Abstract: A shaving or shearing blade utilized in dressing solder joint chip technologies without the use of heat or a copper block wicking process. In essence, any solder debris resulting from the solder shaving process as implemented by the shaving blade is removed through the intermediary of a vacuum arrangement located as an integral structure in the shaving blade so as to inhibit the potential formation of electrical shorts or causing solder damage in subsequent replacement chip joins or other assembly operations.

Abstract: The inventive mechanism conducts heat through the leads of the connector to the solder connection points, and simultaneously reflows all of the solder on all of the pads. The inventive mechanism comprises a machined aluminum piece that mimics the mating geometry for the connector and couples to the connector as if it were a chip device. The inventive mechanism couples to the connector via heat conducting fins. Heat is transferred to the aluminum piece, and down through the fins and into the internal portion of the connector. The fins contact the internal portion of the connector leads. Thus, heat is transferred from the internal portion of the leads to the exterior portion of the leads, and down to the soldered connection point with the PCB board. Since the fins contact all of the internal leads of the connector, each of the soldered connections is reflowed at approximately the same time, and thus, the connector is then removed from the board.

Abstract: The invention relates to a method for dry cleaning or dry fluxing metallic surfaces before, during, or after a reflow soldering operation. The metallic surfaces that are dry cleaned or dry fluxed include (1) the metallic substrate on which an at least partially metallic, electronic component is to be mounted, (2) the solder paste, and (3) the metallic portions of the electronic component. The method comprises treating the metallic surface with a gaseous treatment atmosphere comprising unstable or excited gaseous species, and is substantially free of electrically charged species.

Abstract: Copper-containing surfaces of substrates such as laminated electronic circuit boards are protected by organometallic coatings comprising organic compounds selected from the group consisting of benzimidazoles, alkylimidazoles, benzotriazozles and alkyltriazoles, substituted or unsubstituted, and metal particles of solder-wettable metals or metal solders. The metal particles can be thermally formed in situ from metallic compounds such as noble metal acetates, acetylacetonates and carbonates.

Abstract: Method is for welding billets leaving a heating furnace in a rolling line, the line including, in the segment (10) between the heating furnace (11) and the first rolling stand, at least a drawing unit (14), a rollerway to transport the billets, a movable welding assembly (20) with welding jaws (31) and an emergency shears (13). The trailing end of the billet (12a) being rolled is welded to the leading end of the billet (12b) unloaded afterwards from the furnace (11) while the billets (12) are in movement by a welding assembly (20) mounted on a movable trolley (19). The movable trolley (19) is taken substantially to the rolling speed, grips the billets (12) with the jaws (31) of the welding unit (20) and welds the ends of the billets (12).

Abstract: The invention relates to a method for mechanically removing solder beads (14) from the surface of printed circuit boards (10) directly after they pass through the solder flow during flow soldering of printed circuit boards in a soldering plant. In order to ensure that the solder beads are mechanically removed without damaging the printed circuit boards, the solder beads (14) are mechanically removed by means of at least one jet (50) of cold gas directed onto the surface.

Abstract: A surface metal plate 2 made of aluminium or aluminium alloy is overlayed upon a backing metal plate 1 and integrally bonded by cold rolling bonding of a rolling machine 30. After that, the thus obtained composite metal plate 3 is annealed, so that the bonding strength between a surface metal layer 1a having a thickness of 2 to 8 mm and a backing metal layer 2a is enhanced.

Abstract: A portable electric soldering tool includes a housing forming a handle and a power head. A heating rod extends from the power head, the rod having an axial bore with a stainless steel lining to prevent solder from building up in the heating rod. A heating coil heats the heating rod. The heating rod directs melted solder into an extraction tube in which a curved wafer is disposed to collect the solder. A diaphragm pump is mounted in the power head and has an oblong piston head, which is mounted with the long axis aligned on a longitudinal axis of the tool, which facilitates a more compact unit.

Abstract: In a process for applying a metallic adhesion layer for thermally sprayed ceramic thermal barrier coatings to metallic components, the surface which is to be coated being cleaned in a first process step, so that the metallic surface is free of grease and oxide, a binder is applied to the metallic surface of the base material in a second process step. Metallic adhesive powder is applied uniformly to the binder in a third process step and solder powder, which has a smaller particle size than the adhesive powder, is applied uniformly to the binder in a fourth process step. After drying the binder, a heat treatment is carried out for the purpose of soldering. The adhesion layers produced in this way are rough and provide a considerable positive lock for the ceramic thermal barrier coatings which are to be sprayed thereon.

Abstract: A soldering/desoldering apparatus has a handpiece with a handgrip portion from which a hot air tube extends, a vacuum pickup tube which extends through the handgrip portion and hot air tube, one end of which has a suction cup mounted thereon and an opposite end of which is connected to a flexible vacuum line. Furthermore, an adjustment knob for axially shifting the vacuum pickup tube is provided on the handgrip portion and the vacuum pickup tube is resiliently displaceably supported relative to a displacement mechanism formed by a slide rod fixed to an inner wall of the handgrip portion and a rack member slidably disposed on the slide rod and geared to the adjustment knob. The pickup tube is fixed to a slide bracket which is slidably disposed on the slide rod between the ends of the rack member and between a pair of coil springs which act to position the slide bracket in a neutral position between the ends of the rack member. Additionally, nozzles having a fixed vacuum pickup extension can be used.

Abstract: In soldering together two members such as electronic circuit devices, after an oxide or contaminated layer has been removed from the surface of a solder material or bonding pad, for example, the members are aligned in an oxidizing atmosphere. Then the solder material is heated in a nonoxidizing atmosphere to melt the solder and bond the members. Cleaning of the solder material or bonding pad is performed by sputter-cleaning, laser cleaning, mechanical polishing, or cutting.

Abstract: The present invention is directed to a self-contained desoldering gun having a built-in vacuum pump. The vacuum pump is operated by a low voltage electric motor which is electrically connected in at least partial series with a heating tip. The heating tip reduces the voltage in the circuit and reduces the size of the motor required to operate the pump. In exemplary embodiments, a portion of the heating tip which is not in partial series with the motor is electrically connected in parallel with the motor. In alternate embodiments, the heating tip can include separately formed first and second heating elements, the first heating element being connected in parallel with the motor and the second heating element being connected in series with the motor. Such a configuration allows the second heating element to be energized only when the motor of the vacuum pump is energized.

Abstract: This invention is directed to an improved method for making a bonded sputter target/backing plate assembly as well as assemblies produced therefrom. The assembly includes a sputter target having a bonding surface which is bonded to the bonding surface of an underlying backing plate. The method of forming the bonded assembly includes treating one of the bonding surfaces, either by roughening at least a portion of one of the bonding surfaces so as to produce a roughened portion having a surface roughness (R.sub.a) of at least about 120 micro inches, or by drilling a plurality of holes in one of the bonding surfaces. The method further includes orienting the sputter target and backing plate to form an assembly having an interface defined by the bonding surfaces, subjecting the assembly to a controlled atmosphere, heating the assembly, and pressing the assembly so as to bond the bonding surfaces.

Abstract: A method for cleaning a bonding tool of a bonding apparatus includes a step of positioning a tip portion of the bonding tool between a pair of discharge electrodes, which are primarily used for removing a covering that covers a bonding wire, and a step of causing an electrical discharge across the discharge electrodes by applying a high voltage, such as of 3500 V, by connecting the discharge electrodes to positive and negative poles of a discharge power source, respectively. The electrical discharge is performed with the bonding wire kept inside the bonding tool so as not to project out of the bonding tool or after the bonding wire is removed from the bonding tool.

Abstract: A sputtering target assembly is fabricated by diffusion bonding a target material plate to a backing plate. The plates are cleaned in a vacuum environment, and an interlayer is formed on one or more of the plates. The plates are then joined under heat and pressure, before an oxide layer can form on the joining surfaces of the plates. The plates may be sequentially processed through cleaning, interlayer deposition, and bonding chambers, all with vacuum environments, to form the finished part, or, a single chamber may be used to provide the cleaning, interlayer deposition and bonding functions.

Abstract: A method of solder bonding suitable for a body having a large bonding surface area including the following steps of cleaning off the bonding surfaces in vacuum chamber by impinging accelerated particles such as argon ions through reverse spattering; then covering with an oxidation inhibiting thin silver film over the cleaned off bonding surfaces through spattering; further sandwiching a cleaned off solder foil between the bonding surfaces covered with the oxidation inhibiting thin sliver film; and heating the solder foil in vacuum upto the melting temperature thereof to complete the bonding, whereby defects in the solder bonding is reduced downto about 1/25 and life time of the solder bonding which is affected by thermal fatigue is prolonged twice in comparison with a conventional solder bonding method, thereby reliability of the solder bonding is greatly improved.

Abstract: A method for preparing a Ni base superalloy inner wall surface of a body open end, such as an end of a turbomachinery blade, and an end plate, such as a blade tip cap, for brazing together at a rim of the end plate includes electrochemically removing oxides from the inner wall surface. The end plate is prepared, at least at its rim, by first removing surface and subsurface oxides, for example by mechanical abrading or a combination of such abrading and acid cleaning. Then at least the rim is electroplated with Ni which is heated to diffuse the Ni into the rim substrate. This provides an improved combination of surfaces for brazing for example with a Ni base brazing alloy. After brazing the rim to the inner wall, there is provided an article with an improved relatively low oxide brazed joint, including less than about 20 volume % oxides, and a plate rim of substantially Ni along with elements diffused from the brazing alloy and the rim.

Abstract: A soldering method, which secures reliable joints without using flux, is disclosed. Soldering is performed using an auxiliary connecting material capable of physically destroying and dispersing an oxide film, which is naturally grown on the surface of a main connecting material such as solder or brazing between two terminals, to realize a reliable solder wetting (a state of the main connecting material being fused and mixed). For an auxiliary connecting material, hydrocarbon such as n-tetradecane (C.sub.14 H.sub.30), for example, can be used. N-tetradecane boils between connection surfaces and cubically expands; energy generated therefrom physically disperses the oxide film and causes a fresh surface to be exposed; solders on both terminals are mixed; and an electrical and mechanical joint is securely achieved. The residue of the auxiliary connecting material is an insulating material, and therefore does not need cleaning.

Abstract: A process is provided for manufacturing and repairing components, and particularly superalloy components such as gas turbine engine components. The invention entails forming precipitates in a surface of the article that has been cold worked as a result of surface machining, cleaning, handling, etc. The precipitates serve to prevent recrystallization and formation of a secondary reaction zone in the cold worked surface of the superalloy when subsequently exposed to temperatures approaching the solution temperature of the superalloy, such that the microstructure and mechanical properties of the superalloy article are preserved.

Abstract: A control circuit for a vacuum desoldering apparatus includes a timing mechanism to ensure that vacuum is maintained for a necessary minimum amount of time, even if a vacuum actuation switch of the desoldering tool is prematurely deactivated by the operator. If the operator presses the vacuum actuator switch for a period of time longer than the predetermined minimum time, vacuum will flow until the switch is released. However, if the operator actuates the switch very briefly, that is, for less than the predetermined minimum vacuum actuation time, the vacuum supply is maintained in an activated state for the predetermined minimum time.

Abstract: An induction heating module encapsulation apparatus and method for its use is disclosed. The apparatus comprises a substantially airtight chamber which is composed of ceramic or some other high temperature insulating material in which a cap and a ceramic substrate having semiconductor chips joined thereon are placed. A sealband of solder or other brazing material is placed at the periphery of the cap where the cap and substrate are to be joined. An RF coil, which serves as inductor in the apparatus, the energized by a high frequency generator, generating an electromagnetic field in the radio frequency spectrum. The RF coil is oriented to localize the inducted current at the periphery of the cap and the sealband. The inducted current is dissipated in the form of heat until the sealband is molten. The RF power is then turned off.

Abstract: A method is disclosed for improving the metallurgical bond between the end of an armature wire of an electric motor and the connector riser or tine on the motor armature. The armature wire has a titanium oxide-containing insulation coating. The titanium oxide content improves the resistance of the wire to erosive forces which occur during the winding operation but it also tends to interfere with the metallurgical bond between the wire and the riser or tine. The disclosed method involves the roughening of the surface of the riser or tine at least to a depth equal to the thickness of the insulation. Grit or vapor blasting with silica glass beads as well as other roughening techniques are disclosed.

Abstract: A self contained desoldering gun (10) with a built in vacuum pump (40). Vacuum pump (40) is operated by a low voltage DC electric motor (50) which is connected electrically in series with heating tip (20). Heating tip (20) reduces the voltage in the circuit and reduces the size of the motor required to operate pump (40). A second heating element may be used when motor (50) is energized.

Abstract: A safe soldering device includes a retractable heat shield which can be moved between a first position in which the solder tip of the device is exposed for soldering operation and a second position in which the solder tip is covered by the heat shield. Preferably, the heat shield is biased towards the second position and may be locked in the first position for ease of use. When the soldering device is equipped with a vacuum system, the heat shield may serve to guide the flow of gases and heat from the solder tip away from the work area. The heat shield is preferably made of non-heatsinking plastic.

Abstract: In order to remove oxide film and contamination film on members to be bonded by soldering and solder material therefor corresponding to variation of thickness thereof by sputter-etching in a fluxless bonding method and apparatus therefor, substance emitted from the solder material under sputter-etching using atom or ion is detected and determined whether it is from the solder material or from the oxide film thereon. The sputter-etching is controlled on the basis of the determination to remove the oxide film. Then, the members are aligned in oxidizing atmosphere and soldered in non-oxidizing atmosphere.

Abstract: An improved method for forming fluid inflatable metal structures is taught. The improvement concerns the patterning of the portion of the structure to be inflated. Patterning is accomplished by first applying a strippable flexible mask coating and then scoring this coating so that a patterned portion may be removed therefrom. The parent portion is the portion of the sheet article to be inflated by subsequent processing. After the patterned portion has been removed, a stop-off is applied to the exposed surface of the first sheet. After the stop-off material has been applied, the remainder of the strippable mask is removed and washed with a detergent to remove the residue from the mask. The sheet having stop-off applied in the pattern to the first sheet is then superposed over a second sheet, and heat and pressure are applied to cause diffusion bonding between the exposed surfaces of the two sheets.

Abstract: A process of joining metal members, comprising the steps of: providing a first group of a plurality of metal members, each member having a solder bead formed thereon; providing a second group of a plurality of metal members, each member having a solder bead formed thereon; abutting the first group of metal members against the second group of metal members by direct contact between the solder beads; applying an ultrasonic vibration through the metal members to the solder beads in contact; and subsequently heating the beads to cause the solder beads to be bonded together.

Abstract: A method of hot pressure welding of hot steel stock, in which the ends of the steel stock are descaled mechanically and pressure joined under a reducing flame. Since re-oxidation after descaling is prevented and the feasible temperature for hot pressure joining is maintained by the reducing flame, the joining is accomplished firmly and strong joints are obtained.

Abstract: A method for applying brazing material to a metal structure includes applying a sticky material maintaining adhesiveness up to temperatures of at least 180.degree. C. and preferably above 200.degree. C., to at least a subregion of the structure. Then brazing powder is applied which continues to adhere to the sticky material. After the application of the brazing powder but before an actual brazing process, the structure is heat treated without the brazing powder falling out during the heat treatment or during ensuing handling steps. The heat treatment may be a heat-degreasing of the structural parts that do not have or do not yet have brazing material applied to them.

Abstract: Oxide films, and residues of organic matters, carbons, if any, are removed from a metal surface simply without using complicated steps and without giving adverse effects on electronic parts or electronic devices by irradiating the metal surface with a laser beam of lower energy level than energy capable of changing the metal surface structure, thereby cleaning the metal surface.

Abstract: A flux-free method for bonding a member which is at least partially metallic to another member is provided including preserving the at least partially metallic member in a container having a low gas permeability, together with a packet containing a rust-proof composition; and bonding the at least partially metallic member with the other member by using a filler material.

Abstract: The invention relates to a method for soldering electronic components to printed circuit boards or other elements to be connected by soldering, as well as suitable continuous soldering systems. The use of electronic modules, designed in the form of printed circuit boards populated with pluggable, mountable, or surface-mountable electronic components (Surface Mounted Devices, SMDs), which must be then soldered, is growing steadily. To manufacture these modules, suitably prepared printed circuit boards are populated with the corresponding components, the latter are held in place possibly with an adhesive or soldering paste in preparation for the soldering process, and finally the printed circuit boards and the components are connected together permanently and conductively by a soldering process. This soldering process is performed under low pressure and under the plasma action of a special process gas.

Abstract: System and method for evaporating moisture from a gap defined between a heat transfer tube surrounding a repair sleeve in a nuclear steam generator. The nuclear steam generator has a heat transfer tube surrounding a repair sleeve that has been hydraulically expanded into engagement with the tube. The tube and the sleeve define a gap therebetween having moisture residing therein. The system includes an air compressor in communication with the gap for supplying air to the gap and a dryer in communication with the air compressor for drying the gas supplied to the gap. A heater in communication with the air compressor may also be provided for heating the air supplied to the gap, so that the moisture residing in the gap evaporates into the heated air. A vacuum pump in communication with the gap may be provided for decreasing the pressure of the heated air in the gap, so that substantially all the moisture evaporates from the gap and into the heated air.

Abstract: An electric soldering iron is disclosed in which a gas such as compressed air is electrically heated and then forced through a metallic soldering tip which is deeply slotted or finned for maximum heat transfer thereto. Soldering is then accomplished by applying the thusly heated tip to the workpiece. The slots may be formed to exhaust the hot gas forwardly over the tip to add heat to the workpiece and control the gaseous environment thereof; or the slots may be formed to exhaust the hot gas laterally or rearwardly to help in removing pollutants from the operator's environment.

Abstract: A method for preparing a machined surface of a composite article for diffusion bonding is provided. The method includes removing most of the exposed fibers by shot peening followed by acid etching. The acid etch may be followed by grit blasting and then another acid etch. After the method is applied to the surface, the article can be diffusion bonded to other composite article to form complex shapes.

Abstract: A system for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs.

Abstract: An apparatus comprises a current source, first and second wheels through which a current from the current source selectively flows, and a source of gas, wherein the first and second wheels receive first and second pieces of metal having overlapping portions, force the first and second pieces of metal together at said overlapping portions. The current from the current source flows through the first and second wheels in the overlapping portions of the first and second pieces of metal, generating heat in said first and second pieces of metal sufficient to melt a coating on the first and second sheets of metal where the first and second sheets of metal contact and overlap. The source of gas comprises removes said melted coatings away from the overlapping portions of metal to clean the metal surfaces in preparation for movement to a weld station where the pieces of metal are resistive seam welded or laser lap seam welded.

Abstract: A solder-desolder system includes a hand held tool having an electrically heated soldering tip which is a hollow tube through which molten solder may be removed from the workpiece by a steady inward flow of air or by a strong impulse, vacuum stroke. Also supplied to the workpiece is a flow of solder melting hot gas which may be inert for improved soldering performance. The hot gas is directed over the heated soldering tube and may independently melt the solder or it may be utilized to preheat the work. In any event, the system provides in a compact hand held soldering tool a jet of hot air within which is a hot soldering tube tip within which a vacuum flow removes molten solder from the workpiece.A further aspect of the solder-desolder system is a trigger in the handle of the tool which selectively connects the hollow tube to an ambient air driven venturi to provide the vacuum stroke.

Abstract: A vacuum actuated solder sucker device having a body chamber in which a vacuum is created by a vacuum source attached thereto and a cover chamber separated from the body chamber by a piston. The piston drives a primary air valve which controls the passage of air through a passageway between the body chamber and a nozzle. In a first position the primary air valve permits the application of the vacuum to the nozzle portion, and in a second position the primary air valve permits the vacuum to be reestablished within the body chamber. The primary air valve is actuated by pressure differential across the piston which is controlled by a user who covers or uncovers a bleed hole. Air pressure equalizes between the body and cover chambers through a bleed tube through the piston. The nominal pressure of the cover chamber portion in one embodiment is controlled by an adjustable bleed valve which can restrict the maximum flow of air through the bleed hole.

Abstract: In a method of soldering for use in fabricating electronic circuit device, after an oxide layer and/or contaminated layer on a surface of a soldering material and members to be soldered thereby is removed by sputter-cleaning with atom or ion, the members are aligned in an oxidizing atmosphere within a predetermined time period and, then, the soldering material is heated in non-oxidizing atmosphere to performe soldering. An apparatus for performing the above method comprises a sputter cleaning device, an alignment device operable in atmospheric condition and a heating and soldering device in the form of a belt furnace operable in non-oxidizing or reducing environment. Instead of the sputter cleaning device, a mechanical polishing or cutting device can be used to cleaning a surface of solder or a member to be bonded or a solder ball plated with gold may be used.

Abstract: A method of applying brazing filler metal to a surface to form a brazed joint by plasma spraying the brazing filler metal on the portions of the surface to be joined.

Abstract: The present invention provides a magnet wire having a high heat resistance, a conductor, and an inner layer formed by baking a first resin coating covering the outer surface of the conductor. The inner layer has a heat resistance which is not lower than 130.degree. C. and is lower than 200.degree. C. An outer layer is formed by baking a second resin coating covering the outer surface of the inner layer, the outer layer having a heat resistance which is not lower than 200.degree. C., the thickness of the lower layer falling within a range of between 0.3 .mu.m and 5 .mu.m and being not larger than 1/3 of the sum of the thicknesses of the outer and inner layers. The present invention also provides a method of removing an insulating covering from a magnet wire having a high heat resistance comprising the steps of: preparing a magnet wire having a high heat resistance, and irradiating an insulating covering of said magnet wire with a converged laser beam having a high energy.

Abstract: A first portion is set near or in contact with a second portion. The first and second portions are electrically connected by spraying fine metal particles particles of gold, nickel or copper in a carrier gas of helium, argon, hydrogen or nitrogen on the first and second portions to form a metal bump. Prior to spraying the fine metal particles to form the metal bump, hard particles of titanium, copper, hafnium, zirconium or vanadium may be sprayed on the first and second portions to remove contamination layers.

Abstract: The solder bonding is conducted by applying a postflux, which contains halogen compounds in the ratio of 0.2% or less as the amount of halogen, over a metal surface, which is the portion to be bonded by solder, of a member including metal accommodated in a gas-impermeable container in a hermetically sealed manner together with a rust-proof agent packet. The method of the present invention prevents, in an extremely simple way and at a low cost, the oxidation of the metal surface by retaining the member including the metal under a reductive atmosphere in which no oxygen, moisture or corrosive substances actually exist, and in which reductive gas co-exists with the material including the metal member, and the use of the flux containing a small amount of halogen easily enables good bonding properties of the solder. Accordingly, it is unnecessary to remove the flux by organic halogen based solvents after the solder bonding, the cleaning steps may be simplified and cost reduction may be promoted.

Abstract: A desoldering tool for melting and collecting solder includes a heated desoldering tip connected to a suction tube. The tip and tube from a flow bore for the flow of melted solder. The suction tube projects into an elongated tin collecting container which in turn is connected to a vacuum tube connected to a vacuum source. The axis of the suction tube traverses the axis of the container such that the solder flowing rom the suction tube is directed toward the interior wall of the container. That portion of the suction tube extending into the container forms a tin collecting space therearound for collecting the melted tin flowing from the mouth of the suction tube.

Abstract: The present invention relates generally to apparatus and methods for making simultaneous electrical connections, and more particularly to making these electrical connections simultaneously using a new bond tip configuration. Various methods and processes are being disclosed to simultaneously make electrical connections between electrical conductor lines or pads. The electrical connection is made by placing an electrically conductive wire across a pair of electrical lines or pads that have to be electrically connected and then by using a special tip, both ends of the electrically conductive wire are simultaneously secured to the two electrically conductive lines or pads.

Abstract: The present invention relates to a wire bonding method and a wire bonding apparatus employing a coated wire in which the surface of a metal wire is coated with an insulator, and a semiconductor device produced by the bonding method. The present invention includes forming a mixed gas of (1) a combustible gas and (2) a temperature controlling gas for lowering the combustion temperature of the mixture; and removing the insulator coating material from the coated wire at a bonding part of the coated wire, so as to denude the surface of a metal wire, by the use of flames produced by the combustion of the combustible gas of the mixed gas. The removal of the insulator is executed by an insulator removal torch.

Abstract: Soldering-vapor exhaust device comprising vacuum generator means and filter arrangements for filtering and for the direct evacuation of soldering vapors at a soldering point, via a suction pipe provided on a soldering iron, the latter being provided with a suction opening adjacent to the soldering bit of the soldering iron and connected to the filter arrangement via a suction line, the vacuum generator means comprising a linear motor acting as pumping means, arranged downstream of the filter means in an intake chamber and being driven by an electromagnetic a.c. field, and which serves a pumping means.

Abstract: An component or connector lead (12) is soldered to a bare copper metallized area (14) on a circuit board (16) using core solder (26) by manually applying heat from a heated tip (24) to a separate one of the lead and metallized area. As the heat is being applied, a vacuum is drawn in the region where the solder is applied to the lead and/or metallized area to draw off any flux vapors created upon heating of the solder. At the same time, hot air is also directed into the region where the solder is being applied to maintain the flux vapors, created upon heating of the solder, in their vaporous state to facilitate such vapors being drawn off, thereby reducing the amount of flux residues resulting from the soldering operation.

Abstract: An automated heat pipe processing system is able to take a heat pipe casing and an end cap for the heat pipe casing and form these into a heat pipe within a totally contained system. The heat pipe casing and end cap are cleaned by means of glow-discharge plasma, a bakeout heating, if required. After cleaning, a working fluid is placed within the cleaned heat pipe after which the end cap is fixedly attached to the heat pipe casing by means of inertia welding. This in-situ fabrication of the heat pipe minimizes defective end products and steps to fabricate such.