Abstract: A system and a method of operating that system are used to quickly adjust the temperature of an electric stove heating element. A heat transfer or moderating fluid is pumped through a hollow portion of an electric stove heating element. The moderating fluid is heated or cooled to an appropriate temperature, and inserted under the control of a microprocessor to more quickly modify the temperature of the stove heating element. The system allows rapid temperature changes in normally sluggish electric stove heating elements. Also, accurate temperature adjustment is permitted by the microprocessor controlled.

Abstract: A heating system 1 has a ceramic substrate 2 having a mounting face 2a for mounting an object W, a back face 2b and a side face 2c; a heating means 3 for generating heat from the mounting face 2a of the ceramic substrate 2; and a plate-shaped supporting metal member 4 for supporting the back face 2b of the ceramic substrate 2. According to the system, the thermal deformation of the mounting face upon heating over time may be reduced and the flatness of the object may be maintained at a low value. It is further possible to impart a mechanical strength to the heater sufficient for its handling and to reduce the production cost.

Abstract: A cooking appliance includes a cooktop having at least one heating zone having first and second heating elements and a control element for setting a desired cooking temperature for the heating zone. When the control element is rotated in a first direction, only the first heating element will be activated and, when rotated in a second direction, both the first and second heating elements are activated. The control element includes a variable resistor that changes resistance as the control element is rotated through nearly 360° to alter the operational state of the heating element(s). A controller senses the change in resistance and determines in which direction the control element is rotated so as to activate the appropriate heating element(s).

Abstract: A composite cooking apparatus having a body, a heating unit, and an induction heating unit. The heating unit is positioned in the body to generate heat used to heat food. The induction heating unit is positioned adjacent to the heating unit to generate a magnetic field to cook the food by induction heating. The induction heating unit has at least one wire, a coating of which is exposed to an electron beam to strengthen a heat resistance thereof.

Abstract: A method and apparatus for adjusting exhaust flow, and the apparatus has a programmable exhaust control regulator generating a first input signal to a motor control circuit, an exhaust flow meter generating a second input signal to the motor control circuit and a motor driven control valve moved to different positions according to the first and second input signals, the control valve being installed in an exhaust portion of the hot plate apparatus.

Abstract: A support structure for supporting a ceramic susceptor in a chamber is provided. The support structure includes a supporting portion joined with a back face of the ceramic susceptor. The supporting portion includes an inner space that is separated from the atmosphere of the chamber. A cooling system is provided below the supporting portion 6. At least one thermal control portion is provided between the cooling system and the supporting portion for reducing thermal conduction from the susceptor to the cooling system.

Abstract: A system, apparatus, and method for thermal processing of substrates undergoing lithographic chemical processes is provided. The thermal processing system includes at least one heating element, a heat distributing plate, having a heating surface and being disposed in thermal communication with the at least one heating element. The heat distributing plate is constructed and arranged to distribute heat from the heating element onto the heating surface. A substrate support, supports a substrate at a position above the heating surface and the system includes an actuator that rotates the substrate relative to the heating surface during a heat transfer operation.

Abstract: The cooking unit has a glass-ceramic panel (1) providing a cooking surface, which is made of transparent colorless glass-ceramic bulk material or a glass panel made of pre-stressed transparent colorless glass material. Radiant heating elements (3) are provided under the glass or glass-ceramic panel, which heat respective cooking zones. The glass or glass-ceramic panel has a full surface decorative coating (7) on its upper side, which makes dirt and usage marks less conspicuous, and an IR permeable coating (6) having a solid or plain color, preferably bisque-like, on its underside. The IR permeable coating having the solid or plain color prevents an observer from viewing the internal components of the cooking unit that are under the cooking panel from above it.

Abstract: A control unit for a household appliance, preferably a cooking device, containing a control device and regulating devices. The control device has a removable control element and a blocking device. The regulating devices have a change-over regulating device that allows the cooking device to be used in an alternative operating mode should the control element be removed from the cooking device.

Abstract: An objective of the present invention is to provide an aluminum nitride sintered body making it possible to keep a volume resistivity of 108 ?·cm or more, and guarantee covering-up capability, a large radiant heat amount and measurement accuracy with a thermoviewer. A carbon-containing aluminum nitride sintered body of the present invention of the present invention comprising: carbon whose peak cannot be detected on its X-ray diffraction chart or whose peak is below its detection limit thereon; in a matrix made of aluminum nitride.

Abstract: The invention relates to glass-ceramic plates, hotplates incorporating them and their fabrication process. The glass-ceramic plate of the invention is of the type having a bottom substrate layer and a top coating layer and is characterized in that the top coating layer covers at least the external top surface of the bottom glass-ceramic layer and is a layer of a hard substrate material chosen from the group constituted by silicon carbide, silicon oxycarbide, silicon nitride, silicon oxynitride and hydrogenated amorphous carbons. The invention finds an application in the fabrication of coated glass-ceramic plates and in particular in the fabrication of glass-ceramic hotplates.

Abstract: A ceramic heater capable of reducing temperature uniformity at the periphery of through holes such as insertion holes and vacuum suction holes is provided, which protects wafer against thermal shocks and has improved controllability for temperature control parts such as thermocouples and temperature fuse. Further, a ceramic heater capable of uniform resin curing is provided. A heat generation body is disposed on the surface or inside of a ceramic substrate. Further, corners for the insertion holes, the recesses and the vacuum suction holes of the ceramic substrate are chamfered.

Abstract: The present invention relates to a system comprising at least one serving dish configured to support food and a power source which comprises at least one portable electrical power generating device. The power source provides power to heat the food.

Abstract: A hot plate oven used in a thermal process of forming an ultrafine photoresist pattern and a method of forming a pattern using the same. More particularly, a hot plate oven used to flow photoresist under the high pressure in the sealed oven during a resist flow process.

Abstract: An electric heater with a sensor for preventing no-water heating includes a heating plate and/or a metal plate fixed on the heating plate, a heating film electro-plated on a lower surface of the heating plate, and a water level probe, or a sensing electrode, or a water level sensor and a temperature fuse fixed with the heating plate. The water level probe, the sensing electrode or the water level sensor produces alteration of electric potential in case of the water level becoming very low, triggering a switch of an A/D amplifying circuit automatically cutting off power of the heating film.

Abstract: Embodiments of the present invention are directed to relieving the stresses caused by a mismatch in the coefficients of thermal expansion in the components forming the connections at the terminals of a heater. In one embodiment, a heater comprises a heater body having an electrical heating element and a bottom surface, and a rod configured to be coupled with an electrical power source. A plug has a first end which is coupled to the heater body and extends into the heater body through the bottom surface of the heater body, and which is electrically connected with the electrical heating element. The plug has a second end which includes a cavity to receive a portion of the rod. The cavity is surrounded by a slotted side wall of the plug which is disposed outside of the heater body and includes a plurality of slots extending from the second end toward the bottom surface of the heater body and terminating near the bottom surface but before reaching the bottom surface.

Abstract: Embodiments of the present invention are directed to relieving the stresses caused by a mismatch in the coefficients of thermal expansion in the components forming the connections at the terminals of a heater. In one embodiment, a heater comprises a heater body having an electrical heating element and a bottom surface, and a rod configured to be coupled with an electrical power source. A plug has a first end which is coupled to the heater body and extends into the heater body through the bottom surface of the heater body, and which is electrically connected with the electrical heating element. The plug has a second end which includes a cavity to receive a portion of the rod. The cavity is surrounded by a slotted side wall of the plug which is disposed outside of the heater body and includes a plurality of slots extending from the second end toward the bottom surface of the heater body and terminating near the bottom surface but before reaching the bottom surface.

Abstract: A hot plate for a semiconductor producing/examining device, in which hot plate, when an object to be heated such as a silicon wafer is heated in a state that the object is distanced by a certain distance from the heating face, air is less likely to stagnate between the silicon wafer and the heating face and thus the object to be heated can be evenly heated. Specifically, the hot plate for a semiconductor producing/examining device includes a resistance heating element formed on a surface of a ceramic substrate or inside the ceramic substrate, wherein the glossiness of the heating face of the ceramic substrate is 1.5% or more.

Abstract: The present invention provides a ceramic substrate which can keep a sufficiently large breakdown voltage even if the pore diameter of its maximum pore is 50 &mgr;m or less to be larger than that of conventional ceramic substrates, can give a large fracture toughness value because of the presence of pores, can resist thermal impact, and can give a small warp amount at high temperature. The ceramic substrate of the present invention is a ceramic substrate for a semiconductor-producing/examining device having a conductor formed on a surface of the ceramic substrate or inside the ceramic substrate, wherein: the substrate is made of a non-oxide ceramic containing oxygen; and the pore diameter of the maximum pore thereof is 50 &mgr;m or less.

Abstract: A heating apparatus includes a central hot plate for heating the center portion of a substrate, a plurality of segment hot plates for heating the peripheral portion of the substrate, a hot plate support member supporting the central hot plate and the segment hot plates, support pins for supporting the substrate so as to face the central hot plate and the segment hot plates in a close proximity without being in contact with the central hot plate and the segment hot plates, and a power supply for supplying electricity to the central hot plate and the segment hot plates.

Abstract: The invention relates to a ceramic cooktop comprising a cooking plate (12) made of glass ceramic or glass. The ceramic cooktop also comprises an electrical heat conductor layer (22) and an insulating layer (14) that is located between the cooking plate (12) and the heat conductor layer (22). The insulating layer (14) consists of a plurality of individual layers (16, 18, 20) that each have a porosity that decreases toward the heat conductor layer (22).

Abstract: A substrate holder for holding a substrate (e.g., a wafer or an LCD panel) during plasma processing. The substrate holder is a stack of processing elements which each perform at least one function. The elements include an electrostatic chuck (102), an He gas distribution system (122), multi-zone heating plates (132), and multi-zone cooling system (152). Each element is designed to match the characteristic of the processing system, e.g., by applying heat based on a heat loss characteristic of the substrate during normal processing. The integrated design allows for precise control of the operating conditions, including, but not limited to, fast heating and fast cooling of a substrate.

Abstract: A cooking device includes two casings each having an inner portion, and a shelf disposed in the middle portion. A heating device is disposed and supported on the inner portions of the casings, and may either be the electrical heating members, or gas stoves, or furnaces, etc. The casings and the heating device may be assembled by the users when required, and may be disengaged from each other for allowing the cooking device to be easily stored and packaged. The casings each may include a chamber to receive boiled fluid material.

Abstract: A heating and cooling apparatus is provided which employs a series of thermally conductive plates thermally coupled to heating and cooling devices to heat or cool a mounting plate loaded with semiconductor devices. The mounting plate is assembled on a heating plate, which is then assembled on a cooling plate. The heating plate includes upper and lower plates with a heater therebetween which can heat the heating plate to a desired temperature, which in turn heats the mounting plate and the semiconductor devices. The cooling plate has ‘S’ shaped flow grooves formed throughout. When cooling fluid is flowed through the flow grooves, the cooling plate is cooled, which cools the heating plate, which in turn cools the mounting plate and the semiconductor devices.

Abstract: A heater assembly of a semiconductor device manufacturing apparatus minimizes a temperature difference between a peripheral portion and a central portion of the wafer being processed in the apparatus. The heater assembly includes a unitary resistive heating member in the form of a disc, heat blocks that divide the peripheral portion and central portion of the upper surface of the disc into respective heating sections, a support for supporting the heating member, and an electric power source for supplying electric current to the unitary heating member. The widths of the heating sections become greater towards the center of the heater, and thus the electrical resistance of the heater also increases in a direction towards the center of the heater. The power source for the heater includes a lead that extends from the bottom surface of the heater to a bottom portion of the heater support.

Abstract: This invention is a thermal management method for efficient, rapid, controllable and uniform thermal management over a wide temperature range. The method integrates a thermal source, thermal sink and a thermal diffuser. According to the invention, a thermal diffuser is positioned stationary relative to the wafer surface and coupled to a thermal source and a thermal sink, which are also stationary relative to the wafer surface. The thermal sink comprises a heat-carrying media with a controllable temperature. The wafer is heated from a first processing temperature to a second processing temperature during a heating time interval and then cooled to the first processing temperature from the second processing temperature during a cooling time interval. During heating and cooling, the wafer is constantly held in a fixed position. Zonal control of the thermal source and non-uniform flow of the thermal sink enable sensitive mitigation of thermal non-uniformity on a heating surface.

Abstract: A system and method for limiting the temperature of a burner for a cooking appliance without the use of a temperature sensor. The method includes the step of sensing the conduction state of a thermal switch and feeding back the sensed signal to control the duty-cycle (and thus “on” time) of bang-bang thermal limiting control. The power to the burner is reduced until the sensed duty-cycle (near 100%) cycling is reduced (lower frequency and amplitude) resulting in smoother power and temperature control. Preferably, the control system and method is implemented for controlling power applied to a burner for a glass-ceramic cooktop.

Abstract: A power management system in electrical cooking appliances having at least two electrical heating elements wherein the power level of the elements can be set by a user but not exceed a predetermined power level. The power management system being able to compare the total level set by the user with the predetermined power level. The power management system also being able to downgrade the total level set by the user to a lower level which does not to exceed the predetermined level, independently of the set levels. The power management system being further able to selectively downgrade the heating element operating at the higher power level by a predefined step until the total power does not exceed the predetermined power level.

Abstract: In accordance with a first aspect, a susceptor is provided that includes (1) a supporting surface adapted to support a substrate, the supporting surface comprising a first material; and (2) a support frame encased within the first material, the support frame comprising a second material that has a lower coefficient of thermal expansion than the first material. The support frame is offset from a center of the susceptor toward the supporting surface. In accordance with a second aspect, a susceptor is provided that includes (1) a supporting surface adapted to support a substrate, the supporting surface comprising a first material; and (2) a support frame encased within the first material, the support frame comprising a second material that has a higher coefficient of thermal expansion than the first material. The support frame is offset from a center of the susceptor away from the supporting surface. Other aspects are also provided.

Abstract: A system, method and apparatus are described for improving critical dimension uniformity in baked substrates. The system, method and apparatus provide for varying the distance between a substrate to be baked and the surface of a hot plate such that an approximately uniform temperature is obtained in the substrate during baking. In one embodiment, the substrate is positioned on a hot plate having a recess generally centered on its top side. The differences in distance between the edges of the substrates contacting the hot plate and the distance between the center region of the substrate and the bottom of the recess enable a generally uniform temperature to be obtained in the substrate.

Abstract: The invention relates to lead- and cadmium-free glass for glazing, enamelling and decorating glasses or glass-ceramics which have a low coefficient of thermal expansion of less than 2×10−6/K, having the composition (in % by weight) 0-6 Li2O, 0-5 Na2O, 0 to less than 2 K2O, where the sum Li2O+K2+Na2O is between 2 and 12, 0-4 MgO, 0-4 CaO, 0-4 SrO, 0-1 BaO, 0-4 ZnO, 3 to less than 10 Al2O3, 13-23 B2O3, 50-65 SiO2, 0-4 TiO2, 0-4 ZrO2 and 0-4 F, as replacement for oxygen and containing up to 30% by weight of a pigment which is resistant at the firing temperature, where the glass is suitable for glazing, enamelling and decoration in both primary and secondary firing, and both the full-area and sparse glaze, enamel or decoration layers have low abrasion susceptibility after firing, and it relates to processes for the production of a glass-ceramic coated therewith.

Abstract: There is disclosed a stove, with a smooth-top cooktop, for cooking food, the stove comprising: a stove body; a smooth-top cooktop to cook food thereon; and at least one heat source disposed adjacent to a cooking surface of said cooktop. The cooktop comprises glass ceramic with an upper layer and an inner layer, with the upper layer comprising a different glass ceramic material than the inner layer. The upper layer is configured to minimize surface defects such as fissures, cracks, pits, and pores. The inner layer is configured to provide resistance to impact to the upper layer from cooking utensils being dropped onto the upper layer of the smooth-top cooktop, and at least the inner layer of the glass ceramic being configured to obscure visibility of the at least one heat source, through the upper layer of the glass ceramic.

Abstract: The present invention provides a heat sink for cooling a component. The component may be one of several components on a circuit board. The heat sink includes a tubular body and a plurality of internal fins. The tubular body has an interior surface and an exterior surface. At least a portion of the exterior surface being substantially flat. The plurality of internal fins extend from the internal surface and are generally symmetric around a center line of the tubular body. The substantially flat portion of the tubular body contacts the component to remove heat from the component. The heat sink may further include a plurality of exterior fins extending from the exterior surface of the tubular body.

Abstract: The cooking unit has a glass-ceramic panel (1) providing a cooking surface, which is made of transparent colorless glass-ceramic bulk material or a glass panel made of pre-stressed transparent colorless glass material. Radiant heating elements (3) are provided under the glass or glass-ceramic panel, which heat respective cooking zones. The glass or glass-ceramic panel has a full surface decorative coating (7) on its upper side, which makes dirt and usage marks less conspicuous, and an IR permeable coating (6) having a solid or plain color, preferably bisque-like, on its underside. The IR permeable coating having the solid or plain color prevents an observer from viewing the internal components of the cooking unit that are under the cooking panel from above it.

Abstract: There is provided a bonding heater used to package a semiconductor chip on a multilayer substrate, which has adaptability to various chip sizes, with an excellent maintenance characteristics, with undesirable displacement of the chip at the time of mounting a semiconductor chip being made as small as possible and also with a temperature rise time to a desired temperature being shortened. This bonding heater is constituted by a ceramic tool for pressing an object to be heated, a ceramic heater for heating the tool, a heat insulating member for transferring heat generated by the ceramic heater mainly to the tool side and a holder for integrating these members and connecting these members to another member, and the tool, ceramic heater, heat insulating member and holder are detachably bonded.

Abstract: A cooktop hygiene device removably mountable to a cooktop for collecting food sputterings or spillings and preventing such sputterings or spillings from contaminating the cooktop comprises a plate-like structure, which can be flexible or rigid, having an upper surface adapted to receive the spillings or sputterings and a lower surface adapted to interface with the cooktop surface, and a plurality of openings on the plate-like structure to receive the heaters on the cooktop and to allow a user to place a cookware or utensil on the heaters. A fold facilitator is provided on the plate like structure to facilitate the folding of the device to fit into a dishwasher. A plurality of drip pans secured to the plate-like structure is provided for catching the food and liquid spillings or sputterings. The plurality of openings may be covered by heater covers to provide cooking zones on the plate-like structure to engage with the heaters and conduct heat from the heaters to cookware on the cooking zones.

Abstract: A disc heater is applied to a temperature control apparatus which controls a temperature of an object to be processed on at least one surface thereof. In the disc heater, wire-like heating elements are laid on a plate surface in a predetermined pattern and power feeding portions are disposed at ends of the wire-like heating elements. The pattern formed by the wire-like heating elements comprise a large number of arc portions disposed on a large number of concentric circles, and a surface area of the arc portions is 70% or greater, more preferably, 85 to 95% of a surface area of the entire pattern. With this feature, it is possible to effectively reduce the local excessively heated portion to the utmost, and to uniformly heat the entire heating surface, thus realizing an ideal topology pattern of the disc heater.

Abstract: A device and method for the removal of excess embedding tissue from histological samples comprising a plate with heating elements. The plate has at least one trench and a plurality of grooves at the surface of the plate. The plate is arranged at a slight angle as compared to a horizontal plane. Once the device reaches working temperature the user slide the cassette, with extra embedding medium down the surface of the plate. The extra embedding medium melts from the cassette and runs through the plurality of grooves to the trench and finally to a receptacle.

Abstract: A system for transforming electrical energy into thermal energy, already diffused has a flat support, and a substantially continuous heat-emitting surface formed by one or more electrically conducting continuous strips, each having a constant thickness, laid flat in parallel lengths and spaced for electrical insulation, the strips being arranged on the flat support and mechanically connected to it.

Abstract: A mounting for a cooking surface held at its periphery by at least one support part comprising a fiberglass reinforced duromer or thermosetting resin selected from the group consisting of an unsaturated polyester resin, a melamine resin, a phenol resin, and an epoxy resin, wherein the fiberglass reinforcement are glass fibers having a length of 15 mm to 65 mm.

Abstract: Upper and lower housing portions 4, 6, and 8 are connected together around a reduced width interface 10. An electric heating element 38 projects upwardly from the top to allow containers of various sizes to be placed on the element 38. The element 38 has a plug-in connector 40 received into a receptacle 44 carried by a side projection 6 of the housing. An electric conductor 46 extends inside the housing from the receptacle 44 down into a switch 48 mounted on the lower housing portion 8. The stove housing is dimensioned to position the element to be readily accessible by a person seating on the ground or a chair when the stove is resting on the ground, and also to be readily accessible to a person standing adjacent to a table on which the stove is resting. The height of the lower portion is sufficient to isolate a surface on which the stove is resting from excessive heat.

Abstract: A heater is provided for use in substrate processing. In a first aspect, the heater is formed from a heater plate including an upper surface having at least one recess formed therein, a heater element wire disposed within the at least one recess and an electrically insulating and thermally conductive material disposed within the at least one recess so as to electrically insulate the heater element wire from the heater plate. Preferably a plurality of recesses are formed within the upper surface, a heater element wire is disposed within each recess and an electrically insulating and thermally conductive material is disposed within each recess so as to electrically insulate the heater element wire within each recess from the heater plate. A plurality of heating zones thereby may be formed.