Abstract: The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base tapes having a number of land pattern groups are adhered. In the above state, the base frames are inserted into an adjacent reflow device to make the solder balls be attached on the solder ball pads. After the flux of the solder ball pad, on which the solder ball is attached, is removed, the base frames are stored in containers. To perform the base frame storing process in a very small space, the transfer course of the base frames is in the form of loop.

Abstract: A method of joining superalloy substrates together comprises diffusion bonding the superalloy substrates by depositing an activator directly on the surface of the joint to be bonded and thereafter subjecting the joint to heat and pressure. The heat and pressure causes the surface of the superalloy, in the presence of the activator, to diffusion bond without the use of a brazing alloy. By eliminating the brazing alloy, a high strength, high temperature bond is achieved, yet there is no molten brazing alloy to be drawn through capillary action into any fine features surrounding the joint being bonded, and there is no residue left at the interface that would diminish the mechanical or chemical properties of the joint.

Abstract: The invention encompasses a method of bonding a first mass to a second mass. A first mass of first material and a second mass of second material are provided and joined in physical contact with one another. The first and second masses are then diffusion bonded to one another simultaneously with the development of grains of the second material in the second mass. The diffusion bonding comprises solid state diffusion between the first mass and the second mass. A predominate portion of the developed grains in the second material have a maximum dimension of less than 100 microns. The invention also encompasses methods of forming a physical vapor deposition target bonded to a backing plate.

Abstract: A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. Producing a plasma from at least one of CF4, SF4, and H2 and exposing the solder structure to the plasma. Heating the solder structure and cooling the same to provide a solder bump on the semiconductor device.

Abstract: Process gas is fed from a gas supply means to a plasma generating means in a vacuum chamber, and hydrogen-containing plasma is generated by the plasma generating means under a low pressure. A soft solder alloy on the surface of a workpiece supported by a workpiece exposing means is exposed to the hydrogen-containing plasma so that the soft solder alloy is irradiated with the hydrogen-containing plasma. Either simultaneously with or immediately after the plasma irradiation, the soft solder alloy undergoes reflow treatment in a vacuum by a heating means. As no flux is used, there is no need of a washing process, and the bump-shaped electrode terminals produced by using the inexpensive soft solder alloy on the surface of the workpiece have great reliability.

Abstract: Method for controlling the deposition of solder on a base metal or substrate is disclosed. The method comprises applying an attaching flux and finishing flux to a substrate, placing a preform thereon and subjecting the same to reflow conditions. The finishing flux is applied to solubilize the normally insoluble corrosive residues that would occur when the attaching flux is subjected to reflow conditions with the preform and substrate. Alternatively, the attaching flux may be applied to the preform and substrate before undergoing reverse reflow conditions and then the finishing flux is applied to the solder deposit and substrate and the same subjected to second reflow conditions. After each method, the residues left from the attaching flux which are solubilized by the finishing flux, are cleaned by washing with a typical solvent.

Abstract: A method of forming reflowed bumps comprising the following sequential steps. A wafer is provided. A series of spaced initial bumps is formed upon the wafer. The initial bumps having exposed side walls and top surfaces and organic residue over the initial bump side walls and/or the initial bump top surfaces. The organic residue is simultaneously removed from the initial bump side walls and top surfaces with the forming a surface oxide layer over the initial bump side walls and top surfaces. The surface oxide layer is stripped from the initial bump top surfaces and an upper portion of the initial bump side walls to form partially exposed bumps. The partially exposed bumps are heat treated to melt the partially exposed bumps to form the reflowed bumps.

Abstract: The invention provides a water-soluble preflux that can solve problems with a soldering land array having a narrow spacing in that fused solder is likely to cause soldering bridges with defective soldering, a printed circuit board with its film formed thereon, and a surface treatment process for a metal in that circuit. The water-soluble preflux comprises given two different benzimidazoles compound and an iodine-based compound optionally with an amino acid, etc. The invention provides a printed circuit board with a film of that preflux formed thereon, and a surface treatment process for the metal in that circuit.

Abstract: A diffusion bond mixture paint and method for repairing a single-crystal superalloy article that minimizes the amount of braze alloy applied to the article. The amount of boron and eutectic brittle borides of the wide gap brazing processes is minimized, resulting in a more robust repair. The braze paint includes an alloy powder mixture, a binder, and a carrier to thin the paint.

Abstract: The invention includes an aluminum-comprising physical vapor deposition target bonded to an aluminum-comprising backing plate to a bond strength of greater than 10,000 pounds/in2. The invention also includes a method of bonding a first aluminum-comprising mass to a second aluminum-comprising mass. The first aluminum-comprising mass has a first surface, and the second aluminum-comprising mass has a second surface. The first and second masses are pressed together to bond the first mass to the second mass. Additionally, the invention includes a method of bonding a physical vapor deposition target material to a backing plate material. The target material and backing plate material are joined in physical contact with one another. The target material and backing plate material are then compressed under a load that progresses sequentially.

Abstract: There is provided a method for producing a bonded substrate comprising, at least, a process of joining two substrates and a process of subjecting the joined substrates to heat treatment to bond them firmly, wherein, at least, a process of cleaning for removing contaminants on the surface of the substrates is performed before joining the substrates, and then a process of drying the cleaned surface of the substrates is performed without using the water displacing method for the drying process, so that moisture is left on the substrates before joining to increase a joining strength after joining the substrates. Thereby, there can be provided a method for producing a bonded substrate wherein a joining strength of the joining interface of the substrates to be joined is improved, and thus the bonded substrate wherein there is no void failure and blister failure in the bonding interface of a bonded substrate after bonding heat treatment can be produced at high productivity and high yield.

Abstract: A method of manufacturing a high-quality metal foil/ceramics joining material (19) and a metal foil laminated ceramic substrate (20) which can prevent a damage to a ceramic material and enhance the productivity of the metal foil/ceramics joining material and the metal foil etched, are pressure-joined to ensure an easy and positive subsequent pressure-joining and the ceramic material (13) can be prevented from being broken because the ceramics material (13) is heated while being placed on a holder (14) and is pressure-joined under a pressure of 1 kg/mm2 or lower.

Abstract: The present invention relates to a clad sheet for lead frame which can manufacture economically and has excellent characteristics, lead frame using thereof and manufacturing method thereof. A clad sheet for lead frame is manufactured by press-bonding copper foil to nickel foil at the reduction rate of 0.1 to 3%. Or, it is manufactured by press-bonding copper foil having nickel plating on one or both sides of it to the other copper foil at the reduction rate of 0.1 to 3%. Or, it is manufactured by press-bonding aluminum foil to nickel foil at the reduction rate of 0.1 to 3%. Further, it is also manufactured by press-bonding copper foil having nickel plating on one side of it to aluminum foil at the reduction rate of 0.1 to 3%. Clad sheet is comprising three layer of copper/nickel/copper or copper/nickel/aluminum.

Abstract: A method for assembling chips onto substrates includes applying a flux-free, no-flow underfill material. In an embodiment, the method includes removing oxide from interconnects without the use of a flux and applying a flux-free, no-flow underfill. In an embodiment, the method includes removing oxide from bumps, applying no-flow underfill to a substrate, and fluxlessly connecting the bumps to pads on the substrate. In an embodiment, oxide is removed from the bumps by a plasma treatment. In an embodiment, oxide is removed from the bumps by a subjecting the bumps to an oxide reduction process. The assembly of the chips and substrate is free from flux residue and/or flux cleaning solution residue.

Abstract: The disclosure is a plural process to perform a solder ball attaching process that corresponds to the final of a ball grid array package manufacturing process. For example, flux and solder balls are exactly attached on solder ball pads of base frames on which base tapes having a number of land pattern groups are adhered. In the above state, the base frames are inserted into an adjacent reflow device to make the solder balls be attached on the solder ball pads. After the flux of the solder ball pad, on which the solder ball is attached, is removed, the base frames are stored in containers. To perform the base frame storing process in a very small space, the transfer course of the base frames is in the form of loop.

Abstract: A metal alloy solder ball comprising a first metal and a second metal, the first metal having a sputtering yield greater than the second metal. The solder ball comprises a bulk portion having a bulk ratio of the first metal to the second metal, an outer surface, and a surface gradient having a depth and a gradient ratio of the first metal to the second metal that is less than the bulk ratio. The gradient ratio increases along the surface gradient depth from a minimum at the outer surface. The solder ball may be formed by the process of exposing the ball to energized ions of a sputtering gas for an effective amount of time to form the surface gradient.

Abstract: The present invention provides a circuit board connecting method that includes an alkane application step and a heat-press-bonding step. The alkane application step is a preliminary step which applies an alkane group to a printed circuit board. The heat-press-bonding step heat-press-bonds a flexible circuit board to the printed circuit board by positioning their printed wire terminals and conductive thick-film terminals to face one another.

Abstract: A method for the manufacturing or repair of a superalloy gas turbine component including a liquid phase diffusion bonding process wherein the brazing heat treatment used for the diffusion bonding of a powder material to the component is accomplished by a heat cycle that is performed on the component for another purpose. A manufacturing solution heat treatment, a pre-weld heat treatment, a post-weld heat treatment, or a rejuvenating heat treatment may be used as the brazing heat treatment. The composition of the powder material is selected so that a desired set of material properties is achieved when the powder material is subjected to the dual-purpose heat cycle. In one embodiment, a 50/50 mixture of AM775 and IN939 powder is diffusion brazed to an IN939 superalloy component using a heat treatment which also functions as the post-casting solution heat treatment for the IN939 component.

Abstract: A method of manufacturing an article of manufacture for use in a fluxless brazing process is disclosed. The method comprises the step of applying a braze-promoting layer including one or more metals selected from the group consisting of nickel, cobalt and iron, onto a bonding layer which comprises one or more metals selected from the group consisting of zinc, tin, lead, bismuth, nickel, antimony and thallium and which is disposed on a substrate including aluminum.

Abstract: Residue contaminates semiconductor devices during processing in a furnace. Residue contamination is prevented by removing the residue before it builds up to a point where it can contaminate semiconductor devices. Residue build-up is monitored using a residue build-up monitoring device mounted on the furnace exhaust stack. When residue build-up reaches a predetermined level a signal is generated by the residue build-up monitoring device notifying technicians that furnace cleaning is required.

Abstract: A method of cleaning residue on surfaces in a reflow furnace includes introducing a solvent into the furnace chamber; reacting the solvent with the residue to form a product; and, removing the product from the furnace chamber. The solvent is gaseous, such as an etch gas. Also, the product of the reaction between the residue and the solvent can is gaseous. The gaseous product can then be exhausted from the reflow furnace. A reflow furnace for practicing the method is also disclosed.

Abstract: The present invention is a process for manufacturing an electronic circuit device by applying a solder material to electronic parts or electrodes on a printed circuit board; the process comprising the steps of removing an initial surface oxide film and an organic contaminant film from the surfaces of the solder material and electrode, covering the solder material and an area to which solder is to be applied which is comprised of the electrode, with a liquid vaporizing up after the bonding is completed in the step of heat-melting the solder material, to thereby prevent reoxidation of the joining area surface, and heat-melting the solder material, to carry out solder bonding without using any flux.

Abstract: A pin standing resin substrate including a resin substrate having a substantially plate-shaped main surface and composed of one of a resin and a composite material containing a resin, and having a pin-pad exposed from the main surface; and a pin soldered to the pin-pad, wherein the pin has been thermally treated by heating so as to soften the pin. The pin has a rod-like portion composed of a copper base metal and an enlarged diameter portion made of the same material as the rod-like portion. The enlarged diameter portion has a larger diameter than the rod-like portion and is formed at one end of the rod-like portion. At least the enlarged diameter portion is soldered to the pin-pad. Also disclosed is a method of making the pin standing resin substrate, a pin for bonding with the resin substrate, and a method of making the pin.

Abstract: A process is described for forming a structure of aluminum sheet components by spot welding the aluminum sheet components. In the process, aluminum sheet components are pretreated in a single step to both clean and increase the surface resistivity thereof by contacting the aluminum sheets with a pretreatment solution comprising a blend of sulphuric acid and phosphoric acid to clean the surface and generate a surface coating acting as a barrier film to increase the surface resistivity of the sheets. Thereafter the sheet components are secured together by spot welding.

Abstract: The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.

Abstract: A chip bonding location of a microelectronic chip is joined to a substrate bonding location of a substrate using a metallic solder in the absence of a flux. Surface contamination and oxide are first removed from the chip bonding location and from the substrate bonding location. The joining is accomplished by positioning the microelectronic chip and the substrate in a facing contact with the chip bonding location and the substrate bonding location in registry in a contact region. A heating element is disposed adjacent to and below the chip bonding location and the substrate bonding location to form an assembly. There is no flux present in the assembly in the contact region. The assembly is placed into an oven having a non-oxidizing environment.

Abstract: A hermetically sealed chamber and the method of manufacturing same, which comprises the steps of: (a) preparing two aluminum or aluminum alloy material members which face each other; (b) forming at least one extending groove portions on a surface to be metal-bonded of one of the two aluminum or aluminum alloy material members, which groove portion extends in a manner to make an enclosure; (c) forming at least one corresponding extending protruding portions on a surface to be metal-bonded of the other of the two aluminum or aluminum alloy material members, which protruding portion extends in a manner to make a corresponding enclosure; and (d) receiving internally packaged parts therebetween, inserting the at least one extending protruding portions into the at least one corresponding extending groove portions so as to be fitted, and causing the at least one extending protruding portions and the at least one extending groove portions to be metal-bonded by press-forging.

Abstract: The present invention relates to a self cleaning braze paste which is used in the repair of gas turbine engines. The braze paste comprises lithium fluoride in an amount sufficient to act as a flux which allows the braze material to flow into a crack or void in a part to be repaired up to an amount where there is no residual lithium or fluoride in the crack or void, preferably up to about 20% by volume, a gel binder in an amount up to about 15% by volume, and the balance comprising at least one of a nickel braze alloy and a cobalt braze alloy. In a preferred embodiment, the lithium fluoride is present in an amount from about 10% to about 15% by volume. The braze material of the present invention may be applied in a paste form or, alternatively, in a paint or tape form. A method for cleaning and repairing a braze joint is also disclosed.

Abstract: The invention comprises a continuous hot rolling method in which a rear end portion of a preceding metal block and a fore end portion of a succeeding metal block are cut and the metal blocks are joined to each other by heating and pressing followed by a finish rolling. A region of each metal block is restrained from a clamping position to the end portion thereof in order to prevent a change in level of the metal blocks in heating and pressing the piece. The end portions of the metal blocks can be thus prevented from deformation.

Abstract: An improved method of manufacturing a piezoelectric element and an improved piezoelectric element are provided. The improved method comprises the steps of causing a gas discharge in a predetermined discharge gas at approximately atmospheric pressure and generating an excited active species of the discharge gas as a result of the gas discharge. Then, at least one of a connecting surface of an electrode formed of a piezoelectric piece on a piezoelectric resonator and a connecting portion of a lead terminal are exposed to the excited active species, whereby the exposed connecting portions are surface treated. Finally, the electrode and the lead terminal are connected together, and at least the electrode and the lead terminal are sealed in a case. The improved piezoelectric element is formed by this process and uses less solder and is more stable than prior art piezoelectric elements.

Abstract: A method for fusing together, using diffusion bonding, micromachine subassemblies which are separately fabricated is described. A first and second micromachine subassembly are fabricated on a first and second substrate, respectively. The substrates are positioned so that the upper surfaces of the two micromachine subassemblies face each other and are aligned so that the desired assembly results from their fusion. The upper surfaces are then brought into contact, and the assembly is subjected to conditions suited to the desired diffusion bonding.

Abstract: An effective method for cleaning flux residues produced in process of fabricating semiconductor devices, and a method of fabricating the semiconductor devices including this cleaning method are provided. The flux cleaning method for cleaning the solder bump electrodes formed using a flux comprises the steps of: applying a pretreatment process including coating of the solder bump electrode with the flux and applying a heat treatment thereto, and carrying out the flux cleaning to clean the heat-treated flux.

Abstract: A method of pretreating a copper surface for protecting the surface from oxidation, by immersing the surface in a solution containing organic solderabilty preservatives, such as BenzoTriAzole, with the addition of a zinc salt. The method is particularly useful in the manufacturing of electronic Printed Circuit Boards for protecting the copper surfaces during the solder processes when the PCB undergoes high temperature. The addition of the zinc salts also gives the additional advantage of increasing the solderabilty properties of the copper surface (i.e. wettability and adhesion).

Abstract: An upper shearing blade 3 equipped with a protrusion 30 of a triangle-columnar shape and a lower shearing blade 4 equipped with a protrusion 40 of the same shape are applied onto the overlapped portion of metal plates 1 and 2 to be bonded, and then pressed into the metal plates 1 and 2 in an oblique direction inclined with respect to the thickness direction by a stroke in such a range that the metal plates 1 and 2 are not completely cut off. The operating loci of the upper shearing blade 3 and the lower shearing blade 4 are overlapped each other so that one falls inside the other, and the sheared surfaces of the metal plates 1 and 2 are formed into a bonded portion by plastic flow deformation. Therein, since a compressive force is applied onto the portions to be bonded, the portion being defined by the amount of overlap, and the portions are compressed to form a compressed portion after completion of bonding, the bonding strength enhances.

Abstract: A process for promoting fluxless soldering of a mass of bulk solder having a bulk ratio of a first metal to a second metal, such as lead-enriched solder that has significantly more lead than tin. The process comprises exposing the bulk solder to energized ions of a sputtering gas in the presence of a halogen, such as fluorine, and forming a surface layer having a desired surface layer ratio of the first to the second metal that is less than the bulk ratio, the surface layer further comprising an uppermost surface film containing the fluorine or other halogen. After the solder exposure and surface-layer formation, the process may further comprise electrically joining the solder to a surface without using externally-applied flux. This process enables the joining step to be performed at less than 300° C., at approximately 180° C.

Abstract: In soldering together two members such as electronic circuit devices, after an oxide or contaminated layer has been removed from the surface of a solder material or bonding pad, for example, the members are aligned in an oxidizing atmosphere. Then the solder material is heated in a nonoxidizing atmosphere to melt the solder and bond the members. Cleaning of the solder material or bonding pad is performed by sputter-cleaning, laser cleaning, mechanical polishing, or cutting.

Abstract: The invention discloses a method of arranging a plurality of wires of a cable at proper positions for soldering to corresponding terminals of a connector. An arrangement for preparing wires of a cable suitable for subsequent soldering to terminals of an electrical connector has a soldering head including a pair of bases and a pair of heating plates. The base has a plurality of slots for engaging with corresponding flanges of the heating plate. A plurality of equidistantly spaced receiving slots is formed in the heating plates for engaging with the corresponding wires of the cable. Thus, efficiency can be improved during mass production.

Abstract: A method of producing sectional strips and sectional sheets of different thicknesses over the width, in which at least two metal strips or metal sheets of different widths are joined to each other by roll bonded cladding which thins the thickness of the overlaid strips. One strip is wider than the other strip which is narrower. The two strips are arranged symmetrically to the rolling direction center line. The facing surfaces of the two overlaid strips may be prepared for bonding them. The invention also concerns sectional strips or sectional sheets produced by the method.

Abstract: High frequency electrical discharge or nonpolar discharge using microwaves is generated in a gas that is introduced into a gas duct formed by a dielectric material, such as glass or ceramic. Surface treatment is applied to the components, which are under atmospheric pressure, by exposing them to the gas flow containing the active species generated by the above mentioned electrical discharge. Components are soldered before, during, or after the application of this surface treatment. The surface of the components is exposed to the active species by either directly exposing the components to the electrical discharge, or by blasting the reactive gas flow containing the active species at them. By selecting an appropriate gas for generating the active species, it is possible to improve the wettability of the surface of the component to be soldered, or to remove the organic substances or the oxide film.

Abstract: A shaving or shearing blade utilized in dressing solder joint chip technologies without the use of heat or a copper block wicking process. In essence, any solder debris resulting from the solder shaving process as implemented by the shaving blade is removed through the intermediary of a vacuum arrangement located as an integral structure in the shaving blade so as to inhibit the potential formation of electrical shorts or causing solder damage in subsequent replacement chip joins or other assembly operations.

Abstract: A soldering and desoldering device incorporates a vacuum pickup device that assists the user in engaging mounted components for removal or in positioning and installing components. The device comprises a handpiece, a hot air tube extending from one end of the handpiece, and a vacuum pickup tube that extends through the hot air tube and a portion of the handpiece. An adjustment control protrudes from the handpiece and allows a user to control the position of the vacuum pickup tube via a sliding member coupled to the vacuum pickup tube. One or more springs disposed around the vacuum pickup tube are stretched or compressed to absorb excess force applied to the vacuum pickup tube and act to assist a user in mounting or dismounting a component from a substrate.

Abstract: A portable electric soldering tool includes a housing forming a handle and a power head. A heating rod with a main and a secondary heating coil extends from the power head, the rod having an axial bore with a stainless steel lining to prevent solder from building up in the heating rod. A pump draws molten solder through the axial bore of the heating rod. A disposable solder collecting cartridge is removably mounted in the power head to collect solder drawn through the heating rod. The cartridge includes a barrel formed of a heat resistant plastic. Sealing gaskets are disposed at the open ends of the barrel, and a solder accumulator is disposed in the barrel to collect molten solder. The main and secondary heating coils are connected to a power switch. An electric motor for the pump is connected in series with the secondary heating coil. A selector switch energizes alternatively the main heating coil or the secondary heating coil and motor.

Abstract: There are disclosed a surface treatment apparatus and a wire bonding apparatus which are compact in size, have a high processing ability, are simple in construction, and achieve a low cost The surface treatment apparatus includes a base having a transfer path for transferring an object, a lid provided above the base for movement into and out of contact with an upper surface of the base, the lid contacting the base to form a sealed space on the upper surface of the base, an engagement and disengagement mechanism for moving the lid into and out of contact with the base, a transfer mechanism for feeding the object, disposed on the transfer path, into and out of a position beneath the lid when the lid is out of contact with the base, and a treatment portion for surface treating electrodes of the object disposed in the sealed space A wire bonding mechanism is provided at a downstream portion of the transfer path.

Abstract: A method for cleaning and coating a conductor in a plasma reaction chamber utilizing a plasma gas mixture containing Argon and CF.sub.4 to clean and coat a conductor. The method for cleaning and coating a conductor includes the combination of cleaning processes including, physical reduction and chemical reaction and the formation of a polymerization passivation film formed on oxyfluoro metal compositions (SnO.sub.x F.sub.y) which occur during exposure of a conductor to the process of the invention. The polymerization passivation film is formed as a result of the combination of the degraded carbon Tetrafloride (CF.sub.4) gas and degraded environmental and casual hydrocarbons which are present in the form of a variety of unspecified organic contaminants to form crude polymeric molecules in the high energy environment of the plasma.

Abstract: The invention relates to a method for drying fluxing of a metallic surface before soldering or tinning using an alloy, according to which the surface to be fluxed is treated, at a pressure close to atmospheric pressure, with a gaseous treatment atmosphere comprising excited or unstable species and being substantially free of electrically charged species, which is obtained from a primary gas mixture and, optionally, an adjacent gas mixture, the primary gas mixture being obtained at the gas outlet of at least one apparatus for forming excited or unstable gas species, in which an initial gas mixture comprising an inert gas and/or a reducing gas and/or an oxidizing gas has been converted, the adjacent gas mixture not having passed through the apparatus.

Abstract: A novel method of forming low density core metal parts by pressure bonding face sheets to a porous foam metal core and simultaneously densifying the core is disclosed. In particular, low density core aluminum and aluminum alloy parts can be formed according to the method of the invention. The method of forming low density core metal parts generally comprises the steps of providing a porous, foam metal core and simultaneously pressure bonding first and second solid metal face sheets directly to opposite sides of the core and densifying the core by applying heat and uniaxial forge pressure to the first and second face sheets and to the core for a predetermined period of time. The method of the invention can therefore produce LDC parts having a predetermined shape and density. Furthermore, the LDC parts are less subject to interfacial oxidation and delamination than conventional LDC parts made by brazing.

Abstract: A big scale (500 cc) golf club head fabrication method includes the step of preparing molds for making a top cover panel, a bottom cover panel and a face panel, the step of preparing metal alloy plate materials and then cutting the metal alloy plate materials into the desired sizes and then using the molds thus obtained to forge the metal alloy plate materials into the desired top cover panel, bottom panel and face panel respectively, and the step of welding the obtained top cover panel, bottom panel and face panel in a vacuum tank to form a golf club head and then polishing the golf club head into a finished product.

Abstract: This invention is directed to an improved bonded sputter target/backing plate assembly and a method of making these assemblies. The assembly includes a sputter target having side and bottom bonding surfaces bonded within a recess in an underlying backing plate, the recess having top and side bonding surfaces. The method of forming the bonded assembly includes treating the bonding surfaces of either the sputter target or backing plate recess by roughening at least a portion of the bonding surfaces so as to produce a roughened portion having a surface roughness (R.sub.a) of at least about 120 micro-inches. The method further includes orienting the sputter target within the backing plate recess to form one assembly having a parallel interface defined by the top and bottom bonding surfaces and a side interface defined by the side bonding surfaces, subjecting the assembly to a controlled atmosphere, heating the assembly, and pressing the assembly so as to bond the bonding surfaces.

Abstract: The present invention is directed to a self-contained desoldering gun having a built-in vacuum pump. The vacuum pump is operated by a low voltage electric motor which is electrically connected in at least partial series with a heating tip. According to an exemplary embodiment of the invention a full wave bridge rectifier is used to supply power to the vacuum pump motor and a built-in vacuum pump while using a half-wave bridge rectifier to supply power to the heater. In exemplary embodiments, the vacuum pump is provided for drawing molten solder and when a trigger is activated the motor is subsequently energized and the output of the heating tip is increased.

Abstract: A method of bonding a chip element to a wafer-board through at least a solder bump having a surface coated with an oxide layer placed between the chip element and the wafer-board is provided. The method comprises the following steps. The oxide layer coating the surface of the solder bump is exposed to a liquid. An energy is given to the solder bump both for melting the solder bump and for causing at least one of a convection and a cavitation of at least an adjacent part of the liquid to the oxide layer, so as to allow the at least one of the convection and the cavitation to remove the oxide layer from the surface of the solder bump, whereby the solder bump bonds the chip element and the wafer-board.