sample at the position i. Each of the plurality of pulses is characterized by a spot size at the sample. The method further includes c) ablating at least a portion of the sample at the position i to form a portion of the surface feature and d) incrementing counter i. The method includes e) repeating steps a) through d) to form the surface feature. The sample is free of a rim surrounding the surface feature.

Abstract: A method for laser beam machining of a workpiece in which a laser beam is focused by an objective, into or onto the workpiece having a boundary surface, to produce a machining effect by a two-photon process, and the position of the focal point with respect to the workpiece is shifted. To obtain a reference for the position of the focal point, an image of a luminating modulation object is projected through the objective onto the workpiece into the focal plane or so as to intersect it. Reflections of the image occurring at the boundary surface are imaged into an autofocus image plane, and are detected by a camera. The camera image plane either intersects the autofocus image plane when the image of the illuminating modulation object lies in the focal plane, or lies in the autofocus image plane when the image of the modulation object intersects the focal plane.

Abstract: A method for partial detachment of a defined area of a conductive layer using a laser beam includes forming a conductor track with a defined path from the conductive layer on the substrate, the path defining main axes. The area is segmented into zones. A linear recess is provided along a respective perimeter of each of the zones. Each of the zones has a strip shape such that the recesses extend along paths that are substantially straight lines not parallel to either of the main axes. One of the zones to be removed is heated using laser radiation until adhesion of the conductive layer to the substrate is substantially reduced and the zone to be removed is detached in a surface-wide manner from the substrate under external influences. Laser-beam parameters are set such that only the conductive layer is removed without affecting an underlying substrate.

Abstract: An improved method for singulation of electronic substrates into dice uses a laser to first form cuts in the substrate and then chamfers the edges of the cuts by altering the laser parameters. The chamfers increase die break strength by reducing the residual damage and removes debris caused by the initial laser cut without requiring additional process steps, additional equipment or consumable supplies.

Abstract: A substrate cutting apparatus including: a stage to support a substrate; a laser generator to emit a laser beam; a beam oscillator to oscillate the laser beam onto a cutting line of the substrate, to heat the substrate; and a cooling unit to cool the heated substrate.

Abstract: The present invention relates to an elongated male connector (1), for a medical device, and a method of producing the male connector (1). The male connector (1) has a longitudinal axis (2) and comprises a plurality of conductive members (3), each having an outer contact surface (4) and being separated from each other by insulating members (5). The conductive and insulating members (3, 5) are disposed along the male connector (1), such that the outer contact surfaces (4) are arranged essentially at the same surface level, and that each of the conductive members (3) has an elongated extension along the longitudinal axis (2) of the male connector (1). Each conductive member (3) is provided with an insulated microrod (6) extending at least partially along the length of the male connector (1), and the conductive members (3) are hollow and have an essentially cylindrical cross-section and form, together with the insulating members (5), a self-supporting male connector (1) having no core wire.