Abstract: Sputtering targets are described that comprise: a) a target surface component comprising a target material; b) a core backing component having a coupling surface, a back surface and at least one open area, wherein the coupling surface is coupled to at least part of the target surface component; and wherein at least part of the target surface component fits into at least one open area of the core backing component. In some embodiments, the target surface component, the core backing component or a combination thereof have at least one surface area feature coupled to or located in the back surface of the core backing component, the target surface component or a combination thereof, wherein the surface area feature increases the cooling effectiveness of the target surface component.

Abstract: A process for manufacturing a metal part reinforced with ceramic fibers including machining at least one housing for an insert in a metal body having an upper face. At least one insert formed from ceramic fibers in a metal matrix is placed in the housing. The insert is covered with a cover. A vacuum is created in the interstitial space around the insert and the interstitial space is hermetically sealed under vacuum. The assembly, namely the metal body with the cover, is treated by hot isostatic pressure. The treated assembly is machined in order to obtain the part. The cover includes an element covering the insert in the slot and projecting from the upper face, and a sheet covering the upper face with said element. In particular, the insert is straight and the housing for the insert in the metal body forms a straight slot.

Abstract: Methods of forming a blade and rendering a blade resistant to erosion includes positioning a backing plate(s) or elongated backing plate(s) adjacent at least one side of a forward face of a leading edge surface of the blade. The methods include depositing an erosion resistant material in a plurality of layers by fusion bonding the erosion resistant material to the forward face of the leading edge surface of the blade. The backing plates providing a template or guide for depositing the plurality of layers of erosion resistant material. The plurality of layers of erosion resistant material form an erosion shield and a leading edge of the blade. Methods include removing the backing plate.

Abstract: A piezoelectric actuator unit includes a plurality of laminated piezoelectric elements, a first external electrode positioned on a first side surface of each piezoelectric element, and a conductive member connected to each first external electrode with a solder including indium, bismuth, or a mixture thereof, and some of the indium and/or bismuth in the solder is diffused into the soldered portions of the conductive member.

Abstract: A seamless composite metal tube comprises an inner layer (1) consisting of copper or a copper alloy, an outer layer (5) consisting of aluminium or an aluminium alloy, and at least three different intermediate intermetallic layers (2, 3, 4) each consisting of copper and aluminium, wherein the concentration of copper decreases from the inner layer (1) to the outer layer (5) in the radial direction of the tube.

Abstract: A strip-shaped or plate-shaped composite metal object and a method for the production thereof. The composite metal object has at least two layers of the same metal. The layers have been brought by a heat pretreatment to a temperature such that a mutual diffusion bond has resulted through subsequent pressing of the layers against one another, while reducing the thickness by 5 to 25% and preferably 8 to 15%. A layer, which on the side thereof facing an adjacent layer has strip-shaped recesses, which are closed by the adjacent layer to form channels when the layers are pressed together, is used as one of the layers. The channels in the composite metal object allow the inclusion of additional elements before processed further to form an implement. The channels remain extensively preserved during the production and further processing of the composite model object.

Abstract: A method of manufacturing a fiber reinforced metal matrix composite article, the method comprises forming a first metal component, forming a second metal component and forming at least one fiber preform comprising at least one metal coated fiber. The metal at least one first portion of the at least one metal coated fiber of the at least one fiber preform is bonded to the metal at least one second portion of the at least one metal coated fiber of the at least one fiber preform to hold the at least one fiber in position. The at least one fiber preform is placed between the first metal component and the second metal component. The second metal component is sealed to the first metal component, and heat and pressure is applied such as to consolidate the at least one fiber preform and to diffusion bond the metal on the fiber of the at least one fiber preform, the first metal component and the second metal component to form a unitary composite article. The bonding comprises ultrasonic welding.

Abstract: A method for bonding a porous tantalum structure to a substrate is provided. The method comprises providing a substrate comprising cobalt or a cobalt-chromium alloy; an interlayer consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof; and a porous tantalum structure. Heat and pressure are applied to the substrate, the interlayer, and the porous tantalum structure to achieve solid-state diffusion between the substrate and the interlayer and between the interlayer and the porous tantalum structure.

Abstract: A method for bonding a porous tantalum structure to a substrate is provided. The method comprises providing a substrate comprising cobalt or a cobalt-chromium alloy; an interlayer consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof; and a porous tantalum structure. Heat and pressure are applied to the substrate, the interlayer, and the porous tantalum structure to achieve solid-state diffusion between the substrate and the interlayer and between the interlayer and the porous tantalum structure.

Abstract: Copper metal or metal alloy workpieces and/or aluminum metal or metal alloy workpieces are joined in a solid state weld by use of a reactive material placed, in a suitable form, at the joining surfaces. Joining surfaces of the workpieces are pressed against the interposed reactive material and heated. The reactive material alloys or reacts with the workpiece surfaces consuming some of the surface material in forming a liquid-containing reaction product comprising a low melting liquid that removes oxide films and other surface impediments to a welded bond across the interface. Further pressure is applied to expel the reaction product and to join the workpiece surfaces in a solid state weld bond.

Abstract: The invention relates to a novel process for producing a metal ceramic substrate, especially a copper-ceramic substrate, in which at least one metal foil at a time is applied to the surface sides of a ceramic layer or a ceramic substrate using a high temperature bonding process and the metal foil is structured on at least one surface side for forming conductive tracks, contact surfaces, and the like.

Abstract: The production method of a cooler includes a laminated material production step S1 and a brazing joining step. In the laminated material production step, a laminated material is formed by integrally joining a Ni layer made of Ni or a Ni alloy having an upper surface to which a member to be cooled is to be joined by soldering, a Ti layer made of Ti or a Ti alloy and arranged on a lower surface side of the Ni layer, and an Al layer made of Al or an Al alloy and arranged on a lower surface side of the Ti layer in a laminated manner. In the brazing joining step, a lower surface of the Al layer of the laminated material and a cooling surface of a cooler main body are joined by brazing.

Abstract: A method of forming an internal structure in a hollow component that includes the steps of forming an assembly having first, second, and third plates the first and second plates each with a substantially planar surface and a surface that includes at least one protrusion and is on the exterior facing surfaces of the assembly. The third plate is sandwiched between the first and second plates. The method also includes the steps of selectively bonding portions of the third plate to sections of the first and second plates substantially opposite the at least one protrusions of the first and second plates; and forming the assembly against a die such that the at least one protrusions of the first and second plates are transferred from the exterior facing surfaces to the interior facing surfaces of the first and second plates.

Abstract: This alloying element-saving hot rolled duplex stainless steel material contains, by mass %, C: 0.03% or less, Si: 0.05% to 1.0%, Mn: 0.5% to 7.0%, P: 0.05% or less, S: 0.010% or less, Ni: 0.1% to 5.0%, Cr: 18.0% to 25.0%, N: 0.05% to 0.30% and Al: 0.001% to 0.05%, with a remainder being Fe and inevitable impurities, wherein the alloying element-saving hot rolled duplex stainless steel material is produced by hot rolling, a chromium nitride precipitation temperature TN is in a range of 960° C. or lower, a yield strength is 50 MPa or more higher than that of a hot rolled steel material which is subjected to a solution heat treatment, and the alloying element-saving hot rolled duplex stainless steel material is as hot rolled state, and is not subjected to a solution heat treatment. This clad steel plate includes a duplex stainless steel as a cladding material, the duplex stainless steel has the above composition, and the chromium nitride precipitation temperature TN is in a range of 800° C. to 970° C.

Abstract: Copper conductor members or other copper-base workpieces are welded using a suitable copper alloy material that is reactive with the joining surfaces of the copper members. The reactive metal material may be applied as a thin metal strip between assembled facing joining surfaces. The members are pressed together against the reactive material and heated. The combined pressure and heat enable the reactive material to react with facing workpiece material, to liquefy and remove oxides or the like that might inhibit the formation of a welded interface. The liquid, containing original reactive metal and byproducts, is squeezed from the interface of the workpieces to enable the formation of a solid-state weld between them without melting of un-reacted workpiece copper material.

Abstract: Methods of forming devices, including LED devices, are described. The devices may include fluorinated compound layers. The methods described may utilize a plasma treatment to form the fluorinated compound layers. The methods described may operate to produce an intermetallic layer that bonds two substrates such as semiconductor wafers together in a relatively efficient and inexpensive manner.

Abstract: An example diffusion bonding machine includes a support structure configured to receive first and second die sets. A heat transfer device is arranged near the support structure and is configured to transfer heat relative to the die sets. A mechanism is configured to separate the die sets from one another during heat transfer. In one example method of diffusion bonding, heat is transferred relative to a space between die sets. The die sets are supported on the support structure, and a load is applied to the die sets to diffusion bond a component within each of the die sets.

Abstract: An example diffusion bonding machine includes a support structure configured to receive first and second die sets. A heat transfer device is arranged near the support structure and is configured to transfer heat relative to the die sets. A mechanism is configured to separate the die sets from one another during heat transfer. In one example method of diffusion bonding, heat is transferred relative to a space between die sets. The die sets are supported on the support structure, and a load is applied to the die sets to diffusion bond a component within each of the die sets.

Abstract: A plate-like conductor for a busbar, which is a clad member consisting of two copper layers derived from respective two copper plates clad on respective opposite major surfaces of an aluminum plate, an aluminum layer derived from the aluminum plate and formed integrally with the copper layers, and two alloy layers consisting of aluminum and copper and formed between the aluminum layer and the two copper layers.

Abstract: A method for bonding a composite multi-layer shell having complex curvature by the delta-alpha high temperature bonding process uses a novel tool. The tool includes a plurality of segments that combine to form a mandrel assembly having a substantially continuous outer surface. The outer surface has a substantially axisymmetric shape including a complex curvature. When the segments are combined to form the mandrel assembly, at least one of the segments is configured to be movable in a substantially inward direction without substantial obstruction by any other segment. The segments are constructed of a first material have a first coefficient of thermal expansion that is greater than a second coefficient of thermal expansion of a second material of a composite multi-layer shell to be bonded together using the tool.

Abstract: An advanced copper bonding with ceramic substrate technology includes the steps of (1) forming a copper film of thickness <1 ?m on a ceramic substrate by sputtering deposition under 1.33×10?3 torr and 150° C., (2) plating a copper layer of thickness 10˜50 ?m at room temperature, and (3) bonding a copper foil to the ceramic substrate by diffusion bonding under environments of high temperature, vacuum, and negative pressure inertia gas or H2 partial pressure.

Abstract: According to one embodiment, a joined structural body for mounting an electronic component on the body which is provided with a first member, a second member and a joining portion. The joining portion is provided between the first member and the second member so as to connect the first member and the second member with each other mechanically. The joining portion contains at least one metal of a tin, an indium or a zinc, and a copper. The content of the metal in the joining portion decreases toward a side of at least one of the first member and the second member, and the content of the copper in the joining portion increases in the same direction as the decreasing direction of the content of the metal.

Abstract: To easily bond substrates even made of materials whose linear expansion coefficients are different from each other when manufacturing an optical component used by transmitting light through an inside thereof. Buffer layers made of an amorphous inorganic substance causing a brittle fracture are formed on bonding surfaces of a plurality of substrates having linear expansion coefficients different from one another, and the substrates to be bonded are stacked so that the buffer layers are faced to each other. Then, a heat treatment is performed for a stack, and thereby direct bonding via an atom is formed between the buffer layers.

Abstract: A method for manufacturing a module with a hollow area by hot isostatic compression, including: making an assembly including superposed elements defining the hollow area, the assembly forming a sealed casing containing the hollow area, including at least one meltable obturation member separating the hollow area from the outside of the assembly; followed by hot isostatic compression of the assembly, to obtain diffusion-welding of its elements, by letting temperature and pressure conditions change over time to cause a rupture of the meltable obturation member allowing pressurization gas to penetrate into the hollow area.

Abstract: Embodiments of a method for manufacturing a turbine engine component are provided, as are embodiments of a thermal growth constraint tool for the manufacture of turbine engine components. In one embodiment, the method includes the steps of obtaining a plurality of arched pieces, arranging the plurality of arched pieces in a ring formation, and bonding the plurality of arched pieces together to produce a monolithic ring by heating the ring formation to a predetermined bonding temperature while constraining the outward radial growth thereof.

Abstract: Embodiments of golf club face plates with internal cell lattices are presented herein. Other examples and related methods are also disclosed herein.

Abstract: High-temperature solders having a higher melting point than solder alloys used for soldering of printed circuit boards are used for internal bonding of electronic parts, but high-temperature solders which are free from Pb have not been developed. There exist high-temperature solders which comprises Sn balls and Cu balls and which perform bonding through the formation of an intermetallic compound without melting to form a single-phase structure, but they have poor wettability to the lands of a printed circuit board or electrodes of electronic parts and have not been used. A solder paste according to the present invention is provided by mixing flux with a powder mixture of Sn powder or an Sn based lead-free solder powder with Cu or Ag powder which has Ni plating formed on its surface.

Abstract: A method and apparatus for the fabrication and/or repair of an integrally bladed rotor, specifically of an integrally bladed gas turbine rotor, is disclosed. At least one rotor blade is joined to a main rotor body for fabrication and/or repair. The joining is carried out by diffusion welding.

Abstract: In a method of applying a firmly adhering metallic coating onto a steel sheet product, a steel sheet product is inserted into a film bag which contains at least a coating material. Subsequently, the film bag is evacuated to cause the film to evenly bear upon the outer surface of the steel sheet product. This state is fixed by sealing the film bag. The film bag and the steel sheet product are then subjected to a heat treatment to thereby form a coating of the coating material on the steel sheet product.

Abstract: The invention provides methods of superplastic forming and diffusion bonding and a gas inlet tube that facilitates the methods which produce structures that are substantially mark off free. Methods include disposing a sealed pack into a die having a patterned surface and an opposite surface; applying a first pressure within the die around an outside of the pack; applying a second pressure within the pack, the second pressure exceeding the first pressure; and forming the pack by superplastic deformation into a diffusion-bonded structure. Further, a gas inlet tube is provided having an inner tube and an outer tube, where the outer tube is weldable to the pack in a gas tight seal.

Abstract: A method of manufacturing an article by diffusion bonding, the method comprising the steps of assembling first and second component parts having a joint therebetween; sealing the joint against infiltration by solid particulate material, without causing phase change of the component parts; and applying heat and isostatic pressure via a solid particulate material to form a consolidated joint by diffusion bonding.

Abstract: A target and backing plate assembly and method of making the same. The target and backing plate assembly provides a mechanical interlock between the target and backing plate in addition to diffusion bonding between dissimilar materials comprising the target and backing plate. An interlayer may also be used between the target and backing plate. A plurality of ridges, or other salient surface features on one of the target and backing plate are joined to corresponding members or channels on the other of the target and backing plate. The dissimilar materials of the target and backing plate fill negative angled cavities formed by the plurality of ridges and corresponding channels or members of the target and backing plate to accommodate the diffusion bonded dissimilar materials. A target and backing plate assembly with increased strength results.

Abstract: A microsystem has a first cavity which is sealed off from the surroundings and a second cavity which is sealed off from the surroundings. The first cavity is bounded by a first bond joint and the second cavity is bounded by a second bond joint. Either the first bond joint or the second bond joint is a eutectic bond joint or a diffusion-soldered joint.

Abstract: An assembly of a gadolinium target and a titanium backing plate, wherein the gadolinium target-titanium backing plate assembly has a solid-phase diffusion-bonded interface at a bonding interface between the gadolinium target and the titanium backing plate. An object of the present invention is to discover a backing plate that is suitable for the gadolinium sputtering target, explore the optimal bonding conditions, improve the deposition rate, stabilize the sputtering process, and prevent the occurrence of warpage and separation of the target material and the backing plate by increasing the bonding strength between the target material and the backing plate, as well as inhibit the generation of particles during sputtering.

Abstract: A manufacturing method for an electronic device joining a first metallic bond part formed on a first electronic component and a second metallic bond part formed on a second electronic component includes a first process for placing the first metallic bond part directly against the second metallic bond part, applying pressure to the first electronic component and the second electronic component, joining the first metallic bond part to the second metallic bond part with solid-phase diffusion, and releasing the applied pressure, and a second process for heating the first electronic component and the second electronic component at a predetermined temperature such that the first metallic bond part and the second metallic bond part are joined together by melting at least one of the first metallic bond part and the second metallic bond part.

Abstract: A method of forming a part that includes a first component and a second component and which two components are diffusion bonded together. The first component is configured as a pressure component and includes a first bond land surface. The second component is configured as a suction component and includes a second bond land surface. A mandrel is provided that includes a first surface having a contour that mates with at least a portion of the first component and a second surface having a contour that mates with at least a portion of the second component. The first and second components are positioned on the mandrel so that the first bond land surface and the second bond land surface are in mating abutment. The first and second components together with the mandrel are positioned in a die assembly. The die assembly including a first die, a second die and a plurality of fastening members for releasably securing the first die to the second die.

Abstract: A joint structure of the present invention includes a conductive member containing copper as a major component thereof, an electrode member containing copper as a major component thereof, and a joint portion formed by fusion welding the conductive member and the electrode member with a brazing material containing tin as a major component thereof and containing substantially no copper, wherein the amount of copper atoms contained in the alloy in the central part of the joint portion is higher than that in the outer circumference part.

Abstract: Methods and apparatus are provided for forming a diffusion bonded composite structure. The composite structure includes at least one internal void or feature. Surfaces to be bonded are cleaned and prepared for bonding. The exposed joints of the composite structure where the surfaces interface are sealed. The composite structure is placed in hot isostatic process furnace. The furnace is pressurized to a low pressure below 1500 pounds per square inch that forces the surfaces to be bonded in intimate contact with one another. The composite structure is heated to promote diffusion bonding at the interface of surfaces in contact with one another.

Abstract: The present invention relates to a process and a device for joining precious metal sheets (1,4) to form structural parts, and to the products (1,4) made by the process.

Abstract: A manufacturing method for a module having a hollow region, including: making an assembly including at least one recessed plate having a recess open at one face, defining thereon a recess outline and, between the face and the immediately adjacent plate of the assembly, a strand of material lying along the recess outline; treating the assembly, aiming to obtain diffusion bonding of the strand to the plate(s) with which it is in contact, to constitute, along its associated recess outline, a gas-tight connection of the two plates between which it is placed; and consolidating the assembly by hot isostatic pressing.

Abstract: A method of manufacturing a composite rotor disc (2) in which, following diffusion bonding of a ceramic core section (4) of the rotor disc (2) to a metallic outer section (6) of the rotor disc (2) at an elevated temperature, the rotor disc (2) is allowed to cool to a predetermined temperature and is held at this predetermined temperature for a predetermined period of time. While the rotor disc (2) is held at this predetermined temperature it is loaded in a radially outward direction. The rotor disc (2) is then allowed to cool to a temperature below the predetermined temperature.

Abstract: Provided is a sputtering target/backing plate assembly having a structure such that pure copper is embedded in a backing plate position at the central portion of the target, within sputtering target/copper-zinc alloy backing plate bonded bodies. Consequently, provided is a simple structure of sputtering target/backing plate capable of sufficiently accommodating further high-power sputtering without deteriorating the characteristics of a copper-zinc alloy backing plate that is inexpensive and excels in strength and anti-eddy current characteristics.

Abstract: A hydrogen purifier utilizing a hydrogen permeable membrane, and a gas-tight seal, where the seal is uses a low temperature melting point metal, which upon heating above the melting point subsequently forms a seal alloy with adjacent metals, where the alloy has a melting point above the operational temperature of the purifier. The purifier further is constructed such that a degree of isolation exists between the metal that melts to form the seal and the active area of the purifier membrane, so that the active area of the purifier membrane is not corrupted. A method of forming a hydrogen purifier utilizing a hydrogen permeable membrane with a seal of the same type is also disclosed.

Abstract: An apparatus for connecting a component with a substrate by means of diffusion soldering in a closed evacuated chamber, wherein the component and the substrate to be connected are displaceable separate from one another in the chamber, and the chamber comprises a combined transfer and pressing unit being displaceable between a current position of the component and a current position of the substrate, for placing and pressing the component on the substrate, and the combined transfer and pressing unit comprises a rotatable element, which, in response to the placing and pressing of the component on the substrate, assumes an angle between the normal of a lower side of the component to be connected and a pressing direction of the component, the angle corresponding to an angle between the normal of a surface area of the substrate to be connected and the pressing direction of the component.

Abstract: A process of making useful shapes by joining of tungsten alloys. Joining of tungsten heavy alloys which are alloys typically made from W—Ni—Fe is used. These alloys are typically manufactured by liquid phase sintering. This leads to difficulty in producing large length to diameter ratio parts that have some significant weight (such as penetrators). A “brick and mortar” approach is employed wherein smaller segments of this alloy (low length to diameter ratio) are joined to together to produce a larger part with higher length to diameter ratio.

Abstract: A method for the manufacture through diffusion bonding of metallically encapsulated ceramic armor providing enhanced ballistic efficiency and physical durability.

Abstract: A process for joining ceramic components, wherein the components which are to be joined consist of sintered nonoxide ceramic, and the components are brought into contact with one another in a diffusion-welding process in the presence of a shielding gas atmosphere and are joined with little deformation, under the application of a temperature of at least 1600° C., preferably over 1800° C., particularly preferably over 2000° C., and if appropriate a load, to form a monolith, the components which are to be joined experiencing plastic deformation in the direction in which force is introduced of less than 5%, preferably less than 1%.

Abstract: A metal tube having an inner wall coated with a metal foam liner. The metal tube has an outer diameter of between 2 mm and 75 mm, a length of between 10 mm and 1000 mm, and a wall thickness of between 0.2 mm and 2 mm. The metal foam liner has a thickness of between 0.1 mm and 10 mm, a permeability of between 10?13 m2 and 10?8 m2, a capillarity radius of between 5 ?m and 1 mm and a thermo-conductivity of between 1 W/m·K and 50 W/m·K. Also, a method to obtain a metal tube which inner wall is metallurgically bonded in thermo-conduction with a metal foam liner, a method to obtain a metal tube with a heterogeneous metal foam liner, and a method to obtain a tubular metal foam liner 10a from a sheet of metal foam.

Abstract: A method for constantly controlling a direct application of pressure for bonding porous coatings to substrate materials used in orthopaedic implants. The direct pressure is applied to an interface between the porous coating and the substrate material via a pressure application mechanism unaffected by heat and air pressure conditions of the bonding process. The pressure application mechanism maintains a pressure on the implant which is constantly controlled throughout the bonding process.

Abstract: A tab lead soldering apparatus soldering a tab lead to a front face and a rear face of a solar cell has a first pressing mechanism pressing the tab lead toward the front face of the solar cell, a second pressing mechanism pressing the tab lead toward the rear face of the solar cell rear face, a heat member and a support member provided to the first pressing mechanism and/or the second pressing mechanism to contact with the tab lead, a heat member shift mechanism shifting the heat member between a contact position to contact an end of the heat member with the tab lead and a separation position to separate the end of the heat member from the tab lead, and a support member shift mechanism shifting the support member between a contact position to contact an end of the support member with the tab lead and a separation position to separate the end of the support member from the tab lead.