Abstract: A method of carrying out hot pressure welding of hot steel stock is disclosed, which is effective for achieving a continuous hot rolling line. The hot steel stock to be joined is subjected to butt joining or lap joining in a reducing atmosphere under pressure while under hot conditions.

Abstract: Two articles are provided with mounting surfaces which are to be joined together. A ring shaped preform is selected which consists substantially of indium. The preform is placed on a plate like support means having a plurality of flow through apertures such that the apertures are located to be in alignment with and under at least portions of the preform to permit the passage of cleaning agents through the apertures and around at least selected portions of the preform. A motion limiting means is coupled to the support means so as to serve to limit motion of the preform, bounded by the support means and the motion limiting means. With the motion limiting means in place, the combination of the motion limiting means and the support means can be handled without any contact with the preform.

Abstract: In the process according to the invention for soldering electronic boards, in particular, printed circuit boards with devices installed on them, first, during the pickling process, a condensable process material, for example, water, is introduced into flaws in the oxide layers on the soldering connection surfaces and at least partially condensed in the flaws. Then, the oxide layers are exposed to rapid heating such that the process material condensed in the flaws vaporizes explosively and thus the oxide layer breaks up and cracks off of the basis material, such that the soldering connection surfaces for the subsequent actual soldering process are brought to virgin condition. In the case of wave soldering, the rapid heating occurs preferably by means of the wave of solder itself. If non-oxide passive layers must also be removed, this occurs preferably in a preceding stage of the pickling process, during which the oxide layer is hydrophilized. For this, a plasma pretreatment is suitable.

Abstract: Metallic surfaces are soldered together without using flux or solvents. The metallic surfaces are maintained in an atmosphere of inert gas and cleaned with a laser. An ejection device deposits drops of liquid solder on a predetermined one of the metallic surfaces and the metallic surfaces are moved relative to each other so that the solidified solder contacts the other metallic surface. The metallic surfaces and the solidified solder are then heated until the solidified solder reflows and joins the metallic surfaces.

Abstract: The invention is directed to a procedure for processing joints to be soldered, preferably printed circuit boards fitted with electric components, and an arrangement for executing this procedure, wherein the joints are subjected to plasma treatment before the soldering process. The joints may be subjected to plasma treatment separately or in the relative position necessary for the soldering process.

Abstract: A technique for producing a chip mount type package or a TAB package with high reliability, without use of a flux which would cause environmental pollution or would hinder an enhancement of reliability, more particularly pertains to a method of irradiating bonding surfaces, for which a solder is used, and solder bump electrodes of a package with an atomic or ion energy beam, and bonding the bonding surfaces to each other under normal pressure (about 1 atm) in a continuous apparatus.

Abstract: A method is provided for soldering using tin-containing solder to substrate surfaces that are gold plated wherein a selected portion of the gold plated surface is treated by impacting with a high velocity stream of fine nickel containing abrasive particles to remove all the gold from the treated surface and then effecting joining to the treated surface by conventional soldering techniques.

Abstract: A multi-walled steel pipe comprises a metal strip plated with copper and including a brazing layer thereon. At least one surface of the metal strip is roughened and braze welded to the other, overlapping surface when the metal strip is rolled. The roughened surface has a roughness in the range of between 10 and 30.mu.m. A method of making a multi-walled steel pipe comprises roughening at least one surface of a metal strip, the metal strip being previously plated with copper and including a brazing layer thereon, rolling the metal strip a plurality of times by a pipe forming machine to provide a pipe body with the roughened surface directed toward the other overlapping surface, while the metal strip being fed between a plurality of sets of rollers in the pipe forming machine, and heating the pipe body to a melting temperature of the brazing layer in a furnace so as to braze weld the overlapping surfaces of the metal strip together.

Abstract: The present invention relates to a wire bonding method and a wire bonding apparatus employing a coated wire in which the surface of the metal wire is coated with an insulator, and a semiconductor device produced by the bonding method. The present invention includes forming a metal ball on the front end of the coated wire, e.g., by arc discharge; joining the metal ball to an external terminal of a semiconductor chip; bringing the rear end of the coated wire into contact with an external lead and destroying the insulator coating where the coated wire contacts the lead; and joining the metal wire at the rear end of the coated wire to the lead. The metal wire is connected to a common ground with the bonding device, during the arc discharge, and the wire is positive relative to the discharge electrode. Moreover, the melting and shrinking insulator of the coated wire is blown away, and insulator globes can be prevented from being formed in the coated wire, so that bonding defects are avoidable.

Abstract: Aluminum-based sheets or parts, such as formed aluminum assemblies contaminated with forming die lubricants, are cleaned by a solventless, thermal degreasing process at controlled temperature (about 300.degree.-400.degree. F.), and in specified atmospheres (reactive gas which is at least at atmospheric pressure) prior to brazing. The organic contaminates on the aluminum-based sheet or part are reacted with the reactive gas (air or oxygen) and removed from the surface of the sheet or part without disruption of the underlying protective oxide layer. Subsequent brazing is thereby facilitated.

Abstract: A process for joining the surface of one preferably metallic member to another at a joint, and using solder to create the joint at a joining temperature, includes applying a medium to the joint which evaporates by microexplosion at below the joining temperature. The microexplosive evaporation of the medium advantageously cleans the surfaces of the members and reduces surface tension to allow solder to flow and wet the surfaces. The medium is advantageously glycerin or a mixture of glycerin and detergent so that no residue remains after the joining operation.

Abstract: A process for assembling parts of a lightweight structure of aluminum having a multitude of joints. The process includes the following steps:(1) cleaning surfaces of all the parts;(2) selectively depositing on the surfaces a layer of nickel and then tin;(3) selectively plating on the tin layer where joints occur a lead/tin eutectic alloy solder;(4) add flux;(5) fixturing the parts together to form the structure;(6) heating the structure in a vapor phase apparatus;(7) removing the structure from the fixture; and(8) cleaning the structure.By using the above process an antenna faceplate having over 3000 joints was soldered.

Abstract: A method of fabricating 18% Ni maraging steel laminates of varying alloy compositions by roll bonding. Laminates composed of a plurality of different grades of Cobalt-containing or Cobalt-free maraging steels are disclosed.

Abstract: A method is disclosed for creating a strong point for the attachment of carbon composites to metallic bodies that is suitable at high temperatures (1600.degree. F.) as well as ambient temperatures. A pocket of suitable dimensions and depth is molded into the carbon composite structure on both sides at an edge, with the edge relieved and rounded. A hole for a fastening member is molded or drilled in the approximate center of the pocket. After preparation of the surface the pocket, through hole, and relieved edge are nickel-plated to produce a rigid strong point. A doubler can be brazed to the nickel plate to strengthen the bond. The disclosed method can be used for attaching any type of electrically conductive composite material to a metallic structure.

Abstract: Metals to be bonded are drawn from pay-off reels and passed around holding rollers which are grounded cathodes, each roller being partially exposed in an etching chamber having an anode area at least three times the exposed area of the cathode. Each chamber has an inert gas at from 10.sup.-4 to 10.sup.-1 Torr and is subjected to RF power with a frequency from 1 to 50 MHz, which by a magnetic field produced by fixed magnets in the holding roller produces a glow discharge plasma which etches the metal in the chamber. Etched surfaces of the strips are then rolled together in a vacuum of from 10.sup.-6 to 10.sup.-3 Torr and a temperature to 300.degree. C. at a rolling pressure sufficient to effect a thickness reduction from 0.1 to 30%.

Abstract: An ultrasonic transducer and its method of fabrication wherein bonding between an impedance matching layer on one side of a piezoelectric layer and a support layer on the other side of the piezoelectric material is made by providing onto each material a smooth, thin gold film on the smooth surfaces of the layers which are to be in contact with one another in the assembled transducer. The layers are bonded to each other by the gold films under moderate temperature and pressure to form the transducer. Sawing of the impedance matching and piezoelectric layers into a plurality of parallel transducers attached to the support layer forms an array.

Abstract: A tightly bonded abrasion resistant surface layer is formed on, or a binding layer is formed therebetween, reactive metal or metal alloy substrates. A powdered mixture of oxides, at least one of the oxides having a heat of oxidation lower than the heat of oxidation of the oxide of the substrate, is disposed on the substrate. The substrate with the oxide powder disposed thereon is heated to a temperature lower than the melting point or solidus temperature of the substrate. The powdered mixture of oxides preferably comprises fly ash. An abrasion resistant surface layer may be bonded to a structural part by mixing the powdered mixture of oxides with powdered reactive metal or reactive metal alloy, disposing the resultant mixture on the part, and heating.

Abstract: A method is disclosed for joining two semiconductor devices 10 and 10', each having a plurality of metallic contact bumps 12 and 12' on the major surfaces 14 and 14' thereof. The devices are etched to remove oxide 18 from the contact bumps and to prevent subsequent oxidation thereon. The devices are then oriented so that the bumps 12 and 12' on the respective devices are aligned opposite each other. By applying pressure to the devices, the bumps are caused to cold-weld together to form a single device 24.

Abstract: A method for replacing a damaged or defective section of a length of original piping or tubing located within a structrue such as the turbine of a jet engine wherein access to the tubing is limited, and replacing such damaged section with a new section of tubing comprises inserting a cutter mounted at one end of a flexible shaft into the interior of the original tubing and rotating the shaft to cut out and remove the damaged section of tubing leaving at least one stub section of original tubing. The stub sections of original tubing are then prepared for welding or brazing to a section of replacement tubing with a series of tools each mounted to an elongated shaft. These tools include a chamfering tool, a deburring tool, and a polishing tool.

Abstract: This invention relates to an improved process for application of a metal-comprising coating to a metal-comprising surface without using a flux. The metal-comprising surface must be wettable by or become wettable upon contact with a bath of the metal-comprising coating. Application of the coating is carried out in an environment which is inert at least with respect to the coating material during the time period of its application to the metal-comprising surface, and preferably inert with respect to both the coating material and the metal-comprising surface. The inert environment temperature is sufficiently low that no damage is done to the metal-comprising surface and no damage is done to other materials adjacent to the metal-comprising surface.

Abstract: Diffusion bonding of surface layers of an alloy, such as an aluminum alloy, having surface oxides of low solubility in the alloy includes treating the surface layers to be bonded to remove existing surface oxide coatings, and diffusion bonding the surface layers to one another by placing the alloy to be bonded under sufficient pressure to cause disruption of the oxide coatings by localized surface deformation of the alloy, enhanced by a superplastic microstructure, without substantial deformation of the alloy, i.e., macroscopic deformation approaching zero percent, while heating the alloy in a non-oxidizing atmosphere for a time sufficient for diffusion bonding to occur. The alloy may be treated so that at least the surface layers thereof have a fine grain structure of the type associated with superplastic forming properties. Components may be formed by diffusion bonding and superplastic forming.

Abstract: A method for the assembly and connection of bodies, massive parts or powder grains, of alloys comprising at least 50% of nickel, cobalt or iron, comprises a preliminary operation of deposition at the interface of the said bodies of a product of the type MBF.sub.x, x being equal to 3 or 4, M designating a radical of the type NH.sub.4 giving off when hot a gaseous component such as NH.sub.3 or a metallic element and a sequence of treatment of cleaning/activation by passage of the coated body at a temperature in excess of the temperature of sublimation of the said product.

Abstract: A rotary wire brush is used to transfer nickel, copper or brazing filler metal, like gold and silver from a slab of metal to the surface of a workpiece. The brush cleans the metal workpiece to expose a metal surface freshly and rubs metal of the metal slab for quick transfer for the freshly exposed metal surface of the workpiece where it sticks to build up a layer between one and one hundred microns thick in somewhere between one and two minutes. Metal slab and workpiece are both pressed against the brush, but the workpiece is not pressed enough to score the workpiece. The surface of the workpiece coated in this way can then be joined to another workpiece surface thus coated in a fluxless brazing or soldering process in which the temperature does not need to be higher than 1000.degree. C.

Abstract: A process is disclosed for applying an electrical contact to the surface of a semiconductor device. A layer of metal selected from metals such as nickel, silver, copper, or alloys of these metals contacts a selected surface region of the device. A metallic contact is then soldered or otherwise joined to the layer of metal. To facilitate the joining, any native oxide present on the surface of the metal layer is first reduced by the low energy implantation of hydrogen ions into the metal surface.

Abstract: A pair of soft-metal blocks are placed side by side constrainingly on a stationary platen with a space therebetween such that the opposing flank surfaces of the blocks confront each other. Into the space is pressed downward by a movable platen a hard-metal block which has opposing flank surfaces having sharp edges at the lower ends thereof, respectively, the opposing flank surfaces also tapering correspondingly. As the hard-metal block is moved forcibly into the space, the edges operate to pare or peel respective surface layers of the opposing flank surfaces of the soft-metal blocks thereby to create respective fresh surfaces of the soft-metal blocks. The opposing flank surfaces of the hard-metal block are therefore pressed strongly against the fresh surfaces, respectively, as the hard-metal block advances, and strong diffusion welded joints are produced. The method is carried out at elevated temperature.

Abstract: In a method of producing heavy plate of steel, a prematerial is hot-rolled in several passes. As the prematerial at least two slabs of the same steel quality are superposed so as to form a pack and are welded by roll-bonding and reduced in thickness.

Abstract: A method for bonding an aluminum wire to a minute pad of an electronic circuit by an ultrasonic bonding technique. An anodized aluminum wire having its surface subjected to insulating coating is used. The bonding is effected such that this anodized aluminum wire is pressed against the pad by means of a wedge and, while a load is being thereby applied to the wire, ultrasonic vibrations are caused in the wedge. The alumite is exfoliated from the base material by application of the load and ultrasonic energy to the wire, and this base material and pad are bonded together at this exfoliated portion.

Abstract: A method for matching the bonding pad surfaces of a device and heatsinks to be bonded, which method maximizes the uniformity of pressure applied during thermocompression bonding, is disclosed. The method comprises using the collet of a die bonding machine to burnish the bonding pad on a heatsink. The collet is then traversed to a second workstage where the collet is used to pick up a device and burnish the device bonding pad against a suitable burnishing medium. The collet, with the device, is then traversed back to the main workstage where thermocompression bonding of the device to the heatsink is carried out. The alignment of the collet is locked and maintained throughout all of the steps to insure that all burnished surfaces are parallel and that the pressure during bonding is perfectly perpendicular to those parallel surfaces.

Abstract: A method for fabricating superplastically formed/diffusion bonded structures wherein metal blanks of aluminum or an aluminum alloy having an oxide surface layer are joined at selected areas by diffusion bonding and expanded superplastically to form a desired sandwich or integrally stiffened structure. According to such method, a suitable mask is applied to selected areas of the aluminum or aluminum alloy blanks. The assembly is then placed in a vacuum chamber and at a suitable low pressure and suitable voltage a glow discharge is created between the metal blank or blanks functioning as cathode or sputtering target, and an anode to selectively remove the oxide from the metal blanks and deposit the oxide debris on the anode.

Abstract: The method comprises applying a braze material to a sleeve in a manner so that the sleeve may be attached to a tube so as to bridge the defective region of the tube. The sleeve is constructed to have a groove on the outside surface thereof that extends around the entire circumference. The groove is filled with braze material and a flux is applied to the braze material in a manner to prevent the braze material and flux from becoming removed. Once such a sleeve has been inserted into the defective tube, the sleeve is internally expanded in the area of the sleeve wherein the groove is located. The expansion of the sleeve in the area wherein the groove is located causes the braze material to closely contact the inside surface of the tube. The other end of the sleeve can then be either similarly placed in contact with the tube or welded to the tube. Next, the area of the tube wherein the braze material is located is internally heated so as to create a brazed joint between the sleeve and the tube.

Abstract: Process for locating solder on a precalculated position on an electrical terminal. Metal strip stock coated with a thin layer of solder is fed through a strip guide for precisely positioning the metal strip stock between a pair of rollers. A solder wire is cold bonded to the metal strip stock and the strip stock is subsequently stamped into a terminal.

Abstract: A method for fluxlessly joining members having relatively low melting materials is provided. The members to be joined are exposed to ion beam radiation of sufficient intensity and a time sufficient to cause cleaning of the low melting materials after cooling. The members are then placed into juxtaposition with each other and again exposed to ion beam radiation of an intensity and for a time sufficient to cause reflow of the low melting materials which upon cooling joins said members.

Abstract: A method for soldering aluminum or aluminum alloys is disclosed, together with an alloy useful in the method. The method includes heating, for example by using a torch, at least one aluminum piece to a temperature within the range of 90-150 degrees celsius, cleaning at least one heated surface thereof, for example by wire brushing, further heating the cleaned piece to a temperature within the range of 350-490 degrees celsius, and applying, for example by rub soldering, to the cleaned and further-heated piece a quantity sufficient to enable subsequent soldering, as required, of a tin/lead/zinc alloy consisting essentially of, by weight, from 1.7 to 2.2 percent aluminum, from 0.01 to 0.02 percent magnesium, from 45.9 to 50.4 percent zinc, from 14.2 to 34 percent tin, and from 16.6 to 36.7 percent lead.

Abstract: A method which utilizes thermo-compression diffusion bonding to attach a metal foil to structured copper. The different rate of expansion of metal press members with temperature creates a force which squeezes the foil and copper together to achieve a bond when the press and the parts to be joined are heated to an elevated temperature. Because of the high pressure achieved by the press, diffusion bonding occurs at a low enough temperature to avoid problems associated with use of the liquid phase of any of the metals undergoing bonding.

Abstract: A method for cold welding metal joints. In order to remove the contamination layer on the surface of the metal, an ion beam generator is used in a vacuum environment. A gas, such as xenon or argon, is ionized and accelerated toward the metal surface. The beam of gas effectively sputters away the surface oxides and contamination layer so that clean underlying metal is exposed in the area to be welded. The use of this method allows cold welding with minimal deformation. Both similar and dissimilar metals can be cold welded with this method.

Abstract: This invention relates to a method of manufacturing an article having a press-worked member inwardly of a cylindrical member, which comprises a first step for removing stain and oxidation film on the inner surface of a cylindrical member and on the peripheral side surface of a blank, a second step for arranging the blank inwardly of the cylindrical member so that the purified side surface of the blank may be faced toward the purified internal surface of the cylindrical member, a third step for subjecting the blank to a cold press-working inside the cylindrical member to thereby closely combine the blank with the cylindrical member, a fourth step for further subjecting the cold-worked blank to a hot press-working inside the cylindrical member to thereby form the blank into a desired shape within the cylindrical member, and a fifth step for annealing the combined members at a temperature for diffusion to thereby join the blank with the cylindrical member by diffusion.

Abstract: A method of welding together two members placed with the edge surfaces to be joined in mutually facing relationship and separated by a weld gap. A weld material is endothermically heated to a molten state and flowed through the weld gap for heating the members to cause melting of the edge surfaces with the weld metal flow being continued for a time sufficient to provide a ratio of weld gap metal to total metal flowed of at least 1:50, and then the flow is terminated to provide for weld solidification.

Abstract: A method of affixing surface enlarging, transversally corrugated metal strips to elongate metal basic profiles which are advanced in the direction of their longitudinal axes while simultaneously being joined by a joining compound to the wave crests on one side of the corrugated metal strips.

Abstract: A method is described for joining first and second surfaces by depositing a layer of metal on the first surface, preparing the second surface to expose fresh metal, placing the deposited metal and the exposed metal in contact, and applying sufficient pressure to join the surfaces, all done in a protective environment, such as vacuum. Also described is a related apparatus comprising an evacuable chamber, an electron-beam heated vapor source, and a pair of rollers for contacting and applying pressure to join the surfaces.

Abstract: An improved method for brazing aluminum and alloys of aluminum in which at least one of the surfaces to be joined is coated with a controlled quantity of metallic manganese which is effective during the high temperature vacuum brazing operation to promote a wetting and flow of the brazing filler metal between the surfaces to be joined and a penetration of the tenacious aluminum oxide film thereon, thereby producing a substantially uniform and high strength bond.

Abstract: An automotive alternator rectifier bridge comprising a pair of generally flat heat-conducting laminated bases each having a central layer of aluminum with layers of copper bonded to the opposite surfaces thereof. A plurality of first diodes have their cathodes solder-connected to one surface of one of the bases. The anodes of a plurality of second diodes are solder-connected to one surface of the other of these bases. Each diode is constituted by a discrete semiconductor chip having a metallic layer in ohmic contact with one face thereof and each diode is secured to one of the bases by having its metallic layer soldered to the laminated base. Electrical conductors are solder-connected to the anodes of the first diodes and to the cathodes of said second diodes and extend generally parallel to the bases for connection to automotive alternator terminals. Methods of fabricating these bridges are also described.