Abstract: There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: arranging a metal plate 12 of an overall-rate solid solution type alloy on a ceramic substrate 10; and heating the metal plate 12 and the ceramic substrate 10 in a non-oxidizing atmosphere at a temperature of lower than a melting point of the alloy to bond the metal plate 12 directly to the ceramic substrate 10. According to this method, it is possible to easily bond an alloy plate directly to a ceramic substrate, and it is possible to inexpensively provide an electronic member for resistance without causing the alloy plate to be deteriorated.

Abstract: Methods for making abrasive water jet mixing tubes with superhard materials are presented. Also presented are methods for making a tubular elongate superhard material bodies.

Abstract: Disclosed is a novel electric joining method and apparatus that can overcome the defects associated with the prior art while taking advantage of the technology for the pulse excited sintering process such as spark plasma sintering process or the hot-press joining process.

Abstract: A fixture having a bottom plate, top plate and an expansion block interposed between the bottom plate and top plate. A workpiece is positioned between the expansion block and bottom plate. When the fixture is heated, there is a net displacement exerted by the expansion block so as to apply pressure to the workpiece. The pressure applied by the fixture to the workpiece is due solely to the thermal expansion of the fixture when it is heated.

Abstract: A method of diffusion welding of different metals is accomplished while applying pressure to the butt area and homogeneous heating the butt area to about 0.8 to about 0.9 the melting point of the metals to be welded. Additional heat pulses are then supplied to the butt area. The number of additional heat pulses depends on the diameter of the pieces to be welded. The heat pulses provide for a more even temperature distribution over the butt area and increases the number of active diffusion centers to enhance the diffusion process. The method is useful for different refractory and stainless steels and alloys. The resultant diffusion welds do not produce burring.

Abstract: Mating faces of a microchannel plate (MCP) (50) and a multi-layer ceramic body (80) unit are deposited with a thin film having protuberances (84) using a suitable metal selected for optimum diffusion at a desired temperatures and pressure. The metallized MCP (50) and multi-layer ceramic body (80) unit are then aligned and placed in a bonding fixture (F) that provides the necessary force applied to the components to initiate a diffusion bond at a desired elevated temperature. The bonding fixture (F) is then placed in a vacuum heat chamber (V) to accelerate the diffusion bonding process between the MCP (50) and the multi-layer ceramic body unit (80).

Abstract: A soldering agent for use in diffusion soldering processes contains, in a soldering paste, a mixture of at least partially metallic grains of a high-melting metal and a solder metal. In a diffusion soldering process, the solder metal reacts completely with the high-melting metal and metals belonging to parts that are to be joined to one another by the soldering process, to form an intermetallic phase.

Abstract: A method of diffusion bonding three metal work pieces to form a fan blade, where each workpiece has a flat surface and an excess portion larger than a predetermined size needed to produce a finished fan blade; longitudinally extending slots are provided to interconnect the flat surfaces of the excess portions of the work pieces; the work pieces are assembled into a stack with the flat surfaces in mating abutment and the stack is evacuated from one end of the stack through the slots; heat and pressure are applied across the thickness of the work pieces to diffusion bond the work pieces together to form an integral structure; the excess portions with the slots are then removed.

Abstract: The invention encompasses a method of bonding a first mass to a second mass. A first mass of first material and a second mass of second material are provided and joined in physical contact with one another. The first and second masses are then diffusion bonded to one another simultaneously with the development of grains of the second material in the second mass. The diffusion bonding comprises solid state diffusion between the first mass and the second mass. A predominate portion of the developed grains in the second material have a maximum dimension of less than 100 microns. The invention also encompasses methods of forming a physical vapor deposition target bonded to a backing plate.

Abstract: A honeycomb body, which is composed in such a manner that a strip of corrugated foil made of heat-resistant stainless steel containing aluminum and a strip of flat foil made of stainless steel are alternately wound or laminated on each other, is incorporated into an outer cylinder made of metal and integrated into one body by means of diffusion bonding, so that a diffusion bonded metallic catalyst carrier can be formed. Surface roughness of the strip of foil after the completion of diffusion bonding is 0.001 to 2.0 &mgr;m when it is expressed by center line average height Ra, and no sintered bridges are formed at both end portions of the diffusion bonded section in the longitudinal direction.

Abstract: Methods and apparatus are provided for forming a diffusion bonded composite structure. The composite structure includes at least one internal void or feature. Surfaces to be bonded are cleaned and prepared for bonding. The exposed joints of the composite structure where the surfaces interface are sealed. The composite structure is placed in hot isostatic process furnace. The furnace is pressurized to a low pressure below 1500 pounds per square inch that forces the surfaces to be bonded in intimate contact with one another. The composite structure is heated to promote diffusion bonding at the interface of surfaces in contact with one another.

Abstract: A multisheet structure is made using compression diffusion bonding according to the present invention using a CRES template to apply increased pressure in the areas designated for diffusion bonds (DB) to improve the bond quality and to reduce the processing time. The CRES template is patterned to correspond with the DB arrangement in the superplastically formed part. The forming press forces the template against the pack of SPF sheets to provide 300-1200 psi or more pressure along the bond lines to speed their formation.

Abstract: The invention includes deposition apparatuses having reaction chambers and particle-trapping features formed along one or more surfaces within the chambers. In particular aspects, the particle-trapping features can comprise a pattern of bent projections forming receptacles, and can comprise microstructures on the bent projections. The invention also includes methods of forming particle-trapping features by initially forming a pattern of projections, bending the projections, and then exposing the projections to particles to form microstructures on the bent projections.

Abstract: A combinatorial process for production of material libraries from a single sample, comprising forming a diffusion multiple in the single sample, wherein the diffusion multiple comprises a plurality of interdiffusion regions at interfacial locations of dissimilar metals, metal oxides, or alloys, and wherein the diffusion multiple comprises at least three layers of the metals, non-metals, metal oxides, or alloys; and evaluating properties of the diffusion multiple as a function of composition at about the interdiffusion regions.

Abstract: The method of fabricating a hollow mechanical part of the invention includes a step b) of depositing an anti-diffusion substance in a predefined pattern on at least one face of primary parts to be assembled together.

Abstract: Embodiments of the invention include a method comprising disposing a thin metallic layer having a low melting temperature between one end of a conductive post on a substrate and a conducting structure on an opposing substrate. Heated platens in contact with the substrates can apply pressure and heat to the thin metallic layer and cause it to be entirely consumed and subsequently transformed into a bonding layer having a melting temperature higher than the melting temperature of the original thin metallic layer. Prior to, during, or after the conductive post is bonded to the conducting structure, the region around the conductive post and between the substrates may be filled with a dielectric material, such as polyimide.

Abstract: The present invention relates to a color cathode ray tube provided with a pressed-type shadow mask. As material for constituting the shadow mask 6, a single plate body made of a composite gradient alloy plate consisting of three layers 6A, 6B, 6C or more in which an alloy element has the concentration gradient which is continuously changed from one surface to the other surface is used. The present invention can realize a pressed mask having a large radius of curvature by self-correcting the thermal deformation such as a doming or the like.

Abstract: A method of bonding and packaging components of Micro-Electro-Mechanical Systems (MEMS) and MEMS based devices using a Solid-Liquid InterDiffusion (SLID) process is provided. A micro-machine is bonded to a micro-machine chip using bonding materials. A layer of chromium is first deposited onto surfaces of the micro-machine and the micro-machine chip followed by a layer of gold. Subsequently, a layer of indium is deposited between the layers of gold, and the surface of the micro-machine is pressed against the surface of the micro-machine chip forming a gold-indium alloy to serve as a bond between the micro-machine and the micro-machine chip. In addition, a cover is bonded to the micro-machine chip in the same manner providing a hermetic seal for the MEMS based device.

Abstract: A method for producing a metallic honeycomb body, according to which at least partly structured metal sheet is coiled, laminated or looped to form a matrix. The matrix is oscillated by an external excitation and during or after the external excitation is introduced into a casing tube.

Abstract: A method is provided for electrically and mechanically connecting a first electronic device to a second electronic device. At least one electric contact of the first device is located against an electric terminal of the second device. The electric contact is tacked to the electric terminal by simultaneously applying heat and pressure between the electric contact and the electric terminal. The electric contact is subsequently diffusion-bonded to the electric terminal by applying heat to the electric contact and the electric terminal for a select period of time while a pressure between the electric contact and the electric terminal is reduced relative to the pressure when tacking the electric contact to the electric terminal.

Abstract: The present invention relates to an improvement in the manufacture of metal blanks, discs, and sputtering targets by flattening only one of the two surfaces of a metal plate. The elimination of flattening the metal plate's second surface results in a significant cost reduction. The metal plate of the present invention preferably has a single-side flatness of 0.005 inches or less, which improves the reliability of the bond between the target blank and a backing plate. Preferred metals include, but are not limited to, tantalum, niobium, titanium, and alloys thereof. The present invention also relates to machining the first side of a metal plate, bonding the first side to a backing plate, and then optionally machining the second side of the metal plate.

Abstract: A diffusion bonded PVD target assembly (30) includes a target blank (34) bonded directly to a backing plate (32), a majority crystal structure of the target blank comprising a HCP structure. The target blank can include cobalt and the backing plate can include an aluminum or copper alloy. The target assembly can exhibit a thickness dependent high PTF, such as at least about 60%. A PVD target fabrication method includes diffusion bonding a target blank to a backing plate, a majority crystal structure of the target blank comprising a HCP structure; transitioning at least some of the HCP structure to a non-HCP structure; and restoring a majority of the non-HCP structure to the HCP structure. The transitioning can include hot pressing the target blank and backing plate at a temperature exceeding a HCP to non-HCP transition temperature of the target blank. The restoring can include cooling at a specified low rate.

Abstract: A method of forming a sputtering target is described that involves bonding a backing plate onto a casement having one or more recesses that contain target material to form a bonded target. During the bonding process, the bonded target is optionally vacuum sealed within the recess. The bonded target is then optionally annealed while under vacuum to form an annealed sputtering target. The sputtering target can then be retrieved by removing at least a portion of the casement from the sputtering target in one or several steps. Also described is a casement having one or more recesses containing bonded target material that is optionally vacuum sealed in the casement. The casement, as well as the backing plate that is optionally bonded onto the casement, are further described as well as other options and methods.

Abstract: The method of protectively coating metallic uranium which comprises dipping the metallic uranium in a molten alloy comprising about 20-75% of copper and about 80-25% of tin, dipping the coated uranium promptly into molten tin, withdrawing it from the molten tin and removing excess molten metal, thereupon dipping it into a molten metal bath comprising aluminum until it is coated with this metal, then promptly withdrawing it from the bath.

Abstract: Disclosed are different titanium aluminide (Ti—Al) honeycomb panel structures formed from a gamma-based Ti—Al (&ggr;-Ti—Al) or orthorhombic Ti—Al (O—Ti—Al) honeycomb core brazed to a &ggr;-Ti—Al or O—Ti—Al facing sheet(s), where a metal braze filler foil containing copper and one or more other metals is used to join the faying surface of the honeycomb core and the faying surface of the facing sheet(s). The structures and method of the invention are useful where high strength, lightweigth materials are required, such as in aircraft and other aerospace-related applications.

Abstract: A method of manufacturing a fan blade (10) comprises forming three metal workpieces (30,32,34). Each metal workpiece (30,32, 34) has a flat surface (38,42,46,48) and is larger than a predetermined size (X) to form excess portions (62,64,66). The predetermined size (X) is required to produce the finished fan blade (10). The excess portions (62,64,66) are located outside the finished fan blade (10). Longitudinally extending slots (68) are formed to interconnect the flat surfaces (46,48) of the excess portions (66). The metal workpieces (30,32,34) are assembled into a stack (36) so that the flat surfaces (38,42,46,48) are in mating abutment. The stack (36) is evacuated from one longitudinal end of the stack (36) such that the slots (68) enable gases at an opposite end of the stack (36) to be removed from the stack (36). Heat and pressure is applied across the thickness of the metal workpieces (30,32,34) to diffusion bond the metal workpieces (30,32,34) together to form an integral structure.

Abstract: Novel methods of making laminated, microchannel devices are described. Examples include: assembly from thin strips rather than sheets; and hot isostatic pressing (HIPing) to form devices with a hermetically sealed wall. Laminated microchannel articles having novel features are also described. The invention includes processes conducted using any of the articles described.

Abstract: Conductive balls are transferred from a pallet onto an array of conductive pads on a semiconductor chip by means of a transfer apparatus; the transfer apparatus includes a pallet formed with an array of recesses same in pattern as the array of conductive pads, a movable head formed with an array of vacuum holes and a driving mechanism for moving the head from an idle position onto the pallet and from the pallet to the semiconductor chip; when the head is moved to the pallet, the vacuum holes are connected to the recesses so as to confine the conductive balls in the narrow spaces; the vacuum is developed; then the conductive balls are traveled through the closed spaces to the vacuum holes; even if the conductive balls have been charged, the conductive balls are never attracted to the adjacent balls, and are surely captured by the vacuum holes.

Abstract: A backing plate of Ti for supporting a Ti sputtering target is formed of at least two components welded together. The backing plate is welded by interposing a Cu or Zr foil or powder between faces to be welded, and then heating the assembly to a reaction temperature high enough to melt one of the Ti and Cu or Zr to produce a liquid phase. The heating temperature is retained for a time long enough to permit diffusion of the Cu or Zr into the Ti to produce a liquid phase diffusion weld. By permitting diffusion to occur, a separate metallic compound is not produced at the welding face. In effect welding is accomplished without producing a welding face, whereby no interface exists in the finished weld. The resulting weld has a strength substantially equal to the strength of the Ti material, and very good welding qualities.

Abstract: A method of manufacturing a lightweight bearing in which raceway surface parts are formed of iron-based material and body members are formed of a lightweight material that is lighter than the iron-based material. Bearing rings are manufactured by producing first and second split body members whose shapes are identical to those obtained by dividing the body members transversely along a plane perpendicular to the center axis, producing split raceway surface members whose shapes are identical to those obtained by similarly dividing the raceway surface formation members, and bonding together split raceway surface members and split body members.

Abstract: A titanium target assembly includes a titanium sputtering target, a copper or copper alloy backing plate and serving as a support member for the target and a silver or silver alloy coating film and formed between the target and backing plate. The coating film is formed on a surface subjected to cleaning treatment on the bonding side or sides of the target and backing plate by physical vapor deposition. The titanium target and backing plate are solid phase diffusion bonded. The face(s) serve as the bonding plane. The assembly can be manufactured by cleaning the surface(s) of the target and/or backing plate on bonding side(s), forming a coating film on the cleaned surface(s) on bonding side(s) and solid phase diffusion-bonding the target and backing plate, while using surface(s) provided with coated film as the bonding plane. The target assembly possesses high bonding strength and excellent bonding stability and reliability.

Abstract: A method and an apparatus incorporating the method for making a long, continuous laminate. A plurality of layers of materials are simultaneously wound around a metal hub. Strips of refractory material, perforated metal, metal foil, metal mesh, and random fiber media, are employed in the layers of materials. The hub, once completed, is placed into a furnace for diffusion bonding and later cooled to room temperature. The cooled laminate coil may be cut into various lengths.

Abstract: A method of forming sheets of superplastically formable material into a three dimensional article, the sheets being joined together along diffusion bonds to form discrete cells, at least one gas path being provided through the bond between cells. The sheets are heated to a temperature at which they exhibit superplastic properties and a gas injected between the sheets to expand the cells, the gas paths allowing the injected gas to pass from cell to cell. The edges of the gas paths are locally heated to change the microstructure of the sheets in the edge areas, which reduces the flow resistance of the edges under superplastic forming conditions and thereby reduces the propensity of the diffusion bonds bordering the gas transfer holes to peel apart under the forces of the inert gas exerted on the sheets at the gas transfer paths.

Abstract: A method of producing fiber-reinforced metallic building components having a complicated three-dimensional geometric shape includes the following steps. First, metal-coated SiC fibers are applied to a metallic sectional piece having a simple geometric shape, and are then held thereon without restraint by a metallic counterpart piece. Then, the unit consisting of the sectional piece, fibers and counterpart piece undergoes plastic deformation in vacuo between mold halves by applying pressure at an elevated temperature, without bonding of the fibers to one another or to the building component metal. By further increasing the pressure and/or temperature, the molded unit is compressed further between the mold halves and is consolidated to a monolithic part by metallic bonding (diffusion welding), whereby the part, either alone or bonded to other parts, forms the building component, after cooling and removing it from the mold halves.

Abstract: This disclosure describes a method for metallurgically bonding a complete leak-tight enclosure to a matrix-type fuel element penetrated longitudinally by a multiplicity of coolant channels. Coolant tubes containing solid filler pins are disposed in the coolant channels. A leak-tight metal enclosure is then formed about the entire assembly of fuel matrix, coolant tubes and pins. The completely enclosed and sealed assembly is exposed to a high temperature and pressure gas environment to effect a metallurgical bond between all contacting surfaces therein. The ends of the assembly are then machined away to expose the pin ends which are chemically leached from the coolant tubes to leave the coolant tubes with internal coolant passageways. The invention described herein was made in the course of, or under, a contract with the U.S. Atomic Energy Commission.

Abstract: In order to improve solid phase diffusion bondability at contact portions between a metal flat foil and a metal corrugated foil together constituting a metal honeycomb body for a catalyst converter used for purifying an exhaust gas and to improve engine durability, the present invention comprises one or combination of the following structures; a structure wherein at least one of the metal foils has a foil thickness of less than 40 &mgr;m; a structure wherein an Al content after bonding is at least 3%; a structure wherein the surface condition of both metal foils in a width-wise direction has a predetermined surface coarseness or a predetermined surface shape and condition; and a structure wherein the width of contact portions between both metal foils is at least five times the thickness of the metal foils.

Abstract: A preferred sputter target assembly (10, 10′) comprises a target (12, 12′), a backing plate (14, 14′) bonded to the target (12, 12′) along an interface (22, 22′) and dielectric particles (20, 20′) between the target (12, 12′) and the backing plate (14, 14′). A preferred method for manufacturing the sputter target assembly (10, 10′) comprises the steps of providing the target (12, 12′) and the backing plate (14, 14′); distributing the dielectric particles (20, 20′) between mating surfaces (24, 26) of the target (12, 12′) and the backing plate (14, 14′), most preferably along a sputtering track pattern on one of the mating surfaces; and bonding the target (12, 12′) to the backing plate (14, 14′) along the mating surfaces (24, 26).

Abstract: An efficient and effective process for manufacturing of hardened aluminum components is achieved by coordinating the material preparation steps with the forming steps. The resulting product is a hardened aluminum component with desirable strength characteristics. The process includes initial heating of sheet material in order to prepare it for further processing. The sheet material is then quenched to promote appropriate material conditioning. A product forming sub-process is then undertaken in a relatively short period of time following the quenching. The product forming is done while the material is in a relatively ductile condition, thus easing forming operations, and avoiding product spring-back problems. Lastly, the component is naturally aged, to provide the final hardening operations. The resulting product has very desirable strength characteristics, due to the combined forming and hardening process.

Abstract: A valve is characterized by excellent corrosion and wear resistance and maintainability due to use of a bonding corrosion and wear proof alloy containing non-continuously distributed eutectic carbide on the sliding portions of various types of apparatuses and valves by diffusion bonding. This serves to improve the maintainability of a thermal and nuclear power plant and to provide a nuclear power plant using recirculating water, which ensures excellent working safety, in particular. The corrosion and wear proof alloy is characterized in that network-formed eutectic carbide in the alloy containing the cast structure base metal and eutectic carbide is formed into(multiple) granules or lumps having a particle size of 30 microns or less so that said eutectic carbide is non-continuously distributed.

Abstract: A method is provided for diffusion bonding a first member (20) and a second member (3) to each other. According to this method, a first joint portion (24) of the first member and a second joint portion (34) of the second member are fitted to each other with a predetermined interference. Thereafter, the first and second members are heated under a condition substantially without oxygen, so that the first and second joint portions are diffusion bonded to each other.

Abstract: A process for welding superalloys, and particularly articles formed of gamma prime-strengthened nickel-base superalloys whose chemistries and/or microstructures differ. The process entails forming the faying surface of at least one of the articles to have a cladding layer of a filler material. The filler material may have a composition that is different from both of the articles, or the same as one of the articles. The cladding layer is machined to promote mating of the faying surfaces, after which the faying surfaces are mated and the articles welded together. After cooling, the welded assembly is free of thermally-induced cracks.

Abstract: Deterioration and damage to insulator materials in an interconnection structure having vertical connections due to exposure to heat during bonding of lamina is avoided by performing diffusion bonding of metal pads at plated through holes (PTH) at temperatures below the melting points of conductive material in the bond. Diffusion bonding is achieved during time periods required for processing (e.g. curing or drying) of insulating materials in the laminated structure.

Abstract: A sputter target assembly including a high purity copper sputter target diffusion bonded to a backing plate, preferably composed of either aluminum, aluminum alloy, aluminum matrix composite materials, copper, or copper alloy, and a Ni-alloy interlayer, preferably composed of Ni—V, Ni—Ti, Ni—Cr, or Ni—Si, located between and joining the target and backing plate, and a method for making the assembly. The method of making involves depositing (e.g., electroplating, sputtering, plasma spraying) the interlayer on a mating surface of either the sputter target or backing plate and pressing, such as hot isostatically pressing, the sputter target and backing plate together along mating surfaces so as to form a diffusion bonded sputter target assembly.

Abstract: A method for enhancing temporary solder ball connection comprises the application of thermal energy to the solder balls, heating them to a submelting “softening” temperature, whereby the compression force required to connect all balls in a BGA is achieved at much reduced force, avoiding damage to the package, insert, substrate and support apparatus. Several forms of heating apparatus, and temperature measuring apparatus are disclosed.

Abstract: In the process for the monolithic molding of superplastic material, generation of wrinkles on the molded product can be prevented by avoiding local expansion generated in the no-bonding regions of both of three or more metal plates when the metal plates are monolithically molded by means of superplastic molding. The process is characterized in that auxiliary plates for molding are placed on both sides of the superposed plates through the no-bonding regions, these plates are set in the molding die, and a pressure lower than applied to the non-bonding regions is applied to spaces between inner wall of the molding die and the auxiliary plates to control movement of the top and bottom.

Abstract: A coated nickel-base superalloy article, which is otherwise susceptible to the formation of a secondary reaction zone, is prepared by furnishing a nickel-base superalloy article substrate having thereon an initial aluminum-containing coating comprising an initial-coating additive zone and an initial-coating diffusion zone. The article is susceptible to the formation of the secondary reaction zone if heated to an elevated SRZ reaction temperature for an SRZ reaction period of time. The formation of the secondary reaction zone is avoided by first removing the initial-coating additive zone and the initial-coating diffusion zone, and thereafter depositing a subsequent aluminum-containing coating onto the article substrate. The subsequent aluminum-containing coating includes a subsequent-coating additive zone and a subsequent-coating diffusion zone.

Abstract: The method manufactures sputter target assemblies. It first includes the step of manufacturing a target insert. The target insert has a yield strength, a diameter, a height, a planar top surface and a conical-shaped rear surface. Then a backing plate is manufactured. The backing plate has a cylindrical recess that corresponds to the diameter of the target insert. The cylindrical recess has a depth less than the height of the target insert and a yield strength less than the yield strength of the target insert. Finally, pressing the target insert into the cylindrical recess of the backing plate bonds the target insert to the backing plate to form a target assembly. The pressed target assembly contains the target insert with the conical-shaped rear surface.

Abstract: A structure (10) in the shape of an aerodynamic panel in which adjacent cells (20a, 20b) are formed by placing a stack of three metal plates in a mould. After diffusion welding of the plates at the required locations, a first variable pressure is applied in a first series of cells (20a) formed between the outer plate and the intermediate plate and a second independent pressure approximately constant and lower than the first is applied in the other cells (20b) and on the inner face of the stack. Thus, this partially forms the cells and shapes the structure in contact with a complementary surface of the mould. The final conformation of the cells and the structure is obtained by applying a second pressure cycle in the cells and on the inner face of the stack.

Abstract: A method for the manufacturing or repair of a superalloy gas turbine component including a liquid phase diffusion bonding process wherein the brazing heat treatment used for the diffusion bonding of a powder material to the component is accomplished by a heat cycle that is performed on the component for another purpose. A manufacturing solution heat treatment, a pre-weld heat treatment, a post-weld heat treatment, or a rejuvenating heat treatment may be used as the brazing heat treatment. The composition of the powder material is selected so that a desired set of material properties is achieved when the powder material is subjected to the dual-purpose heat cycle. In one embodiment, a 50/50 mixture of AM775 and IN939 powder is diffusion brazed to an IN939 superalloy component using a heat treatment which also functions as the post-casting solution heat treatment for the IN939 component.

Abstract: Deterioration and damage to insulator materials in an interconnection structure having vertical connections due to exposure to heat during bonding of lamina is avoided by performing diffusion bonding of metal pads at plated through holes (PTH) at temperatures below the melting points of conductive material in the bond. Diffusion bonding is achieved during time periods required for processing (e.g. curing or drying) of insulating materials in the laminated structure.