Abstract: Drive shaft assemblies for a surgical instrument. Various forms include a plurality of movably interlocking joint segments that are interconnected to form a flexible hollow tube. A flexible secondary constraining member is configured in flexible constraining engagement with the plurality of movably interlocking joint segments to retain the interlocking joint segments in movable interlocking engagement while facilitating flexing of the drive shaft assembly.

Abstract: Methods for separating strengthened glass articles from glass substrate sheets and strengthened glass substrate sheets are described herein. In one embodiment, a method of separating a glass article from a glass substrate sheet includes forming at least one groove on at least one surface of the glass substrate sheet. The at least one groove continuously extends around a perimeter of the glass article and extends partially through a thickness of the glass substrate sheet. The method further includes strengthening the glass substrate sheet by a strengthening process and separating the glass article from the glass substrate sheet along the at least one groove such that one or more edges of the glass article are under compressive stress. In another embodiment, a strengthened glass substrate sheet includes an ion exchanged glass having one or more grooves in one or more strengthened surface layers, the one or more grooves defining glass articles.

Abstract: An illuminated display stand that is decorative, functional, and provides a stand for laser milled acrylic or plastic objects. The objects can be formed from any shape with the milled portion providing an outline with definition of most any two dimensional item. The milling of the object can include various depths and widths wherein the illumination from the display stand will highlight the object.

Abstract: A fabric cutting system and/or method can include a mandrel having a body and first and second legs, a centered chuck, and an offset chuck, each chuck configured to receive either one of the legs or body to rotatingly support the mandrel between the chucks. When one of the legs is inserted into the centered chuck and the mandrel body is inserted into the offset chuck, the mandrel can be rotated and the fabric mounted on the mandrel can be cut about the leg at a location beyond the end of the other leg. One of the legs can include a leg extension removable from a leg base that when removed allows the other leg to be cut beyond the end of the leg base. The fabric can be cut with a cutting laser, which may be a multi-axis laser, and/or have low power.

Abstract: Systems and methods for cutting a cover from a portion of a housing of an electronic device, and positioning the cover within the housing are provided. An electronic device can include an interface having an actuator over which a cover is placed. The cover can by cutting away a portion of a housing of the electronic device. To improve the aesthetic appeal of the device, the orientation of the cover can be maintained while and after it is cut away from the housing by a fixture used for the cutting process. An adhesive sheet can be placed over the housing and the cover to ensure that the cover remains stationary relative to the housing once it is separated from the housing.

Abstract: A laser beam processing machine comprising a laser beam application means for applying a laser beam to a workpiece held on a chuck table, a processing-feed means, an indexing-feed means, a processing-feed amount detection means for detecting the amount of feed, an indexing-feed amount detection means, and a control means, wherein the condenser constituting the laser beam application means comprises an elliptic spot forming means for forming a focal spot into an elliptic shape and a focal spot turning means for turning the elliptic focal spot on an optical axis at the center thereof; and the control means comprises a storage means for storing the X, Y coordinate values of a processing line formed on the workpiece, obtains the X, Y coordinate values of the current position of a laser beam application position based on detection signals from the processing-feed amount detection means and the indexing-feed amount detection means, and controls the focal spot turning means to ensure that the long axis of the focal

Abstract: Methods for separating glass articles from strengthened glass substrate sheets and strengthened glass substrate sheets are provided. In one embodiment, a method includes forming at least one groove on at least one surface of the glass substrate sheet and strengthening the glass substrate sheet by a strengthening process. The groove defines the glass article and partially extends through a thickness of the glass substrate sheet. The method further includes generating an initiation defect on the groove at an initiation location to cause a through crack to self-propagate through the glass substrate sheet along the groove, thereby separating the glass article from the glass substrate sheet. In another embodiment, a strengthened glass substrate sheet includes a strengthened glass having a glass article groove and an initiation groove on a surface, the glass article groove defining a glass article.

Abstract: The invention is a method and apparatus for laser marking a stainless steel specimen with commercially desirable marks. The method includes providing a laser processing system having a laser, laser optics and a controller with pre-determined laser pulse parameters, selecting the pre-determined laser pulse parameters associated with the desired mark, and directing the laser marking system to produce laser pulses having laser pulse parameters associated with the desired marks including temporal pulse widths greater than about 1 and less than about 1000 picoseconds.

Abstract: An apparatus for processing a workpiece can be exemplarily characterized as including a processing tool having a processing region within which a workpiece can be processed, and an illumination system configured to direct detection light into the processing region. In this embodiment, detection light directable by the illumination system has a wavelength to which the workpiece is at least partially opaque. The apparatus may further include an image sensor configured to detect a characteristic of the detection light transmitted through the processing region and a chuck configured to support a workpiece such that at least a portion of the workpiece is disposable within the processing region and is illuminatable by the detection light. Methods for processing a workpiece are also disclosed.

Abstract: There is provided high power laser systems, high power laser tools, and methods of using these tools and systems for cutting, sectioning and removing structures objects, and materials, and in particular, for doing so in difficult to access locations and environments, such as offshore, underwater, or in hazardous environments, such as nuclear and chemical facilities. Thus, there is also provided high power laser systems, high power laser tools, and methods of using these systems and tools for removing structures, objects, and materials located offshore, under bodies of water and under the seafloor.

Abstract: A transport apparatus including an endless conveyor belt which is drivable by drive means, of which conveyor belt at least the outer side is embodied in a material which can withstand irradiation by the infrared laser radiation used to cut flat, thin materials such as textile, non-woven, sandpaper, cardboard, plastic film material present on the active upper part of the conveyor belt and carried along by this part. The invention further relates to a cutting device, comprising said transport apparatus. The transport apparatus is also used in a method for cutting flat, thin materials such as textile, non-woven, sandpaper, cardboard, plastic film material.

Abstract: A system, method, and device for etching an indicia onto a piece of glass or other inorganic oxide includes a compact laser etching device having a delivery head, an emitter housing, a RF cable, and a communication cable. The delivery head has a beam steering mechanism and a hood assembly positioned between the beam steering mechanism and the piece of glass. The emitter housing has a laser for generating a laser beam, and a fold mirror positioned in an optical path of the laser beam for redirecting the laser beam into the beam steering mechanism. A remote RF electronics package drives the laser. Control electronics cause the beam steering mechanism to steer the laser beam into a pattern of the indicia. The delivery head may further include a plurality of suction cups for holding the compact laser etching device in engagement with the piece of glass.

Abstract: A system and method for precision cutting using multiple laser beams is described, The system and method includes a combination of optical components that split the output of a single laser into multiple beams, with the power, polarization status and spot size of each split beam being individually controllable, while providing a circularly polarized beam at the surface of a work piece to be cut by the laser beam. A system and method for tracking manufacture of individual stents is also provided.

Abstract: A method for cutting off an edge portion of a workpiece includes applying a laser to the workpiece to form multiple individual severing cuts in the edge portion such that the edge portion is cut off from the workpiece, the multiple individual severing cuts being arranged together along the edge portion. Applying the laser to the workpiece to form the multiple individual severing cuts includes, for each individual severing cut, translating a laser cutting head and/or the workpiece relative to one another, and detecting, at an end of each severing cut, an edge of the workpiece, in which the translation of the laser cutting head or the workpiece continues at least until the edge is detected.

Abstract: A workpiece dividing method for dividing a workpiece having an uneven incident surface upon which a pulsed laser beam falls. The workpiece dividing method includes a coating step of applying a coating member to the incident surface of the workpiece, thereby planarizing the incident surface of the workpiece, the coating member transmitting the pulsed laser beam and having a refractive index close to that of the workpiece for the pulsed laser beam, a modified layer forming step of applying the pulsed laser beam to the workpiece from the side of the incident surface in the condition where a focal point of the pulsed laser beam is set inside the workpiece after performing the coating step, thereby forming a modified layer inside the workpiece, and a dividing step of applying an external force to the workpiece after performing the modified layer forming step, thereby dividing the workpiece as starting from the modified layer formed inside said workpiece as a break start point.

Abstract: Methods and apparatus are provided for forming an initiation flaw (111) in the surface (114) of a glass sheet or glass ribbon (13). The initiation flaw (111) is used in connection with a laser light beam (121) and a cooling area produced by a cooling nozzle (119) to from a score line (115) in the surface (114) of the sheet or ribbon (13). The initiation flaw (111) is formed by a mechanical scoring head (20) which is carried by moving carriage (14) and which undergoes retrograde motion (19) relative to the carriage (14) so as to increase the time available for forming the initiation flaw (111).

Abstract: What is described is: a method for cutting leaf-like or plate-like objects, in particular electrodes and/or separators for constructing an electrochemical energy store or parts of such electrodes or separators, wherein the cutting method has the following steps: (S1) leading the objects to be cut (1) up to a laser cutting apparatus (2), (S2) cutting the objects (1) with the laser cutting apparatus (2), and (S3) performing processing operations at the cutting edges (3) in order to reduce micro-short-circuits. The step (S3) of performing operations at the cutting edges (3) for reducing micro-short-circuits can comprise (S3a) structuring of the cutting edges (3) and/or application of support materials to the cutting edges (3).

Abstract: The invention relates to an optimized laser cutting method for cutting a part from a material by means of a cutting system comprising: a laser source for producing a laser beam having a certain power; and a cutting head comprising an end nozzle for passage of a cutting laser beam, said method being characterized in that it comprises a step of determining the cutting power Pd such that: Pd=Max(Popt;?e) where Max is the mathematical operator of the maximum, Popt is an optimal power of the laser beam of the cutting system, which is predetermined in accordance with the part to be cut, and/or with cutting parameters and/or with system parameters, to minimize the mass defect per unit length of the part when the part is being cut, ? is a leading coefficient representing the number of kW required for cutting the part per mm of the thickness of the part, and e is the thickness of the part in mm.

Abstract: A method for producing an energy cell, in particular an energy storage cell or battery, having the steps of: arranging a plurality of films of the energy cell at a processing location, and cutting the plurality of films in one operation, wherein the cutting of the films is carried out by a laser beam, and wherein the laser beam is guided in a liquid. Also an apparatus for producing an energy cell.

Abstract: A display device is provided with a touch panel includes: a base substrate; a first transparent electrode layer located on the base substrate; an ultrasonic wave guiding layer located on the first transparent electrode layer; a second transparent electrode layer located on the ultrasonic wave guiding layer; an ultrasonic wave transmitting unit and an ultrasonic wave receiving unit located on the second transparent electrode layer; and a protecting layer located on the second transparent electrode layer.

Abstract: A method for forming an integrated lithium-ion type battery, including the successive steps of: forming, on a substrate, a stack of a cathode layer made of a material capable of receiving lithium ions, an electrolyte layer, and an anode layer of the battery; forming a short-circuit between the anode and cathode layers; performing a thermal evaporation of lithium; and opening the short-circuit between the anode and cathode layers.

Abstract: A method for producing an RFID transponder. An RFID chip is attached onto a conductive sheet. A portion of an antenna element is cut from the conductive sheet using a laser beam after the RFID chip has been attached to the conductive sheet.

Abstract: A color coding is applied to medical guide wires by coloring portions of the guide wire to distinguish similar guide wires and guide wire portions from a particular manufacturer. The metallic elongate core can be colored using various methods such as electrochemical processes, sputtering, electroplating, and laser inducing microstructures to alter the surface characteristics of the elongate metallic core. Alternatively, the outer layer of the guide wire can be color coded by using non-standard colors or by introducing a colored band on the guide wire.

Abstract: A light irradiation device and method for irradiating converged light with an object include a light source configured to output a light, a phase-modulating spatial light modulator, a controller, and a converging optical system. The phase-modulating spatial light modulator is configured to input the light outputted from the light source and to display a hologram modulating a phase of the light at each of a plurality of pixels arranged two-dimensionally, and outputs the phase-modulated light. The controller is configured to cause the spatial light modulator to display a hologram such that the light outputted from the spatial light modulator is converged at a plurality of converging positions. The controller causes the spatial light modulator to display a first hologram and performs a feedback of the first hologram so as to modify the first hologram. The modifying of the first hologram is performed by measuring intensity of the light converged.

Abstract: Embodiments of the present invention generally provide methods and apparatus for material removal using lasers in the fabrication of solar cells. In one embodiment, an apparatus is provided that removes portions of a dielectric layer deposited on a solar cell substrate according to a desired pattern. In certain embodiments, methods for removing a portion of a material via a laser without damaging the underlying substrate are provided. In one embodiment, the intensity profile of the beam is adjusted so that the difference between the maximum and minimum intensity within a spot formed on a substrate surface is reduced to an optimum range. In one example, the substrate is positioned such that the peak intensity at the center versus the periphery of the substrate is lowered. In one embodiment, the pulse energy is improved to provide thermal stress and physical lift-off of a desired portion of a dielectric layer.

Abstract: A laser blanking system for cutting material stock includes a first series of conveyor lanes that include a plurality of support conveyors which are situated in parallel, generally spaced apart relationships. A second series of conveyor lanes is situated downstream from the first series. The second series includes a plurality of support conveyors situated in parallel, generally spaced apart relationships with respect to each other. The laser blanking system further includes a multiple-axis gantry system. The multiple-axis gantry includes a moveable transverse-axis component is supported by and moveable along a longitudinal-axis component that is situated adjacent to a longitudinal edge of the first and second series. A moveable laser head is supported by the transverse-axis component. A controller operatively controls movements of each one conveyor of the first and second lanes, the transverse-axis component, and the laser head as stock material is indexed downstream and supported by the system.

Abstract: This invention provides a method of forming a fine groove with a width smaller than that of a scoreline in a golf club head. The method according to this invention includes a first step of forming a base groove in a face surface as a base of the fine groove, and a second step of forming a recess in at least one side wall of the base groove to reduce the angle between this side wall and the face surface.

Abstract: The invention relates to a method for processing a movable substrate by means of laser, wherein the processing results in the release of material separated from the substrate, wherein during processing of the substrate a higher pressure prevails on the side of the substrate where the substrate is impinged by the laser beam than on the other side of the substrate, and to a device for performing such a processing, wherein the device comprises guide means for guiding the substrate and laser processing means adapted to cast onto the substrate a laser spot which processes the substrate in a laser processing zone, and comprises means for generating a higher pressure on the side of the substrate where the substrate is impinged by the laser beam than on the other side of the substrate.

Abstract: Methods and apparatus for processing edge portions of a donor semiconductor wafer include controlling chemical mechanical polishing parameters to achieve chamfering of the edges of the donor semiconductor wafer; and alternatively or additionally flexing the donor semiconductor wafer to present a concave configuration, where edge portions thereof are pronounced as compared to a central surface area thereof, such that the pronounced edge portions of the donor semiconductor wafer are preferentially polished against a polishing surface in order to achieve the chamfering.

Abstract: The present application relates to an apparatus (52) for supporting sheet material during cutting by laser radiation comprising a support member (42) having a gold facing layer. A method for cutting sheet material using such apparatus is also defined.

Abstract: This disclosure provides apparatus and methods for scribing a substrate. In one aspect, an apparatus includes optics for focusing a scribe beam onto a substrate and a beam focus adjustment mechanism for adjusting the optics. A triangulation-based distance sensor determines a distance between the triangulation-based distance sensor and the substrate, with the triangulation-based distance sensor being positioned at a location offset from the scribe beam. Reflecting elements are positioned to reflect an incident beam from the triangulation-based distance sensor's source to the substrate and then back to the triangulation-based distance sensor's detector. The beam focus adjustment mechanism adjusts the optics based on the distance between the triangulation-based distance sensor and the substrate so that the scribe beam is focused at a desired position on the substrate.

Abstract: A device for cutting a structure including nanotubes, including: a mechanism to polarize linearly laser pulses emitted in a direction of the structure, wherein a duration of the laser pulses is roughly between 1 femtosecond and 300 femtoseconds; and a mechanism to focus the linearly polarized laser pulses on the structure.

Abstract: An adjustable astigmatic elongated beam spot may be formed from a laser beam having ultrashort laser pulses and/or longer wavelengths to machine substrates made of a variety of different materials. The laser beam may be generated with pulses having a pulse duration of less than 1 ns and/or having a wavelength greater than 400 nm. The laser beam is modified to produce an astigmatic beam that is collimated in a first axis and converging in a second axis. The astigmatic beam is focused to form the astigmatic elongated beam spot on a substrate, which is focused on the substrate in the first axis and defocused in the second axis. The astigmatic elongated beam spot may be adjusted in length to provide an energy density sufficient for a single ultrashort pulse to cause cold ablation of at least a portion of the substrate material.

Abstract: The apparatus and method for controlling laser cutting through surface plasma monitoring provides real-time monitoring and control of laser cutting quality. Laser cutting of a workpiece is controlled through monitoring of surface plasma generation, particularly during a laser gas-assisted cutting process. The apparatus includes a Langmuir probe positioned adjacent the impingement point of the laser beam on the workpiece. The Langmuir probe is in communication with a signal analyzer for measuring electrical voltage generated by plasma generated by the cutting of the workpiece. A controller is provided for comparing the measured electrical voltage with a desired threshold voltage. Control signals are generated to selectively adjust output power of the laser responsive to the compared measured electrical voltage and the desired threshold voltage to minimize plasma generation.

Abstract: The present invention is directed to a method for forming a metal mask. The method includes mounting a metal frame to a periphery of a supporting structure of a worktable, next placing a thin metal plate in a flat manner on a top surface constructed by the metal frame and the supporting structure, next forming a prototype mask by welding the thin metal plate with the metal frame, next forming multiple mesh holes in the thin metal plate by performing a laser drilling process to the prototype mask using a laser drilling apparatus.

Abstract: A wafer has a device area where a plurality of devices are formed, and a peripheral marginal area surrounding the device area. These devices are formed on the front side of the wafer so as to be partitioned by a plurality of division lines. A modified layer is formed by applying a laser beam along the division lines with the focal point of the laser beam set inside the wafer, thereby forming a modified layer as a division start point inside the wafer along each division line. The wafer is transported to a position where the next step is to be performed. In the modified layer forming step, the modified layer is not formed in the peripheral marginal area of the wafer to thereby form a reinforcing portion in the peripheral marginal area. Accordingly, breakage of the wafer from the modified layer in the transporting step can be prevented.

Abstract: A workpiece including an irregularly shaped portion on a dividing line is divided along the dividing line by detecting the location of the irregularly shaped portion, applying a detecting laser beam to an area of the workpiece except for the detected location, along the dividing line to detect the height of a surface of the workpiece except for the location, applying and focusing a machining laser beam having a wavelength which permeates the workpiece within the workpiece while moving a focused spot of the machining laser beam based on the detected height of the surface of the workpiece to form a modified layer in an area of the workpiece except for at least the location of the irregularly shaped portion along the dividing line, and applying an external force to the modified layer to divide the workpiece along the dividing line.

Abstract: A mixture for fabricating a cutting table, the cutting table, and a method of fabricating the cutting table. The mixture includes a cutting table powder and a binder. The binder includes at least one carbide formed from an element selected from at least one of Groups IV, V, and VI of the Periodic Table. The carbide is in its non-stoichiometric and/or stoichiometric form. The binder can include the metal element itself. The binder can also include a catalyst. The cutting table is formed by sintering the mixture using a solid phase sintering process or a near solid phase sintering process. When forming or coupling the cutting table to a substrate, a divider is positioned and coupled therebetween to ensure that the sintering process that forms the cutting table occurs using the solid phase sintering process or the near solid phase sintering process.

Abstract: The invention relates to a method for machining a workpiece by means of a laser beam, wherein a laser beam is guided by a beam guiding device over the surface of the workpiece within a working window. The beam guiding device and the workpiece are arranged in such a way that they are movable relative to one another in a direction of displacement along a displacement section and that they can occupy a first and a second relative working position to one another. According to the invention, a point on the workpiece can be machined from the second relative working position, said point being located behind the point which is machined from the first relative working position when viewed in the direction of displacement.

Abstract: When forming a micromachined part by water jet guided laser machining at a machine component 20, a point for forming a micromachined part is machined while moving a laser head 7 side and machine component 20 side so as to obtain a desired shape of a micromachined part.

Abstract: In the method for cutting a material layer (20) along a given cutting line (21), a cutting beam is moved so as to impinge on the material layer (20) laterally offset by a distance (W) from the cutting line (21). The distance (W) is determined as a function of the variations of the cutting speed at which the cutting beam is moved, and/or as a function of the deviations of the effective cutting beam cross-section from a circular shape.

Abstract: A trimmer for trimming a book has a support for supporting a book, at least one laser for scoring an edge of the book so as to produce a score, and a trimming station for trimming the book at the score.

Abstract: A laser processing machine for processing workpieces, in particular metal sheets, includes a workpiece support and a beam receiver for the laser beam used as a processing tool. The distance between a workpiece lying on the workpiece support and the beam receiver is variable, owing to the fact that the workpiece support and the beam receiver are positionable relative to one another along the beam axis of the laser beam by means of an adjusting drive of an adjusting device with a positioning movement of a variably definable magnitude. A method for processing workpieces, in particular metal sheets, is also provided.

Abstract: A method for creating a flexible portion or bending portion within a rigid structure. The method can also be used for creating a flexible structure from a rigid material. The method includes providing a substantially rigid material, such as, but not limited to, metals, alloys, hard plastics, and the like, and selectively removing portions of the rigid material defining a geometric pattern in the rigid material. A bending radius of the flexible portion is defined by the geometric pattern. The rigid structure may be used to create an enclosure, a cover for an electronic device, one or more hinges, or the like.

Abstract: In the laser processing method, the cross-sectional form of laser light L at a converging point P is such that the maximum length in a direction perpendicular to a line to cut 5 is shorter than the maximum length in a direction parallel to the line to cut 5. Therefore, when seen from the incident direction of the laser light L, a modified region 7 formed within a silicon wafer 11 has such a shape that the maximum length in the direction perpendicular to the line to cut 5 is shorter than the maximum length in the direction parallel to the line to cut 5. Forming the modified region 7 having such a shape within the object 1 can restrain twist hackles from occurring on cut surfaces when cutting the object 1 from the modified region 7 acting as a cutting start point, thereby making it possible to improve the flatness of the cut surfaces.

Abstract: Systems, devices and methods for the transmission of 1 kW or more of laser energy deep into the earth and for the suppression of associated nonlinear phenomena. Systems, devices and methods for the laser drilling of a borehole in the earth. These systems can deliver high power laser energy down a deep borehole, while maintaining the high power to advance such boreholes deep into the earth and at highly efficient advancement rates.

Abstract: A highly elastic stent is made of an alloy that exhibits superelasticity at body temperature. At least a part of the highly elastic stent has such a property that load increases with displacement without exhibiting a distinct yield on a load-displacement curve obtained by a compression test and a bending test.

Abstract: A variable astigmatic focal beam spot is formed using lasers with an anamorphic beam delivery system. The variable astigmatic focal beam spot can be used for cutting applications, for example, to scribe semiconductor wafers such as light emitting diode (LED) wafers. The exemplary anamorphic beam delivery system comprises a series of optical components, which deliberately introduce astigmatism to produce focal points separated into two principal meridians, i.e. vertical and horizontal. The astigmatic focal points result in an asymmetric, yet sharply focused, beam spot that consists of sharpened leading and trailing edges. Adjusting the astigmatic focal points changes the aspect ratio of the compressed focal beam spot, allowing adjustment of energy density at the target without affecting laser output power. Scribing wafers with properly optimized energy and power density increases scribing speeds while minimizing excessive heating and collateral material damage.

Abstract: A method of preparing an apparatus for material processing by generating optical breakthroughs in an object. The apparatus includes a variable focus adjustment device. A contact element is mounted to the apparatus, the contact element has a curved contact surface having a previously known shape. The position of the contact surface is determined prior to processing the object, by focusing measurement laser radiation near or on the surface by the variable focus adjustment device, and the focus position is adjusted in a measurement surface intersecting the expected position of the contact surface. Radiation from the focus of the measurement laser radiation is confocally detected. The position of points of intersection between the measurement surface and the contact surface is determined from the confocally detected radiation to determine the position of the contact surface from the position of the points of intersection and the previously known shape of the contact surface.

Abstract: Radiopaque marker for a catheter includes a collar having a ring shape defining a longitudinal center axis therethrough and at least one helical member extending longitudinally from the collar. A second collar can be provided spaced longitudinally from the first collar. Additionally, a second helical member can extend longitudinally from the collar and be coaxially intertwined with the first helical member in a double helical configuration. The helical member can define a compression spring structure having longitudinal, transverse, and torsional flexibility. A catheter having such a marker and a method of making the marker are also provided.