Abstract: A barrier metal layer is provided on at least one electrodes, wherein one electrode is formed on a substrate and another is connected to an electronic component, so as to coat a base material of the electrode. The base material is made of a material containing Cu. Soldering between the electrode of the electronic component and the electrode on the substrate is conducted by supplying a solder material containing Sn and Zn, placing the solder material in contact with the barrier metal layer while the solder material is in a molten state, and solidifying the solder material. Thus, in the case where the electronic component is soldered to the substrate with the solder material such as an Sn—Zn-based material, the degradation of a soldering part is avoided, Consequently, a sufficient thermal fatigue strength of the soldering part is obtained.

Abstract: A method for joining metal parts in which an aluminum rich surface is produced on a first metal part by selective removal of the beryllium component of a beryllium-aluminum alloy, as by said etching. The aluminum rich surface may then be joined to another aluminum rich surface by a brazing.

Abstract: A backing plate of Ti for supporting a Ti sputtering target is formed of at least two components welded together. The backing plate is welded by interposing a Cu or Zr foil or powder between faces to be welded, and then heating the assembly to a reaction temperature high enough to melt one of the Ti and Cu or Zr to produce a liquid phase. The heating temperature is retained for a time long enough to permit diffusion of the Cu or Zr into the Ti to produce a liquid phase diffusion weld. By permitting diffusion to occur, a separate metallic compound is not produced at the welding face. In effect welding is accomplished without producing a welding face, whereby no interface exists in the finished weld. The resulting weld has a strength substantially equal to the strength of the Ti material, and very good welding qualities.

Abstract: An efficient and effective process for manufacturing of hardened aluminum components is achieved by coordinating the material preparation steps with the forming steps. The resulting product is a hardened aluminum component with desirable strength characteristics. The process includes initial heating of sheet material in order to prepare it for further processing. The sheet material is then quenched to promote appropriate material conditioning. A product forming sub-process is then undertaken in a relatively short period of time following the quenching. The product forming is done while the material is in a relatively ductile condition, thus easing forming operations, and avoiding product spring-back problems. Lastly, the component is naturally aged, to provide the final hardening operations. The resulting product has very desirable strength characteristics, due to the combined forming and hardening process.

Abstract: By utilizing a roll bonding process and appropriately forming steps, a load bearing structure is created which is capable of handling and appropriately transferring loads. One preferred method includes the combination of roll bonding and hydroforming to efficiently create structural components. While various product configurations are possible, one version includes a waffle-type structure produced by appropriate roll bonding of material sheets. This waffle-type structure can also undergo additional forming steps to create several structural components capable of handling and carrying loads in a very efficient and effective manner. More significantly, this process enables the use of structural aluminum for load bearing components which are efficiently and cost effective when manufactured.

Abstract: A refractory braze composition and process for assembling alumina-containing parts to another alumina-based material, metal or a metal alloy by reactive or non-reactive refractory brazing using a braze composition provide assemblies entirely of alumina or containing alumina and a metal or metal alloy. The braze composition is non-reactive with alumina or a reactive composition, whose reactivity with alumina is controlled, and it is formed of aluminium, of titanium, and of a matrix made up either of palladium, or of nickel, or of a nickel and palladium alloy.

Abstract: The invention relates to a rigid composite metal panel comprising at least two metal parallel plates and/or sheets secured to the peaks and troughs of a corrugated aluminium stiffener sheet arranged between the parallel plates and/or sheets, wherein the corrugated aluminium stiffener sheet is an aluminium brazing sheet product made from an aluminium brazing sheet product including a core sheet (1) made of an aluminium alloy having on at least one surface of the core sheet clad, and preferably on both sides, an aluminium clad layer (2), the aluminium clad layer being made of an aluminium alloy comprising silicon in an amount in the range of 2 to 18% by weight, preferably 5 to 14%, and a layer (3) comprising nickel on the outer surface of the aluminium clad layer. The invention further relates to a method of manufacturing thereof.

Abstract: Two silicon workpieces (20, 22) welded together into one member without the formation of cracks along the weld. It may be formed by a first method in which current (34, 36) is passed through one or both of the workpieces to heat them to between 600 and 900° C. Then an electric, laser, or plasma welder (38, 40) passes along the seam (24) between the workpieces to weld them together. In a second forming method, current (34) is passed through a plate (60), preferably formed of silicon, which either supports the workpieces or is brought into contact with at least one of them, whereby the workpieces are preheated prior to the welding operation.

Abstract: Methods for implementing production of an oxide superconductor joined member, excellent in electric current transmission performance, without a need of going through particularly complex steps, are provided. When joining together oxide superconductors by use of a solder composed of an oxide superconducting material, a finally solidified portion of the solder is positioned in a region where a transmission path of electric current flowing between oxide superconductor base materials as joined together is not obstructed by, for example, disposing the solder on a face of the oxide superconductor base materials, other than butting surfaces of the oxide superconductor base materials, so as to straddle both the base materials like bridge-building. Current flow is also not obstructed by, for example, shaping junction faces of the oxide superconductor base materials such that at least portions of the butting surfaces thereof are in the shape of sloped open faces, parting from each other.

Abstract: Process for welding duplex steel in the presence of a shielding gas without use being made of welding aids and with nitrogen being added to the shielding gas and with an austenitic-ferritic duplex steel with a chromium content of between 28 and 35 wt. % and a nickel content of between 3 and 10 wt. % being used.

Abstract: A method for brazing beryllium-aluminum alloy members to form a beryllium-aluminum alloy assembly and coating the beryllium-aluminum alloy assembly in which an aluminum-silicon based braze alloy is placed between the beryllium-aluminum members at the locations for forming braze joints. The aluminum-silicon based braze alloy is surrounded by a brazing flux comprising aluminum fluoride. The beryllium-aluminum alloy members and the aluminum-silicon based braze alloy are heated to form the beryllium-aluminum alloy assembly. Oxidized surfaces appearing on the beryllium-aluminum alloy members are removed. Thereupon, the beryllium-aluminum alloy assembly is coated by plasma deposition of alumina-titania powder.

Abstract: Disclosed is a method of manufacturing an assembly of components joined by brazing, comprising the steps of: (i) forming the components of which at least one is made from a multi-layered brazing sheet product, the multi-layered brazing sheet product comprising a core sheet (a) having on at least one surface of the core sheet an aluminium clad layer (b), the aluminium clad layer being made of an aluminium alloy comprising silicon in an amount in the range of 2 to 18% by weight, a layer (c) comprising nickel on the outer surface of the aluminium clad layer, and a layer (d) comprising zinc or tin as a bonding layer between the outer surface of the aluminium clad layer and the layer comprising nickel; (ii) forming at least one other component of a metal dissimilar to the core sheet of the multi-layered brazing sheet product and selected from the group consisting of titanium, plated titanium, coated titanium, bronze, brass, stainless steel, plated stainless steel, coated stainless steel, low-carbon steel, plated

Abstract: A method for fabricating a printed circuit board includes the steps of: fabricating a printed circuit board having at least one collapsed portion; depositing a first solder resist in the collapsed portion; exposing the first solder resist-coated printed circuit board at a pressure lower than atmospheric pressure for a predetermined time; coating a second solder resist on the entire surface of the printed circuit board; and drying and hardening the first and the second solder resists. With this method, when a solder resist is coated, since an air space does not remain in a blind via hole, the reliability of the attachment between a printed circuit board and the solder resist layer is increased.

Abstract: The present invention is directed to brazing filler metals that can be used in the infiltration brazing of porous matrix materials without the need for a flux. The brazing filler metals contain two different Group II metals and a third metal of Group 9 and 10. A particular brazing filler metal of the invention contains silver, copper, and nickel. The invention is also directed to composite materials formed by infiltration of the brazing material into a porous matrix, and to methods for preparing the composite materials. The invention is further directed to composite articles fabricated from composite materials, including steel bearings or bushings, and to methods of preparing the composite articles.

Abstract: A brazing method for joining to or more pieces of metal together includes running a molten brazing solder into a space between the pieces, heating at least the adjacent surfaces of the pieces to be joined to brazing temperature in a reducing atmosphere and preheating at least the adjacent surfaces to about 600° C. in an oxidizing atmosphere prior to said heating to the brazing temperature.

Abstract: The invention, which permits active solder braze technology to be used in a more versatile manner, relates to a solder braze alloy and to a method for joining workpieces by soldering by means of a solder braze alloy. The novel alloy is characterized in that it comprises 1-10% by weight of an element or a mixture of elements of subgroup IVa and/or Va of the Periodic Table of the Elements and 0.1-20 wt% of an element or a mixture of elements of the group of the rare earths and the remainder consists of zinc, lead, tin, bismuth or indium or a mixture predominantly of two or more of the elements zinc, lead, tin, bismuth and indium and optionally of the elements silver, copper, gallium, antimony, nickel, manganese, chromium, cobalt possibly of customary impurities.

Abstract: A system (5) and method are used for predicting and controlling the temperature of a semiconductor wafer (10) during a solder reflow process by controlling the operating profile of a solder reflow furnace (14). The emissivity of the surface of the wafer (10) is measured using an infrared device (11) prior to the solder reflow process. Using the measured emissivity value of the wafer (10), the peak temperature of the wafer (10) is predicted, and the operating profile of the solder reflow furnace (14) is adjusted accordingly to achieve a desired temperature profile of the wafer (10). A process for reflowing solder on a semiconductor wafer calculates a predicted peak temperature of a semiconductor wafer (10) and controls the actual temperature of the wafer (10) during a solder reflow process by controlling the operating profile of a solder reflow furnace (14).

Abstract: A refractory material powder of a carbide-forming metal or alloy is formed into an intermediate body having a shape and size corresponding to the desired shape and size of the article. The intermediate body is exposed to a gaseous hydrocarbon or a mixture of hydrocarbons at a temperature exceeding the decomposition temperature for the hydrocarbon or hydrocarbons until the mass of the intermediate body has increased by at least 3%. The intermediate body is thereafter exposed to a temperature of 1000-1700° C. in an inert atmosphere if the temperature during exposure to the hydrocarbon or hydrocarbons was too low to ensure a complete carbidization of the intermediate body.

Abstract: The present invention provides a welding method for materials to be welded which are subjected to fluoride passivation treatment, and a fluoride passivation retreatment method, wherein, when fluoride passivation retreatment was conducted after welding, there is no generation of particles or dust, and superior resistance is provided to fluorine system gases.

Abstract: A method and apparatus for welding together two silicon workpieces (20, 22) without the formation of cracks along the weld. In a first embodiment, current (34, 36) is passed through one or both of the workpieces to heat them to between 600 and 900° C. Then an electric or plasma welder (38, 40) passes along the seam (24) between the workpieces to weld them together. In a second embodiment, current (34) is passed through a silicon plate (60) which either supports the workpieces or is brought into contact with at least one of them, whereby the workpieces are preheated prior to the welding operation.

Abstract: The present invention contemplates a method of fabricating a ring or disk having select regions reinforced with a metal matrix composite material. In one embodiment the method includes forming the ring or disk of a high strength iron-cobalt metal matrix composite material. The ring or disk is formed by joining a plurality of metallic members with a composite member located between the metallic members. The metallic members and the composite member form a preassembly, which is subjected to a thermal and pressure cycle so as to cause a metallurgical bonding of the metallic members.

Abstract: A welding method for materials to be welded which are subjected to fluoride passivation treatment, and a fluoride passivation retreatment method, wherein, when fluoride passivation retreatment is conducted after welding, there is no generation of particles or dust. The method provides superior resistance to fluorine system gases. During fluoride passivation treatment, hydrogen is added to the gas (the back shield gas) flowing through the materials to be welded. In one embodiment of the welding method, the thickness of the fluoride passivated film in a predetermined range from the butt end surfaces of the materials to be welded is set to 10 nm or less, followed by subsequent welding. Furthermore, the fluoride passivation retreatment method, includes the steps of heating at least the welded parts following welding and flowing a gas containing fluorine gas in the interior portion of the parts.

Abstract: An article comprising a metal circuit and/or a heat-radiating metal plate formed on a ceramic substrate, wherein the metal circuit and/or the heat-radiating metal plate comprise either (1) the following first metal-second metal bonded product, wherein the first metal and the second metal are different, or (2) the following first metal-third metal-second metal bonded product, and wherein in (1) and (2), the first metal is bonded to the ceramic substrate; first metal: a metal selected from the group consisting of aluminum (Al), lead (Pb), platinum (Pt) and an alloy containing at least one of these metal components; second metal: a metal selected from the group consisting of copper (Cu), silver (Ag), gold (Au), aluminum (Al) and an alloy containing at least one of these metal components; and third metal: a metal selected from the group consisting of titanium (Ti), nickel (Ni), zirconium (Zr), molybdenum (Mo), tungsten (W) and an alloy containing at least one of these metal components.