Plural Heat Applying Patents (Class 228/227)
  • Patent number: 7328831
    Abstract: A method of making an article that is comprised of a metal foam in contact with a base metal by an intermediate braze composition, in particular, a method of brazing a metal foam to a base metal via a braze composition. In one preferred method, a polymeric foam is coated with a powdered metal composition and thermally-treated to volatilize the polymeric foam and form an open-cell metal foam. A second polymeric foam is coated with a braze composition. The second coated polymeric foam is thermally-treated to volatilize the polymeric foam. The metal foam is surrounded by the second coated polymeric foam to form a composite metal foam. The composite metal foam is placed in contact with a base metal to form an article. The article is thermally-treated to a brazing temperature to form a brazed metal article.
    Type: Grant
    Filed: June 25, 2004
    Date of Patent: February 12, 2008
    Assignee: Porvair PLC
    Inventor: Mark J. Topolski
  • Patent number: 7325716
    Abstract: Apparatus and methods of fabricating a bump limiting metallization structure including a two-step bump reflow process that reduces intermetallic compound porosity, increases bump strength, improve die yield, and device reliability. The first step comprises annealing a bump limiting metallurgy and a solder plug at a temperature below the liquidus temperature of the solder plug to form a dense intermetallic compound layer between the solder plug and the bump limiting metallurgy. The second step comprises heating the bump limiting metallurgy and the solder plug at a temperature above the liquidus temperature of the solder plug to form a solder bump.
    Type: Grant
    Filed: August 24, 2004
    Date of Patent: February 5, 2008
    Assignee: Intel Corporation
    Inventors: Christopher August Debelius, Jianxing Li
  • Patent number: 7238919
    Abstract: According to an aspect of the present invention, there is provided a bonding method, comprising disposing on a first body a second body with a bump interposed therebetween; and electrically and mechanically bonding the first body and the second body with the bump by passing a heating element between the first body and the second body to melt the bump by the heating element, the heating element being heated to a melting point or more of a material configuring the bump.
    Type: Grant
    Filed: February 7, 2006
    Date of Patent: July 3, 2007
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Hisashi Kaneko, Mie Matsuo, Hirokazu Ezawa
  • Patent number: 7159309
    Abstract: When an electronic component is mounted on a substrate, the electronic component is first placed on the substrate with a solid support interposed between the electronic component and the substrate. The solid support serves to space a terminal conductor of the electronic component from a corresponding terminal pad on the substrate. A conductive bonding material is then melted on the terminal pad. The melted conductive bonding material gets exposed to the peripheral atmosphere over a larger area. Even if a bubble is generated within the melted conductive bonding material, the bubble is allowed to easily get out of the melted conductive bonding material. Removal of the gas is promoted in the melted conductive bonding material. The solid support is subsequently melted. The electronic component is moved down toward the substrate, thereby contacting the terminal conductor with the melted conductive bonding material on the corresponding terminal pad.
    Type: Grant
    Filed: February 12, 2002
    Date of Patent: January 9, 2007
    Assignee: Fujitsu Limited
    Inventors: Tsuyoshi Yamamoto, Mitsuo Suehiro, Hiroshi Yamada
  • Patent number: 7129446
    Abstract: A device is provided to heat the whole heated surface of a carried member carried intermittently with a temperature change over time maintained constant. The device controls the driving of a belt-conveyer so that a heater moves in a carrying direction at a carry time movement velocity that is slower than the carry velocity of a TAB tape if the TAB tape is in a carried state. On the other hand, the heater moves in an opposite carrying direction at a carry standby time movement velocity derived from the difference between the carry velocity and the carry time movement velocity if the TAB tape is in a carry standby state.
    Type: Grant
    Filed: April 21, 2004
    Date of Patent: October 31, 2006
    Assignee: Seiko Epson Corporation
    Inventor: Norio Imaoka
  • Patent number: 7047612
    Abstract: This invention relates generally to a method for repairing a casting, and more specifically to a method of repairing a casting by pouring melted filler material into a damaged portion of the original casting. Damaged cast metal components, such as a cylinder head of an internal combustion engine are repaired by preheating the component to a first preheat temperature. The damaged area of the casting is then heated to a higher temperature using a torch and melted filler material is poured into the casting. The torch is used to maintain the temperature of the melted material for thirty seconds to two minutes. The temperature of the filler material is then cooled using compressed air.
    Type: Grant
    Filed: May 2, 2003
    Date of Patent: May 23, 2006
    Assignee: Caterpillar Inc.
    Inventors: Michael D. Bridges, Leonid Chuzhoy, Christopher A Kinney, Jose F. Leon Torres, Stephen E Post, Robert E. Sharp
  • Patent number: 6786390
    Abstract: A LED stacking manufacturing method and its structure thereof, mainly uses a stacking method to integrate the epitaxial layer and the high-thermal-conductive substrate by twice bonding process, and the converted epitaxial layer of the temporary bonded substrate replaces the epitaxial wafer growth substrate, and the second bonded layer of the etch stop layer of the epitaxial layer is bonded with the second bonded layer of the high-thermal-conductive substrate to form an alloy layer with permanent connection, and then the temporary bonded substrate is removed, such that the process completes the integration of the epitaxial layer and the high-thermal-conductive substrate and makes the ohmic contact layer to face upward to provide a better reliability and efficiency of optical output of the LED.
    Type: Grant
    Filed: February 4, 2003
    Date of Patent: September 7, 2004
    Assignee: United Epitaxy Company Ltd.
    Inventors: Kuang-Neng Yang, Pai-Hsiang Wang, Chih-Sung Chang, Tzer-Perng Chen
  • Patent number: 6695201
    Abstract: A lower shell for a sealed compressor includes a shape with a plurality of intricate bends. In particular, u-shaped sections are stamped into a plainer sheet of material to form the lower shell. This stamping process can cause brittleness in the lower shell. Thus, after the stamping process, the lower shell is subjected to a heat-treating process to reduce the brittleness. After the heat-treating process a center shell is welded to the lower shell.
    Type: Grant
    Filed: August 23, 2001
    Date of Patent: February 24, 2004
    Assignee: Scroll Technologies
    Inventors: Sudarshan K. Narasipura, Gregory W. Hahn
  • Patent number: 6686565
    Abstract: A method of uniformly or substantially uniformly heating at least one surface of a substrate, comprises the steps of supporting a substrate, generating a heated air flow, directing the heated air flow to heat a strip of a first surface of the substrate, and moving the flow path of the heated air in a direction transverse to the direction in which the heated air flow impinges on the substrate until the temperature of the whole or substantially the whole first surface of the substrate has been uniformly or substantially uniformly raised. Apparatus for performing this method is also disclosed.
    Type: Grant
    Filed: July 11, 2001
    Date of Patent: February 3, 2004
    Assignee: Planer Products, Limited
    Inventors: Paul Lakra, Stephen James Butler
  • Patent number: 6648209
    Abstract: In a process for producing welded steel pipes, a pipe is molded cold from a TM-rolled sheet, welded together and sized to the desired diameter, whereby the sheet includes steel with (in wt. %) 0.02 to 0.20% carbon, 0.05 to 0.50% silicon, 0.50 to 2.50% manganese, 0.003 to 0.06% aluminum, the remainder being iron with potentially other production-related impurities. After welding and sizing, the pipe is subjected to a heat treatment process at a temperature of 100-300° C. and for a holding time that is suited to the thickness of the pipe wall, with subsequent cooling with air or by forced cooling. The resulting pipe is resistant to aging and has sufficiently integral deformation reserve against fracturing with the same high degree of strength, without exceeding the upper limit for the ratio of yield strength to tensile stress according to the current industry standards for conventional steels.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: November 18, 2003
    Assignee: Mannesmannröhren-Werke AG
    Inventors: Gerold Hohl, Gerhard Knauf
  • Patent number: 6625886
    Abstract: In a manufacturing method of a heat exchanger including a core portion having a plurality of tubes and a plurality of radiation fins connected to surfaces of the tubes, and a tank portion communicating with the tubes, a preheating step, a brazing step, a gradual cooling step and a cooling step are performed in this order. In the preheating step, temperature of the tank portion having a large heat capacity is increased earlier than that of the core portion having a small heat capacity. Therefore, the temperature of the tank portion is rapidly increased, and the temperature of the core portion is obediently increased in accordance with the temperature increase of the tank portion.
    Type: Grant
    Filed: June 17, 2002
    Date of Patent: September 30, 2003
    Assignee: Denso Corporation
    Inventors: Syoji Iriyama, Koji Hirao, Hiroshi Ogawa, Takanori Takeda, Hiroshi Nishikawa, Satoshi Nohira
  • Patent number: 6607847
    Abstract: An article, such as an airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined by a braze to the first piece. The first piece comprises one of a first niobium-based refractory metal intermetallic composite and a first molybdenum-based refractory metal intermetallic composite, and the second piece comprises one of a second niobium-based refractory metal intermetallic composite and a second molybdenum-based refractory metal intermetallic composite. The braze joining the first piece to the second piece comprises a first metallic element and a second metallic element, wherein the first metallic element is one of titanium, palladium, zirconium, niobium, and hafnium, and wherein the second metallic element is one of titanium, palladium, zirconium, niobium, hafnium, aluminum, chromium, vanadium, platinum, gold, iron, nickel, and cobalt, the first metallic element being different from the second metallic element.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: August 19, 2003
    Assignee: General Electric Company
    Inventors: Ji-Cheng Zhao, Melvin Robert Jackson, Bernard Patrick Bewlay
  • Patent number: 6586118
    Abstract: An airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined by a braze to the first piece. The first piece comprises one of a first niobium-based refractory metal intermetallic composite and a first-based refractory metal intermetallic composite, and the second piece comprises one of a second niobium-based refractory metal intermetallic composite and a second molybdenum-based refractory metal intermetallic composite. The braze joining the first piece to the second piece is a semi-solid braze that comprises a first component and a second component.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: July 1, 2003
    Assignee: General Electric Company
    Inventors: Melvin Robert Jackson, Bernard Patrick Bewlay, Ji-Cheng Zhao
  • Publication number: 20030098341
    Abstract: A method for implementing post-heat treatment during spray forming to achieve stress control in the manufacture of a spray formed metallic tool involves applying a metallic spray-forming material onto a mold substrate and causing substantially homogenous metallic phase transformations from the austenite phase, for example, via manipulation of either or both of the substrate temperature and the spray forming cell environment temperature.
    Type: Application
    Filed: November 27, 2001
    Publication date: May 29, 2003
    Applicant: Ford Motor Company
    Inventors: Allen Dennis Roche, Samir Samir, Chijoke Mgbokwere, Mark Lusk
  • Patent number: 6565989
    Abstract: An airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined by a braze to the first piece. The first piece comprises one of a first niobium-based refractory metal intermetallic composite and a first molybdenum-based refractory metal intermetallic composite, and the second piece comprises one of a second niobium-based refractory metal intermetallic composite and a second molybdenum-based refractory metal intermetallic composite. The braze joining the first piece to the second piece comprises one of germanium and silicon, and one of chromium, titanium, gold, aluminum, palladium, platinum, and nickel. This abstract is submitted in compliance with 37 C.F.R. 1.72(b) with the understanding that it will not be used to interpret or limit the scope of or meaning of the claims.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: May 20, 2003
    Assignee: General Electric Company
    Inventors: Ji-Cheng Zhao, Melvin Robert Jackson, Bernard Patrick Bewlay
  • Patent number: 6565990
    Abstract: An airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined at a bonded region to the first piece by a diffusion bond. The first piece comprises one of a first niobium-based refractory metal intermetallic composite and a first molybdenum-based refractory metal intermetallic composite. The second piece comprises one of a second niobium-based refractory metal intermetallic composite and a second molybdenum-based refractory metal intermetallic composite. The diffusion bond is formed from a first metallic element disposed on a first surface of the first piece and a second metallic element disposed on at least one of the first surface and a second surface of the second piece, the second surface contacting the first surface, wherein the first and second metal form a composition having a melting temperature less than about 1400° C. This abstract is submitted in compliance with 37 C.F.R. 1.
    Type: Grant
    Filed: May 30, 2001
    Date of Patent: May 20, 2003
    Assignee: General Electric Company
    Inventors: Bernard Patrick Bewlay, Melvin Robert Jackson, Ji-Cheng Zhao
  • Publication number: 20030019916
    Abstract: An end portion of a coil wire is wound around a coil terminal to form a wound portion. Then, air is supplied to the wound portion. While the air is supplied to the wound portion, heat is supplied in a first stage to the coil terminal, and thus a heat resistant coating of the coil wire is burnt and is removed from the coil wire located in the wound portion. Thereafter, heat is supplied in a second stage to the coil terminal, and thus a protrusion of the coil terminal is melted to join the coil wire and the coil terminal to each other at the wound portion.
    Type: Application
    Filed: July 24, 2002
    Publication date: January 30, 2003
    Inventor: Mitsunori Tsuge
  • Patent number: 6502739
    Abstract: The rotary tools are disposed to weld along two spaced welding lines. The two rotary tools are inserted into respective welding joints and moved at the same time along the respective welding lines. At a position P1 of a portion of a window one rotary tool is withdrawn from the welding joint so that the friction stir welding on that welding joint is stopped although the welding tool continues to move. At a position P3, the rotary tools are gradually withdrawn from their respective welding joints while they continue to move along the welding line. At a position P4, the movement of the rotary tools along the respective welding lines is stopped, the rotary tools are completely withdrawn and the welding is stopped. Next, the rotary tools are inserted into the respective welding joints once again and movement thereof is started again. An insertion amount of the rotary tools at this time is larger than the insertion amount thereof prior to the stopping of the movement of these rotary tools.
    Type: Grant
    Filed: April 12, 2001
    Date of Patent: January 7, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Masakuni Ezumi, Kazusige Fukuyori, Akihiro Satou
  • Publication number: 20020185524
    Abstract: An article, such as an airfoil having a melting temperature of at least about 1500° C. and comprising a first piece and a second piece joined by a braze to the first piece. The first piece comprises one of a first niobium-based refractory metal intermetallic composite and a first molybdenum-based refractory metal intermetallic composite, and the second piece comprises one of a second niobium-based refractory metal intermetallic composite and a second molybdenum-based refractory metal intermetallic composite. The braze joining the first piece to the second piece comprises a first metallic element and a second metallic element, wherein the first metallic element is one of titanium, palladium, zirconium, niobium, and hafnium, and wherein the second metallic element is one of titanium, palladium, zirconium, niobium, hafnium, aluminum, chromium, vanadium, platinum, gold, iron, nickel, and cobalt, the first metallic element being different from the second metallic element.
    Type: Application
    Filed: May 30, 2001
    Publication date: December 12, 2002
    Applicant: Gerneral Electric Company with cover sheet
    Inventors: Ji-Cheng Zhao, Melvin Robert Jackson, Bernard Patrick Bewlay
  • Publication number: 20020185810
    Abstract: A device is proposed for the conveyance and releasable fixing of substrates (27) to be printed in a printing process, with a conveyor device (2, 4) which conveys the substrate (27) to a fixing device (3) which fixes the substrate (27) by means of contact with side edge areas (33) of the substrate (27) lying in the direction of conveyance (F), wherein the fixing device (3) has support means (21) on which the substrate (27) lies in the side edge area.
    Type: Application
    Filed: April 3, 2002
    Publication date: December 12, 2002
    Applicant: EKRA Eduard Kraft GmbH Maschinenfabrik
    Inventors: Georg Baier, Hartmut Drose
  • Publication number: 20020130163
    Abstract: A soldering method including: bonding a first electronic component having electrodes plated with a material containing lead to one surface of an interconnect substrate through solder containing no lead; and flow-soldering to bond a second electronic component to the other surface of the interconnect substrate. In the soldering method, a joint section between the first electronic component and the interconnect substrate is heated at the same time as or after the step of flow soldering to melt the joint section.
    Type: Application
    Filed: March 5, 2002
    Publication date: September 19, 2002
    Applicant: SEIKO EPSON CORPORATION
    Inventor: Ikuya Miyazawa
  • Patent number: 6434946
    Abstract: An article assembly comprising a plurality of members includes a multi-layered brazed joint provided in the assembly between a first member that can be affected adversely by thermal exposure at a limiting and a second member requiring exposure, such as for brazing, at least at the limiting temperature. The assembly is provided with a multi-layered brazed joint directly or indirectly between such members by brazing to the second member a second brazing alloy that can be brazed at a temperature required to braze the second member, providing a preform. The assembly is brazed to include the first member by brazing members of the assembly together with a first brazing alloy, brazing at a temperature less than the limiting temperature, brazed at the second brazing alloy.
    Type: Grant
    Filed: April 6, 2001
    Date of Patent: August 20, 2002
    Assignee: General Electric Company
    Inventors: Mark Richard Shaw, David Edwin Budinger, Ronald Daniel Regan
  • Patent number: 6419806
    Abstract: Method of forming a two-piece hollow cathode sputter target assembly and the assembly formed thereby. The sputter target assembly includes an outer shell having a substantially cylindrical side wall and is composed of a relatively low purity metallic material. A sputtering insert includes a substantially cylindrical side wall and is concentrically received within, and bonded to, the outer shell. The sputtering insert is composed of a relatively high purity metallic material as used for depositing a thin layer or film onto a desired substrate.
    Type: Grant
    Filed: April 9, 2001
    Date of Patent: July 16, 2002
    Assignee: Tosoh SMD, Inc.
    Inventors: Melvin K. Holcomb, William E. Barnes, Steven L. Bardus
  • Patent number: 6395972
    Abstract: A method of solar cell external interconnection and a solar cell panel (1) made thereby are disclosed. An assembly (2) including a solar cell module (4), a flexible lead frame (5) to which the solar cell module is to be interconnected and a solder located between the solar cell module and the flexible lead frame, is provided. The solder is heated by directing a hot gas (42) into the area of the solder to melt the solder and form a soldered connection (6) between the solar cell module and the lead frame. The soldered assembly is attached to a module carrier panel (3) by embedding a portion of the assembly in a first, flexible adhesive (32) and another portion of the assembly in a second, thermally curable adhesive (33) which is then cured to anchor the assembly on the module carrier panel.
    Type: Grant
    Filed: November 9, 2000
    Date of Patent: May 28, 2002
    Assignee: TRW Inc.
    Inventors: Dean Tran, George J. Vendura, Jr., Mark A. Kruer, Alan M. Hirschberg
  • Publication number: 20020023946
    Abstract: A method of uniformly or substantially uniformly heating at least one surface of a substrate, comprises the steps of supporting a substrate, generating a heated air flow, directing the heated air flow to heat a strip of a first surface of the substrate, and moving the flow path of the heated air in a direction transverse to the direction in which the heated air flow impinges on the substrate until the temperature of the whole or substantially the whole first surface of the substrate has been uniformly or substantially uniformly raised. Apparatus for performing this method is also disclosed.
    Type: Application
    Filed: July 11, 2001
    Publication date: February 28, 2002
    Inventors: Paul Lakra, Stephen James Butler
  • Patent number: 6320155
    Abstract: A method and apparatus for simultaneously cleaning and bonding a wire to a bonding surface is presented. In accordance with the invention, a gas is energized to form a plasma, which is then directed in a directional pressurized flow at the wire and bonding surface to form a dynamic plasma cleaning chamber bubble around the portion of the wire and bonding surface that are to be bonded together, and then the respective portions of the wire and bonding surface are bonded together within the plasma cleaning chamber bubble.
    Type: Grant
    Filed: January 11, 2000
    Date of Patent: November 20, 2001
    Assignee: GeoMat Insights, LLC
    Inventor: Ronald J. Barnett
  • Publication number: 20010019074
    Abstract: A method of welding a hollow member and an insert member to form a composite member including a hollow member and insertion member requiring a high dimensional accuracy in the end-to-end distance in the axial direction and requiring a reliable concentricity in the center axes of the hollow member and insertion member, including preparing a hollow member and insertion member, inserting the insertion member in the hollow member, providing spot welds at an overlap portion where the hollow member and insertion member overlap to correct the axial end-to-end distance of the hollow member and the insertion member, and providing a partial weld at an overlap portion where the hollow member and insertion member overlap to correct the concentricity of the hollow member and the insertion member.
    Type: Application
    Filed: March 5, 2001
    Publication date: September 6, 2001
    Inventors: Hideaki Shirai, Takafumi Sato, Eiji Iwanari, Yoshinori Ohmi
  • Patent number: 6259036
    Abstract: A method for fabricating bumped semiconductor components and electronic assemblies, such as multi chip modules, is provided. The method includes forming semi cured, electrically conductive, elastomeric bumps on electrodes of a semiconductor component (e.g., die, chip scale package), or on electrodes of a mating component (e.g., PCB, MCM substrate). The bumps include an adhesive matrix material and dendritic metal particles. The adhesive matrix material is in a semi cured condition having adhesive qualities for bonding, but with a structural rigidity for supporting the dendritic particles to enable penetration of oxide layers on the electrodes. The semi cured adhesive bumps permit the bumps to be cured without the necessity of externally generated compressive forces.
    Type: Grant
    Filed: April 13, 1998
    Date of Patent: July 10, 2001
    Assignee: Micron Technology, Inc.
    Inventor: Warren M. Farnworth
  • Patent number: 6119921
    Abstract: The invention is a method and resulting device which provides a strong bond between a silicon substrate and an oxide component mounted within a cavity in the substrate. A layer of titanium, for example, is deposited on the walls of the cavity, followed by deposition of a layer of aluminum. The structure is preferably annealed to form titanium silicide and titanium-aluminum interface layers. The component is then bonded to the aluminum layer.
    Type: Grant
    Filed: February 19, 1999
    Date of Patent: September 19, 2000
    Assignee: Lucent Technologies
    Inventors: Michael Francis Brady, Mindaugas Fernand Dautartas, James F. Dormer, Sailesh Mansinh Merchant, Casimir Roman Nijander, John William Osenbach
  • Patent number: 6095403
    Abstract: A method and implementing system is provided in which a gas, such as oxygen, is injected on to area of a circuit board to which an electronic component is being mounted. The injected gas causes a formation of a coating or surface alloy layer such as tin-oxide, on the solder joint. The coating causes the solder bead or joint to have a higher surface tension and a higher reflow temperature. In an exemplary double-sided double-pass assembly operation, circuit boards pass through a soldering oven on a first pass to attach components to a first side, and then the board is inverted and passed through the oven on a second pass while components are mounted on the opposite side of the board. During the second pass, a gas injection device is aimed at the component-to-board connection points on the inverted side of the board which were soldered on the first pass. The gas is injected at the point in the soldering reflow oven at which the temperature begins to exceed the solder reflow temperature.
    Type: Grant
    Filed: January 22, 1999
    Date of Patent: August 1, 2000
    Assignee: International Business Machines Corporation
    Inventors: James Sherill Akin, Thomas Alan Schiesser, John Andrew Shriver, III
  • Patent number: 6032851
    Abstract: A vertical pipe column assembly procedure involves the simultaneous welding and ultrasonic testing activity by using a plurality of welders progressing peripherally around a joint with the ultrasonic testing work similarly progressing peripherally around the joint between the welders. The temperature rise from welding activity is reduced by only partially completing the weld at a selected joint, then lowering the joint by the usual process of lowering or driving it downward one section length and completing the weld deposit at a lower work station. At the lower work station, ultrasonic testing again proceeds simultaneously between the peripherally progressing welders. An optional step used to improve joint strength, usable at selected joints needing the most strength, involves the application of an axial pull on the section above the finish welding activity. This axial pull places an axial stress in the partially completed weld.
    Type: Grant
    Filed: October 21, 1996
    Date of Patent: March 7, 2000
    Assignee: Premiere, Inc.
    Inventor: Lee Matherne
  • Patent number: 5948549
    Abstract: A sinter-joining method for forming a sinter of high quality at low cost and a sintered composite member produced by the sinter-joining method.A tubular copper-base material is forced into a tubular iron-base material and these materials are sintered at temperatures equal to and higher than 600.degree. C. so that the copper-base material expands and pressure-joins to the iron-base material. Then, the materials are sintered at temperatures equal to and higher than 850.degree. C. so that the compactness of the copper-base material is increased. Through these steps, the sintered composite member containing the copper-base material joined to the inside of the iron-base material is obtained.
    Type: Grant
    Filed: October 17, 1997
    Date of Patent: September 7, 1999
    Assignee: Komatsu Ltd.
    Inventors: Takemori Takayama, Yuichi Hori, Hirotaka Kato
  • Patent number: 5758816
    Abstract: A method is provided to heat a plurality of components to a preselected temperature that creates a tackiness at the surface of a preformed solder component and permits the preformed solder component to adhere to a first metallic surface of a first component. When the preselected temperature is reached, the components are rapidly cooled to prevent diffusion that would result from further heating and melting of the preformed solder component. In a particularly preferred embodiment of the invention, the first component is a lens that has a first metallic surface rigidly attached thereto. A second metallic surface is attached to a ceramic body and a preformed solder component is disposed between the first and second metallic surfaces.
    Type: Grant
    Filed: August 19, 1996
    Date of Patent: June 2, 1998
    Assignee: Honeywell Inc.
    Inventor: Simon M. Rabinovich
  • Patent number: 5579575
    Abstract: A method and apparatus of forming a solder connection between a plurality of elongate bodies, comprises:(i) forming an initial connection between the elongate bodies by inserting them into an induction heatable connecting element of a connector, the connector comprising a dimensionally heat-recoverable sleeve and, retained within the sleeve, the connecting element and a solder insert that is in thermal contact with the connecting element; and(ii) heating the connector (a) by subjecting the connecting element to an alternating magnetic field so that it is heated by induction thereby melting the solder insert, and (b) subjecting the sleeve to hot air and/or infrared radiation, thereby causing the sleeve to recover.The apparatus for applying heat to an elongate connector, comprises a first heat source which comprises an induction coil, and a second heat source arranged to generate hot air or infrared radiation.
    Type: Grant
    Filed: September 23, 1994
    Date of Patent: December 3, 1996
    Assignee: Raychem S.A.
    Inventors: Alain Lamome, Jacques Delalle, Sylvain Briens
  • Patent number: 5540379
    Abstract: A soldering process using two different types of solder alloys is disclosed. The first solder alloy (115) undergoes a solid-to-liquid transition at a first temperature. The second solder alloy (120) undergoes this solid-to-liquid transition at a second temperature, the second temperature being greater than the first temperature. The soldering composition is deposited (20) on a substrate (100) having solderable portions (105) and is heated to a temperature that is above the first temperature but below the second temperature (32). During this time, the first solder alloy liquifies, while the second solder alloy remains solid. The soldering composition is subsequently cooled (40) to solidify the first solder material. A part or electronic component is added (80) to the solidified solder material and the solder materials is again heated above the second temperature (30) in order to reflow the solder and form a metallurgical bond between the substrate and the electronic component.
    Type: Grant
    Filed: May 2, 1994
    Date of Patent: July 30, 1996
    Assignee: Motorola, Inc.
    Inventors: Vahid Kazem-Goudarzi, Henry F. Liebman, Kingshuk Banerji, William B. Mullen, III, Edwin L. Bradley, III
  • Patent number: 5222652
    Abstract: A seamless double-walled tube having high corrosion resistance and relative flexibility prepared by a process for brazing non-ferritic steel surfaces such as nickel chromium or stainless steel to which a suitable brazing alloy such as copper has been mechanically attache which includes the steps of instantaneously elevating the surface of the stainless steel to a brazing temperature while maintaining the material in a humidified gaseous atmosphere consisting essentially of a non-reactive carrier gas and a reactive gas present in sufficient concentrations to achieve fluxing; maintaining the surface temperature of the steel for an interval sufficient to permit fusion between the selected metal and the non-ferritic steel surface; after metal fusion has been achieved, allowing the resulting fused metal material to cool to a first lowered temperature in a controlled non-oxidative atmosphere at a rate which retards the formation of fine-grained steel crystals in the metal; and after reaching a metallurgical transfo
    Type: Grant
    Filed: January 25, 1991
    Date of Patent: June 29, 1993
    Assignee: ITT Corporation
    Inventors: Glen A. Gibbs, Arnold T. Johnson
  • Patent number: 5161730
    Abstract: The invention is an improved method for fabricating apparatus weldments such as, for example, wheeled end trucks for overhead cranes. The apparatus has a pair of spaced, wheeled end modules, a pair of beams extending between the modules and at least one reference such as a reference plane used to initially align end modules placed in a fixture prior to beam-module attachment by welding. The improved method includes the steps of positioning the modules with respect to the reference, tack welding each piece in position for permanent attachment to the modules and permanently attaching each piece to a module. Permanent attachment includes applying welds in sequence to the first end of one beam, to the second and first ends (in that order) of the second beam and, finally, to the second end of the first beam. Where each module-and-beam-end attachment has plural welding paths, preferred steps are described for the order in which each path at each beam end is to be welded.
    Type: Grant
    Filed: December 6, 1991
    Date of Patent: November 10, 1992
    Assignee: Harnischfeger Corporation
    Inventors: Darrel McGuire, Jonathan M. Christensen, Rodney R. Lautenbach
  • Patent number: 5111991
    Abstract: The need for solder paste or wave soldering to assemble printed circuit boards and components is eliminated by applying (100) a layer of solder to the exposed metal pads, annular rings and plated through holes of the printed circuit board. Leadless components are placed into a layer of `tack` flux applied (110) to the printed circuit board (120). The printed circuit board is heated to reflow (130) leadless components, and the solder in the holes is melted (140). The leads of the leaded components are heated (150) and inserted (160) into the molten solder in the holes. The assembly is then cooled (170) to solidify the solder around the component.
    Type: Grant
    Filed: October 22, 1990
    Date of Patent: May 12, 1992
    Assignee: Motorola, Inc.
    Inventors: Robert A. Clawson, John R. Thome
  • Patent number: 5099573
    Abstract: A method of making a hollow article, for example, a hollow airfoil, from first and second preformed sections involves a first precursor (seal) bonding step where a low external pressure and internal vacuum are utilized to form a substantially gas impermeable seal bond between opposing bonding surfaces of the sections with only limited distortion of one of the sections and no distortion of the other section, a diffusion bonding step where a high external and high internal pressure is utilized to form a complete parent metal diffusion bond between the bonding surfaces without distortion of either section and an inflation step where a high external and high internal pressure are utilized to remove the limited distortion from the affected section without distortion of the unaffected section. The inflation step and diffusion bonding step can be combined into one operation to provide a two step method of making the hollow article.
    Type: Grant
    Filed: June 27, 1990
    Date of Patent: March 31, 1992
    Assignee: Compressor Components Textron Inc.
    Inventors: Tony M. Krauss, Craig R. Boyer, Donald J. Moracz
  • Patent number: 4988036
    Abstract: An improved heating cycle for brazing an assembly of clad aluminum sheet components having a hypoeutectic aluminum-silicon braze alloy cladding comprises a dwell at a temperature slightly above the eutectic melting point and effective to partially melt the cladding. The dwell is accompanied by vaporization of residual magnesium from the clad alloy to getter oxygen from about the assembly and enhanced disruption of oxide film on the cladding surface, which film would otherwise interfere with capillary flow of the braze alloy into joints. The eutectic temperature dwell provides a more uniform flow of braze alloy into seams and thereby produces a strong, leak-free joint in the brazed structure.
    Type: Grant
    Filed: April 9, 1990
    Date of Patent: January 29, 1991
    Assignee: General Motors Corporation
    Inventors: Gary A. Kemble, Melvin C. Nietopski, Joseph P. DiFonzo
  • Patent number: 4955524
    Abstract: In accordance with a preferred embodiment, a monolith extrusion die is formed by a plurality of individual tube elements bonded together as a tube stack defining a plurality of extrudable material feed holes and reference guides for a plurality of individual shaping teeth each having a root segment located in a reference guide and each having a shaping head spaced apart from adjacent shaping heads to form intersecting rows of extrusion slots having a shape corresponding to the monolith formed by extrudable material directed from the feed holes through the shaping teeth.
    Type: Grant
    Filed: August 24, 1989
    Date of Patent: September 11, 1990
    Assignee: General Motors Corporation
    Inventor: Terrance Way
  • Patent number: 4895291
    Abstract: A method of making a hermetic seal for a solid-state device is disclosed. The device includes a ceramic housing having a cavity for an element such as an image sensor. A cover formed of a transparent material is sealed to the housing to close the cavity. A metallization support is formed on the cover and on the housing. In order to form a hermetic seal at a relative low temperature, a layer of indium is coated on the metallization support of either the cover or the housing, and a layer of tin is coated on the support of the other of the two parts. The cover is then placed on the housing, and the parts are placed in a furnace where a temperature under the melting temperature of the composite alloy of tin and indium is maintained for a period long enough to diffuse the tin and indium together. The temperature is then raised to a temperature sufficient to melt the alloy, and the device is then slowly cooled to ambient temperature.
    Type: Grant
    Filed: May 4, 1989
    Date of Patent: January 23, 1990
    Assignee: Eastman Kodak Company
    Inventors: Edward J. Ozimek, Edward Carnall, Jr.
  • Patent number: 4883219
    Abstract: A first surface of a first metal component of an ink jet print head is bonded to a second surface of a second metal component of the ink jet print head, the first and second surfaces being of materials having the same or similar coefficients of thermal expansion. A layer of filler material is electroplated or otherwise placed on at least one of these surfaces. The filler material has a melting point which is below the melting point of the first and second components, and the total thickness of the filler material on the surfaces together is in the range of from approximately one-sixteenth micron to approximately five microns, with one-eighth micron to two microns being a preferred range. These surfaces are placed together and subjected to heat and pressure to diffusion bond the surfaces without melting the filler material. The diffusion bonding is performed in one approach until no more than approximately one micron of filler material remains between the surfaces.
    Type: Grant
    Filed: September 1, 1988
    Date of Patent: November 28, 1989
    Inventors: Jeffrey J. Anderson, John S. Moore, Ted E. Deur, Joy Roy
  • Patent number: 4702406
    Abstract: A method of forming a stable welded joint between low alloy steels and austenitic stainless alloy steels which is characterized by increased resistance to chemical corrosion and mechanical stress and which has a greatly extended service lifetime. The method comprises forming a deposit of a low alloy steel containing niobium onto a portion of low alloy steel to be welded; heating the deposit to a first temperature at which all carbides present therein have dissolved; quenching the deposit and forming a solid solution of the elements of the dissolved carbides; and reheating the deposit for a time period and at a second temperature sufficient to form niobium carbides therein containing substantially all of the carbon present in the deposit. The austenitic stainless steel portion is welded to the deposit using a substantially nonferrous nickel-based alloy as the weld filler material, thereby joining the low alloy steel portion to the austenitic stainless steel portion.
    Type: Grant
    Filed: October 16, 1986
    Date of Patent: October 27, 1987
    Assignee: Carolina Power & Light Company
    Inventors: Dennis Sullivan, Richard J. Bloch
  • Patent number: 4685608
    Abstract: A solar array panel is formed of a matrix of solar cell subarrays and wired together to form an integral power unit. The subarrays are soldered by passing them on a conveyor through successive solder melting and solder cooling regions induced by suspended radiating susceptors which are inductively heated. The system induction generator is cycled on and off to create the desired temperature ranges in the applicable regions. The subarrays are carried through the regions by an aluminum alloy plate on a thermally inert conveyor belt. The aluminum alloy plate is substantially unresponsive to radiated heat from the susceptors.
    Type: Grant
    Filed: October 29, 1985
    Date of Patent: August 11, 1987
    Assignee: RCA Corporation
    Inventor: Erich F. Kujas
  • Patent number: 4620662
    Abstract: A process for brazing a sleeve within a tube which is resistant to longitudinal expansion is disclosed herein. In the first step of the process, a thermally induced radial expansion is induced in the tube in a first longitudinal section of the tube which does not include the ring of brazing alloy which circumscribes the sleeve. In the second step of the process, a brazing heat is applied across the longitudinal section of the tube which does include this ring of brazing material. The residual tensile stress created by the thermally induced radial expansion in the tube avoids the creation of gaps in the braze joint between the sleeve and the inner walls of the tube. This process is particularly useful in creating high-quality braze joints in sleeving operations in nuclear steam generators, where the heat exchange tubes which need to be sleeved may be partially or completely prevented from expanding in the longitudinal direction due to sludge deposits in the generator.
    Type: Grant
    Filed: July 25, 1984
    Date of Patent: November 4, 1986
    Assignee: Westinghouse Electric Corp.
    Inventor: John M. Driggers
  • Patent number: 3984652
    Abstract: A method of butt welding two adjoining plates is disclosed. The method includes welding the two plates together in a single pass, cutting a gap in the center of the first weld leaving first weld material on the two adjoining surfaces, and then rewelding the gap between the two adjoining surfaces of first weld material ensuring the reweld only occurs on the first weld material. This method has the advantage of heat treating the heat affected zone (HAZ) of the parent material adjacent the weld to prevent adverse metallurgical effect on the metal.
    Type: Grant
    Filed: December 23, 1974
    Date of Patent: October 5, 1976
    Assignee: Dominion Bridge Company, Limited
    Inventor: Brian Anthony Graville