Abstract: A semiconductor device includes capacitors connected in parallel. Electrode active portions and a discharge active portion are defined on a semiconductor substrate, and capping electrodes are disposed respectively on the electrode active portions. A capacitor-dielectric layer is disposed between each of the capping electrodes and each of the electrode active portions that overlap each other. A counter doped region is disposed in the discharge active portion. A lower interlayer dielectric covers the entire surface of the semiconductor substrate. Electrode contact plugs respectively contact the capping electrodes through the lower interlayer dielectric, and a discharge contact plug contacts the counter doped region through the lower interlayer dielectric. A lower interconnection is disposed on the lower interlayer dielectric and contacts the electrode contact plugs and the discharge contact plug.

Abstract: A semiconductor device includes an element isolation film formed on a semiconductor substrate surface of one conductivity type, a gate electrode having one pair of end portions located on a boundary between an element isolation film and an element forming region, a source region and a drain region of a reverse conductivity type arranged to sandwich a region immediately below a gate electrode, and an impurity diffusion region of the one conductivity type formed in the element forming region. The source region is separated from a region on a boundary side between the element isolation film and the element forming region in the region immediately below the gate electrode in the element forming region. In the impurity diffusion region, a portion adjacent to the region on the boundary side is arranged between the source region and the element isolation film, and is in contact with the source region and the region on the boundary side.

Abstract: Some embodiments relate to an apparatus that exhibits vertical diode activity to occur between a semiconductive body and an epitaxial film that is disposed over a doping region of the semiconductive body. Some embodiments include an apparatus that causes both vertical and lateral diode activity. Some embodiments include a gated vertical diode for a finned semiconductor apparatus. Process embodiments include the formation of vertical-diode apparatus.

Abstract: Design time (TAT) is reduced in a layout design of a semiconductor integrated circuit having a well supplied with a potential different from a substrate potential. A layout design method of the present invention includes preparing a first cell pattern placed on a semiconductor substrate of a first conductive type, preparing a second cell pattern having a deep well of a second conductive type, placing the first cell pattern in a first circuit region, and placing the second cell pattern in a second region different from the first circuit region. This reduces TAT in chip design.

Abstract: A method for forming a submicron device includes depositing a hard mask over a first region that includes a polysilicon well of a first dopant type and a gate of a second dopant type and a second region that includes a polysilicon well of a second dopant type and a gate of a first dopant type. The hard mask over the first region is removed. Angled implantation of the first dopant type is performed to form pockets under the gate of the second dopant type.

Abstract: A method of manufacturing a semiconductor storage device according to an embodiment of the present invention includes forming dummy cells 611, to 618 at a position adjacent to a reference cell 412, and implanting an impurity into the dummy cells 611, to 618 using a mask that covers the reference cell 412. Here, the process of implanting the impurity is carried out so that the impurity exudes out of the dummy cells 611, to 618 to the reference cell 412.

Abstract: The present invention includes a memory cell area that includes a plurality of transistors, and a core area that is arranged adjacent to the memory cell area. The memory cell area and the core area include a semiconductor layer, and an n-type well region and a first p-type well region formed above the semiconductor layer. The memory cell area further includes a second p-type well region formed under the n-type well region and the first p-type well region in the semiconductor layer. The second p-type well region contacts to at least the first p-type well region.

Abstract: A method for fabricating a non-volatile memory device includes forming a charge tunneling layer composed of a hafnium silicate (HfSixOyNz) layer on a semiconductor substrate. A charge trapping layer composed of a hafnium oxide nitride (HfOxNy) layer is formed on the charge tunneling layer. A charge blocking layer composed of a hafnium oxide layer is formed on the charge trapping layer. A gate layer is formed on the charge blocking layer. A non-volatile memory device fabricated by the method is also disclosed.

Abstract: Apparatus and methods are provided for fabricating semiconductor devices with reduced bipolar effects. One apparatus includes a semiconductor body (120) including a surface and a transistor source (300) located in the semiconductor body proximate the surface, and the transistor source includes an area (310) of alternating conductivity regions (3110, 3120). Another apparatus includes a semiconductor body (120) including a first conductivity and a transistor source (500) located in the semiconductor body. The transistor source includes multiple regions (5120) including a second conductivity, wherein the regions and the semiconductor body form an area (510) of alternating regions of the first and second conductivities. One method includes implanting a semiconductor well (120) including a first conductivity in a substrate (110) and implanting a plurality of doped regions (5120) comprising a second conductivity in the semiconductor well.

Abstract: A semiconductor memory device includes a semiconductor substrate. An inter-layer dielectric is disposed on the semiconductor substrate. A bit line is disposed on the inter-layer dielectric. A bit line spacer is fabricated of a nitride layer containing boron and/or carbon and covers sidewalls of the bit line. A method of fabricating the semiconductor memory device is also provided.

Abstract: A description is given of a concept for reducing shunt currents in a semiconductor body.

Abstract: An integrated circuit structure includes a semiconductor substrate of a first conductivity type; and a depletion region in the semiconductor substrate. A deep well region is substantially enclosed by the depletion region, wherein the deep well region is of a second conductivity type opposite the first conductivity type. The depletion region includes a first portion directly over the deep well region and a second portion directly under the deep well region. An integrated circuit device is directly over the depletion region.

Abstract: A semiconductor device includes a P-substrate, an N-well disposed in the P-substrate, an NMOS transistor disposed in the P-substrate and having one of a source and a drain connected to a ground voltage, a P-tap disposed in the P-substrate and connected to a low voltage so as to provide the P-substrate with the low voltage to be lower than the ground voltage, a PMOS transistor disposed in the N-well and having a source connected to a power supply voltage, an N-tap disposed in the N-well and connected to the power supply voltage so as to provide the N-well with the power supply voltage, and a depression-type PMOS transistor having a drain connected to the low voltage and a source connected to the ground voltage so as to prevent a parasitic transistor, which may exist among the PMOS transistor, the N-well, the NMOS transistor, and the P-substrate, from causing a latchup between the power supply voltage and the ground voltage due to the low voltage rising higher than the ground voltage, and for becoming in a cond

Abstract: A solid state imaging apparatus includes a plurality of photoelectric conversion sections formed in an imaging area of a silicon substrate, and an embedded layer embedded in an isolation trench formed in at least one part of the silicon substrate located around the photoelectric conversion sections. The embedded layer is made of an isolation material having a thermal expansion coefficient larger than silicon oxide and equal to or smaller than silicon.

Abstract: This invention pertains to a color coatings blender apparatus to be used for color composition customization for the application of color coatings on 2D and 3D surfaces. The apparatus is comprised of a main body and interchangeable inserts all with central blender chambers and primary and secondary ports, and interchangeable spindles; the configurations of which are governed by coating technical characteristics. This invention integrates gradient specific programmable computer digital processes to function as internal editors, manipulate information and present the operator with multiple options and production overrides. This invention will make data analysis more interactive by utilizing existing external software applications as editors and expanding the process of visual communications for multiple purposes. While the blender apparatus, complete with external selectable appurtenances, can be used manually, it can also be combined with a programmable computer for producing physical gradient layers.

Abstract: A composite integrated circuit incorporating two LDMOSFETs of unlike designs, with the consequent creation of a parasitic transistor. A multipurpose resistor is integrally built into the composite integrated circuit in order to prevent the parasitic transistor from accidentally turning on. In an intended application of the composite integrated circuit to a startup circuit of a switching-mode power supply, the multipurpose resistor serves as startup resistor for limiting the flow of rush current during the startup period of the switching-mode power supply.

Abstract: In a PMOS transistor, the source-drain region is divided into four parts along the gate width and has an arrangement of four independent source regions and an arrangement of four independent drain regions. A partial trench isolation insulating film is arranged in contact with the whole of the opposed surfaces between the four source regions in such a manner that the channel region formed under the gate electrode is divided across the channel length. A body-tied region containing N-type impurities relatively high in concentration is arranged in contact with the side surface of the source region opposite to the gate electrode, and the potential of the body region is fixed through the well region from the body-tied region.

Abstract: An integrated circuit includes a p-well block region having a low doping concentration formed in a region of a substrate for providing noise isolation between a first circuit block and a second circuit block. The integrated circuit further includes a guard region and a grounded, highly doped region for providing additional noise isolation.

Abstract: An integrated circuit includes a p-well block region having a high resistivity due to low doping concentration formed in a region of a substrate for providing noise isolation between a first circuit block and a second circuit block. The integrated circuit further includes a guard region formed surrounding the p-well block region for providing noise isolation between the first circuit block and the second circuit block.

Abstract: In a semiconductor device of the present invention, two epitaxial layers are formed on a P type single crystal silicon substrate. One of the epitaxial layers has an impurity concentration higher than that of the other epitaxial layer. The epitaxial layers are divided into a plurality of element formation regions by isolation regions. In one of the element formation regions, an NPN transistor is formed. Moreover, between a P type diffusion layer, which is used as a base region of the NPN transistor, and a P type isolation region, an N type diffusion layer is formed. Use of this structure makes it hard for a short-circuit to occur between the base region and the isolation region. Thus, the breakdown voltage characteristics of the NPN transistor can be improved.

Abstract: A method and structure for an improved shallow trench isolation (STI) structure for a semiconductor device. The STI structure incorporates an oxynitride top layer of the STI fill. Optionally, the STI structure incorporates an oxynitride margin of the STI fill adjacent the silicon trench walls. A region of the oxynitride margin near the upper edges of the silicon trench walls includes oxynitride corners that are relatively thicker and contain a higher concentration of nitrogen as compared to the other regions of the oxynitride margin. The oxynitride features limit the STI fill height loss and also reduce the formation of divots in the STI fill below the level of the silicon substrate cause by hydrofluoric acid etching and other fabrication processes. Limiting STI fill height loss and the formation of divots improves the functions of the STI structure.

Abstract: A semiconductor memory device that has an isolated area formed from one conductivity and formed in part by a buried layer of a second conductivity that is implanted in a substrate. The walls of the isolated area are formed by implants that are formed from the second conductivity and extend down to the buried layer. The isolated region has implanted source lines and is further subdivided by overlay strips of the second conductivity that extend substantially down to the buried layer. Each isolation region can contain one or more blocks of memory cells.

Abstract: A power semiconductor device has a first region in which a transistor is formed, a third region in which a control element is formed, and a second region for separating the first region and the third region.

Abstract: A transistor in which a physical property of its channel is changed according to an applied voltage, and methods of manufacturing and operating the same are provided. The transistor may include a first conductive layer on a substrate, a phase change layer and a second conductive layer which are sequentially stacked on the first conductive layer, a first current direction limiting unit and a second current direction limiting unit formed on the second conductive layer by being separated within a space, a third conductive layer and a fourth conductive layer formed on the first current direction limiting unit and the second current direction limiting unit, respectively, a word line connected to the third conductive layer, a bit line connected to the fourth conductive layer, and a voltage lowering unit connected to the word line.

Abstract: A complementary metal-oxide-semiconductor field effect transistor (CMOSFET) is provided. The CMOSFET includes a substrate of a first conductivity type, a first epitaxial layer, a well, a second epitaxial layer of a second conductivity type, a first sinker, a second sinker, a first buried layer and a second buried layer. The first and the second epitaxial layer are sequentially disposed on the substrate. The first sinker and the first buried layer separate a first region from the second epitaxial layer. The second sinker and the second buried layer separate a second region from the second epitaxial layer. The well is disposed in the first region. A first transistor is disposed in the well. A second transistor is disposed in the second region. A deep trench isolation is disposed between the first and the second region and extends from the substrate to the upper surface of the second epitaxial layer.

Abstract: One or more local oxidation of silicon (LOCOS) regions may be formed that apply compressive strain to a channel of a field-effect transistor such as a P-type field-effect transistor (PFET) or other circuit element of a semiconductor device. For instance, a pair of LOCOS regions may be formed on opposite sides of a PFET gate and its corresponding channel, or one or more LOCOS regions may more fully surround, or even completely surround, the PFET channel. In addition, one or more slits may be formed in the LOCOS regions as appropriate to reduce or even completely neutralize the compressive strain in certain directions that would otherwise be applied without the slits. These techniques may be used in silicon-on-insulator (SOI) wafers with or without hybrid orientation technology (HOT) regions.

Abstract: In a PMOS transistor, the source-drain region is divided into four parts along the gate width and has an arrangement of four independent source regions and an arrangement of four independent drain regions. A partial trench isolation insulating film is arranged in contact with the whole of the opposed surfaces between the four source regions in such a manner that the channel region formed under the gate electrode is divided across the channel length. A body-tied region containing N-type impurities relatively high in concentration is arranged in contact with the side surface of the source region opposite to the gate electrode, and the potential of the body region is fixed through the well region from the body-tied region.

Abstract: A semiconductor structure and associated method for forming the semiconductor structure. The semiconductor structure comprises a first field effect transistor (FET), a second FET, and a shallow trench isolation (STI) structure. The first FET comprises a channel region formed from a portion of a silicon substrate, a gate dielectric formed over the channel region, and a gate electrode comprising a bottom surface in direct physical contact with the gate dielectric. A top surface of the channel region is located within a first plane and the bottom surface of the gate electrode is located within a second plane. The STI structure comprises a conductive STI fill structure. A top surface of the conductive STI fill structure is above the first plane by a first distance D1 and is above the second plane by a second distance D2 that is less than D1.

Abstract: An asymmetrically doped memory cell has first and second N+ doped junctions on a P substrate. A composite charge trapping layer is disposed over the P substrate and between the first and the second N+ doped junctions. A N? doped region is positioned adjacent to the first N+ doped junction and under the composite charge trapping layer. A P? doped region is positioned adjacent to the second N+ doped junction and under the composite charge trapping layer. The asymmetrically doped memory cell will store charges at the end of the composite charge trapping layer that is above the P? doped region. The asymmetrically doped memory cell can function as an electrically erasable programmable read only memory cell, and is capable of multiple level cell operations. A method for making an asymmetrically doped memory cell is also described.

Abstract: A semiconductor component, which functions according to the principle of charge carrier compensation, has incompletely ionized dopants that are additionally provided in a semiconductor body of the semiconductor component. When a reverse voltage is applied, the degree of compensation changes as a function of time and the breakdown voltage of the semiconductor component increases in a manner governed by the degree of compensation. The invention furthermore relates to a circuit configuration and to a method for doping a compensation layer according to the invention.

Abstract: A structure and associated method for annealing a trapped charge from a semiconductor device. The semiconductor structure comprises a substrate and a first heating element. The substrate comprises a bulk layer, an insulator layer and a device layer. The first heating element is formed within the bulk layer. A first side of the first heating element is adjacent to a first portion of the insulator layer. The first heating element is adapted to be selectively activated to generate thermal energy to heat the first portion of the insulator layer and anneal a trapped electrical charge from the first portion of the insulator layer.

Abstract: A diode structure is provided. The diode structure comprises a first conductive type substrate, a second conductive type first well region, a first conductive type second well region, a second conductive type first doped region, a first conductive type second doped region and a second conductive type third doped region. The first well region is located within the substrate and the second well region is located within the first well region. The first doped region is located within the first well region and detached from the second well region but adjacent to the surface of the substrate. The second doped region and the third doped region are located within the second well region and adjacent to the surface of the substrate. The second doped region is located between the first doped region and the third doped region but detached from both the first doped region and the third doped region.

Abstract: A semiconductor device includes an N channel MOS transistor. The N channel MOS transistor includes a first P type buried layer that isolates an N epitaxial region on a P type substrate (P-SUB) from another N epitaxial region, a drain in an N well in the N epitaxial region, a source in a P well surrounding sides of the N well to isolate the N well, and a gate on upper layer portions of the drain and the source. The MOS transistor also includes a second P type buried layer between the N well and the P well and the substrate and contiguous to the P well, and an N buried layer contiguous to the P type buried layer and the P-SUB. The N epitaxial region, the P-SUB, and the first P type buried layer are connected to ground potential.

Abstract: An integrated circuit having improved isolation includes a first circuit section formed in a substrate and a second circuit section formed in the substrate, the second circuit section being spaced laterally from the first circuit section. The integrated circuit further includes an isolation buried layer formed under at least a portion of the first circuit section, and a conductive layer formed on a surface of the substrate and electrically coupled to the buried layer and to a voltage reference, the conductive layer reducing an effective lateral resistance of the buried layer, whereby an isolation between the first and second circuit sections is increased. A second isolation buried layer can be formed under at least a portion of the second circuit section as well to provide further isolation between the first and second circuit sections.

Abstract: A power semiconductor device has an active region that includes a drift region. At least a portion of the drift region is provided in a membrane which has opposed top and bottom surfaces. In one embodiment, the top surface of the membrane has electrical terminals connected directly or indirectly thereto to allow a voltage to be applied laterally across the drift region. In another embodiment, at least one electrical terminal is connected directly or indirectly to the top surface and at least one electrical terminal is connected directly or indirectly to the bottom surface to allow a voltage to be applied vertically across the drift region. In each of these embodiments, the bottom surface of the membrane does not have a semiconductor substrate positioned adjacent thereto.

Abstract: The present invention is directed to a seal structure and a method for forming a seal structure for a semiconductor die. An elongate region which is electrically isolated from the remainder of the substrate, such as a well region of a conductivity type opposite that of the substrate, extends around the major portion of the periphery of the substrate. A gap is left between the two ends of the elongate region along the minor portion of the periphery of the substrate not covered by the elongate region. A conductive seal ring is formed around the periphery of the substrate at the elongate region and spans the gap between the ends of the elongate region. The substrate of the semiconductor die is only brought into electrical contact with the seal ring at the gap between the ends of the elongate region.

Abstract: An integrated circuit configuration includes a semiconductor body having a first semiconductor zone of a first conductivity type in a region near a rear side and a second semiconductor zone of the first conductivity type adjoining the first semiconductor zone and doped more weakly than the first semiconductor zone in a region near a front side, a first component region in the body having at least one semiconductor zone of a second conductivity type, a second component region in the body having at least one semiconductor zone of the second conductivity type, and a conversion structure having a semiconductor zone of the second conductivity type and a semiconductor zone of the first conductivity type that are short-circuited and disposed at a distance from the first semiconductor zone between the first and second component regions in the second semiconductor zone.

Abstract: In a semiconductor device having a junction type diode using a bipolar transistor and a process for producing the same, a ratio of a diode electric current to a leakage electric current is improved, and latch up resistance is improved without increasing the process. A p type semiconductor substrate, a collector buried region and an n type epitaxial layer are formed, a p type first impurity region is formed in the n type epitaxial layer, an n type second impurity region is formed in the first impurity region, an N+ sinker is formed, and a collector electrode is formed, with a common electrode being formed on the first and second impurity regions.

Abstract: A transistor includes an NPN transistor provided with an N-type emitter, a P-type base, an N-type collector, an emitter diffusion region and a collector compensation diffusion region around the base and the emitter for decreasing a saturation voltage and a parasitic PNP transistor in a region where the NPN transistor is formed, the parasitic PNP transistor operating under saturation of the NPN transistor.

Abstract: A power semiconductor device (10) has an active region that includes a drift region (20). At least a portion of the drift region (20) is provided in a membrane (16) which has opposed top and bottom surfaces (15,17). In one embodiment, the top surface (15) of the membrane (16) has electrical terminals connected directly or indirectly thereto to allow a voltage to be applied laterally across the drift region (20). In another embodiment, at least one electrical terminal is connected directly or indirectly to the top surface (15) and at least one electrical terminal is connected directly or indirectly to the bottom surface (17) to allow a voltage to be applied vertically across the drift region (20). In each of these embodiments, the bottom surface (17) of the membrane (16) does not have a semiconductor substrate positioned adjacent thereto.

Abstract: An integrated circuit that supports digital circuits, analog circuits, and RF circuits on a single IC. Digital CMOS circuitry lies on a low resistivity layer that provides good latch-up qualities and allows for dense PAD I/O. Analog CMOS circuitry rests on an isolated well region on a highly resistive layer in order to minimize signal crosstalk through the substrate. Analog BJT devices also sit on a highly resistive region within its own well structure in order to minimize parasitic capacitances and provide for high frequency device switching. RF passive elements, such as inductors and capacitors, rest on a highly resistive region in order to minimize signal losses that especially occur at high frequencies. RF active components rest on a highly resistive region to maximize device performance.

Abstract: In a semiconductor device having a junction type diode using a bipolar transistor and a process for producing the same, a ratio of a diode electric current to a leakage electric current is improved, and latch up resistance is improved without increasing the process. A p type semiconductor substrate, a collector buried region and an n type epitaxial layer are formed, a p type first impurity region is formed in the n type epitaxial layer, an n type second impurity region is formed in the first impurity region, an N+ sinker is formed, and a collector electrode is formed, with a common electrode being formed on the first and second impurity regions.

Abstract: A semiconductor device includes an epitaxial layer formed on a P type silicon substrate; a P+ diffusion layer for dividing the epitaxial layer into an N− epi layer, which constitutes a device formation region, and an N− epi layer, which constitutes an invalid area; and an aluminum wire for electrically connecting the N− epi layer (invalid area) to the P+ diffusion layer. Since the potential of the N− epi layer (invalid area) can be made equal to that of the P+ diffusion layer, it is possible to prevent the electron supply from the P+ diffusion layer to the invalid area even when electrons are supplied to the device formation region by a counterelectromotive force produced by a load having an inductance L.

Abstract: When forming first and second circuits on a semiconductor substrate, an isolation region is provided between the first and second circuits by embedding a conductor in the semiconductor substrate. Also, an output node of a low impedance voltage output circuit that provides a fixed voltage at low impedance is connected to the isolation region. In this way, a noise current caused by high-frequency noise generated from the first or second circuit flows into the low impedance voltage output circuit. Hence leakage of noise signals between the circuits can be suppressed.

Abstract: An npn transistor allowing the potential of each terminal to be easily set and superior in characteristics such as withstand-voltage performance and current amplification factor can be obtained. An n-type buried layer on a p-type substrate, a p-type buried layer on the n-type buried layer, n-type epitaxial layers covering the above layers, terminal regions on the surfaces of the layers, p-type outer-periphery layers encircling the terminal regions, and an encirclement layer encircling the layers are included, and p-type base regions and the p-type outer-periphery layer are continued to the p-type buried layer to separate a collector region from a p-type substrate and the n-type buried layer and the n-type encirclement layer are continued to separate the p-type buried layer, the p-type base region, and the p-type outer-periphery layer from the p-type substrate.

Abstract: An electrostatic discharge (ESD) protection structure is disclosed. The ESD protection structure of the present invention uses a resistance capacitance (RC) circuit to distinguish an overshoot phenomenon caused by the instantaneous power-on from an ESD event, so as to prevent the ESD protection device, such as a P-type modified lateral silicon controlled rectifier (MLSCR), from being triggered unexpectedly by an overshoot phenomenon which results from the power-on under normal operation, and thereby the efficiency of the ESD protection device is promoted.

Abstract: A methodology of creating integrated circuits with improved noise isolation is presented. The circuitry of an integrated circuits is separated into noise generating circuit blocks and noise sensitive circuit blocks. N-type and P-type diffusion guard rings are placed around each of the circuit blocks. Substantially overlying the N-type and P-type diffusion guard rings are power supply meshes which are intimately in contract with the guard rings below through spaced apart vias. The power supply meshes not only supply power for the circuit blocks, but also reverse-bias the diffusion guard rings for improved noise isolation.

Abstract: In a semiconductor device having a junction type diode using a bipolar transistor and a process for producing the same, a ratio of a diode electric current to a leakage electric current is improved, and latch up resistance is improved without increasing the process. A p type semiconductor substrate, a collector buried region and an n type epitaxial layer are formed, a p type first impurity region is formed in the n type epitaxial layer, an n type second impurity region is formed in the first impurity region, an N+ sinker is formed, and a collector electrode is formed, with a common electrode being formed on the first and second impurity regions.

Abstract: A semiconductor device (20) includes an isolated p-well (22) formed in a substrate (21) by a buried n-well (25) and an n-well ring (24). The n-well ring (24) extends from a surface of the semiconductor device (20) to the buried n-well (25). The isolated p-well (22) includes a plurality of n-well plugs (27) extending from the surface of the semiconductor device (20) into the isolated p-well (22) and contacting the buried n-well (25). The plurality of n-well plugs (27) reduces an n-well resistance to provide better noise isolation for high frequency signals.

Abstract: Provided is a substrate of a semiconductor integrated circuit which can easily manufacture an integrated circuit having a soft error resistance, a latch up resistance and an ESD resistance increased. A thickness of a semiconductor surface layer having a lower impurity concentration than that of each of substrate single crystals 51 and 55 is varied according to a resistance which should be possessed by each section such as a memory cell section 5, a logic section 6, an input-output section 8 or the like for a region where each section is to be formed.