Abstract: A method for selectively adhering braze powders to a surface comprises applying a binder material to a surface, depositing a braze powder on the binder material, and then directing a laser beam onto the braze powder while the laser beam moves along a predetermined path relative to the surface. The laser beam selectively heats the braze powder and the binder material along the predetermined path such that the binder material is removed and the braze powder is sintered and bonded to the surface. Thus, a braze deposit is formed at one or more predetermined locations on the surface. After forming the braze deposit, excess braze powder and binder material, that is, the braze powder and binder material not selectively heated by the laser, are removed from the surface.

Abstract: A solder printing inspection device that is placed on an upstream side of a component mounting machine that mounts an electronic component on solder that is printed on a substrate by a solder printing machine, and that inspects the solder on the substrate on which a thermosetting adhesive is applied, the solder printing inspection device including: an irradiator that irradiates the solder with light; an imaging device that takes an image of the irradiated solder; a processor that: generates actual solder position information of a solder group that the electronic component is mounted on based on the image, wherein the solder group includes two or more solders; generates, based on design data or manufacturing data, ideal solder inspection reference information indicating a reference inspection position and/or a reference inspection range of the solder included in the solder group; outputs mounting position adjustment information to the component mounting machine.

Abstract: A method of forming a gas turbine engine component according to an example of the present disclosure includes, among other things, forming a plurality of internal channels in a main body between one or more internal ribs, and forming a weld pattern in an external surface of a cover skin. The weld pattern is based on at least a geometry of the one or more internal ribs. The method includes positioning the cover skin along the main body to enclose the plurality of internal channels, and welding the cover skin to the main body along the weld pattern subsequent to the positioning step.

Abstract: A system for applying thermal interface materials to components includes a supply of thermal interface material and a die. The die is operable for pushing against and/or removing a portion of the thermal interface material that is between the die and a corresponding one of the components. The portion of the thermal interface material is removed from the supply and applied to the corresponding one of the components.

Abstract: A process for producing a sputtering target in which a target material is diffusion-bonded to a backing plate material having an annular frame part, the method comprising: an incorporating step of incorporating the target material inside the frame part of the backing plate material in such a manner that the uppermost position of the target material becomes higher than the uppermost position of the frame part of the backing plate material in a height direction of the frame part of the backing plate material; and a bonding step of diffusion-bonding the target material to the backing plate material.

Abstract: A thermalization structure is formed using a foil and a low temperature device (LTD). The foil includes a first layer of a first material. The LTD includes a surface from which heat is transferred away from the LTD. A coupling is formed between the foil and the surface of the LTD, where the coupling includes a bond formed between the foil and the surface such that forming the bond forms a set of ridges in the foil, a ridge in the set of ridges operating to dissipate the heat.

Abstract: An electrostatic chuck of an embodiment includes a base, a dielectric layer, and a chuck main body. The dielectric layer is provided on the base, and is fixed to the base. The chuck main body is mounted on the dielectric layer. The chuck main body has a ceramic main body, a first electrode, a second electrode, and a third electrode. The ceramic main body has a substrate mounting region. The first electrode is provided in the substrate mounting region. The second electrode and the third electrode form a bipolar electrode. The second electrode and the third electrode are provided in the ceramic main body, and are provided between the first electrode and the dielectric layer.

Abstract: A substrate structure includes a polycrystalline substrate, a plurality of thin film layers disposed on the polycrystalline substrate, a bonding layer coupled to at least a portion of the plurality of thin films, and a single crystal silicon layer joined to the bonding layer.

Abstract: According to one embodiment, a method for manufacturing a semiconductor device is disclosed. The method includes forming a co-catalyst layer and catalyst layer above a surface of a semiconductor substrate. The co-catalyst layer and catalyst layer have fcc structure. The fcc structure is formed such that (111) face of the fcc structure is to be oriented parallel to the surface of the semiconductor substrate. The catalyst includes a portion which contacts the co-catalyst layer. The portion has the fcc structure. An exposed surface of the catalyst layer is planarized by oxidation and reduction treatments. A graphene layer is formed on the catalyst layer.

Abstract: A method of bonding a terminal of a semiconductor chip using a solder bump includes preparing a semiconductor chip with an aluminum (Al) pad terminal formed thereon (S-1), forming a solder bump on the Al pad terminal through a primary solder (S-2), attaching the solder bump and a metal structure to each other via a secondary solder with a higher melting point than a melting point of the primary solder (S-3), performing heat treatment in an attachment state (S-4), and mixing the primary solder and the secondary solder that are melted during the heat treatment and converting a resulting mixture into a tertiary solder including one solder layer (S-4).

Abstract: A method for producing heat exchangers having at least two fluid circuits each having channels, including the following steps: producing one or a plurality of elements of a first fluid circuit, each element having at least two metal plates, at least one of which has first grooves; stacking the at least two metal plates of each element in such a way that the first grooves form the channels of the first circuit; assembling each element of the first circuit by diffusion welding between the two stacked metal plates; producing one or a plurality of elements of at least one second fluid circuit, each element of the second circuit having at least a portion of the channels of the second circuit; assembling, either by diffusion welding, or by brazing, or by diffusion brazing between the element or elements of the first circuit and the element or elements of the second circuit.

Abstract: Indentation approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes forming a plurality of alternating N-type and P-type semiconductor regions in or above a substrate. The method also includes locating a metal foil above the alternating N-type and P-type semiconductor regions. The method also includes forming a plurality of indentations through only a portion of the metal foil, the plurality of indentations formed at regions corresponding to locations between the alternating N-type and P-type semiconductor regions. The method also includes, subsequent to forming the plurality of indentations, isolating regions of the remaining metal foil corresponding to the alternating N-type and P-type semiconductor regions.

Abstract: According to one embodiment, a method for manufacturing a semiconductor device is disclosed. The method includes forming a co-catalyst layer and catalyst layer above a surface of a semiconductor substrate. The co-catalyst layer and catalyst layer have fcc structure. The fcc structure is formed such that (111) face of the fcc structure is to be oriented parallel to the surface of the semiconductor substrate. The catalyst includes a portion which contacts the co-catalyst layer. The portion has the fcc structure. An exposed surface of the catalyst layer is planarized by oxidation and reduction treatments. A graphene layer is formed on the catalyst layer.

Abstract: An aluminum alloy brazing sheet achieves a stable brazability equal to by brazing using a flux, even if an etching treatment is not performed on the brazing site. The aluminum alloy brazing sheet is used to braze aluminum in an inert gas atmosphere without using a flux and includes a core material and a filler metal, one side or each side of the core material being clad with the filler metal, the core material being formed of an aluminum alloy that includes 0.2 to 1.3 mass % of Mg, the filler metal including 6 to 13 mass % of Si and 0.004 to 0.1 mass % of Li, with the balance being aluminum and unavoidable impurities, a surface oxide film having been removed from the brazing sheet, and an oil solution that decomposes when heated at 380° C. or less in an inert gas having been applied to the brazing sheet.

Abstract: A method for manufacturing a cemented carbide body includes the steps of forming a first part of a first powder composition comprising a first carbide and a first binder phase, sintering the first part to full density in a first sintering operation, forming a second part of a second powder composition comprising a second carbide and a second binder phase, sintering the second part to full density in a second sintering operation, bringing a first surface of the first part and a second surface of the second part in contact, and joining the first and second surface in a heat treatment operation.

Abstract: A method for bonding of a first solid substrate to a second solid substrate which contains a first material with the following steps, especially the following sequence: formation or application of a function layer which contains a second material to the second solid substrate, making contact of the first solid substrate with the second solid substrate on the function layer, pressing together the solid substrates for forming a permanent bond between the first and second solid substrate, at least partially reinforced by solid diffusion and/or phase transformation of the first material with the second material, an increase of volume on the function layer being caused.

Abstract: A bearing component and a method to form a bearing component. The bearing component comprises a first and a second metallic material wherein the first material presents a first carbon content and the second material presents a second carbon content, wherein the first material and the second material have been joined by a diffusion welding process. The diffusion welding process has resulted in a transition zone with a varying carbon content between the first material and the second material. The varying carbon content in the transition zone is essentially within an interval, wherein the interval end points are defined by the carbon content of the first material and the second material.

Abstract: Provided is a target formed of a sintering-resistant material of high-melting point metal alloy, high-melting point metal silicide, high-melting point metal carbide, high-melting point metal nitride or high-melting point metal boride comprising a structure in which a target material formed of a sintering-resistant material of high-melting point metal alloy, high-melting point metal silicide, high-melting point metal carbide, high-melting point metal nitride or high-melting point metal boride and a high-melting point metal plate other than the target material are bonded. Additionally provided is a production method of such a target capable of producing, with relative ease, a target formed of a sintering-resistant material of high-melting point metal alloy, high-melting point metal silicide, high-melting point metal carbide, high-melting point metal nitride or high-melting point metal boride, which has poor machinability, can relatively easily produced.

Abstract: An aluminum alloy brazing sheet achieves a stable brazability equal to by brazing using a flux, even if an etching treatment is not performed on the brazing site. The aluminum alloy brazing sheet is used to braze aluminum in an inert gas atmosphere without using a flux and includes a core material and a filler metal, one side or each side of the core material being clad with the filler metal, the core material being formed of an aluminum alloy that includes 0.2 to 1.3 mass % of Mg, the filler metal including 6 to 13 mass % of Si and 0.004 to 0.1 mass % of Li, with the balance being aluminum and unavoidable impurities, a surface oxide film having been removed from the brazing sheet, and an oil solution that decomposes when heated at 380° C. or less in an inert gas having been applied to the brazing sheet.

Abstract: A vehicle structural member, such as a rocker panel, including a micro-truss core. The structural member includes specially configured and opposing outer panels that are welded together to define a channel therein, where the micro-truss core is placed in one of the panels or is fabricated to one of the panels during the micro-truss fabrication process before the panels are secured together. The micro-truss core can include separate individual sections, where each section has a tailored stiffness for that location in the member, or the micro-truss core can be a continuous core, where different sections along the length of the core are fabricated with different stiffnesses.

Abstract: A conductive coating layer 2a, 2b is formed on at least one of an inner peripheral side and an outer peripheral side of a base body 2 of bellows 1 by diffusion-bonding. Regarding the diffusion-bonding, the flat conductive coating layer 2a, 2b is layered on at least one end surface side of the plate-shaped base body 2, and these base body 2 and conductive coating layer 2a, 2b are diffusion-bonded. After forming this diffusion-bonded multilayer member into a tubular body by a drawing process, a side wall of the tubular body is formed into a bellows shape. With these processes, it is possible to obtain the bellows that has the conductive coating layer having a more uniform thickness on the base body of the bellows and has extremely good characteristics (the mechanical characteristics and the electric characteristics).

Abstract: A manufacturing method for a module having a hollow region, including: making an assembly including at least one recessed plate having a recess open at one face, defining thereon a recess outline and, between the face and the immediately adjacent plate of the assembly, a strand of material lying along the recess outline; treating the assembly, aiming to obtain diffusion bonding of the strand to the plate(s) with which it is in contact, to constitute, along its associated recess outline, a gas-tight connection of the two plates between which it is placed; and consolidating the assembly by hot isostatic pressing.

Abstract: Provided are: a method for brazing an aluminum alloy, which is characterized in that brazing is carried out by heating an aluminum brazing sheet without using flux in a furnace that is in an argon gas-containing atmosphere, said aluminum brazing sheet comprising a core material that is composed of aluminum or an aluminum alloy and a brazing filler material that is composed of an aluminum alloy and clad on one surface or both surfaces of the core material, and said core material and/or said brazing filler material containing Mg; and a brazing apparatus which is used in the method for brazing an aluminum alloy. The brazing method has good and stable brazing properties and is applicable in industrial practice.

Abstract: The present invention provides a ceramic to ceramic joint and methods for making such a joint. Generally, the joint includes a first ceramic part and a second ceramic part, wherein the first and second ceramic parts each include a ceramic-carbide or a ceramic-nitride material. In some cases, an aluminum-initiated joint region joins the first and second ceramic parts. This joint region typically includes chemical species from the first and second ceramic parts that have diffused into the joint region. Additionally, the first and second ceramic parts each typically include a joint diffusion zone that is disposed adjacent to the joint region and which includes aluminum species from the joint region that have diffused into the joint diffusion zone. Other implementations are also described.

Abstract: A method and apparatus are described for swing adsorption processes. The method includes obtaining different plates, wherein the plates have gaseous openings and a utility fluid opening. Then, the gaseous openings are substantially oriented along a common axis for gaseous openings and the plates are diffusion bonded. Once diffusion bonded, the gaseous openings within the module are wash coated with an adsorbent material.

Abstract: A nuclear fusion reactor first wall component includes a copper alloy element, an intermediate metal layer made from niobium and a beryllium element, directly in contact with the intermediate metal layer. The intermediate niobium layer is further advantageously associated with a mechanical stress-reducing layer formed by a metal chosen from copper and nickel. This mechanical stress-reducing layer is in particular arranged between the intermediate niobium layer and the copper alloy element. Furthermore, when the mechanical stress-reducing layer is made from pure copper, a layer of pure nickel can be inserted between the niobium and the pure copper before diffusion welding. Such a component presents the advantage of having an improved thermal fatigue behavior while at the same time preventing the formation of intermetallic compounds at the junction between the beryllium and the copper alloy.

Abstract: A method of manufacturing a hollow component, such as a fan blade for a gas turbine engine, includes the steps of: (a) providing first and second panels and a membrane; (b) providing a stop-off material on at least one of the first and second panels and the membrane to define regions where no diffusion bonding is to take place; (c) assembling the panels and the membrane together so the membrane is between the panels; (d) diffusion bonding the panels and the membrane together. The method is such that when assembled in step (c) the membrane does not extend to at least one edge of the first and second panels, so that in that region the first and second panels are diffusion bonded directly to each other.

Abstract: A method of forming a pack in a die by superplastic formation and diffusion bonding comprises applying a forming pressure within the pack to expand the pack within the die; and supplying gas between the die and the pack to apply a back pressure around an outside of the pack while the pack is being expanded to counteract the forming pressure to reduce surface mark off.

Abstract: According to one aspect of the present disclosure, a part for an article of equipment includes a fluid conducting first region including a corrosion resistant first material, and a fluid conducting second region including a second material. The first region and the second region are either directly or indirectly joined by solid state welding to form a unitary fluid conducting part. According to another aspect of the present disclosure, a method for replacing at least one fluid conducting part of an article of equipment is disclosed wherein a replacement part is provided that includes a fluid conducting first region including a corrosion resistant first material, and a fluid conducting second region including a second material. The second material is substantially identical to the material of a region of the equipment on which the replacement part is mounted. The first and second regions are either directly or indirectly joined by solid state welding to form a unitary fluid conducting replacement part.

Abstract: The invention relates to a method for producing a nickel aluminide coating on a metal substrate. Said method includes the following steps: a) coating the substrate with a nickel deposit; b) applying an aluminum sheet onto the nickel deposit from step a) so as to form an assembly made up of the substrate coated with the nickel deposit and the aluminum sheet; and c) subjecting said assembly to heat treatment at a temperature that is lower than the melting point of aluminum, and at a low pressure so as to induce a reaction between the aluminum and the nickel and thus form a ?-NiAl nickel aluminide layer mounted on a nickel layer. The invention is particularly of use for protecting the materials used in turbines of aircraft engines.

Abstract: A method for preparing an implant having a porous metal component. A loose powder mixture including a biocompatible metal powder and a spacing agent is prepared and compressed onto a metal base. After being compressed, the spacing agent is removed, thereby forming a compact including a porous metal structure pressed on the metal base. The compact is sintered, forming a subassembly, which is aligned with a metal substrate portion of an implant. A metallurgical bonding process, such as diffusion bonding, is performed at the interface of the subassembly and the metal substrate to form an implant having a porous metal component.

Abstract: A solder joint may be used to attach components of an organic vapor jet printing device together with a fluid-tight seal that is capable of performance at high temperatures. The solder joint includes one or more metals that are deposited over opposing component surfaces, such as an inlet side of a nozzle plate and/or an outlet side of a mounting plate. The components are pressed together to form the solder joint. Two or more of the deposited metals may be capable of together forming a eutectic alloy, and the solder joint may be formed by heating the deposited metals to a temperature above the melting point of the eutectic alloy. A diffusion barrier layer and an adhesion layer may be included between the solder joint and each of the components.

Abstract: Disclosed are methods of processing an object, the object being made of a metal or an alloy, the object having a plurality of open cavities, the method comprising: performing a sealing process on the object to seal the openings of the open cavities, thereby forming a plurality of closed cavities; and reducing the sizes of the closed cavities by performing a consolidation process on the object having the closed cavities. Sealing process may comprise shot peening or coating the object. A consolidation process may comprise a hot isostatic pressing process. The sizes of the closed cavities may be reduced until the closed cavities are no longer present in the object.

Abstract: A bond free of an anti-stiction layer and bonding method is disclosed. An exemplary method includes forming a first bonding layer; forming an interlayer over the first bonding layer; forming an anti-stiction layer over the interlayer; and forming a liquid from the first bonding layer and interlayer, such that the anti-stiction layer floats over the first bonding layer. A second bonding layer can be bonded to the first bonding layer while the anti-stiction layer floats over the first bonding layer, such that a bond between the first and second bonding layers is free of the anti-stiction layer.

Abstract: A method is disclosed for mechanically bonding a metal component to a ceramic material, comprising providing a metal component comprising an anchor material attached to at least a first portion of one surface of the metal component; providing a ceramic material having a first surface and a second surface, wherein the ceramic material defines at least one conduit extending from the first surface to the second surface, wherein the at least one conduit has a first open end defined by the first surface, a second open end defined by the second surface, a continuous sidewall and a cross sectional area; positioning the ceramic material such that at least a portion of the at least one conduit is in overlying registration with at least a portion of the anchor material; and applying a bonding agent into at least a portion of the at least one conduit.

Abstract: Disclosed herein is a method of making a structure by ultrasonic welding and superplastic forming. The method comprises assembling a plurality of workpieces comprising a first workpiece including a first material having superplastic characteristics; ultrasonically welding the first workpiece to a second workpiece, to form an assembly; heating the assembly to a temperature at which the first material having superplastic characteristics is capable of superplastic deformation, and injecting a fluid between the first workpiece and the second workpiece to form a cavity between the first workpiece and the second workpiece.

Abstract: A method of joining a plurality of parts to form a unitary body. At least two sintered parts are provided. At least one of the sintered parts has at least one internal channel. Each of the parts is formed of a hard metal composition of material. The at least two sintered parts are assembled into the shape of a unitary body. Each of the at least two sintered parts has a joining surface and when each joining surface is brought into contact the surfaces form a bonding interface therebetween. The assembled parts are subjected to a vacuum or gas atmosphere, without the application of external pressure, and to a temperature sufficient to fuse the at least two sintered parts together at the bonding interface to form the unitary body.

Abstract: A method for applying a wear protection layer to a continuous flow machine component which has a base material comprising titanium is provided. The method includes the following steps: mixing a solder which comprises an alloy comprising titanium and particles which are distributed in the alloy and have a reaction agent; applying the solder to predetermined points of the continuous flow machine component; introducing a heat volume into the solder and the continuous flow machine component so that the alloy becomes liquid and the reaction agent changes through diffusion processes with the solder and undergoes a chemical reaction with the alloy, forming a hard aggregate; and cooling the solder so that the alloy becomes solid.

Abstract: A method of joining a plurality of parts to form a unitary body includes providing at least two sintered parts. Each of the parts is formed of a hard metal composition of material. The sintered parts are assembled into the shape of a unitary body. Each of the sintered parts has a joining surface and when each joining surface is brought into contact the surfaces form a bonding interface therebetween. The assembled sintered parts are subjected to a temperature sufficient to fuse the sintered parts together at the bonding interface to form the unitary body. A wear resistant tool includes a plurality of sintered parts, each of the sintered parts is formed of a hard metal composition of material, wherein the plurality of sintered parts can be assembled into a unitary body, wherein the assembled parts are fused together at a respective bonding interface to form the unitary body.

Abstract: A method of joining a plurality of parts to form a unitary body. At least two sintered parts are provided. At least one of the sintered parts has at least one internal cavity. Each of the parts is formed of a hard metal composition of material. The at least two sintered parts are assembled into the shape of a unitary body. Each of the at least two sintered parts has a joining surface and when each joining surface is brought into contact the surfaces form a bonding interface therebetween. The assembled parts are subjected to a vacuum or gas atmosphere, without the application of external pressure, and to a temperature sufficient to fuse the at least two sintered parts together at the bonding interface to form the unitary body.

Abstract: The present invention relates to a process and a device for joining precious metal sheets (1,4) to form structural parts, and to the products (1,4) made by the process.

Abstract: A method for manufacturing an integral molded cooling device, a circulation channel of a refrigerant being formed in the inside of the cooling device, the method includes: laminating a channel forming plate, a top plate and a bottom plate, a plurality of comb tooth units being provided on the channel forming plate; and integrating the channel forming plate, the top plate and the bottom plate by diffusion joining.

Abstract: A structure is disclosed herein. The structure includes a first component including a first material, and a second component joined to the first component. The second component includes a second material that is dissimilar from the first material. A spacer is disposed between the first and second components, and the spacer eliminates galvanic corrosion of the first component at an interface between the first component and the second component. The spacer includes a first layer consisting of the first material, a second layer bonded to the first layer and consisting of a third material, and a third layer bonded to the second layer and consisting of the second material. The third material of the second layer is different from the first material and different from the second material. Also disclosed herein are a method of making the structure, and a method for reducing galvanic corrosion.

Abstract: An information handling system is disclosed. The information handling system comprises a chassis including a metal base, and a metal insulation layer, and a processing unit coupled to the chassis.

Abstract: A composite steel plate includes at least two steel sheets rolled to form a plate. One of the sheets has a composition that varies in a depthwise direction, between nanocrystalline and micron grained. The plate is made by treating a steel sheet to produce a composition in the sheet that varies in a depthwise direction of the sheet between nanocrystalline and micron grained, stacking the treated sheet with at least one other steel sheet, and rolling the stacked sheets to form the plate.

Abstract: A microelectronic assembly includes a first substrate having a surface and a first conductive element and a second substrate having a surface and a second conductive element. The assembly further includes an electrically conductive alloy mass joined to the first and second conductive elements. First and second materials of the alloy mass each have a melting point lower than a melting point of the alloy. A concentration of the first material varies in concentration from a relatively higher amount at a location disposed toward the first conductive element to a relatively lower amount toward the second conductive element, and a concentration of the second material varies in concentration from a relatively higher amount at a location disposed toward the second conductive element to a relatively lower amount toward the first conductive element.

Abstract: Disclosed herein are bonded structures and methods of forming the same. One embodiment of a bonded structure comprises first and second metallic layers and a bonding interface between the first and second metallic layers formed by diffusion and comprising a layer of at least one intermetallic compound. The intermetallic compound layer is formed in an area 52% or greater of an area of the bonding interface and has a thickness of 0.5 to 3.2 ?m.

Abstract: A method of manufacturing an orthopaedic implant device having a porous outer surface is described. In one embodiment, the implant device includes a porous layer, an intermediate layer, and a solid substrate. The porous layer is preferably bonded to the intermediate layer by cold isostatic pressing. The intermediate layer is preferably bonded by vacuum welding to the solid substrate such that the porous layer forms at least a portion of the outer surface of the orthopaedic implant device. Preferably, a diffusion bond is created between the bonded intermediate layer and the solid substrate by hot isostatic pressing. In another embodiment, a porous layer is created on an outer surface of a solid layer by selective melting. Preferably, the solid layer is bonded to the solid substrate such that the porous layer forms at least a portion of the outer surface of the orthopaedic implant device.

Abstract: A high-frequency power supply 10 includes a shaft 16 bonded to one surface of a plate 12 serving as a gas distributor plate. The plate 12 includes a radio-frequency electrode 14 buried therein. The shaft 16 has a through-hole 20 through which a gas flows. The plate 12 and the shaft 16 are made of a ceramic material. The shaft 16 has a double-tube structure including the inner tube 18 and the outer tube 22. The interior space of the inner tube 18 forms the through-hole 20. The plate 12 is hermetically solid-state bonded to the inner tube 18 and the outer tube 22. The shaft 16 is bonded to the center of the plate 12.

Abstract: A process for manufacturing a shaped sandwich panel includes arranging a sandwich panel adjacent a die. The sandwich panel includes a core layer arranged between and connected to a first layer and a second layer. The core layer includes a plurality of apertures that extend through the core layer to the first layer. The first layer engages the die. Fluid within the apertures is pressurized to a pressure adequate to at least partially form the sandwich panel to a geometry of the die.